| Patent | Date |
|---|
Structure And Formation Method Of Semiconductor Device With Backside Contact
App 20220310804 - SU; Huan-Chieh ; et al. | 2022-09-29 |
Semiconductor device structure and methods of forming the same
Grant 11,456,246 - Huang , et al. September 27, 2 | 2022-09-27 |
Spacers for semiconductor devices including a backside power rails
Grant 11,456,209 - Yu , et al. September 27, 2 | 2022-09-27 |
Semiconductor Device Including Recessed Interconnect Structure
App 20220302027 - Wu; Guo-Huei ; et al. | 2022-09-22 |
Semiconductor Devices With Backside Power Rail And Backside Self-aligned Via
App 20220302268 - Chiang; Kuo-Cheng ; et al. | 2022-09-22 |
Semiconductor Device Including Recessed Interconnect Structure
App 20220302026 - Wu; Guo-Huei ; et al. | 2022-09-22 |
Integrated circuit structure with backside via rail
Grant 11,450,751 - Su , et al. September 20, 2 | 2022-09-20 |
Contact Via Formation
App 20220293521 - Huang; Lin-Yu ; et al. | 2022-09-15 |
Semiconductor devices with backside air gap dielectric
Grant 11,443,987 - Chen , et al. September 13, 2 | 2022-09-13 |
Semiconductor device including recessed interconnect structure
Grant 11,444,018 - Wu , et al. September 13, 2 | 2022-09-13 |
Selective Liner On Backside Via And Method Thereof
App 20220285494 - Huang; Lin-Yu ; et al. | 2022-09-08 |
Using A Liner Layer To Enlarge Process Window For A Contact Via
App 20220285206 - Yu; Li-Zhen ; et al. | 2022-09-08 |
Method for fabricating a semiconductor device
Grant 11,437,279 - Chen , et al. September 6, 2 | 2022-09-06 |
Backside Vias in Semiconductor Device
App 20220278213 - Yu; Li-Zhen ; et al. | 2022-09-01 |
Semiconductor devices with backside contacts and isolation
Grant 11,430,789 - Chen , et al. August 30, 2 | 2022-08-30 |
Semiconductor Device With Backside Gate Isolation Structure And Method For Forming The Same
App 20220271139 - Su; Huan-Chieh ; et al. | 2022-08-25 |
Backside Gate Contact
App 20220271138 - Su; Huan-Chieh ; et al. | 2022-08-25 |
Method For Fabricating A Semiconductor Device
App 20220270929 - CHEN; Chun-Yuan ; et al. | 2022-08-25 |
Semiconductor Devices Including Metal Gate Protection And Methods Of Fabrication Thereof
App 20220270971 - WANG; Sheng-Tsung ; et al. | 2022-08-25 |
Method For Forming Via Structure Having Low Interface Resistance
App 20220262727 - YU; Li-Zhen ; et al. | 2022-08-18 |
Self-Aligned Etch in Semiconductor Devices
App 20220262794 - Chiu; Yi-Hsun ; et al. | 2022-08-18 |
Semiconductor Device With Gate Cut Feature And Method For Forming The Same
App 20220262915 - Su; Huan-Chieh ; et al. | 2022-08-18 |
Semiconductor device with air gaps and method of fabrication thereof
Grant 11,410,876 - Chang , et al. August 9, 2 | 2022-08-09 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220246464 - HUANG; Lin-Yu ; et al. | 2022-08-04 |
Dumbbell Shaped Self-aligned Capping Layer Over Source/drain Contacts And Method Thereof
App 20220246740 - Huang; Lin-Yu ; et al. | 2022-08-04 |
Capacitance reduction for backside power rail device
Grant 11,404,548 - Yu , et al. August 2, 2 | 2022-08-02 |
Semiconductor Device with Gate Cut Structure and Method of Forming the Same
App 20220238370 - Chen; Chun-Yuan ; et al. | 2022-07-28 |
Gate Contact Structure
App 20220238373 - Chuang; Cheng-Chi ; et al. | 2022-07-28 |
Semiconductor Devices With Air Gate Spacer And Air Gate Cap
App 20220238693 - Chuang; Cheng-Chi ; et al. | 2022-07-28 |
Semiconductor device structure and methods of forming the same
Grant 11,387,233 - Su , et al. July 12, 2 | 2022-07-12 |
Enlarging contact area and process window for a contact via
Grant 11,387,140 - Yu , et al. July 12, 2 | 2022-07-12 |
Semiconductor device structure and methods of forming the same
Grant 11,374,093 - Huang , et al. June 28, 2 | 2022-06-28 |
Using a liner layer to enlarge process window for a contact via
Grant 11,361,986 - Yu , et al. June 14, 2 | 2022-06-14 |
Backside Connection Structures For Nanostructures And Methods Of Forming The Same
App 20220181250 - YU; Li-Zhen ; et al. | 2022-06-09 |
Semiconductor devices with backside power rail and backside self-aligned via
Grant 11,355,601 - Chiang , et al. June 7, 2 | 2022-06-07 |
Self-aligned Contact Structures
App 20220173223 - Yu; Li-Zhen ; et al. | 2022-06-02 |
Backside vias in semiconductor device
Grant 11,349,004 - Yu , et al. May 31, 2 | 2022-05-31 |
Semiconductor Devices With Backside Contacts And Isolation
App 20220165733 - Chen; Chun-Yuan ; et al. | 2022-05-26 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220165846 - HUANG; Lin-Yu ; et al. | 2022-05-26 |
Interconnect Structure
App 20220165659 - Huang; Lin-Yu ; et al. | 2022-05-26 |
Self-aligned etch in semiconductor devices
Grant 11,342,326 - Chiu , et al. May 24, 2 | 2022-05-24 |
Selective liner on backside via and method thereof
Grant 11,342,413 - Huang , et al. May 24, 2 | 2022-05-24 |
Integrated Circuit Interconnect Structures with Air Gaps
App 20220157720 - Yang; Tai-I ; et al. | 2022-05-19 |
Semiconductor Device Having Backside Via And Method Of Fabricating Thereof
App 20220157949 - HUANG; Lin-Yu ; et al. | 2022-05-19 |
Anchor-Shaped Backside Via and Method Thereof
App 20220148964 - Chen; Chun-Yuan ; et al. | 2022-05-12 |
Via structure having a metal hump for low interface resistance
Grant 11,328,990 - Yu , et al. May 10, 2 | 2022-05-10 |
Semiconductor Device With Backside Power Rail And Methods Of Fabrication Thereof
App 20220130991 - YU; Li-Zhen ; et al. | 2022-04-28 |
Gate Cut Structure And Method Of Forming The Same
App 20220131004 - Chen; Chun-Yuan ; et al. | 2022-04-28 |
Backside Power Rail And Methods Of Forming The Same
App 20220130823 - Su; Huan-Chieh ; et al. | 2022-04-28 |
Dumbbell shaped self-aligned capping layer over source/drain contacts and method thereof
Grant 11,316,023 - Huang , et al. April 26, 2 | 2022-04-26 |
Semiconductor device structure and methods of forming the same
Grant 11,309,212 - Huang , et al. April 19, 2 | 2022-04-19 |
Capacitance Reduction For Backside Power Rail Device
App 20220115510 - YU; Li-Zhen ; et al. | 2022-04-14 |
Semiconductor devices with air gate spacer and air gate cap
Grant 11,302,798 - Chuang , et al. April 12, 2 | 2022-04-12 |
Integrated Circuit Structure With Backside Interconnection Structure Having Air Gap
App 20220093448 - YU; Li-Zhen ; et al. | 2022-03-24 |
Semiconductor Devices With Backside Power Rail And Method Thereof
App 20220069076 - Yu; Li-Zhen ; et al. | 2022-03-03 |
Contact via formation
Grant 11,264,326 - Huang , et al. March 1, 2 | 2022-03-01 |
Dual spacer metal patterning
Grant 11,257,673 - Liao , et al. February 22, 2 | 2022-02-22 |
Backside connection structures for nanostructures and methods of forming the same
Grant 11,257,758 - Yu , et al. February 22, 2 | 2022-02-22 |
Self-aligned contact structures
Grant 11,257,926 - Yu , et al. February 22, 2 | 2022-02-22 |
Method for Forming Source/Drain Contacts Utilizing an Inhibitor
App 20220052167 - Huang; Lin-Yu ; et al. | 2022-02-17 |
Fin field effect transistor device structure and method for forming the same
Grant 11,251,305 - Huang , et al. February 15, 2 | 2022-02-15 |
Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via
App 20220045011 - Sio; Kam-Tou ; et al. | 2022-02-10 |
Integrated circuit interconnect structures with air gaps
Grant 11,244,898 - Yang , et al. February 8, 2 | 2022-02-08 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220037191 - HUANG; Lin-Yu ; et al. | 2022-02-03 |
Spacers for Semiconductor Devices Including a Backside Power Rails
App 20220037193 - Yu; Li-Zhen ; et al. | 2022-02-03 |
Spacers for Semiconductor Devices Including Backside Power Rails
App 20220037192 - Yu; Li-Zhen ; et al. | 2022-02-03 |
Semiconductor Structures And Methods Of Forming The Same
App 20220037486 - Huang; Lin-Yu ; et al. | 2022-02-03 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220037190 - HUANG; Lin-Yu ; et al. | 2022-02-03 |
Semiconductor device having backside via and method of fabricating thereof
Grant 11,239,325 - Huang , et al. February 1, 2 | 2022-02-01 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220028780 - HUANG; Lin-Yu ; et al. | 2022-01-27 |
Air Spacers For Semiconductor Devices
App 20220028999 - Chang; Chia-Hao ; et al. | 2022-01-27 |
Semiconductor Device With L-Shape Conductive Feature And Methods Of Forming The Same
App 20220028743 - Chuang; Cheng-Chi ; et al. | 2022-01-27 |
Method for manufacturing an anchor-shaped backside via
Grant 11,233,005 - Chen , et al. January 25, 2 | 2022-01-25 |
Method for Manufacturing an Anchor-Shaped Backside Via
App 20220013453 - Chen; Chun-Yuan ; et al. | 2022-01-13 |
Backside power rail and methods of forming the same
Grant 11,222,892 - Su , et al. January 11, 2 | 2022-01-11 |
Source/drain Contacts And Methods Of Forming Same
App 20210408247 - Yu; Li-Zhen ; et al. | 2021-12-30 |
Backside Connection Structures For Nanostructures And Methods Of Forming The Same
App 20210407900 - YU; Li-Zhen ; et al. | 2021-12-30 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20210407994 - SU; Huan-Chieh ; et al. | 2021-12-30 |
Connector Via Structures For Nanostructures And Methods Of Forming The Same
App 20210408274 - YU; Li-Zhen ; et al. | 2021-12-30 |
Semiconductor Device and Method of Forming Thereof
App 20210408249 - Yu; Li-Zhen ; et al. | 2021-12-30 |
Integrated Circuit Structure With Backside Via Rail
App 20210399109 - SU; Huan-Chieh ; et al. | 2021-12-23 |
Interconnect Structure Having a Multi-Deck Conductive Feature and Method of Forming the Same
App 20210391438 - Chiu; Shih-Chuan ; et al. | 2021-12-16 |
Backside Power Rail And Methods Of Forming The Same
App 20210391325 - Su; Huan-Chieh ; et al. | 2021-12-16 |
Dumbbell Shaped Self-aligned Capping Layer Over Source/drain Contacts And Method Thereof
App 20210391431 - Huang; Lin-Yu ; et al. | 2021-12-16 |
Semiconductor device structure having air gap and method for forming the same
Grant 11,201,085 - Chuang , et al. December 14, 2 | 2021-12-14 |
Self-aligned Contact Structures
App 20210384316 - Yu; Li-Zhen ; et al. | 2021-12-09 |
Structure and method for bi-layer self-aligned contact
Grant 11,195,934 - Huang , et al. December 7, 2 | 2021-12-07 |
Semiconductor Devices with Backside Routing and Method of Forming Same
App 20210375761 - Chang; Shang-Wen ; et al. | 2021-12-02 |
Semiconductor Devices with Backside Air Gap Dielectric
App 20210375691 - Chen; Chun-Yuan ; et al. | 2021-12-02 |
Semiconductor Devices with Air Gate Spacer and Air Gate Cap
App 20210376111 - Chuang; Cheng-Chi ; et al. | 2021-12-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20210376092 - YU; Li-Zhen ; et al. | 2021-12-02 |
Semiconductor Device and Method
App 20210376076 - Su; Huan-Chieh ; et al. | 2021-12-02 |
Semiconductor Device with Air Gaps and Method of Fabrication Thereof
App 20210375664 - Chang; Chia-Hao ; et al. | 2021-12-02 |
Contact Via Formation
App 20210375758 - Huang; Lin-Yu ; et al. | 2021-12-02 |
Semiconductor device structure and method for forming the same
Grant 11,177,383 - Chang , et al. November 16, 2 | 2021-11-16 |
Method For Forming Long Channel Back-side Power Rail Device
App 20210351079 - Su; Huan-Chieh ; et al. | 2021-11-11 |
Integrated Circuit And Method For Forming The Same
App 20210343645 - PENG; Shih-Wei ; et al. | 2021-11-04 |
Backside Vias in Semiconductor Device
App 20210336020 - Yu; Li-Zhen ; et al. | 2021-10-28 |
Drain Side Recess For Back-side Power Rail Device
App 20210336019 - Su; Huan-Chieh ; et al. | 2021-10-28 |
Semiconductor Device Having Backside Via And Method Of Fabricating Thereof
App 20210336012 - HUANG; Lin-Yu ; et al. | 2021-10-28 |
Self-Aligned Etch in Semiconductor Devices
App 20210335783 - Chiu; Yi-Hsun ; et al. | 2021-10-28 |
Selective Liner on Backside Via and Method Thereof
App 20210336004 - Huang; Lin-Yu ; et al. | 2021-10-28 |
Integrated circuit and method of manufacturing the same
Grant 11,159,164 - Peng , et al. October 26, 2 | 2021-10-26 |
Semiconductor devices with backside power distribution network and frontside through silicon via
Grant 11,158,580 - Sio , et al. October 26, 2 | 2021-10-26 |
Butted Contacts and Methods of Fabricating the Same in Semiconductor Devices
App 20210328032 - Yu; Li-Zhen ; et al. | 2021-10-21 |
Method for forming source/drain contacts utilizing an inhibitor
Grant 11,152,475 - Huang , et al. October 19, 2 | 2021-10-19 |
Semiconductor device and method of forming same
Grant 11,145,728 - Huang , et al. October 12, 2 | 2021-10-12 |
Contact Formation Method And Related Structure
App 20210305382 - HUANG; Lin-Yu ; et al. | 2021-09-30 |
Air Spacer And Capping Structures In Semiconductor Devices
App 20210305246 - HUANG; Lin-Yu ; et al. | 2021-09-30 |
Semiconductor Devices With Backside Power Rail And Backside Self-aligned Via
App 20210305381 - Chiang; Kuo-Cheng ; et al. | 2021-09-30 |
Enlarging Contact Area And Process Window For A Contact Via
App 20210296162 - Yu; Li-Zhen ; et al. | 2021-09-23 |
Low resistance pickup cells for SRAM
Grant 11,121,138 - Chiu , et al. September 14, 2 | 2021-09-14 |
Local Interconnect Structure
App 20210280607 - CHEN; Chih-Liang ; et al. | 2021-09-09 |
Using A Liner Layer To Enlarge Process Window For A Contact Via
App 20210280454 - Yu; Li-Zhen ; et al. | 2021-09-09 |
Semiconductor Device Including Recessed Interconnect Structure
App 20210272895 - Wu; Guo-Huei ; et al. | 2021-09-02 |
Method for Forming Source/Drain Contacts Utilizing an Inhibitor
App 20210273062 - Huang; Lin-Yu ; et al. | 2021-09-02 |
Semiconductor Device Structure Having Air Gap And Method For Forming The Same
App 20210265218 - CHUANG; Chia-Lin ; et al. | 2021-08-26 |
Semiconductor device and manufacturing method thereof
Grant 11,094,788 - Yu , et al. August 17, 2 | 2021-08-17 |
Semiconductor Device Structure And Method For Forming The Same
App 20210249537 - CHANG; Chia-Hao ; et al. | 2021-08-12 |
Structure and formation method of interconnection structure of semiconductor device
Grant 11,088,020 - Yang , et al. August 10, 2 | 2021-08-10 |
Structure And Formation Method Of Semiconductor Device With Stacked Conductive Structures
App 20210225697 - CHEN; Chun-Yuan ; et al. | 2021-07-22 |
Structure and Method for Transistors Having Backside Power Rails
App 20210202385 - Huang; Yu-Xuan ; et al. | 2021-07-01 |
Standard Cells Having Via Rail And Deep Via Structures
App 20210183772 - LIN; Wei-Cheng ; et al. | 2021-06-17 |
Interconnect Structure With Air-gaps
App 20210159175 - Yang; Tai-I ; et al. | 2021-05-27 |
Local interconnect structure
Grant 11,018,157 - Chen , et al. May 25, 2 | 2021-05-25 |
Isolation Structure For Metal Interconnect
App 20210134669 - HUANG; Lin-Yu ; et al. | 2021-05-06 |
Increasing Device Density And Reducing Cross-talk Spacer Structures
App 20210134944 - Su; Huan-Chieh ; et al. | 2021-05-06 |
Semiconductor Device And Method Of Forming Same
App 20210134969 - Huang; Lin-Yu ; et al. | 2021-05-06 |
Fin Field Effect Transistor Device Structure And Method For Forming The Same
App 20210126129 - HUANG; Lin-Yu ; et al. | 2021-04-29 |
Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via
App 20210118805 - SIO; Kam-Tou ; et al. | 2021-04-22 |
Contact Features and Methods of Fabricating the Same in Semiconductor Devices
App 20210098364 - Yu; Li-Zhen ; et al. | 2021-04-01 |
Via Structure Having Low Interface Resistance And Method For Forming The Same
App 20210098368 - YU; Li-Zhen ; et al. | 2021-04-01 |
Integrated Circuit And Method Of Manufacturing The Same
App 20210083668 - PENG; Shih-Wei ; et al. | 2021-03-18 |
Gate Spacer With Air Gap For Semiconductor Device Structure And Method For Forming The Same
App 20210083067 - Wang; Sheng-Tsung ; et al. | 2021-03-18 |
Structure And Method For Bi-layer Self-aligned Contact
App 20210066470 - Huang; Lin-Yu ; et al. | 2021-03-04 |
Advanced Metal Connection With Metal Cut
App 20210066182 - Chen; Chih-Liang ; et al. | 2021-03-04 |
Gate spacer with air gap for semiconductor device structure and method for forming the same
Grant 10,937,884 - Wang , et al. March 2, 2 | 2021-03-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20210057530 - YU; Li-Zhen ; et al. | 2021-02-25 |
Standard cells having via rail and deep via structures
Grant 10,930,595 - Lin , et al. February 23, 2 | 2021-02-23 |
Interconnect structure with air-gaps
Grant 10,923,424 - Yang , et al. February 16, 2 | 2021-02-16 |
Semiconductor Device Structure Having a Multi-Layer Conductive Feature and Method Making the Same
App 20210035906 - Chen; Chun-Yuan ; et al. | 2021-02-04 |
Self aligned via and method for fabricating the same
Grant 10,879,120 - Chen , et al. December 29, 2 | 2020-12-29 |
Advanced metal connection with metal cut
Grant 10,847,460 - Chen , et al. November 24, 2 | 2020-11-24 |
Hybrid copper structure for advance interconnect usage
Grant 10,818,597 - Liu , et al. October 27, 2 | 2020-10-27 |
Integrated circuit and method of manufacturing the same
Grant 10,784,869 - Peng , et al. Sept | 2020-09-22 |
Multi-metal fill with self-align patterning
Grant 10,784,155 - Chu , et al. Sept | 2020-09-22 |
Interconnect Structure With Air-gaps
App 20200294919 - Yang; Tai-I ; et al. | 2020-09-17 |
Methods of forming metal layer structures in semiconductor devices
Grant 10,727,113 - Hsiao , et al. | 2020-07-28 |
Interconnect structure with air gaps
Grant 10,700,005 - Yang , et al. | 2020-06-30 |
Dual Spacer Metal Patterning
App 20200168458 - Liao; Yu-Chieh ; et al. | 2020-05-28 |
Methods of Forming Metal Layer Structures in Semiconductor Devices
App 20200111702 - Hsiao; Ethan ; et al. | 2020-04-09 |
Contact Structure, Method, Layout, And System
App 20200105660 - SIO; Kam-Tou ; et al. | 2020-04-02 |
Multi-Metal Fill with Self-Align Patterning
App 20200051853 - Chu; Wei-Chen ; et al. | 2020-02-13 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200035612 - HO; POKUAN ; et al. | 2020-01-30 |
Advanced Metal Connection With Metal Cut
App 20200020625 - Chen; Chih-Liang ; et al. | 2020-01-16 |
Integrated Circuit And Method Of Manufacturing The Same
App 20200021292 - PENG; Shih-Wei ; et al. | 2020-01-16 |
Integrated Circuit Interconnect Structures with Air Gaps
App 20200006228 - Yang; Tai-I ; et al. | 2020-01-02 |
Methods of forming metal layer structures in semiconductor devices
Grant 10,504,775 - Hsiao , et al. Dec | 2019-12-10 |
Methods of Forming Metal Layer Structures in Semiconductor Devices
App 20190371655 - Hsiao; Ethan ; et al. | 2019-12-05 |
Multi-metal fill with self-align patterning
Grant 10,483,159 - Chu , et al. Nov | 2019-11-19 |
Advanced metal connection with metal cut
Grant 10,468,349 - Chen , et al. No | 2019-11-05 |
Interconnect Structure With Air-gaps
App 20190252319 - Yang; Tai-I ; et al. | 2019-08-15 |
Hybrid Copper Structure For Advance Interconnect Usage
App 20190244897 - Liu; Hsiang-Wei ; et al. | 2019-08-08 |
Hybrid copper structure for advance interconnect usage
Grant 10,290,580 - Liu , et al. | 2019-05-14 |
Interconnect structure with air-gaps
Grant 10,276,498 - Yang , et al. | 2019-04-30 |
Standard Cells Having Via Rail And Deep Via Structures
App 20190096809 - Lin; Wei-Cheng ; et al. | 2019-03-28 |
Local Interconnect Structure
App 20190096909 - Chen; Chih-Liang ; et al. | 2019-03-28 |
Structure And Formation Method Of Interconnection Structure Of Semiconductor Device
App 20190067089 - YANG; Tai-I ; et al. | 2019-02-28 |
Advanced Metal Connection With Metal Cut
App 20190051595 - Chen; Chih-Liang ; et al. | 2019-02-14 |
Multi-metal Fill With Self-align Patterning
App 20180308749 - YANG; Tai-I ; et al. | 2018-10-25 |
Method of semiconductor integrated circuit fabrication
Grant 10,109,519 - Kao , et al. October 23, 2 | 2018-10-23 |
Advanced metal connection with metal cut
Grant 10,109,582 - Chen , et al. October 23, 2 | 2018-10-23 |
Structure and formation method of semiconductor device structure
Grant 10,103,102 - Chen , et al. October 16, 2 | 2018-10-16 |
Passivation structure and method of making the same
Grant 10,049,956 - Chuang , et al. August 14, 2 | 2018-08-14 |
Multi-metal fill with self-align patterning
Grant 10,026,647 - Chu , et al. July 17, 2 | 2018-07-17 |
Multi-metal Fill With Self-align Patterning
App 20180166330 - CHU; Wei-Chen ; et al. | 2018-06-14 |
Self Aligned Via and Method for Fabricating the Same
App 20180151432 - Chen; Chih-Liang ; et al. | 2018-05-31 |
Interconnect Structure With Air-gaps
App 20180138124 - Yang; Tai-I ; et al. | 2018-05-17 |
Structure And Formation Method Of Semiconductor Device Structure
App 20180122739 - CHEN; Jian-Hua ; et al. | 2018-05-03 |
Hybrid Copper Structure For Advance Interconnect Usage
App 20180090439 - Liu; Hsiang-Wei ; et al. | 2018-03-29 |
Interconnect structure with air-gaps
Grant 9,875,967 - Yang , et al. January 23, 2 | 2018-01-23 |
Passivation Structure And Method Of Making The Same
App 20180012817 - CHUANG; Cheng-Chi ; et al. | 2018-01-11 |
Structure and formation method of semiconductor device structure
Grant 9,865,539 - Chen , et al. January 9, 2 | 2018-01-09 |
Hybrid copper structure for advance interconnect usage
Grant 9,837,354 - Liu , et al. December 5, 2 | 2017-12-05 |
Advanced Metal Connection With Metal Cut
App 20170301618 - Chen; Chih-Liang ; et al. | 2017-10-19 |
Structure And Formation Method Of Semiconductor Device Structure
App 20170263548 - CHEN; Jian-Hua ; et al. | 2017-09-14 |
Passivation structure and method of making the same
Grant 9,761,504 - Chuang , et al. September 12, 2 | 2017-09-12 |
Combination interconnect structure and methods of forming same
Grant 9,716,035 - Yang , et al. July 25, 2 | 2017-07-25 |
Interconnect Structure With Air-gaps
App 20170194259 - Yang; Tai-I ; et al. | 2017-07-06 |
Air-gap forming techniques for interconnect structures
Grant 9,633,897 - Yang , et al. April 25, 2 | 2017-04-25 |
Semiconductor arrangement and formation thereof
Grant 9,576,896 - Liao , et al. February 21, 2 | 2017-02-21 |
Method Of Semiconductor Integrated Circuit Fabrication
App 20170018498 - Kao; Hsiang-Lun ; et al. | 2017-01-19 |
Air-gap Forming Techniques For Interconnect Structures
App 20160284593 - Yang; Tai-I ; et al. | 2016-09-29 |
Method of semiconductor integrated circuit fabrication
Grant 9,455,178 - Kao , et al. September 27, 2 | 2016-09-27 |
Semiconductor Arrangement And Formation Thereof
App 20160240477 - Liao; Yu-Chieh ; et al. | 2016-08-18 |
Air-gap forming techniques for interconnect structures
Grant 9,390,965 - Yang , et al. July 12, 2 | 2016-07-12 |
Semiconductor arrangement and formation thereof
Grant 9,349,690 - Liao , et al. May 24, 2 | 2016-05-24 |
Passivation Structure And Method Of Making The Same
App 20160086868 - Chuang; Cheng-Chi ; et al. | 2016-03-24 |
Hybrid Copper Structure for Advance Interconnect Usage
App 20160005691 - Liu; Hsiang-Wei ; et al. | 2016-01-07 |
Combination Interconnect Structure and Methods of Forming Same
App 20150371939 - Yang; Tai-I ; et al. | 2015-12-24 |
Passivation structure and method of making the same
Grant 9,209,102 - Chuang , et al. December 8, 2 | 2015-12-08 |
Semiconductor Arrangement And Formation Thereof
App 20150262937 - Liao; Yu-Chieh ; et al. | 2015-09-17 |
Method of Semiconductor Integrated Circuit Fabrication
App 20150262860 - Kao; Hsiang-Lun ; et al. | 2015-09-17 |
Air-Gap Forming Techniques for Interconnect Structures
App 20150179499 - Yang; Tai-I ; et al. | 2015-06-25 |
Passivation Structure And Method Of Making The Same
App 20150054143 - CHUANG; Cheng-Chi ; et al. | 2015-02-26 |
Passivation scheme
Grant 8,884,405 - Chuang , et al. November 11, 2 | 2014-11-11 |
Apparatus and method for high voltage MOS transistor
Grant 8,766,357 - Tseng , et al. July 1, 2 | 2014-07-01 |
Passivation Scheme
App 20140001607 - CHUANG; Cheng-Chi ; et al. | 2014-01-02 |
Apparatus and Method for High Voltage MOS Transistor
App 20130228873 - Tseng; Chao-Wei ; et al. | 2013-09-05 |
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