CHU; Chi-Chih

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHU; Chi-Chih.The latest application filed is for "semiconductor package and semiconductor device".

Company Profile

0.16.23

CHU; Chi-Chih - Kao-Hsiung City TW
Chu; Chi-Chih - Kaohsiung TW
Chu; Chi-Chih - Hsin-Chu TW
Chu; Chi-Chih - Shiaugang Chiu TW
Chu; Chi-Chih - Kaohsiung City R.O.C. TW
CHU; Chi-Chih - Fengshan City TW
Chu; Chi-Chih - Kao-Hsiung TW
Chu; Chi-chih - Hsin-Chu City TW
Chu; Chi-Chih - Yung Ho TW
Chu, Chi-Chih - Kaohsiung City TW
Chu, Chi-Chih - Yonghe City TW
Chu; Chi-Chih - Taipei Hsien TW
Chu, Chi-Chih - Yung Ho City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package And Semiconductor Device App 20140312496 - WU; Yen-Yi ; et al.	2014-10-23
Semiconductor Package App 20130161816 - Chu; Chi-Chih ; et al.	2013-06-27
Backlight module with bent reflector sheet and display panel device Grant 8,446,546 - Ho , et al. May 21, 2	2013-05-21
Semiconductor package Grant 8,405,212 - Chu , et al. March 26, 2	2013-03-26
Stackable semiconductor device packages Grant 8,198,131 - Weng , et al. June 12, 2	2012-06-12
Stackable Semiconductor Device Packages App 20120049338 - Chen; Kuang-Hsiung ; et al.	2012-03-01
Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors Grant 8,076,765 - Chen , et al. December 13, 2	2011-12-13
Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries Grant 8,012,797 - Shen , et al. September 6, 2	2011-09-06
Semiconductor Package App 20110156251 - Chu; Chi-Chih ; et al.	2011-06-30
Stackable Semiconductor Device Packages App 20110117700 - WENG; CHENG-YI ; et al.	2011-05-19
Backlight module having replaceable light apparatus Grant 7,866,874 - Liu , et al. January 11, 2	2011-01-11
Package Structure And Manufacturing Method Thereof App 20100237490 - CHU; Chi-Chih ; et al.	2010-09-23
Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same App 20100171206 - Chu; Chi-Chih ; et al.	2010-07-08
Stackable Semiconductor Device Packages App 20100171205 - CHEN; Kuang-Hsiung ; et al.	2010-07-08
Stackable Semiconductor Device Packages App 20100171207 - Shen; Chi-Chih ; et al.	2010-07-08
Backlight Module with Bended Reflector Sheet and Display Panel Device Using the Same App 20100014015 - Ho; Ya-Ting ; et al.	2010-01-21
Method of making a semiconductor package and method of making a semiconductor device Grant 7,642,133 - Wu , et al. January 5, 2	2010-01-05
Backlight Module Having Replaceable Light Apparatus App 20090290381 - Liu; Keng-ju ; et al.	2009-11-26
Substrate structure having a solder mask and a process for making the same Grant 7,473,629 - Tai , et al. January 6, 2	2009-01-06
Electronic package structure and the packaging process thereof Grant 7,439,619 - Chu , et al. October 21, 2	2008-10-21
System-in-package structure Grant 7,417,329 - Chuang , et al. August 26, 2	2008-08-26
Semiconductor package and semiconductor device App 20080073769 - Wu; Yen-Yi ; et al.	2008-03-27
Method of making a semiconductor package and method of making a semiconductor device App 20080076208 - Wu; Yen-Yi ; et al.	2008-03-27
System-in-package structure App 20080001272 - Chu; Chi-Chih	2008-01-03
Substrate structure having a solder mask and a process for making the same App 20070243704 - Tai; Wei-Chang ; et al.	2007-10-18
System-in-package Structure App 20070132093 - Chuang; Meng-Jung ; et al.	2007-06-14
Stacked package module Grant 7,187,070 - Chu , et al. March 6, 2	2007-03-06
Semiconductor package Grant 7,126,221 - Weng , et al. October 24, 2	2006-10-24
Frame and bezel structure for backlight unit Grant 6,976,781 - Chu , et al. December 20, 2	2005-12-20
Semiconductor package and method of manufacturing the same App 20050275074 - Weng, Gwo-Liang ; et al.	2005-12-15
Direct backlight module and assembly method thereof App 20050185397 - Chu, Chi-Chih	2005-08-25
Electronic package structure and the packaging process thereof App 20050146054 - Chu, Chi-Chih ; et al.	2005-07-07
Stacked package module App 20050082656 - Chu, Chi Chih ; et al.	2005-04-21
Leading wire arrangement of a lighting fixture in a back light module Grant 6,866,397 - Cheng , et al. March 15, 2	2005-03-15
Assembling structure of backlight unit App 20040080952 - Chu, Chi-Chih ; et al.	2004-04-29
Leading wire arrangement of a lighting fixture in a back light module App 20030165057 - Cheng, Wen-Yuan ; et al.	2003-09-04

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