| Patent | Date |
|---|
C-phy Half-rate Wire State Encoder And Decoder
App 20220158879 - LEE; Chulkyu ; et al. | 2022-05-19 |
C-PHY data-triggered edge generation with intrinsic half-rate operation
Grant 11,327,914 - Ying , et al. May 10, 2 | 2022-05-10 |
C-PHY half-rate wire state encoder and decoder
Grant 11,240,077 - Lee , et al. February 1, 2 | 2022-02-01 |
Small Loop Delay Clock And Data Recovery Block For High-speed Next Generation C-phy
App 20210336760 - DUAN; Ying ; et al. | 2021-10-28 |
Seat
Grant 11,116,319 - Hsiao , et al. September 14, 2 | 2021-09-14 |
Seperation of low-power and high-speed analog front-end receivers
Grant 11,106,610 - Duan , et al. August 31, 2 | 2021-08-31 |
Small loop delay clock and data recovery block for high-speed next generation C-PHY
Grant 11,095,425 - Duan , et al. August 17, 2 | 2021-08-17 |
Open-loop, Super Fast, Half-rate Clock And Data Recovery For Next Generation C-phy Interfaces
App 20210184829 - DUAN; Ying ; et al. | 2021-06-17 |
Open-loop, super fast, half-rate clock and data recovery for next generation C-PHY interfaces
Grant 11,038,666 - Duan , et al. June 15, 2 | 2021-06-15 |
MIPI D-PHY receiver auto rate detection and high-speed settle time control
Grant 11,023,409 - Ahmed , et al. June 1, 2 | 2021-06-01 |
Composition For Cobalt Or Cobalt Alloy Electroplating
App 20210147994 - ARNOLD; Marco ; et al. | 2021-05-20 |
Small Loop Delay Clock And Data Recovery Block For High-speed Next Generation C-phy
App 20210126765 - DUAN; Ying ; et al. | 2021-04-29 |
C-phy Half-rate Wire State Encoder And Decoder
App 20210126819 - LEE; Chulkyu ; et al. | 2021-04-29 |
Mipi D-phy Receiver Auto Rate Detection And High-speed Settle Time Control
App 20210103547 - AHMED; Yasser ; et al. | 2021-04-08 |
Analog Front-end Receivers
App 20210081339 - DUAN; Ying ; et al. | 2021-03-18 |
Low power physical layer driver topologies
Grant 10,833,899 - Chou , et al. November 10, 2 | 2020-11-10 |
Fully compensated complementary duty cycle correction circuits
Grant 10,615,785 - Chou , et al. | 2020-04-07 |
Low Power Physical Layer Driver Topologies
App 20190356519 - CHOU; Shih-Wei ; et al. | 2019-11-21 |
C-PHY training pattern for adaptive equalization, adaptive edge tracking and delay calibration
Grant 10,419,246 - Duan , et al. Sept | 2019-09-17 |
Low power physical layer driver topologies
Grant 10,419,252 - Chou , et al. Sept | 2019-09-17 |
Three-input continuous-time amplifier and equalizer for multi-level signaling
Grant 10,389,315 - Lee , et al. A | 2019-08-20 |
Calibration pattern and duty-cycle distortion correction for clock data recovery in a multi-wire, multi-phase interface
Grant 10,333,690 - Duan , et al. | 2019-06-25 |
Multiphase clock data recovery with adaptive tracking for a multi-wire, multi-phase interface
Grant 10,298,381 - Lee , et al. | 2019-05-21 |
Reducing transmitter encoding jitter in a C-PHY interface using multiple clock phases to launch symbols
Grant 10,289,600 - Sejpal , et al. | 2019-05-14 |
Three-input Continuous-time Amplifier And Equalizer For Multi-level Signaling
App 20180358939 - Lee; Chulkyu ; et al. | 2018-12-13 |
Low Power Physical Layer Driver Topologies
App 20180337698 - CHOU; Shih-Wei ; et al. | 2018-11-22 |
Low Power Physical Layer Driver Topologies
App 20180234122 - Chou; Shih-Wei ; et al. | 2018-08-16 |
Low power physical layer driver topologies
Grant 9,998,154 - Chou , et al. June 12, 2 | 2018-06-12 |
Semiconductor device
Grant 9,978,681 - Su , et al. May 22, 2 | 2018-05-22 |
C-phy Training Pattern For Adaptive Equalization, Adaptive Edge Tracking And Delay Calibration
App 20180062883 - Duan; Ying ; et al. | 2018-03-01 |
Intelligent equalization for a three-transmitter multi-phase system
Grant 9,819,523 - Lee , et al. November 14, 2 | 2017-11-14 |
Intelligent Equalization For A Three-transmitter Multi-phase System
App 20170264471 - Lee; Chulkyu ; et al. | 2017-09-14 |
Reducing Transmitter Encoding Jitter In A C-phy Interface Using Multiple Clock Phases To Launch Symbols
App 20170039163 - Sejpal; Dhaval ; et al. | 2017-02-09 |
Low Power Physical Layer Driver Topologies
App 20160373141 - Chou; Shih-Wei ; et al. | 2016-12-22 |
Multiphase clock data recovery for a 3-phase interface
Grant 9,496,879 - Duan , et al. November 15, 2 | 2016-11-15 |
Semiconductor Device
App 20150371943 - SU; Hung-Wen ; et al. | 2015-12-24 |
Semiconductor device and method for forming the same
Grant 9,123,781 - Su , et al. September 1, 2 | 2015-09-01 |
Semiconductor Device And Method For Forming The Same
App 20100230816 - Su; Hung-Wen ; et al. | 2010-09-16 |
Semiconductor device and method for forming the same
Grant 7,749,896 - Su , et al. July 6, 2 | 2010-07-06 |
Method For Making A Thermally-stable Silicide
App 20100151639 - Shue; Shau-Lin ; et al. | 2010-06-17 |
Method for silicide formation on semiconductor devices
Grant 7,446,042 - Wu , et al. November 4, 2 | 2008-11-04 |
Silicide structure for ultra-shallow junction for MOS devices
Grant 7,332,435 - Shih , et al. February 19, 2 | 2008-02-19 |
Method for making a thermally stable silicide
App 20070221993 - Shue; Shau-Lin ; et al. | 2007-09-27 |
Method and apparatus for fabricating metal layer
App 20070181434 - Lee; Hsien-Ming ; et al. | 2007-08-09 |
Method for silicide formation on semiconductor devices
App 20070178696 - Wu; Chii-Ming ; et al. | 2007-08-02 |
Method and apparatus for fabricating metal layer
Grant 7,226,860 - Lee , et al. June 5, 2 | 2007-06-05 |
Semiconductor device and method for forming the same
App 20070052096 - Su; Hung-Wen ; et al. | 2007-03-08 |
Method to improve thermal stability of silicides with additives
App 20060246720 - Wu; Chii-Ming ; et al. | 2006-11-02 |
Novel silicide structure for ultra-shallow junction for MOS devices
App 20060205214 - Shih; Chien-Hsueh ; et al. | 2006-09-14 |
Method to improve palanarity of electroplated copper
App 20060189127 - Chou; Shih-Wei ; et al. | 2006-08-24 |
Method to improve planarity of electroplated copper
Grant 7,064,068 - Chou , et al. June 20, 2 | 2006-06-20 |
Differentially metal doped copper damascenes
App 20060091551 - Lin; Chun-Chieh ; et al. | 2006-05-04 |
Method to remove copper without pattern density effect
Grant 6,995,089 - Chou , et al. February 7, 2 | 2006-02-07 |
Method and apparatus for fabricating metal layer
App 20050245072 - Lee, Hsien-Ming ; et al. | 2005-11-03 |
Method to improve planarity of electroplated copper
App 20050164495 - Chou, Shih-Wei ; et al. | 2005-07-28 |
Cleaning apparatus for ECMD anode pad
Grant 6,893,549 - Chou , et al. May 17, 2 | 2005-05-17 |
Loadlock
App 20050097769 - Lin, Jing-Cheng ; et al. | 2005-05-12 |
Method to remove copper without pattern density effect
App 20040224509 - Chou, Shih-Wei ; et al. | 2004-11-11 |
Method for depositing an adhesion/barrier layer to improve adhesion and contact resistance
Grant 6,803,309 - Chou , et al. October 12, 2 | 2004-10-12 |
Method for reducing surface defects in an electrodeposition process
Grant 6,797,144 - Su , et al. September 28, 2 | 2004-09-28 |
Method for integrating an electrodeposition and electro-mechanical polishing process
Grant 6,793,797 - Chou , et al. September 21, 2 | 2004-09-21 |
Cleaning apparatus for ECMD anode pad
App 20040065549 - Chou, Shih-Wei ; et al. | 2004-04-08 |
Method for improving an electrodeposition process through use of a multi-electrode assembly
Grant 6,706,166 - Chou , et al. March 16, 2 | 2004-03-16 |
Method for depositing an adhesion/barrier layer to improve adhesion and contact resistance
App 20040005775 - Chou, Shih-Wei ; et al. | 2004-01-08 |
Method for reducing wafer edge defects in an electrodeposition process
Grant 6,652,726 - Chou November 25, 2 | 2003-11-25 |
Method For Reducing Wafer Edge Defects In An Electrodeposition Process
App 20030213697 - Chou, Shih-Wei | 2003-11-20 |
Copper back-end-of-line by electropolish
Grant 6,649,513 - Tsai , et al. November 18, 2 | 2003-11-18 |
Method for reducing surface defects in an electrodeposition process
App 20030209444 - Su, Hung-Wen ; et al. | 2003-11-13 |
Method For Improving An Electrodeposition Process Through Use Of A Multi-electrode Assembly
App 20030205477 - Chou, Shih-Wei ; et al. | 2003-11-06 |
Method for integrating an electrodeposition and electro-mechanical polishing process
App 20030183530 - Chou, Shih-Wei ; et al. | 2003-10-02 |
In-situ monitor seed for copper plating
App 20030168345 - Tsai, Minghsing ; et al. | 2003-09-11 |
Network hub
App 20020143910 - Chou, Shih-Wei ; et al. | 2002-10-03 |
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