Chiang; Cheng-Chia

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiang; Cheng-Chia.The latest application filed is for "fabrication method of package on package structure".

Company Profile

0.11.14

Chiang; Cheng-Chia - Taichung TW
Chiang; Cheng-Chia - Taichung Hsien TW
Chiang; Cheng-Chia - Chung Ho TW
Chiang; Cheng-Chia - Chung Ho City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication method of semiconductor package Grant 10,163,662 - Chiang , et al. Dec	2018-12-25
Fabrication Method Of Package On Package Structure App 20180138158 - Tung; Shih-Hao ; et al.	2018-05-17
Package on package structure and fabrication method thereof Grant 9,905,546 - Tung , et al. February 27, 2	2018-02-27
Fabrication Method Of Semiconductor Package App 20170207104 - Chiang; Cheng-Chia ; et al.	2017-07-20
Semiconductor package and fabrication method thereof Grant 9,646,921 - Chiang , et al. May 9, 2	2017-05-09
Method For Fabricating Semiconductor Package App 20160233205 - Wang; Lung-Yuan ; et al.	2016-08-11
Semiconductor package and fabrication method thereof Grant 9,356,008 - Chiang , et al. May 31, 2	2016-05-31
Package on package structure and fabrication method thereof Grant 9,343,387 - Hsu , et al. May 17, 2	2016-05-17
Semiconductor package and fabrication method thereof Grant 9,343,421 - Wang , et al. May 17, 2	2016-05-17
Semiconductor Package And Fabrication Method Thereof App 20160020195 - Chiang; Cheng-Chia ; et al.	2016-01-21
Package On Package Structure And Fabrication Method Thereof App 20150255360 - Hsu; Chu-Chi ; et al.	2015-09-10
Semiconductor Package And Fabrication Method Thereof App 20150200169 - Wang; Lung-Yuan ; et al.	2015-07-16
Package On Package Structure And Fabrication Method Thereof App 20150187741 - Tung; Shih-Hao ; et al.	2015-07-02
Semiconductor Package And Fabrication Method Thereof App 20150187722 - Chiang; Cheng-Chia ; et al.	2015-07-02
Semiconductor Package And Fabrication Method Thereof And Substrate And Packaging Structure App 20150123287 - Hsu; Chu-Chi ; et al.	2015-05-07
Semiconductor Package And Fabrication Method Thereof App 20150041972 - Shih; Chia-Kai ; et al.	2015-02-12
Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure Grant 8,802,507 - Chiang , et al. August 12, 2	2014-08-12
Fabrication Method Of Semiconductor Package Device, And Fabrication Method Of Semiconductor Package Structure App 20130059418 - Chiang; Cheng-Chia ; et al.	2013-03-07
Semiconductor package device, semiconductor package structure, and fabrication methods thereof Grant 8,304,891 - Chiang , et al. November 6, 2	2012-11-06
TV card with power-switching function Grant 7,857,228 - Chiang , et al. December 28, 2	2010-12-28
Semiconductor package device, semiconductor package structure, and fabrication methods thereof App 20090294959 - Chiang; Cheng-Chia ; et al.	2009-12-03
TV Card with Power-Switching Function App 20090147136 - Chiang; Cheng-Chia ; et al.	2009-06-11
Semiconductor Device and Method for Fabricating the Same App 20080258306 - Chang; Chin-Huang ; et al.	2008-10-23
Digital memory card Grant D498,760 - Chiang , et al. November 23, 2	2004-11-23
Digital memory card Grant D493,799 - Chiang , et al. August 3, 2	2004-08-03

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