| Patent | Date |
|---|
Integrated Circuit Package and Method
App 20220310470 - Chen; Hsien-Wei ; et al. | 2022-09-29 |
Bonding to Alignment marks with Dummy Alignment Marks
App 20220310554 - Chen; Hsien-Wei ; et al. | 2022-09-29 |
Semiconductor device and method of manufacture
Grant 11,456,240 - Yu , et al. September 27, 2 | 2022-09-27 |
Package Structure
App 20220302070 - Yeh; Sung-Feng ; et al. | 2022-09-22 |
Semiconductor Die Connection System and Method
App 20220302062 - Chen; Ming-Fa ; et al. | 2022-09-22 |
Integrated Circuit Package and Method of Forming Thereof
App 20220301890 - Chen; Hsien-Wei ; et al. | 2022-09-22 |
Package Structure For Heat Dissipation
App 20220301973 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20220302034 - Chen; Ming-Fa ; et al. | 2022-09-22 |
Integrated circuit component and package structure having the same
Grant 11,450,579 - Liu , et al. September 20, 2 | 2022-09-20 |
Die Stack Structure And Manufacturing Method Thereof
App 20220293568 - Yu; Chen-Hua ; et al. | 2022-09-15 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20220293560 - Chen; Ming-Fa ; et al. | 2022-09-15 |
Integrated circuit package and method
Grant 11,443,995 - Yu , et al. September 13, 2 | 2022-09-13 |
Package, Optical Device, And Manufacturing Method Of Package
App 20220283368 - Chen; Hsien-Wei ; et al. | 2022-09-08 |
Manufacturing Method Of Three-dimensional Stacking Structure
App 20220285324 - Chen; Hsien-Wei ; et al. | 2022-09-08 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220285279 - Yang; Ching-Jung ; et al. | 2022-09-08 |
Wafer on Wafer Bonding Structure
App 20220278074 - Chen; Ming-Fa ; et al. | 2022-09-01 |
Semiconductor Device and Method of Manufacturing
App 20220278063 - Hu; Chih-Chia ; et al. | 2022-09-01 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220271014 - Chen; Ying-Ju ; et al. | 2022-08-25 |
Microelectromechanical Heating Device
App 20220267143 - CHEN; Ming-Fa ; et al. | 2022-08-25 |
Manufacturing Method Of Package
App 20220271012 - Chen; Ming-Fa ; et al. | 2022-08-25 |
Semiconductor devices and methods of manufacture
Grant 11,424,191 - Chen , et al. August 23, 2 | 2022-08-23 |
Semiconductor Structure
App 20220260776 - Chen; Hsien-Wei ; et al. | 2022-08-18 |
Through-Dielectric Vias for Direct Connection and Method Forming Same
App 20220262766 - Chen; Ming-Fa ; et al. | 2022-08-18 |
Inactive Structure On Soic
App 20220262768 - Chen; Ming-Fa ; et al. | 2022-08-18 |
Semiconductor Package With Shared Barrier Layer In Redistribution And Via And Method Of Manufacturing The Same
App 20220262772 - Chen; Hsien-Wei ; et al. | 2022-08-18 |
Package And Manufacturing Method Thereof
App 20220262771 - Chen; Hsien-Wei ; et al. | 2022-08-18 |
Three-dimensional stacking structure and manufacturing method thereof
Grant 11,417,629 - Chen , et al. August 16, 2 | 2022-08-16 |
Package structure and method of fabricating the same
Grant 11,417,587 - Chen , et al. August 16, 2 | 2022-08-16 |
Package and manufacturing method thereof
Grant 11,417,619 - Chen , et al. August 16, 2 | 2022-08-16 |
Semiconductor device and method of manufacture
Grant 11,410,929 - Chang , et al. August 9, 2 | 2022-08-09 |
Package Structure With Photonic Die And Method
App 20220246502 - Chen; Hsien-Wei ; et al. | 2022-08-04 |
Package Having Different Metal Densities In Different Regions And Manufacturing Method Thereof
App 20220246524 - Chen; Hsien-Wei ; et al. | 2022-08-04 |
Package Structure And Manufacturing Method Thereof
App 20220246573 - Chen; Ming-Fa ; et al. | 2022-08-04 |
Semiconductor Devices and Methods of Manufacture
App 20220246598 - Chen; Ming-Fa ; et al. | 2022-08-04 |
Semiconductor structure having photonic die and electronic die
Grant 11,404,404 - Chen , et al. August 2, 2 | 2022-08-02 |
Semiconductor Packaging And Methods Of Forming Same
App 20220238484 - Chen; Hsien-Wei ; et al. | 2022-07-28 |
Methods of Forming Semiconductor Device Packages
App 20220238398 - Yu; Chen-Hua ; et al. | 2022-07-28 |
Die Stack Structure And Manufacturing Method Thereof
App 20220230996 - Chen; Hsien-Wei ; et al. | 2022-07-21 |
Semiconductor Packages And Methods Of Forming The Same
App 20220223553 - Chen; Ming-Fa ; et al. | 2022-07-14 |
Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20220223564 - Chen; Hsien-Wei ; et al. | 2022-07-14 |
Package Structure
App 20220223557 - Chen; Hsien-Wei ; et al. | 2022-07-14 |
Package And Method Of Fabricating The Same
App 20220223565 - Chen; Hsien-Wei ; et al. | 2022-07-14 |
Semiconductor die connection system and method
Grant 11,387,205 - Chen , et al. July 12, 2 | 2022-07-12 |
Package structure
Grant 11,387,209 - Yeh , et al. July 12, 2 | 2022-07-12 |
Semiconductor Package And Manufacturing Method Of The Same
App 20220216146 - CHEN; MING-FA ; et al. | 2022-07-07 |
Integrated circuit package and method of forming same
Grant 11,380,598 - Chen , et al. July 5, 2 | 2022-07-05 |
Die stack structure and manufacturing method thereof
Grant 11,380,653 - Yu , et al. July 5, 2 | 2022-07-05 |
Method Of Manufacturing Semiconductor Structure
App 20220208725 - CHEN; MING-FA ; et al. | 2022-06-30 |
Package and manufacturing method thereof
Grant 11,373,981 - Chen , et al. June 28, 2 | 2022-06-28 |
Semiconductor structure and manufacturing method thereof
Grant 11,373,953 - Yang , et al. June 28, 2 | 2022-06-28 |
Package, optical device, and manufacturing method of package
Grant 11,372,160 - Chen , et al. June 28, 2 | 2022-06-28 |
Microelectromechanical Infrared Sensing Device
App 20220196479 - LEE; BOR-SHIUN ; et al. | 2022-06-23 |
Microelectromechanical infrared sensing device
Grant 11,366,015 - Lee , et al. June 21, 2 | 2022-06-21 |
Package Structure And Method Of Fabricating The Same
App 20220189918 - Chen; Ming-Fa ; et al. | 2022-06-16 |
Microelectromechanical infrared sensing apparatus having stoppers
Grant 11,359,970 - Lee , et al. June 14, 2 | 2022-06-14 |
Semiconductor package with shared barrier layer in redistribution and via
Grant 11,362,064 - Chen , et al. June 14, 2 | 2022-06-14 |
Three-dimensional stacking structure and manufacturing method thereof
Grant 11,362,069 - Chen , et al. June 14, 2 | 2022-06-14 |
Package and manufacturing method thereof
Grant 11,362,065 - Chen , et al. June 14, 2 | 2022-06-14 |
Semiconductor structure and manufacturing method thereof
Grant 11,362,066 - Chen , et al. June 14, 2 | 2022-06-14 |
Package structure for heat dissipation
Grant 11,362,013 - Yu , et al. June 14, 2 | 2022-06-14 |
Die Stack Structure, Semiconductor Structure And Method Of Fabricating The Same
App 20220181301 - Chen; Ming-Fa ; et al. | 2022-06-09 |
Stacked Die Structure And Method Of Fabricating The Same
App 20220173077 - Chen; Jie ; et al. | 2022-06-02 |
Package Structure
App 20220173070 - Chen; Hsien-Wei ; et al. | 2022-06-02 |
Bonding Structure And Method Of Forming Same
App 20220173059 - Chen; Ming-Fa ; et al. | 2022-06-02 |
Semiconductor structure and method of fabricating the same
Grant 11,347,001 - Chen , et al. May 31, 2 | 2022-05-31 |
Semiconductor Structure Having An Anti-arcing Pattern Disposed On A Passivation Layer And Method Of Fabricating The Semiconductor Structure
App 20220165633 - Kuo; Sheng-An ; et al. | 2022-05-26 |
Package structure and manufacturing method thereof
Grant 11,342,297 - Chen , et al. May 24, 2 | 2022-05-24 |
Semiconductor device and method of manufacturing
Grant 11,335,656 - Hu , et al. May 17, 2 | 2022-05-17 |
Integrating Passive Devices in Package Structures
App 20220139885 - Hu; Chih-Chia ; et al. | 2022-05-05 |
Package Structure And Method Of Manufacturing The Same
App 20220139882 - Chen; Ming-Fa ; et al. | 2022-05-05 |
Methods Of Manufacturing Three-dimensional Integrated Circuit Structures
App 20220139898 - Chen; Hsien-Wei ; et al. | 2022-05-05 |
Package And Manufacturing Method Thereof
App 20220139807 - Chen; Ming-Fa ; et al. | 2022-05-05 |
Package structure and method of fabricating the same
Grant 11,322,477 - Chen , et al. May 3, 2 | 2022-05-03 |
Package structure with photonic die and method
Grant 11,315,855 - Chen , et al. April 26, 2 | 2022-04-26 |
Integrated circuit package having heat dissipation structure
Grant 11309289 - | 2022-04-19 |
Die stack structure and manufacturing method thereof
Grant 11,309,291 - Chen , et al. April 19, 2 | 2022-04-19 |
Method of forming semiconductor device package having dummy devices on a first die
Grant 11,309,223 - Yu , et al. April 19, 2 | 2022-04-19 |
Package having different metal densities in different regions and manufacturing method thereof
Grant 11,309,243 - Chen , et al. April 19, 2 | 2022-04-19 |
Semiconductor structure and manufacturing method thereof
Grant 11,289,450 - Chen , et al. March 29, 2 | 2022-03-29 |
Die Stack Structure And Manufacturing Method Thereof
App 20220093564 - Chen; Hsien-Wei ; et al. | 2022-03-24 |
Semiconductor package and manufacturing method of the same
Grant 11,282,784 - Chen , et al. March 22, 2 | 2022-03-22 |
Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same
App 20220084940 - Chen; Hsien-Wei ; et al. | 2022-03-17 |
System Formed Through Package-In-Package Formation
App 20220077117 - Yu; Chen-Hua ; et al. | 2022-03-10 |
Bonding Structure And Method Of Forming Same
App 20220068860 - Chen; Hsien-Wei ; et al. | 2022-03-03 |
Semiconductor structure and method of fabricating the same
Grant 11,264,362 - Chen , et al. March 1, 2 | 2022-03-01 |
Bond pad structure for semiconductor device and method of forming same
Grant 11,264,343 - Chen , et al. March 1, 2 | 2022-03-01 |
Stacked die structure and method of fabricating the same
Grant 11,257,791 - Chen , et al. February 22, 2 | 2022-02-22 |
Package structure and method of fabricating the same
Grant 11,257,787 - Chen , et al. February 22, 2 | 2022-02-22 |
Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure
Grant 11,251,100 - Kuo , et al. February 15, 2 | 2022-02-15 |
Semiconductor Package And Manufacturing Method Of Semiconductor Package
App 20220037566 - Chen; Ming-Fa ; et al. | 2022-02-03 |
Integrating passive devices in package structures
Grant 11,239,205 - Hu , et al. February 1, 2 | 2022-02-01 |
Three-dimensional integrated circuit structures and methods of manufacturing the same
Grant 11,239,225 - Chen , et al. February 1, 2 | 2022-02-01 |
Package structure and method of manufacturing the same
Grant 11,233,035 - Chen , et al. January 25, 2 | 2022-01-25 |
Multi-Liner TSV Structure and Method Forming Same
App 20220020675 - Chen; Ming-Fa ; et al. | 2022-01-20 |
Package and manufacturing method thereof
Grant 11,227,812 - Chen , et al. January 18, 2 | 2022-01-18 |
Method Of Manufacturing Integrated Circuit Having Through-substrate Via
App 20220012402 - Hu; Chih-Chia ; et al. | 2022-01-13 |
Semiconductor Devices and Methods of Manufacture
App 20210407920 - Chen; Hsien-Wei ; et al. | 2021-12-30 |
Methods Of Forming Semiconductor Structure
App 20210398973 - Chen; Hsien-Wei ; et al. | 2021-12-23 |
Package Structures And Methods Of Fabricating The Same
App 20210391322 - Chen; Ming-Fa ; et al. | 2021-12-16 |
Structure And Method For Forming Integrated High Density Mim Capacitor
App 20210391413 - Chen; Hsien-Wei ; et al. | 2021-12-16 |
Semiconductor Package And Manufacturing Method Thereof
App 20210384147 - Chen; Hsien-Wei ; et al. | 2021-12-09 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20210384164 - Chen; Ming-Fa ; et al. | 2021-12-09 |
Bonding structure and method of forming same
Grant 11,195,810 - Chen , et al. December 7, 2 | 2021-12-07 |
Semiconductor structure
Grant 11,195,804 - Chen , et al. December 7, 2 | 2021-12-07 |
Semiconductor Package and Method for Manufacturing the Same
App 20210375721 - Chen; Hsien-Wei ; et al. | 2021-12-02 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210375846 - Chen; Hsien-Wei ; et al. | 2021-12-02 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210375826 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Package Structure And Method Of Manufacturing The Same
App 20210375827 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Multi-level Stacking Of Wafers And Chips
App 20210375819 - Chen; Ming-Fa ; et al. | 2021-12-02 |
System formed through package-in-package formation
Grant 11,189,599 - Yu , et al. November 30, 2 | 2021-11-30 |
Semiconductor Package And Manufacturing Method Thereof
App 20210364710 - Chen; Hsien-Wei ; et al. | 2021-11-25 |
Semiconductor Device that Uses Bonding Layer to Join Semiconductor Substrates Together
App 20210366893 - Chen; Ming-Fa ; et al. | 2021-11-25 |
Functional component within interconnect structure of semiconductor device and method of forming same
Grant 11,183,454 - Chen , et al. November 23, 2 | 2021-11-23 |
Methods Of Forming Semiconductor Packages With Shortened Talking Path
App 20210358821 - Chen; Hsien-Wei ; et al. | 2021-11-18 |
System on Integrated Chips and Methods of Forming Same
App 20210343680 - Yeh; Sung-Feng ; et al. | 2021-11-04 |
Semiconductor structure and method manufacturing the same
Grant 11,164,848 - Chen , et al. November 2, 2 | 2021-11-02 |
Passivation Scheme Design For Wafer Singulation
App 20210335722 - Chen; Hsien-Wei ; et al. | 2021-10-28 |
Integrated Circuits
App 20210335735 - Chen; Hsien-Wei ; et al. | 2021-10-28 |
Manufacturing Method Of Semiconductor Structure
App 20210327789 - Hu; Chih-Chia ; et al. | 2021-10-21 |
Manufacturing Method Of Semiconductor Structure
App 20210327807 - Chen; Ming-Fa ; et al. | 2021-10-21 |
Method Of Manufacturing Semiconductor Package Structure
App 20210313309 - Chen; Yi-Hsiu ; et al. | 2021-10-07 |
Package Structure With Photonic Die And Method
App 20210313254 - Chen; Hsien-Wei ; et al. | 2021-10-07 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210311252 - Chen; Hsien-Wei ; et al. | 2021-10-07 |
Semiconductor Device And Method
App 20210305094 - Chen; Ming-Fa ; et al. | 2021-09-30 |
Packaged Device With Optical Pathway
App 20210302654 - Chen; Hsien-Wei ; et al. | 2021-09-30 |
Package
App 20210305214 - Chen; Ming-Fa ; et al. | 2021-09-30 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210305209 - Chen; Ying-Ju ; et al. | 2021-09-30 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210296288 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Semiconductor Packages
App 20210296251 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Integrated Circuit Package and Method
App 20210288030 - Chen; Ming-Fa ; et al. | 2021-09-16 |
Integrated circuit device with through interconnect via and methods of manufacturing the same
Grant 11,121,084 - Chen , et al. September 14, 2 | 2021-09-14 |
Semiconductor Structure And Method For Manufacturing The Same
App 20210280544 - CHEN; MING-FA ; et al. | 2021-09-09 |
Semiconductor Die, Manufacturing Method Thereof, And Semiconductor Package
App 20210280487 - Chen; Jie ; et al. | 2021-09-09 |
3DIC structure and method of fabricating the same
Grant 11,114,433 - Chen , et al. September 7, 2 | 2021-09-07 |
Stacking structure, package structure and method of fabricating the same
Grant 11,114,413 - Chen , et al. September 7, 2 | 2021-09-07 |
Semiconductor package and manufacturing method thereof
Grant 11,107,779 - Chen , et al. August 31, 2 | 2021-08-31 |
Package And Manufacturing Method Thereof
App 20210265313 - Chen; Hsien-Wei ; et al. | 2021-08-26 |
Semiconductor Structure
App 20210257340 - Chen; Hsien-Wei ; et al. | 2021-08-19 |
Semiconductor structure and manufacturing method thereof
Grant 11,094,613 - Hu , et al. August 17, 2 | 2021-08-17 |
Three-dimensional Stacking Structure And Manufacturing Method Thereof
App 20210249380 - Chen; Ming-Fa ; et al. | 2021-08-12 |
Semiconductor packages with shortened talking path
Grant 11,088,041 - Chen , et al. August 10, 2 | 2021-08-10 |
Semiconductor device that uses bonding layer to join semiconductor substrates together
Grant 11,088,131 - Chen , et al. August 10, 2 | 2021-08-10 |
Package, Optical Device, And Manufacturing Method Of Package
App 20210239904 - Chen; Hsien-Wei ; et al. | 2021-08-05 |
Layout design of integrated circuit with through-substrate via
Grant 11,080,455 - Hu , et al. August 3, 2 | 2021-08-03 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20210225750 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor structure and manufacturing method thereof
Grant 11,069,608 - Chen , et al. July 20, 2 | 2021-07-20 |
System on integrated chips and methods of forming same
Grant 11,069,658 - Yeh , et al. July 20, 2 | 2021-07-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210217710 - LIU; TZUAN-HORNG ; et al. | 2021-07-15 |
Package structure, chip structure and method of fabricating the same
Grant 11,063,019 - Chen , et al. July 13, 2 | 2021-07-13 |
Package and manufacturing method of reconstructed wafer
Grant 11,063,022 - Chen , et al. July 13, 2 | 2021-07-13 |
Integrated Circuit Component And Package Structure Having The Same
App 20210210395 - Liu; Tzuan-Horng ; et al. | 2021-07-08 |
Semiconductor packages and method of forming the same
Grant 11,056,438 - Chen , et al. July 6, 2 | 2021-07-06 |
Microelectromechanical Apparatus Having Hermitic Chamber
App 20210198101 - LEE; Bor-Shiun ; et al. | 2021-07-01 |
Package Structure
App 20210202438 - Liu; Tzuan-Horng ; et al. | 2021-07-01 |
Buffer Design for Package Integration
App 20210202463 - Chen; Jie ; et al. | 2021-07-01 |
Microelectromechanical Infrared Sensing Apparatus Having Stoppers
App 20210190595 - LEE; BOR-SHIUN ; et al. | 2021-06-24 |
Semiconductor component, package structure and manufacturing method thereof
Grant 11,043,482 - Chen , et al. June 22, 2 | 2021-06-22 |
Method of manufacturing semiconductor package structure
Grant 11,043,481 - Chen , et al. June 22, 2 | 2021-06-22 |
Package Structure for Heat Dissipation
App 20210175143 - Yu; Chen-Hua ; et al. | 2021-06-10 |
Semiconductor Device and Method of Manufacture
App 20210175154 - Hu; Chih-Chia ; et al. | 2021-06-10 |
Mixing organic materials into hybrid packages
Grant 11,031,354 - Chen , et al. June 8, 2 | 2021-06-08 |
3DIC Architecture with Interposer or Bonding Dies
App 20210167018 - Hu; Hsien-Pin ; et al. | 2021-06-03 |
Integrated circuit package and method
Grant 11,024,605 - Chen , et al. June 1, 2 | 2021-06-01 |
Integrated circuit package and method of forming same
Grant 11,018,066 - Chen , et al. May 25, 2 | 2021-05-25 |
Semiconductor structure and method for manufacturing the same
Grant 11,018,104 - Chen , et al. May 25, 2 | 2021-05-25 |
Semiconductor die, manufacturing method thereof, and semiconductor package
Grant 11,018,070 - Chen , et al. May 25, 2 | 2021-05-25 |
Integrated Circuit Package and Method of Forming Same
App 20210151412 - Chen; Ming-Fa ; et al. | 2021-05-20 |
3DIC formation with dies bonded to formed RDLs
Grant 11,004,826 - Yu , et al. May 11, 2 | 2021-05-11 |
Semiconductor Structures and Methods of Forming the Same
App 20210134730 - Yu; Chen-Hua ; et al. | 2021-05-06 |
Package Structure And Method Of Fabricating The Same
App 20210134704 - Chen; Hsien-Wei ; et al. | 2021-05-06 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210134685 - Chen; Hsien-Wei ; et al. | 2021-05-06 |
Method of fabricating semiconductor structure
Grant 10,998,293 - Chen , et al. May 4, 2 | 2021-05-04 |
3DIC Formation with Dies Bonded to Formed RDLs
App 20210125968 - Yu; Chen-Hua ; et al. | 2021-04-29 |
Semiconductor Package And Manufacturing Method Thereof
App 20210118827 - Chen; Hsien-Wei ; et al. | 2021-04-22 |
Bonding Structure of Dies with Dangling Bonds
App 20210118832 - Chen; Hsien-Wei ; et al. | 2021-04-22 |
Semiconductor structure and manufacturing method thereof
Grant 10,978,410 - Liu , et al. April 13, 2 | 2021-04-13 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,971,443 - Yu , et al. April 6, 2 | 2021-04-06 |
3D stacked-chip package
Grant 10,971,417 - Yu , et al. April 6, 2 | 2021-04-06 |
Package Structure And Manufacturing Method Thereof
App 20210098409 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Integrated Circuit Package and Method
App 20210098323 - Yu; Chen-Hua ; et al. | 2021-04-01 |
Package Structure And Method Of Manufacturing The Same
App 20210098423 - Chen; Hsien-Wei ; et al. | 2021-04-01 |
Semiconductor Die Package And Method Of Manufacture
App 20210098380 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210098420 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Semiconductor Devices and Methods of Manufacture
App 20210091084 - Yu; Chen-Hua ; et al. | 2021-03-25 |
Package Structure And Method Of Fabricating The Same
App 20210091064 - Chen; Hsien-Wei ; et al. | 2021-03-25 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210090966 - Kuo; Sheng-An ; et al. | 2021-03-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210091022 - Chen; Ming-Fa ; et al. | 2021-03-25 |
Integrated circuit component and package structure having the same
Grant 10,957,610 - Liu , et al. March 23, 2 | 2021-03-23 |
Semiconductor Packages Wiyh Shortened Talking Path
App 20210082779 - Chen; Hsien-Wei ; et al. | 2021-03-18 |
Semiconductor Device and Method of Manufacture
App 20210082816 - Chang; Fong-yuan ; et al. | 2021-03-18 |
Packages with Si-substrate-free Interposer and Method Forming Same
App 20210082857 - Chen; Ming-Fa ; et al. | 2021-03-18 |
Package And Manufacturing Method Of Reconstructed Wafer
App 20210082874 - Chen; Ming-Fa ; et al. | 2021-03-18 |
Package structure
Grant 10,950,576 - Liu , et al. March 16, 2 | 2021-03-16 |
Integrated circuit package and method of forming same
Grant 10,950,579 - Chen , et al. March 16, 2 | 2021-03-16 |
Structure And Formation Method For Chip Package
App 20210074684 - Yu; Chen-Hua ; et al. | 2021-03-11 |
Package Structure With Protective Structure And Method Of Fabricating The Same
App 20210074681 - Chen; Hsien-Wei ; et al. | 2021-03-11 |
Stacked Die Structure And Method Of Fabricating The Same
App 20210066252 - Chen; Jie ; et al. | 2021-03-04 |
Package And Manufacturing Method Thereof
App 20210066168 - Chen; Ming-Fa ; et al. | 2021-03-04 |
Three-dimensional Stacking Structure And Manufacturing Method Thereof
App 20210066255 - Chen; Hsien-Wei ; et al. | 2021-03-04 |
Semicondcutor Packages
App 20210066191 - Chen; Jie ; et al. | 2021-03-04 |
Bonding Structure And Method Of Forming Same
App 20210066222 - Chen; Ming-Fa ; et al. | 2021-03-04 |
Package And Manufacturing Method Thereof
App 20210066248A1 - | 2021-03-04 |
Die Stack Structure And Manufacturing Method Thereof
App 20210066254 - Yu; Chen-Hua ; et al. | 2021-03-04 |
Package And Manufacturing Method Thereof
App 20210066192 - Chen; Hsien-Wei ; et al. | 2021-03-04 |
Mixing organic materials into hybrid packages
Grant 10,937,743 - Chen , et al. March 2, 2 | 2021-03-02 |
Bonding Structure And Method Of Forming Same
App 20210057363 - Chen; Hsien-Wei ; et al. | 2021-02-25 |
Package And Manufacturing Method Thereof
App 20210057362 - Chen; Ming-Fa ; et al. | 2021-02-25 |
Semiconductor Die, Manufacturing Method Thereof, And Semiconductor Package
App 20210057303 - Chen; Jie ; et al. | 2021-02-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210057309 - Hu; Chih-Chia ; et al. | 2021-02-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210057332 - Chen; Ming-Fa ; et al. | 2021-02-25 |
Semiconductor device and method of manufacture
Grant 10,930,580 - Hu , et al. February 23, 2 | 2021-02-23 |
Buffer design for package integration
Grant 10,930,633 - Chen , et al. February 23, 2 | 2021-02-23 |
Die Stack Structure
App 20210050331 - Chen; Jie ; et al. | 2021-02-18 |
Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
Grant 10,923,431 - Hu , et al. February 16, 2 | 2021-02-16 |
Package structure and method of manufacturing the same
Grant 10,923,421 - Chen , et al. February 16, 2 | 2021-02-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210043576 - Yang; Ching-Jung ; et al. | 2021-02-11 |
Semiconductor Structure And Method For Manufacturing The Same
App 20210035935 - CHEN; MING-FA ; et al. | 2021-02-04 |
Integrated Circuit Device With Through Interconnect Via And Methods Of Manufacturing The Same
App 20210035907 - Chen; Hsien-Wei ; et al. | 2021-02-04 |
Three-dimensional Integrated Circuit Structures And Methods Of Manufacturing The Same
App 20210020601 - Chen; Hsien-Wei ; et al. | 2021-01-21 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210020602 - Chen; Ming-Fa ; et al. | 2021-01-21 |
Process Control for Package Formation
App 20210005595 - Chen; Ming-Fa ; et al. | 2021-01-07 |
Semiconductor Device and Method of Manufacturing
App 20210005561 - Hu; Chih-Chia ; et al. | 2021-01-07 |
Semiconductor structure, 3DIC structure and method of fabricating the same
Grant 10,886,245 - Chen , et al. January 5, 2 | 2021-01-05 |
Package And Manufacturing Method Thereof
App 20200411473 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20200411476 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Semiconductor Packages And Method Of Forming The Same
App 20200411445 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Package Structure
App 20200402947 - Yeh; Sung-Feng ; et al. | 2020-12-24 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402942 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402960 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Integrated Circuit Package And Method Of Forming Same
App 20200402875 - Chen; Hsien-Wei ; et al. | 2020-12-24 |
Package structure for heat dissipation
Grant 10,872,836 - Yu , et al. December 22, 2 | 2020-12-22 |
Method Of Fabricating Semiconductor Structure
App 20200395339 - Chen; Hsien-Wei ; et al. | 2020-12-17 |
Heat spreading device and method
Grant 10,867,884 - Yu , et al. December 15, 2 | 2020-12-15 |
Heat spreading device and method
Grant 10,867,885 - Yu , et al. December 15, 2 | 2020-12-15 |
Package structure, package-on-package structure and method of fabricating the same
Grant 10,867,966 - Chen , et al. December 15, 2 | 2020-12-15 |
Semiconductor structures and methods of forming the same
Grant 10,867,929 - Yu , et al. December 15, 2 | 2020-12-15 |
3DIC structure with protective structure and method of fabricating the same
Grant 10,867,968 - Chen , et al. December 15, 2 | 2020-12-15 |
Integrated circuit package and method
Grant 10,867,879 - Yu , et al. December 15, 2 | 2020-12-15 |
Semiconductor Device and Method of Manufacture
App 20200388563 - Yu; Chen-Hua ; et al. | 2020-12-10 |
Bonding structure of dies with dangling bonds
Grant 10,861,808 - Chen , et al. December 8, 2 | 2020-12-08 |
Semiconductor Structure
App 20200381374 - CHEN; YING-JU ; et al. | 2020-12-03 |
Semiconductor Structure, 3dic Structure And Method Of Fabricating The Same
App 20200381379 - Chen; Hsien-Wei ; et al. | 2020-12-03 |
Integrated Circuit Package and Method
App 20200381396 - Chen; Ming-Fa ; et al. | 2020-12-03 |
System Formed Through Package-In-Package Formation
App 20200381397 - Yu; Chen-Hua ; et al. | 2020-12-03 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20200381346 - Chen; Ming-Fa ; et al. | 2020-12-03 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,854,568 - Chen , et al. December 1, 2 | 2020-12-01 |
Forming metal bonds with recesses
Grant 10,854,574 - Chen , et al. December 1, 2 | 2020-12-01 |
Seal Ring for Hybrid-Bond
App 20200373253 - Hu; Chih-Chia ; et al. | 2020-11-26 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200365514 - Yang; Ching-Jung ; et al. | 2020-11-19 |
Semiconductor structure and manufacturing method thereof
Grant 10,840,190 - Yang , et al. November 17, 2 | 2020-11-17 |
Stacked chip package and methods of manufacture thereof
Grant 10,840,217 - Yu , et al. November 17, 2 | 2020-11-17 |
Packages Formed Using RDL-Last Process
App 20200357769 - Chen; Ming-Fa ; et al. | 2020-11-12 |
Package Structure And Method Of Manufacturing The Same
App 20200343183 - Chen; Ying-Ju ; et al. | 2020-10-29 |
Integrated Circuit Packages And Methods Of Forming The Same
App 20200343218 - Hu; Chih-Chia ; et al. | 2020-10-29 |
Package Structure, Package-on-package Structure And Method Of Fabricating The Same
App 20200343223 - Chen; Hsien-Wei ; et al. | 2020-10-29 |
Semiconductor structure
Grant 10,818,615 - Chen , et al. October 27, 2 | 2020-10-27 |
Semiconductor structure and method for manufacturing the same
Grant 10,818,624 - Chen , et al. October 27, 2 | 2020-10-27 |
Through-Silicon Via With Low-K Dielectric Liner
App 20200335428 - Chen; Ming-Fa | 2020-10-22 |
Die stack structure and method of fabricating the same and package
Grant 10,811,390 - Chen , et al. October 20, 2 | 2020-10-20 |
Method of Manufacturing Semiconductor Device that Uses Bonding Layer to Join Semiconductor Substrates Together
App 20200328200 - Chen; Ming-Fa ; et al. | 2020-10-15 |
Method of manufacturing 3DIC structure
Grant 10,797,015 - Yeh , et al. October 6, 2 | 2020-10-06 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20200312758 - Yu; Chen-Hua ; et al. | 2020-10-01 |
Integrated Circuit Package And Method Of Forming Same
App 20200312816 - Chen; Ming-Fa ; et al. | 2020-10-01 |
Semiconductor Package And Manufacturing Method Of The Same
App 20200303301 - CHEN; MING-FA ; et al. | 2020-09-24 |
Process control for package formation
Grant 10,784,247 - Chen , et al. Sept | 2020-09-22 |
Semiconductor device and method of manufacturing
Grant 10,784,219 - Hu , et al. Sept | 2020-09-22 |
Semiconductor Device Package and Method
App 20200294870 - Yu; Chen-Hua ; et al. | 2020-09-17 |
Semiconductor Component, Package Structure And Manufacturing Method Thereof
App 20200294984 - Chen; Ming-Fa ; et al. | 2020-09-17 |
Method Of Manufacturing Semiconductor Package Structure
App 20200286879 - Chen; Yi-Hsiu ; et al. | 2020-09-10 |
Package Structure And Method Of Fabricating The Same
App 20200279831 - Chen; Hsien-Wei ; et al. | 2020-09-03 |
Semiconductor device packaging structure having through interposer vias and through substrate vias
Grant 10,756,010 - Yu , et al. A | 2020-08-25 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,748,841 - Chen , et al. A | 2020-08-18 |
Seal ring for hybrid-bond
Grant 10,741,506 - Hu , et al. A | 2020-08-11 |
Method of manufacturing semiconductor device that uses bonding layer to join semiconductor substrates together
Grant 10,727,217 - Chen , et al. | 2020-07-28 |
Packages formed using RDL-last process
Grant 10,727,201 - Chen , et al. | 2020-07-28 |
Die Stack Structure And Method Of Fabricating The Same And Package
App 20200235073 - Chen; Jie ; et al. | 2020-07-23 |
Through-silicon via with low-K dielectric liner
Grant 10,707,149 - Chen | 2020-07-07 |
Forming metal bonds with recesses
Grant 10,685,935 - Chen , et al. | 2020-06-16 |
Semiconductor package and manufacturing method of the same
Grant 10,685,911 - Chen , et al. | 2020-06-16 |
Integrated circuit package having dummy structures and method of forming same
Grant 10,685,937 - Chen , et al. | 2020-06-16 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,685,910 - Yu , et al. | 2020-06-16 |
Semiconductor Structures And Methods Of Forming The Same
App 20200185330 - Yu; Chen-Hua ; et al. | 2020-06-11 |
Functional Component Within Interconnect Structure Of Semiconductor Device And Method Of Forming Same
App 20200176380 - Chen; Hsien-Wei ; et al. | 2020-06-04 |
Method of forming semiconductor device package having testing pads on a topmost die
Grant 10,672,674 - Yu , et al. | 2020-06-02 |
Semiconductor component, package structure and manufacturing method thereof
Grant 10,672,754 - Chen , et al. | 2020-06-02 |
Method of manufacturing semiconductor package structure
Grant 10,665,582 - Chen , et al. | 2020-05-26 |
Bonding Structure of Dies with Dangling Bonds
App 20200161263 - Chen; Hsien-Wei ; et al. | 2020-05-21 |
Package structure and method of fabricating the same
Grant 10,658,333 - Chen , et al. | 2020-05-19 |
Integrating Passive Devices in Package Structures
App 20200152608 - Hu; Chih-Chia ; et al. | 2020-05-14 |
System on Integrated Chips and Methods of Forming Same
App 20200152604 - Yeh; Sung-Feng ; et al. | 2020-05-14 |
Packages formed using RDL--last process
Grant 10,651,149 - Chen , et al. | 2020-05-12 |
Semiconductor Device and Method of Manufacture
App 20200144160 - Hu; Chih-Chia ; et al. | 2020-05-07 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200126933 - LIU; TZUAN-HORNG ; et al. | 2020-04-23 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200118975 - CHEN; MING-FA ; et al. | 2020-04-16 |
System and Method for Aligned Stitching
App 20200118937 - Hu; Chih-Chia ; et al. | 2020-04-16 |
Semiconductor Device and Method of Manufacture
App 20200118915 - Yu; Chen-Hua ; et al. | 2020-04-16 |
Semiconductor Die Connection System and Method
App 20200118957 - Chen; Ming-Fa ; et al. | 2020-04-16 |
Method for manufacturing semiconductor structure
Grant 10,622,327 - Yu , et al. | 2020-04-14 |
Integrated Circuit Package and Method
App 20200105635 - Yu; Chen-Hua ; et al. | 2020-04-02 |
3dic Structure With Protective Structure And Method Of Fabricating The Same
App 20200098731 - Chen; Hsien-Wei ; et al. | 2020-03-26 |
Packages Formed Using RDL-Last Process
App 20200091113 - Chen; Ming-Fa ; et al. | 2020-03-19 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20200083151 - Chen; Ming-Fa ; et al. | 2020-03-12 |
Package Structure
App 20200051955 - Liu; Tzuan-Horng ; et al. | 2020-02-13 |
Integrated Circuit Component And Package Structure Having The Same
App 20200043816 - Liu; Tzuan-Horng ; et al. | 2020-02-06 |
Package Structure And Method Of Fabricating The Same
App 20200043893 - Chen; Hsien-Wei ; et al. | 2020-02-06 |
System on integrated chips and methods of forming same
Grant 10,541,227 - Yeh , et al. Ja | 2020-01-21 |
Packages formed using RDL-last process
Grant 10,541,228 - Chen , et al. Ja | 2020-01-21 |
3dic Structure And Method Of Fabricating The Same
App 20200020684 - Chen; Hsien-Wei ; et al. | 2020-01-16 |
Integrating passive devices in package structures
Grant 10,535,636 - Hu , et al. Ja | 2020-01-14 |
3D Chip-on-wager-on-substrate structure with via last process
Grant 10,535,631 - Yu , et al. Ja | 2020-01-14 |
Heat Spreading Device and Method
App 20200013697 - Yu; Chen-Hua ; et al. | 2020-01-09 |
Method Of Manufacturing 3dic Structure
App 20200013746 - Yeh; Sung-Feng ; et al. | 2020-01-09 |
Heat Spreading Device and Method
App 20200013698 - Yu; Chen-Hua ; et al. | 2020-01-09 |
Integrated Circuit Package and Method of Forming Same
App 20200006294 - Chen; Ming-Fa ; et al. | 2020-01-02 |
Forming Metal Bonds with Recesses
App 20200006288 - Chen; Ming-Fa ; et al. | 2020-01-02 |
Buffer Design for Package Integration
App 20200006309 - Chen; Jie ; et al. | 2020-01-02 |
Mixing Organic Materials into Hybrid Packages
App 20200006254 - Chen; Ming-Fa ; et al. | 2020-01-02 |
Integrated Circuit Package and Method of Forming Same
App 20200006173 - Chen; Hsien-Wei ; et al. | 2020-01-02 |
Semiconductor Device Package and Method
App 20200006164 - Yu; Chen-Hua ; et al. | 2020-01-02 |
Method of manufacturing a semiconductor device
Grant 10,522,382 - Lu , et al. Dec | 2019-12-31 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,522,449 - Chen , et al. Dec | 2019-12-31 |
3dic Structure With Protective Structure And Method Of Fabricating The Same And Package
App 20190393194 - Chen; Hsien-Wei ; et al. | 2019-12-26 |
Semiconductor device and method of manufacture
Grant 10,515,874 - Hu , et al. Dec | 2019-12-24 |
Integrated Circuit Package Having Dummy Structures And Method Of Forming Same
App 20190385981 - Chen; Ming-Fa ; et al. | 2019-12-19 |
Semiconductor structure and manufacturing method thereof
Grant 10,510,691 - Liu , et al. Dec | 2019-12-17 |
Semiconductor structure and manufacturing method thereof
Grant 10,510,718 - Chen , et al. Dec | 2019-12-17 |
Semiconductor die connection system and method
Grant 10,510,701 - Chen , et al. Dec | 2019-12-17 |
System and method for aligned stitching
Grant 10,510,676 - Hu , et al. Dec | 2019-12-17 |
Bond structures and the methods of forming the same
Grant 10,510,699 - Yu , et al. Dec | 2019-12-17 |
Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias
Grant 10,510,650 - Yu , et al. Dec | 2019-12-17 |
Using serial dilutions of reference samples to construct a reference table for sigmoidal fitting in real-time PCR copy number analysis
Grant 10,510,436 - Wong , et al. Dec | 2019-12-17 |
Integrated circuit package and method of forming same
Grant 10,510,629 - Chen , et al. Dec | 2019-12-17 |
Methods for forming through-substrate vias penetrating inter-layer dielectric
Grant 10,504,776 - Chen , et al. Dec | 2019-12-10 |
3DIC structure with protective structure and method of fabricating the same and package
Grant 10,504,873 - Chen , et al. Dec | 2019-12-10 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20190363045A1 - | 2019-11-28 |
Integrated Circuit Package And Method Of Forming Same
App 20190355637A1 - | 2019-11-21 |
3d Stacked-chip Package
App 20190355640A1 - | 2019-11-21 |
Heat spreading device and method
Grant 10,483,187 - Yu , et al. Nov | 2019-11-19 |
Integrated circuit component and package structure having the same
Grant 10,483,174 - Liu , et al. Nov | 2019-11-19 |
3DIC structure and method of manufacturing the same
Grant 10,475,762 - Yeh , et al. Nov | 2019-11-12 |
3DIC structure and method of manufacturing the same
Grant 10,468,379 - Liu , et al. No | 2019-11-05 |
Mixing Organic Materials Into Hybrid Packages
App 20190333871A1 - | 2019-10-31 |
Semiconductor Component, Package Structure And Manufacturing Method Thereof
App 20190312022A1 - | 2019-10-10 |
Semiconductor Structure
App 20190295964A1 - | 2019-09-26 |
Seal Ring for Hybrid-Bond
App 20190287932A1 - | 2019-09-19 |
3DIC Architecture with Interposer for Bonding Dies
App 20190273046A1 - | 2019-09-05 |
Bond Structures and the Methods of Forming the Same
App 20190252335A1 - | 2019-08-15 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,381,298 - Yu , et al. A | 2019-08-13 |
Semiconductor Device and Method of Manufacture
App 20190244947A1 - | 2019-08-08 |
3D stacked-chip package
Grant 10,373,885 - Yu , et al. | 2019-08-06 |
Semiconductor devices and methods of manufacture thereof
Grant 10,347,607 - Yuan , et al. July 9, 2 | 2019-07-09 |
Semiconductor structure and manufacturing method thereof
Grant 10,325,865 - Chen , et al. | 2019-06-18 |
Semiconductor component, package structure and manufacturing method thereof
Grant 10,319,707 - Chen , et al. | 2019-06-11 |
Seal ring for hybrid-bond
Grant 10,312,201 - Hu , et al. | 2019-06-04 |
Seal Ring for Hybrid-Bond
App 20190164914A1 - | 2019-05-30 |
Semiconductor Device And Method Of Manufacture
App 20190164867A1 - | 2019-05-30 |
System and Method for Aligned Stitching
App 20190164899A1 - | 2019-05-30 |
Semiconductor Device and Method of Manufacturing
App 20190164919A1 - | 2019-05-30 |
3D IC architecture with interposer and interconnect structure for bonding dies
Grant 10,297,550 - Hu , et al. | 2019-05-21 |
Process Control for Package Formation
App 20190148351A1 - | 2019-05-16 |
Forming Metal Bonds with Recesses
App 20190148336A1 - | 2019-05-16 |
Integrating Passive Devices in Package Structures
App 20190148342A1 - | 2019-05-16 |
Structure and Formation Method for Chip Package
App 20190148343A1 - | 2019-05-16 |
Packages with si-substrate-free interposer and method forming same
Grant 10,290,571 - Yu , et al. | 2019-05-14 |
3D Chip-on-Wafer-on-Substrate Structure with Via Last Process
App 20190139933A1 - | 2019-05-09 |
Semiconductor Structure
App 20190139842A1 - | 2019-05-09 |
Method Of Manufacturing Semiconductor Package Structure
App 20190131289A1 - | 2019-05-02 |
Semiconductor Structure And Method For Manufacturing The Same
App 20190123006A1 - | 2019-04-25 |
Bond structures and the methods of forming the same
Grant 10,269,741 - Yu , et al. | 2019-04-23 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20190115321A1 - | 2019-04-18 |
Package Structure for Heat Dissipation
App 20190115277A1 - | 2019-04-18 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20190109083A1 - | 2019-04-11 |
Semiconductor Device and Method of Manufacture
App 20190103390A1 - | 2019-04-04 |
Semiconductor Component, Package Structure And Manufacturing Method Thereof
App 20190096867A1 - | 2019-03-28 |
Packages Formed Using RDL-Last Process
App 20190096852A1 - | 2019-03-28 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20190088581A1 - | 2019-03-21 |
Mixing and transfer device for materials used in biological and biochemical assays
Grant 10,222,307 - Wong , et al. | 2019-03-05 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190067244A1 - | 2019-02-28 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190051621A1 - | 2019-02-14 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190051622A1 - | 2019-02-14 |
System on Integrated Chips and Methods of Forming Same
App 20190027465A1 - | 2019-01-24 |
Heat Spreading Device and Method
App 20190006263A1 - | 2019-01-03 |
Semiconductor structure and method of manufacturing the same
Grant 10,163,799 - Chen , et al. Dec | 2018-12-25 |
Package structure for heat dissipation
Grant 10,163,750 - Yu , et al. Dec | 2018-12-25 |
Structure and formation method for chip package
Grant 10,163,859 - Yu , et al. Dec | 2018-12-25 |
Semiconductor structure and method of manufacturing the same
Grant 10,157,890 - Yu , et al. Dec | 2018-12-18 |
3D chip-on-wafer-on-substrate structure with via last process
Grant 10,157,882 - Yu , et al. Dec | 2018-12-18 |
Interconnect structure and method
Grant 10,157,867 - Chen , et al. Dec | 2018-12-18 |
Semiconductor devices and methods of manufacturing thereof
Grant 10,147,704 - Yuan , et al. De | 2018-12-04 |
Chip-on-wafer package and method of forming same
Grant 10,096,571 - Yu , et al. October 9, 2 | 2018-10-09 |
Semiconductor structure and manufacturing method thereof
Grant 10,074,618 - Chen , et al. September 11, 2 | 2018-09-11 |
System on integrated chips and methods of forming same
Grant 10,074,629 - Yeh , et al. September 11, 2 | 2018-09-11 |
Through-substrate vias and methods for forming the same
Grant 10,049,965 - Chen , et al. August 14, 2 | 2018-08-14 |
3DIC formation with dies bonded to formed RDLs
Grant 10,026,716 - Yu , et al. July 17, 2 | 2018-07-17 |
Semiconductor structure and method of manufacturing the same
Grant 10,014,271 - Yu , et al. July 3, 2 | 2018-07-03 |
Wafer backside interconnect structure connected to TSVs
Grant 9,978,708 - Chen , et al. May 22, 2 | 2018-05-22 |
Three-dimensional integrated circuit structure
Grant 9,899,355 - Yuan , et al. February 20, 2 | 2018-02-20 |
Bond structures and the methods of forming the same
Grant 9,893,028 - Yu , et al. February 13, 2 | 2018-02-13 |
Semiconductor device and manufacturing method thereof
Grant 9,875,982 - Chen , et al. January 23, 2 | 2018-01-23 |
Method of using two-stage nucleic acid reaction and detection tube
Grant 9,873,910 - Wong , et al. January 23, 2 | 2018-01-23 |
Semiconductor structure and a manufacturing method thereof
Grant 9,859,254 - Yu , et al. January 2, 2 | 2018-01-02 |
Two-stage nucleic acid reaction and detection tube
Grant 9,816,136 - Wong , et al. November 14, 2 | 2017-11-14 |
Chip-on-wafer package and method of forming same
Grant 9,806,055 - Yu , et al. October 31, 2 | 2017-10-31 |
Method of manufacturing a semiconductor device
Grant 9,786,540 - Lu , et al. October 10, 2 | 2017-10-10 |
Substrate interconnections having different sizes
Grant 9,773,755 - Shen , et al. September 26, 2 | 2017-09-26 |
Improving the strength of micro-bump joints
Grant 9,768,138 - Shen , et al. September 19, 2 | 2017-09-19 |
3D chip-on-wafer-on-substrate structure with via last process
Grant 9,754,918 - Yu , et al. September 5, 2 | 2017-09-05 |
Semiconductor structure and method of manufacturing the same
Grant 9,741,694 - Yu , et al. August 22, 2 | 2017-08-22 |
Wafer backside interconnect structure connected to TSVs
Grant 9,716,074 - Chen , et al. July 25, 2 | 2017-07-25 |
3D stacked-chip package
Grant 9,711,379 - Yu , et al. July 18, 2 | 2017-07-18 |
3D chip-on-wafer-on-substrate structure with via last process
Grant 9,698,081 - Yu , et al. July 4, 2 | 2017-07-04 |
3D stacked-chip package
Grant 9,666,520 - Yu , et al. May 30, 2 | 2017-05-30 |
Three dimensional integrated circuit structure and method of manufacturing the same
Grant 9,633,917 - Tsai , et al. April 25, 2 | 2017-04-25 |
Three-dimensional integrated circuit structure and bonded structure
Grant 9,620,488 - Yu , et al. April 11, 2 | 2017-04-11 |
Wafer to wafer bonding process and structures
Grant 9,613,926 - Yu , et al. April 4, 2 | 2017-04-04 |
Reticle for non-rectangular die
Grant 9,548,274 - Yu , et al. January 17, 2 | 2017-01-17 |
System on integrated chips and methods of forming same
Grant 9,524,959 - Yeh , et al. December 20, 2 | 2016-12-20 |
Semiconductor die connection system and method
Grant 9,520,340 - Chen , et al. December 13, 2 | 2016-12-13 |
Stacked dies with wire bonds and method
Grant 9,508,703 - Yu , et al. November 29, 2 | 2016-11-29 |
3D chip-on-wafer-on-substrate structure with via last process
Grant 9,449,837 - Yu , et al. September 20, 2 | 2016-09-20 |
Wafer backside interconnect structure connected to TSVs
Grant 9,449,875 - Chen , et al. September 20, 2 | 2016-09-20 |
3-D inductor and transformer
Grant 9,373,673 - Yen , et al. June 21, 2 | 2016-06-21 |
Connecting through vias to devices
Grant 9,355,935 - Chen , et al. May 31, 2 | 2016-05-31 |
Chip-on-wafer package and method of forming same
Grant 9,331,021 - Yu , et al. May 3, 2 | 2016-05-03 |
Controlling the device performance by forming a stressed backside dielectric layer
Grant 9,236,311 - Chen , et al. January 12, 2 | 2016-01-12 |
Strength of micro-bump joints
Grant 9,219,046 - Shen , et al. December 22, 2 | 2015-12-22 |
Semiconductor die connection system and method
Grant 9,153,540 - Chen , et al. October 6, 2 | 2015-10-06 |
Substrate interconnections having different sizes
Grant 9,142,533 - Shen , et al. September 22, 2 | 2015-09-22 |
Connecting through vias to devices
Grant 9,123,702 - Chen , et al. September 1, 2 | 2015-09-01 |
Through-silicon via with low-K dielectric liner
Grant 9,064,940 - Chen June 23, 2 | 2015-06-23 |
3-D inductor and transformer
Grant 9,059,026 - Yen , et al. June 16, 2 | 2015-06-16 |
Controlling the device performance by forming a stressed backside dielectric layer
Grant 8,946,084 - Chen , et al. February 3, 2 | 2015-02-03 |
Strength of micro-bump joints
Grant 8,901,736 - Shen , et al. December 2, 2 | 2014-12-02 |
| 