Chen; Hsien-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Hsien-Wei.The latest application filed is for "bonding to alignment marks with dummy alignment marks".

Company Profile

200.200.200

Chen; Hsien-Wei - Hsinchu TW
Chen; Hsien-Wei - Hsinchu City TW
- Hsinchu TW
Chen; Hsien-Wei - Hsin-Chu TW
Chen; Hsien-Wei - New Taipei TW
Chen; Hsien-Wei - New Taipei City TW
- Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Package and Method App 20220310470 - Chen; Hsien-Wei ; et al.	2022-09-29
Bonding to Alignment marks with Dummy Alignment Marks App 20220310554 - Chen; Hsien-Wei ; et al.	2022-09-29
Semiconductor device and method of manufacture Grant 11,456,240 - Yu , et al. September 27, 2	2022-09-27
Advanced Seal Ring Structure And Method Of Making The Same App 20220302047 - Chen; Hsien-Wei	2022-09-22
Package Structure App 20220302070 - Yeh; Sung-Feng ; et al.	2022-09-22
Integrated Circuit Package and Method of Forming Thereof App 20220301890 - Chen; Hsien-Wei ; et al.	2022-09-22
Semiconductor Package And Manufacturing Method Thereof App 20220302034 - Chen; Ming-Fa ; et al.	2022-09-22
Structure and Method of Forming a Joint Assembly App 20220302069 - Chen; Ying-Ju ; et al.	2022-09-22
Integrated circuit component and package structure having the same Grant 11,450,579 - Liu , et al. September 20, 2	2022-09-20
Die Stack Structure And Manufacturing Method Thereof App 20220293568 - Yu; Chen-Hua ; et al.	2022-09-15
Semiconductor Structure And Method Of Manufacturing The Same App 20220293560 - Chen; Ming-Fa ; et al.	2022-09-15
Semiconductor Structure And Method Of Fabricating The Same App 20220293540 - Chen; Jie ; et al.	2022-09-15
Integrated circuit package and method Grant 11,443,995 - Yu , et al. September 13, 2	2022-09-13
Package structures and methods of forming Grant 11,444,057 - Yu , et al. September 13, 2	2022-09-13
Device and package structure and method of forming the same Grant 11,444,021 - Chen , et al. September 13, 2	2022-09-13
Manufacturing Method Of Three-dimensional Stacking Structure App 20220285324 - Chen; Hsien-Wei ; et al.	2022-09-08
Semiconductor Structure And Manufacturing Method Thereof App 20220285279 - Yang; Ching-Jung ; et al.	2022-09-08
Integrated Circuit Package Pad and Methods of Forming App 20220285171 - Yu; Chen-Hua ; et al.	2022-09-08
Package, Optical Device, And Manufacturing Method Of Package App 20220283368 - Chen; Hsien-Wei ; et al.	2022-09-08
Stacked semiconductor devices and methods of forming same Grant 11,430,670 - Chen , et al. August 30, 2	2022-08-30
Semiconductor Structure And Manufacturing Method Thereof App 20220271014 - Chen; Ying-Ju ; et al.	2022-08-25
Semiconductor interconnect structure and method Grant 11,424,205 - Chen , et al. August 23, 2	2022-08-23
Semiconductor devices and methods of manufacture Grant 11,424,191 - Chen , et al. August 23, 2	2022-08-23
Pad structure design in fan-out package Grant 11,424,189 - Yu , et al. August 23, 2	2022-08-23
Semiconductor Structure App 20220260776 - Chen; Hsien-Wei ; et al.	2022-08-18
Semiconductor Package With Shared Barrier Layer In Redistribution And Via And Method Of Manufacturing The Same App 20220262772 - Chen; Hsien-Wei ; et al.	2022-08-18
Inactive Structure On Soic App 20220262768 - Chen; Ming-Fa ; et al.	2022-08-18
Package And Manufacturing Method Thereof App 20220262771 - Chen; Hsien-Wei ; et al.	2022-08-18
Package structure and method of fabricating the same Grant 11,417,587 - Chen , et al. August 16, 2	2022-08-16
Package and manufacturing method thereof Grant 11,417,619 - Chen , et al. August 16, 2	2022-08-16
Plurality of different size metal layers for a pad structure Grant 11,417,599 - Chen , et al. August 16, 2	2022-08-16
Post-passivation interconnect structure Grant 11,417,610 - Chen , et al. August 16, 2	2022-08-16
Chip package structure with bump Grant 11,410,956 - Chen , et al. August 9, 2	2022-08-09
Package Structure With Photonic Die And Method App 20220246502 - Chen; Hsien-Wei ; et al.	2022-08-04
Package Structure And Manufacturing Method Thereof App 20220246573 - Chen; Ming-Fa ; et al.	2022-08-04
Package Having Different Metal Densities In Different Regions And Manufacturing Method Thereof App 20220246524 - Chen; Hsien-Wei ; et al.	2022-08-04
Semiconductor structure having photonic die and electronic die Grant 11,404,404 - Chen , et al. August 2, 2	2022-08-02
Semiconductor Packaging And Methods Of Forming Same App 20220238484 - Chen; Hsien-Wei ; et al.	2022-07-28
Methods of Forming Semiconductor Device Packages App 20220238398 - Yu; Chen-Hua ; et al.	2022-07-28
Semiconductor Structure Including Interconnection To Probe Pad With Probe Mark App 20220238397 - Chen; Hsien-Wei ; et al.	2022-07-28
Die Stack Structure And Manufacturing Method Thereof App 20220230996 - Chen; Hsien-Wei ; et al.	2022-07-21
Chip package with redistribution layers Grant 11,393,797 - Chen , et al. July 19, 2	2022-07-19
Semiconductor Packages And Methods Of Forming The Same App 20220223553 - Chen; Ming-Fa ; et al.	2022-07-14
Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20220223564 - Chen; Hsien-Wei ; et al.	2022-07-14
Package And Method Of Fabricating The Same App 20220223565 - Chen; Hsien-Wei ; et al.	2022-07-14
Package Structure App 20220223557 - Chen; Hsien-Wei ; et al.	2022-07-14
Semiconductor structure and method of fabricating the same Grant 11,387,204 - Chen , et al. July 12, 2	2022-07-12
Package structure Grant 11,387,209 - Yeh , et al. July 12, 2	2022-07-12
Die stack structure and manufacturing method thereof Grant 11,380,653 - Yu , et al. July 5, 2	2022-07-05
Integrated circuit package and method of forming same Grant 11,380,598 - Chen , et al. July 5, 2	2022-07-05
Advanced seal ring structure and method of making the same Grant 11,373,962 - Chen June 28, 2	2022-06-28
Semiconductor structure and manufacturing method thereof Grant 11,373,953 - Yang , et al. June 28, 2	2022-06-28
Semiconductor package and method of forming the same Grant 11,373,969 - Wu , et al. June 28, 2	2022-06-28
Package, optical device, and manufacturing method of package Grant 11,372,160 - Chen , et al. June 28, 2	2022-06-28
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices App 20220189942 - Chen; Jie ; et al.	2022-06-16
Package and manufacturing method thereof Grant 11,362,065 - Chen , et al. June 14, 2	2022-06-14
Three-dimensional stacking structure and manufacturing method thereof Grant 11,362,069 - Chen , et al. June 14, 2	2022-06-14
Semiconductor package with shared barrier layer in redistribution and via Grant 11,362,064 - Chen , et al. June 14, 2	2022-06-14
Semiconductor structure and manufacturing method thereof Grant 11,362,066 - Chen , et al. June 14, 2	2022-06-14
Structure and method of forming a joint assembly Grant 11,355,468 - Chen , et al. June 7, 2	2022-06-07
Package Structure App 20220173070 - Chen; Hsien-Wei ; et al.	2022-06-02
Stacked Die Structure And Method Of Fabricating The Same App 20220173077 - Chen; Jie ; et al.	2022-06-02
Bonding Structure And Method Of Forming Same App 20220173059 - Chen; Ming-Fa ; et al.	2022-06-02
Semiconductor structure and method of fabricating the same Grant 11,347,001 - Chen , et al. May 31, 2	2022-05-31
Method Of Manufacturing Die Stack Structure App 20220165711 - Yang; Ching-Jung ; et al.	2022-05-26
Semiconductor Structure Having An Anti-arcing Pattern Disposed On A Passivation Layer And Method Of Fabricating The Semiconductor Structure App 20220165633 - Kuo; Sheng-An ; et al.	2022-05-26
Package structure and manufacturing method thereof Grant 11,342,297 - Chen , et al. May 24, 2	2022-05-24
Integrated circuit package pad and methods of forming Grant 11,342,196 - Chen , et al. May 24, 2	2022-05-24
Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same Grant 11,335,610 - Chen , et al. May 17, 2	2022-05-17
Methods Of Manufacturing Three-dimensional Integrated Circuit Structures App 20220139898 - Chen; Hsien-Wei ; et al.	2022-05-05
Multi-Chip Integrated Fan-Out Package App 20220130788 - Chen; Jie ; et al.	2022-04-28
Package structure with photonic die and method Grant 11,315,855 - Chen , et al. April 26, 2	2022-04-26
Method of forming semiconductor device package having dummy devices on a first die Grant 11,309,223 - Yu , et al. April 19, 2	2022-04-19
Package having different metal densities in different regions and manufacturing method thereof Grant 11,309,243 - Chen , et al. April 19, 2	2022-04-19
Die stack structure and manufacturing method thereof Grant 11,309,291 - Chen , et al. April 19, 2	2022-04-19
Methods and apparatus for package on package devices Grant RE49,046 - Liu , et al. April 19, 2	2022-04-19
Integrated circuit package having heat dissipation structure Grant 11309289 -	2022-04-19
Die Stack Structure And Manufacturing Method Thereof App 20220093564 - Chen; Hsien-Wei ; et al.	2022-03-24
Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same App 20220084940 - Chen; Hsien-Wei ; et al.	2022-03-17
Integrated fan-out structure and method of forming Grant 11,276,656 - Chen , et al. March 15, 2	2022-03-15
Manufacturing Method Of Semiconductor Structure App 20220077097 - Chen; Jie ; et al.	2022-03-10
Semiconductor device packages, packaging methods, and packaged semiconductor devices Grant 11,270,989 - Chen , et al. March 8, 2	2022-03-08
Semiconductor Structure App 20220068880 - YU; CHEN-HUA ; et al.	2022-03-03
Bonding Structure And Method Of Forming Same App 20220068860 - Chen; Hsien-Wei ; et al.	2022-03-03
Bond pad structure for semiconductor device and method of forming same Grant 11,264,343 - Chen , et al. March 1, 2	2022-03-01
Stacked die structure and method of fabricating the same Grant 11,257,791 - Chen , et al. February 22, 2	2022-02-22
Mechanisms for forming post-passivation interconnect structure Grant 11,257,775 - Chen , et al. February 22, 2	2022-02-22
Package structure and method of fabricating the same Grant 11,257,787 - Chen , et al. February 22, 2	2022-02-22
Advanced Seal Ring Structure And Method Of Making The Same App 20220051993 - Chen; Hsien-Wei	2022-02-17
Die stack structure with hybrid bonding structure and method of fabricating the same and package Grant 11,251,157 - Yang , et al. February 15, 2	2022-02-15
Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure Grant 11,251,100 - Kuo , et al. February 15, 2	2022-02-15
Semiconductor Package And Manufacturing Method Of Semiconductor Package App 20220037566 - Chen; Ming-Fa ; et al.	2022-02-03
Three-dimensional integrated circuit structures and methods of manufacturing the same Grant 11,239,225 - Chen , et al. February 1, 2	2022-02-01
Integrated Circuit Test Method And Structure Thereof App 20220028748 - Liu; Hsien-Wen ; et al.	2022-01-27
Multi-chip integrated fan-out package Grant 11,217,552 - Chen , et al. January 4, 2	2022-01-04
Semiconductor Devices and Methods of Manufacture App 20210407920 - Chen; Hsien-Wei ; et al.	2021-12-30
Methods Of Forming Semiconductor Structure App 20210398973 - Chen; Hsien-Wei ; et al.	2021-12-23
Method For Fabricating A Chip Package App 20210391168 - Chen; Jie ; et al.	2021-12-16
Structure And Method For Forming Integrated High Density Mim Capacitor App 20210391413 - Chen; Hsien-Wei ; et al.	2021-12-16
Semiconductor Package And Manufacturing Method Thereof App 20210384147 - Chen; Hsien-Wei ; et al.	2021-12-09
Semiconductor structure Grant 11,195,804 - Chen , et al. December 7, 2	2021-12-07
Bonding structure and method of forming same Grant 11,195,810 - Chen , et al. December 7, 2	2021-12-07
Semiconductor Package and Method for Manufacturing the Same App 20210375721 - Chen; Hsien-Wei ; et al.	2021-12-02
Semiconductor Structure And Manufacturing Method Thereof App 20210375846 - Chen; Hsien-Wei ; et al.	2021-12-02
Fan-Out Package Having a Main Die and a Dummy Die App 20210375775 - Lin; Yan-Fu ; et al.	2021-12-02
Wafer Level Dicing Method And Semiconductor Device App 20210366773 - Chen; Ying-Ju ; et al.	2021-11-25
Semiconductor Package And Manufacturing Method Thereof App 20210364710 - Chen; Hsien-Wei ; et al.	2021-11-25
Functional component within interconnect structure of semiconductor device and method of forming same Grant 11,183,454 - Chen , et al. November 23, 2	2021-11-23
Semiconductor structure Grant 11,183,475 - Chen , et al. November 23, 2	2021-11-23
Methods Of Forming Semiconductor Packages With Shortened Talking Path App 20210358821 - Chen; Hsien-Wei ; et al.	2021-11-18
Semiconductor packages including routing dies and methods of forming same Grant 11,177,201 - Chen , et al. November 16, 2	2021-11-16
Semiconductor structure Grant 11,177,238 - Yu , et al. November 16, 2	2021-11-16
Pad design for reliability enhancement in packages Grant 11,177,200 - Chen , et al. November 16, 2	2021-11-16
Redistribution Layer Structures For Integrated Circuit Package App 20210351130 - CHEN; Jie ; et al.	2021-11-11
Semiconductor Package and Method of Forming the Same App 20210351149 - Chen; Hsien-Wei ; et al.	2021-11-11
Integrated circuit package assembly Grant 11,171,120 - Chen November 9, 2	2021-11-09
Semiconductor Package And Manufacturing Method Thereof App 20210343681 - Chen; Jie ; et al.	2021-11-04
Semiconductor device packages, packaging methods, and packaged semiconductor devices Grant 11,164,857 - Chen , et al. November 2, 2	2021-11-02
Package with UBM and methods of forming Grant 11,164,832 - Chen , et al. November 2, 2	2021-11-02
Integrated Circuits App 20210335735 - Chen; Hsien-Wei ; et al.	2021-10-28
Passivation Scheme Design For Wafer Singulation App 20210335722 - Chen; Hsien-Wei ; et al.	2021-10-28
Manufacturing Method Of Semiconductor Structure App 20210327789 - Hu; Chih-Chia ; et al.	2021-10-21
Package with UBM and methods of forming Grant 11,152,323 - Yu , et al. October 19, 2	2021-10-19
Discrete polymer in fan-out packages Grant 11,145,622 - Chen , et al. October 12, 2	2021-10-12
Semiconductor Structure And Method Of Fabricating The Same App 20210311252 - Chen; Hsien-Wei ; et al.	2021-10-07
Package Structure With Photonic Die And Method App 20210313254 - Chen; Hsien-Wei ; et al.	2021-10-07
Package App 20210305214 - Chen; Ming-Fa ; et al.	2021-09-30
Packaged Device With Optical Pathway App 20210302654 - Chen; Hsien-Wei ; et al.	2021-09-30
Semiconductor Structure And Manufacturing Method Thereof App 20210305209 - Chen; Ying-Ju ; et al.	2021-09-30
Semiconductor structure and method of forming Grant 11,133,197 - Chen , et al. September 28, 2	2021-09-28
Packaging scheme involving metal-insulator-metal capacitor Grant 11,133,304 - Shen , et al. September 28, 2	2021-09-28
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20210296274 - Chen; Hsien-Wei	2021-09-23
Integrated circuit device with through interconnect via and methods of manufacturing the same Grant 11,121,084 - Chen , et al. September 14, 2	2021-09-14
Redistribution Lines Having Stacking Vias App 20210280435 - Chen; Hsien-Wei ; et al.	2021-09-09
Semiconductor Die, Manufacturing Method Thereof, And Semiconductor Package App 20210280487 - Chen; Jie ; et al.	2021-09-09
Semiconductor Structure And Method For Manufacturing The Same App 20210280544 - CHEN; MING-FA ; et al.	2021-09-09
3DIC structure and method of fabricating the same Grant 11,114,433 - Chen , et al. September 7, 2	2021-09-07
Method Of Making Package Including Stress Relief Structures And Package App 20210272914 - CHEN; Hsien-Wei	2021-09-02
Semiconductor package and manufacturing method thereof Grant 11,107,779 - Chen , et al. August 31, 2	2021-08-31
Mask assembly and method for fabricating a chip package Grant 11,107,680 - Chen , et al. August 31, 2	2021-08-31
Package And Manufacturing Method Thereof App 20210265313 - Chen; Hsien-Wei ; et al.	2021-08-26
Semiconductor Structure App 20210257340 - Chen; Hsien-Wei ; et al.	2021-08-19
Packaged semiconductor devices and methods of packaging thereof Grant 11,094,622 - Chen August 17, 2	2021-08-17
Semiconductor structure and manufacturing method thereof Grant 11,094,613 - Hu , et al. August 17, 2	2021-08-17
Fan-out package having a main die and a dummy die Grant 11,094,641 - Lin , et al. August 17, 2	2021-08-17
Packaged Die And Rdl With Bonding Structures Therebetween App 20210249399 - Chen; Hsien-Wei ; et al.	2021-08-12
Semiconductor packages with shortened talking path Grant 11,088,041 - Chen , et al. August 10, 2	2021-08-10
Package, Optical Device, And Manufacturing Method Of Package App 20210239904 - Chen; Hsien-Wei ; et al.	2021-08-05
Wafer level dicing method and semiconductor device Grant 11,081,391 - Chen , et al. August 3, 2	2021-08-03
Semiconductor package and method of forming the same Grant 11,075,182 - Chen , et al. July 27, 2	2021-07-27
Semiconductor Structure And Method Of Fabricating The Same App 20210225790 - Chen; Jie ; et al.	2021-07-22
Packages with Si-Substrate-Free Interposer and Method Forming Same App 20210225750 - Yu; Chen-Hua ; et al.	2021-07-22
Semiconductor package and manufacturing method thereof Grant 11,069,662 - Chen , et al. July 20, 2	2021-07-20
Method for forming package structure Grant 11,069,625 - Hsieh , et al. July 20, 2	2021-07-20
Semiconductor Structure And Manufacturing Method Thereof App 20210217710 - LIU; TZUAN-HORNG ; et al.	2021-07-15
Package and manufacturing method of reconstructed wafer Grant 11,063,022 - Chen , et al. July 13, 2	2021-07-13
Integrated Circuit Component And Package Structure Having The Same App 20210210395 - Liu; Tzuan-Horng ; et al.	2021-07-08
Redistribution layer structures for integrated circuit package Grant 11,056,433 - Chen , et al. July 6, 2	2021-07-06
Packages with metal line crack prevention design Grant 11,056,464 - Yu , et al. July 6, 2	2021-07-06
Buffer Design for Package Integration App 20210202463 - Chen; Jie ; et al.	2021-07-01
Package Structure App 20210202438 - Liu; Tzuan-Horng ; et al.	2021-07-01
Fan-Out Structure and Method of Fabricating the Same App 20210193485 - Yu; Chen-Hua ; et al.	2021-06-24
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20210193618 - Hsieh; Cheng-Hsien ; et al.	2021-06-24
Semiconductor component, package structure and manufacturing method thereof Grant 11,043,482 - Chen , et al. June 22, 2	2021-06-22
Packages with through-vias having tapered ends Grant 11,043,410 - Chen June 22, 2	2021-06-22
Interconnect structures and methods of forming same Grant 11,043,463 - Lu , et al. June 22, 2	2021-06-22
Opening in the Pad for Bonding Integrated Passive Device in InFO Package App 20210185810 - Hsieh; Cheng-Hsien ; et al.	2021-06-17
Method of making package assembly including stress relief structures Grant 11,037,887 - Chen June 15, 2	2021-06-15
Package structures and methods of forming the same Grant 11,037,899 - Huang , et al. June 15, 2	2021-06-15
Semiconductor Device and Method of Manufacture App 20210175154 - Hu; Chih-Chia ; et al.	2021-06-10
Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 11,031,363 - Chen June 8, 2	2021-06-08
Routing design of dummy metal cap and redistribution line Grant 11,031,352 - Yu , et al. June 8, 2	2021-06-08
Mixing organic materials into hybrid packages Grant 11,031,354 - Chen , et al. June 8, 2	2021-06-08
Packaging Scheme Involving Metal-Insulator-Metal Capacitor App 20210159224 - Shen; Hsiang-Ku ; et al.	2021-05-27
Integrated circuit package and method of forming same Grant 11,018,066 - Chen , et al. May 25, 2	2021-05-25
Dummy features in redistribution layers (RDLS) and methods of forming same Grant 11,018,088 - Hsieh , et al. May 25, 2	2021-05-25
Redistribution lines having stacking vias Grant 11,018,025 - Chen , et al. May 25, 2	2021-05-25
Semiconductor die, manufacturing method thereof, and semiconductor package Grant 11,018,070 - Chen , et al. May 25, 2	2021-05-25
Underfill control structures and method Grant 11,018,069 - Chen , et al. May 25, 2	2021-05-25
Semiconductor structure and method for manufacturing the same Grant 11,018,104 - Chen , et al. May 25, 2	2021-05-25
Eliminate sawing-induced peeling through forming trenches Grant 11,018,091 - Chen , et al. May 25, 2	2021-05-25
Semiconductor Structure Including Interconnection To Probe Pad With Probe Mark And Method Of Manufacturing The Same App 20210151355 - Chen; Hsien-Wei ; et al.	2021-05-20
Integrated Circuit Package and Method of Forming Same App 20210151412 - Chen; Ming-Fa ; et al.	2021-05-20
Supporting InFO Packages to Reduce Warpage App 20210151389 - Chen; Jie ; et al.	2021-05-20
Packaged die and RDL with bonding structures therebetween Grant 11,004,838 - Chen , et al. May 11, 2	2021-05-11
Semiconductor Structure And Method Of Fabricating The Same App 20210134685 - Chen; Hsien-Wei ; et al.	2021-05-06
Package Structure And Method Of Fabricating The Same App 20210134704 - Chen; Hsien-Wei ; et al.	2021-05-06
Method of fabricating semiconductor structure Grant 10,998,293 - Chen , et al. May 4, 2	2021-05-04
Guard ring method for semiconductor devices Grant 10,998,277 - Chen , et al. May 4, 2	2021-05-04
Discrete Polymer in Fan-Out Packages App 20210125963 - Chen; Hsien-Wei ; et al.	2021-04-29
Bonding Structure of Dies with Dangling Bonds App 20210118832 - Chen; Hsien-Wei ; et al.	2021-04-22
Semiconductor Package And Manufacturing Method Thereof App 20210118827 - Chen; Hsien-Wei ; et al.	2021-04-22
Semiconductor structure and manufacturing method thereof Grant 10,978,410 - Liu , et al. April 13, 2	2021-04-13
Stacked Semiconductor Devices And Methods Of Forming Same App 20210104416 - Chen; Hsien-Wei ; et al.	2021-04-08
Packages with Si-substrate-free interposer and method forming same Grant 10,971,443 - Yu , et al. April 6, 2	2021-04-06
Integrated Circuit Package and Method App 20210098323 - Yu; Chen-Hua ; et al.	2021-04-01
Chip Package With Redistribution Layers App 20210098427 - CHEN; Jie ; et al.	2021-04-01
Package Structure And Method Of Manufacturing The Same App 20210098423 - Chen; Hsien-Wei ; et al.	2021-04-01
Semiconductor Die Package And Method Of Manufacture App 20210098380 - Chen; Ming-Fa ; et al.	2021-04-01
Package Structure And Manufacturing Method Thereof App 20210098409 - Chen; Ming-Fa ; et al.	2021-04-01
Semiconductor device Grant 10,964,659 - Chen , et al. March 30, 2	2021-03-30
Semiconductor Structure And Method Of Fabricating The Same App 20210090966 - Kuo; Sheng-An ; et al.	2021-03-25
Package Structure And Method Of Fabricating The Same App 20210091064 - Chen; Hsien-Wei ; et al.	2021-03-25
Semiconductor Structure And Manufacturing Method Thereof App 20210091022 - Chen; Ming-Fa ; et al.	2021-03-25
Semiconductor Devices and Methods of Manufacture App 20210091084 - Yu; Chen-Hua ; et al.	2021-03-25
Integrated circuit component and package structure having the same Grant 10,957,610 - Liu , et al. March 23, 2	2021-03-23
Package And Manufacturing Method Of Reconstructed Wafer App 20210082874 - Chen; Ming-Fa ; et al.	2021-03-18
Semiconductor Packages Wiyh Shortened Talking Path App 20210082779 - Chen; Hsien-Wei ; et al.	2021-03-18
Chip Package Structure with Bump App 20210082855 - Chen; Wei-Yu ; et al.	2021-03-18
Semiconductor Device and Method of Manufacture App 20210082845 - Hsieh; Cheng-Hsien ; et al.	2021-03-18
Package structure and method of forming the same Grant 10,950,575 - Yu , et al. March 16, 2	2021-03-16
Redistribution layers in semiconductor packages and methods of forming same Grant 10,950,577 - Hsieh , et al. March 16, 2	2021-03-16
Package structure Grant 10,950,576 - Liu , et al. March 16, 2	2021-03-16
Integrated circuit package and method of forming same Grant 10,950,579 - Chen , et al. March 16, 2	2021-03-16
Package Structure With Protective Structure And Method Of Fabricating The Same App 20210074681 - Chen; Hsien-Wei ; et al.	2021-03-11
Fan-out structure and method of fabricating the same Grant 10,943,798 - Yu , et al. March 9, 2	2021-03-09
Semiconductor device and method of manufacture Grant 10,943,889 - Chen , et al. March 9, 2	2021-03-09
Semicondcutor Packages App 20210066191 - Chen; Jie ; et al.	2021-03-04
Die Stack Structure And Manufacturing Method Thereof App 20210066254 - Yu; Chen-Hua ; et al.	2021-03-04
Three-dimensional Stacking Structure And Manufacturing Method Thereof App 20210066255 - Chen; Hsien-Wei ; et al.	2021-03-04
Stacked Die Structure And Method Of Fabricating The Same App 20210066252 - Chen; Jie ; et al.	2021-03-04
Bonding Structure And Method Of Forming Same App 20210066222 - Chen; Ming-Fa ; et al.	2021-03-04
Package And Manufacturing Method Thereof App 20210066192 - Chen; Hsien-Wei ; et al.	2021-03-04
Mixing organic materials into hybrid packages Grant 10,937,743 - Chen , et al. March 2, 2	2021-03-02
Opening in the pad for bonding integrated passive device in InFO package Grant 10,939,551 - Hsieh , et al. March 2, 2	2021-03-02
Bonding Structure And Method Of Forming Same App 20210057363 - Chen; Hsien-Wei ; et al.	2021-02-25
Semiconductor Package for Thermal Dissipation App 20210057387 - Yu; Chen-Hua ; et al.	2021-02-25
Semiconductor Die, Manufacturing Method Thereof, And Semiconductor Package App 20210057303 - Chen; Jie ; et al.	2021-02-25
Semiconductor Structure And Manufacturing Method Thereof App 20210057309 - Hu; Chih-Chia ; et al.	2021-02-25
Pad Design For Reliability Enhancement in Packages App 20210057364 - Chen; Hsien-Wei	2021-02-25
Package And Manufacturing Method Thereof App 20210057362 - Chen; Ming-Fa ; et al.	2021-02-25
Semiconductor device and method of manufacture Grant 10,930,580 - Hu , et al. February 23, 2	2021-02-23
Buffer design for package integration Grant 10,930,633 - Chen , et al. February 23, 2	2021-02-23
Semiconductor Device And Method Of Manufacture App 20210050305 - Wu; Chi-Hsi ; et al.	2021-02-18
Die Stack Structure App 20210050331 - Chen; Jie ; et al.	2021-02-18
Package structure and method of manufacturing the same Grant 10,923,421 - Chen , et al. February 16, 2	2021-02-16
Semiconductor Structure And Manufacturing Method Thereof App 20210043576 - Yang; Ching-Jung ; et al.	2021-02-11
Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same App 20210035953 - Yu; Chen-Hua ; et al.	2021-02-04
Semiconductor Structure And Method For Manufacturing The Same App 20210035935 - CHEN; MING-FA ; et al.	2021-02-04
Integrated Circuit Package Pad and Methods of Forming App 20210035819 - Chen; Hsien-Wei ; et al.	2021-02-04
Integrated Circuit Device With Through Interconnect Via And Methods Of Manufacturing The Same App 20210035907 - Chen; Hsien-Wei ; et al.	2021-02-04
Packaging Devices and Methods of Manufacture Thereof App 20210028124 - Chen; Hsien-Wei ; et al.	2021-01-28
Three-dimensional Integrated Circuit Structures And Methods Of Manufacturing The Same App 20210020601 - Chen; Hsien-Wei ; et al.	2021-01-21
Process Control for Package Formation App 20210005595 - Chen; Ming-Fa ; et al.	2021-01-07
Supporting InFO packages to reduce warpage Grant 10,886,238 - Chen , et al. January 5, 2	2021-01-05
Semiconductor structure, 3DIC structure and method of fabricating the same Grant 10,886,245 - Chen , et al. January 5, 2	2021-01-05
Package with solder regions aligned to recesses Grant 10,879,198 - Yang , et al. December 29, 2	2020-12-29
Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same Grant 10,879,138 - Chen , et al. December 29, 2	2020-12-29
Integrated Circuit Package And Method Of Forming Same App 20200402875 - Chen; Hsien-Wei ; et al.	2020-12-24
Package Structure App 20200402947 - Yeh; Sung-Feng ; et al.	2020-12-24
Electric magnetic shielding structure in packages Grant 10,872,865 - Yu , et al. December 22, 2	2020-12-22
Semiconductor Packaging Structure Including Interconnection To Probe Pad With Probe Mark And Method Of Manufacturing The Same App 20200395254 - Chen; Hsien-Wei ; et al.	2020-12-17
Pad Design for Reliability Enhancement in Packages App 20200395279 - Chen; Jie ; et al.	2020-12-17
Method Of Fabricating Semiconductor Structure App 20200395339 - Chen; Hsien-Wei ; et al.	2020-12-17
Chip package with redistribution layers Grant 10,867,967 - Chen , et al. December 15, 2	2020-12-15
Molding compound structure Grant 10,867,896 - Chen December 15, 2	2020-12-15
Package structure, package-on-package structure and method of fabricating the same Grant 10,867,966 - Chen , et al. December 15, 2	2020-12-15
Dummy metal with zigzagged edges Grant 10,867,900 - Hsieh , et al. December 15, 2	2020-12-15
Integrated circuit package and method Grant 10,867,879 - Yu , et al. December 15, 2	2020-12-15
3DIC structure with protective structure and method of fabricating the same Grant 10,867,968 - Chen , et al. December 15, 2	2020-12-15
Semiconductor Device and Method of Manufacture App 20200388563 - Yu; Chen-Hua ; et al.	2020-12-10
Bonding structure of dies with dangling bonds Grant 10,861,808 - Chen , et al. December 8, 2	2020-12-08
Semiconductor Structure, 3dic Structure And Method Of Fabricating The Same App 20200381379 - Chen; Hsien-Wei ; et al.	2020-12-03
Semiconductor Structure App 20200381374 - CHEN; YING-JU ; et al.	2020-12-03
Chip package structure with bump Grant 10,854,565 - Chen , et al. December 1, 2	2020-12-01
Forming metal bonds with recesses Grant 10,854,574 - Chen , et al. December 1, 2	2020-12-01
Seal Ring for Hybrid-Bond App 20200373253 - Hu; Chih-Chia ; et al.	2020-11-26
Semiconductor Package and Method of Forming the Same App 20200373266 - Wu; Chi-Hsi ; et al.	2020-11-26
Stacked semiconductor devices and methods of forming same Grant 10,847,383 - Chen , et al. November 24, 2	2020-11-24
Chip Package Structure With Molding Layer App 20200365563 - CHEN; Wei-Yu ; et al.	2020-11-19
Package Structure With Dummy Die App 20200365570 - CHEN; Hsien-Wei ; et al.	2020-11-19
Semiconductor Structure And Manufacturing Method Thereof App 20200365514 - Yang; Ching-Jung ; et al.	2020-11-19
Semiconductor structure and manufacturing method thereof Grant 10,840,190 - Yang , et al. November 17, 2	2020-11-17
Methods of forming connector pad structures, interconnect structures, and structures thereof Grant 10,840,199 - Chang , et al. November 17, 2	2020-11-17
Manufacturing Method Of A Semiconductor Device App 20200357659 - CHANG; SHOU ZEN ; et al.	2020-11-12
Pad design for reliability enhancement in packages Grant 10,833,031 - Chen November 10, 2	2020-11-10
Semiconductor device and method of manufacture Grant 10,833,030 - Hsieh , et al. November 10, 2	2020-11-10
Semiconductor Structure App 20200350245 - Chen; Ying-Ju ; et al.	2020-11-05
Hollow metal pillar packaging scheme Grant 10,825,804 - Huang , et al. November 3, 2	2020-11-03
Semiconductor device with electromagnetic interference protection and method of manufacture Grant 10,825,780 - Wu , et al. November 3, 2	2020-11-03
Package Structure, Package-on-package Structure And Method Of Fabricating The Same App 20200343223 - Chen; Hsien-Wei ; et al.	2020-10-29
Package Structure And Method Of Manufacturing The Same App 20200343183 - Chen; Ying-Ju ; et al.	2020-10-29
Semiconductor Package and Method of Forming the Same App 20200343193 - Hsieh; Cheng-Hsien ; et al.	2020-10-29
Interconnect Structures and Methods of Forming Same App 20200343209 - Lu; Wen-Hsiung ; et al.	2020-10-29
Semiconductor structure Grant 10,818,615 - Chen , et al. October 27, 2	2020-10-27
Semiconductor structure and method for manufacturing the same Grant 10,818,624 - Chen , et al. October 27, 2	2020-10-27
Device And Package Structure And Method Of Forming The Same App 20200335438 - Chen; Hsien-Wei ; et al.	2020-10-22
Packaging devices and methods of manufacture thereof Grant 10,811,369 - Chen , et al. October 20, 2	2020-10-20
Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,811,394 - Yu , et al. October 20, 2	2020-10-20
Semiconductor package for thermal dissipation Grant 10,811,389 - Yu , et al. October 20, 2	2020-10-20
Die stack structure and method of fabricating the same and package Grant 10,811,390 - Chen , et al. October 20, 2	2020-10-20
Discrete Polymer in Fan-Out Packages App 20200328183 - Chen; Hsien-Wei ; et al.	2020-10-15
Package With UBM and Methods of Forming App 20200328171 - Chen; Hsien-Wei ; et al.	2020-10-15
Method of manufacturing 3DIC structure Grant 10,797,015 - Yeh , et al. October 6, 2	2020-10-06
Three-dimensional integrated circuit structures Grant 10,797,001 - Chen , et al. October 6, 2	2020-10-06
Integrated circuit package pad and methods of forming Grant 10,796,927 - Chen , et al. October 6, 2	2020-10-06
Packages with Si-Substrate-Free Interposer and Method Forming Same App 20200312758 - Yu; Chen-Hua ; et al.	2020-10-01
Integrated Circuit Package And Method Of Forming Same App 20200312816 - Chen; Ming-Fa ; et al.	2020-10-01
Integrated Fan-Out Structure and Method of Forming App 20200303332 - Chen; Hsien-Wei ; et al.	2020-09-24
Process control for package formation Grant 10,784,247 - Chen , et al. Sept	2020-09-22
Package Structures and Methods of Forming App 20200294967 - Yu; Chen-Hua ; et al.	2020-09-17
Semiconductor Component, Package Structure And Manufacturing Method Thereof App 20200294984 - Chen; Ming-Fa ; et al.	2020-09-17
Semiconductor Device Package and Method App 20200294870 - Yu; Chen-Hua ; et al.	2020-09-17
Package Structures And Methods Of Forming The Same App 20200294955 - Huang; Li-Hsien ; et al.	2020-09-17
Semiconductor Package And Manufacturing Method Thereof App 20200286867 - Chen; Jie ; et al.	2020-09-10
Redistribution Layer Structures For Integrated Circuit Package App 20200286830 - CHEN; Jie ; et al.	2020-09-10
Integrated circuit packages and methods for forming the same Grant 10,770,366 - Tu , et al. Sep	2020-09-08
Semiconductor Device and Method of Manufacture App 20200279833 - Chen; Hsien-Wei ; et al.	2020-09-03
Package Structure And Method Of Fabricating The Same App 20200279831 - Chen; Hsien-Wei ; et al.	2020-09-03
Plurality of Different Size Metal Layers for a Pad Structure App 20200279802 - Chen; Hsien-Wei ; et al.	2020-09-03
Semiconductor structure Grant 10763224 -	2020-09-01
Semiconductor device packaging structure having through interposer vias and through substrate vias Grant 10,756,010 - Yu , et al. A	2020-08-25
Pad design for reliability enhancement in packages Grant 10,756,007 - Chen , et al. A	2020-08-25
Fan-Out Structure and Method of Fabricating the Same App 20200258760 - A1	2020-08-13
Seal ring for hybrid-bond Grant 10,741,506 - Hu , et al. A	2020-08-11
Semiconductor package and method of forming the same Grant 10,741,512 - Wu , et al. A	2020-08-11
Device and package structure Grant 10,741,490 - Chen , et al. A	2020-08-11
Semiconductor Structure App 20200251439 - Kind Code	2020-08-06
Chip package structure with molding layer Grant 10,734,357 - Chen , et al.	2020-08-04
Portable information handling system low height mono barrel hinge Grant 10,732,679 - Wu , et al.	2020-08-04
Package structure with dummy die Grant 10,727,211 - Chen , et al.	2020-07-28
Semiconductor device and manufacturing method thereof Grant 10,727,082 - Chang , et al.	2020-07-28
Die Stack Structure And Method Of Fabricating The Same And Package App 20200235073 - Chen; Jie ; et al.	2020-07-23
Semiconductor structure Grant 10,720,385 - Chen , et al.	2020-07-21
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,720,409 - Yu , et al.	2020-07-21
Packages with Through-Vias Having Tapered Ends App 20200227310 - Chen; Hsien-Wei	2020-07-16
Interconnect structures and methods of forming same Grant 10,714,442 - Lu , et al.	2020-07-14
Semiconductor package and method of forming the same Grant 10,714,426 - Hsieh , et al.	2020-07-14
Surface mount device/integrated passive device on package or device structure and methods of forming Grant 10,700,045 - Hsieh , et al.	2020-06-30
Package with UBM and methods of forming Grant 10,700,026 - Chen , et al.	2020-06-30
Discrete polymer in fan-out packages Grant 10,700,040 - Chen , et al.	2020-06-30
Packages with Si-substrate-free interposer and method forming same Grant 10,685,910 - Yu , et al.	2020-06-16
Forming metal bonds with recesses Grant 10,685,935 - Chen , et al.	2020-06-16
Integrated circuit package having dummy structures and method of forming same Grant 10,685,937 - Chen , et al.	2020-06-16
Integrated fan-out structure and method of forming Grant 10,679,953 - Chen , et al.	2020-06-09
Functional Component Within Interconnect Structure Of Semiconductor Device And Method Of Forming Same App 20200176380 - Chen; Hsien-Wei ; et al.	2020-06-04
Portable Information Handling System Low Height Mono Barrel Hinge App 20200174530 - Wu; Chin-Chung ; et al.	2020-06-04
Method of forming semiconductor device package having testing pads on a topmost die Grant 10,672,674 - Yu , et al.	2020-06-02
Semiconductor component, package structure and manufacturing method thereof Grant 10,672,754 - Chen , et al.	2020-06-02
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,672,741 - Yu , et al.	2020-06-02
Package structures and methods of forming Grant 10,672,738 - Yu , et al.	2020-06-02
Package structures and methods of forming the same Grant 10,672,734 - Huang , et al.	2020-06-02
Semiconductor package and manufacturing method thereof Grant 10,665,572 - Chen , et al.	2020-05-26
Redistribution layer structures for integrated circuit package Grant 10,665,540 - Chen , et al.	2020-05-26
Bonding Structure of Dies with Dangling Bonds App 20200161263 - Chen; Hsien-Wei ; et al.	2020-05-21
Semiconductor device and method of manufacture Grant 10,658,339 - Chen , et al.	2020-05-19
Plurality of different size metal layers for a pad structure Grant 10,658,290 - Chen , et al.	2020-05-19
Package structure and method of fabricating the same Grant 10,658,333 - Chen , et al.	2020-05-19
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices Grant 10,658,337 - Yu , et al.	2020-05-19
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20200152481 - Chen; Hsien-Wei	2020-05-14
Supporting InFO packages to reduce warpage Grant 10,651,131 - Chen , et al.	2020-05-12
Semiconductor Device and Method of Manufacture App 20200144160 - Hu; Chih-Chia ; et al.	2020-05-07
Integrated Circuit Package Assembly App 20200144226 - Chen; Hsien-Wei	2020-05-07
Structure and method of forming a joint assembly Grant 10,643,965 - Chen , et al.	2020-05-05
Fan-out structure and method of fabricating the same Grant 10,643,864 - Yu , et al.	2020-05-05
Post-passivation Interconnect Structure App 20200135659 - CHEN; Hsien-Wei ; et al.	2020-04-30
Method Of Making Package Assembly Including Stress Relief Structures App 20200135660 - CHEN; Hsien-Wei	2020-04-30
Packaging Devices and Methods of Manufacture Thereof App 20200126931 - Chen; Hsien-Wei ; et al.	2020-04-23
Semiconductor Structure And Manufacturing Method Thereof App 20200126933 - LIU; TZUAN-HORNG ; et al.	2020-04-23
Conductive vias in semiconductor packages and methods of forming same Grant 10,629,537 - Hsieh , et al.	2020-04-21
Packaging devices and methods of manufacture thereof Grant 10,629,555 - Chen , et al.	2020-04-21
Semiconductor structure Grant 10,629,560 - Chen , et al.	2020-04-21
Packages with through-vias having tapered ends Grant 10,629,476 - Chen	2020-04-21
Semiconductor Device and Method of Manufacture App 20200118915 - Yu; Chen-Hua ; et al.	2020-04-16
Semiconductor Structure App 20200118974 - YU; CHEN-HUA ; et al.	2020-04-16
Fan-Out Package Having a Main Die and a Dummy Die, and Method of Forming App 20200111749 - Lin; Yan-Fu ; et al.	2020-04-09
Eliminate Sawing-Induced Peeling Through Forming Trenches App 20200111751 - Chen; Jie ; et al.	2020-04-09
Integrated Circuit Package and Method App 20200105635 - Yu; Chen-Hua ; et al.	2020-04-02
Methods Of Forming Connector Pad Structures, Interconnect Structures, And Structures Thereof App 20200105693 - Chang; Chia-Lun ; et al.	2020-04-02
3dic Structure With Protective Structure And Method Of Fabricating The Same App 20200098731 - Chen; Hsien-Wei ; et al.	2020-03-26
Integrated Circuit Packages and Methods for Forming the Same App 20200091027 - Tu; Chia-Wei ; et al.	2020-03-19
Alignment Mark Design for Packages App 20200091086 - Huang; Li-Hsien ; et al.	2020-03-19
Pad Structure Design in Fan-Out Package App 20200091075 - Yu; Chen-Hua ; et al.	2020-03-19
Integrated Circuit Package Pad and Methods of Forming App 20200083061 - Chen; Hsien-Wei ; et al.	2020-03-12
Semiconductor Package and Method of Forming the Same App 20200083187 - Wu; Chi-Hsi ; et al.	2020-03-12
Dummy Metal with Zigzagged Edges App 20200083156 - Hsieh; Cheng-Hsien ; et al.	2020-03-12
Surface Mount Device/Integrated Passive Device on Package or Device Structure and Methods of Forming App 20200075563 - Hsieh; Cheng-Hsien ; et al.	2020-03-05
Semiconductor Device App 20200075525 - CHEN; JIE ; et al.	2020-03-05
Stacked Semiconductor Devices and Methods of Forming Same App 20200066548 - Chen; Hsien-Wei ; et al.	2020-02-27
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20200058616 - Hsieh; Cheng-Hsien ; et al.	2020-02-20
Semiconductor Package And Manufacturing Method Thereof App 20200058622 - Chen; Jie ; et al.	2020-02-20
Chip Package With Redistribution Layers App 20200058620 - CHEN; Jie ; et al.	2020-02-20
Package Structure App 20200051955A1 -	2020-02-13
Integrated Circuit Component And Package Structure Having The Same App 20200043816A1 -	2020-02-06
Three-dimensional Integrated Circuit Structures App 20200043861A1 -	2020-02-06
Package Structure And Method Of Fabricating The Same App 20200043893A1 -	2020-02-06
Integrated circuit package assembly Grant 10,546,838 - Chen Ja	2020-01-28
Multi-chip Integrated Fan-out Package App 20200027852A1 -	2020-01-23
Package structure and method of forming the same Grant 10,541,226 - Yu , et al. Ja	2020-01-21
3dic Structure And Method Of Fabricating The Same App 20200020684A1 -	2020-01-16
Packaged semiconductor devices and methods of packaging semiconductor devices Grant 10,535,537 - Chen Ja	2020-01-14
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20200013742A1 -	2020-01-09
Supporting InFO Packages to Reduce Warpage App 20200013733A1 -	2020-01-09
Method Of Manufacturing 3dic Structure App 20200013746A1 -	2020-01-09
Forming Metal Bonds with Recesses App 20200006288A1 -	2020-01-02
Supporting InFO Packages to Reduce Warpage App 20200006251A1 -	2020-01-02
Electric Magnetic Shielding Structure in Packages App 20200006248A1 -	2020-01-02
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices App 20200006313A1 -	2020-01-02
Mixing Organic Materials into Hybrid Packages App 20200006254A1 -	2020-01-02
Semiconductor Interconnect Structure and Method App 20200006266A1 -	2020-01-02
Buffer Design for Package Integration App 20200006309A1 -	2020-01-02
Integrated Circuit Package and Method of Forming Same App 20200006294A1 -	2020-01-02
Structure and Method of Forming a Joint Assembly App 20200006276A1 -	2020-01-02
Packaging devices and methods of manufacture thereof Grant 10,522,480 - Chen , et al. Dec	2019-12-31
Alignment mark design for packages Grant 10,522,473 - Huang , et al. Dec	2019-12-31
Semiconductor package and method of forming the same Grant 10,522,490 - Wu , et al. Dec	2019-12-31
Post-passivation interconnect structure Grant 10,522,481 - Chen , et al. Dec	2019-12-31
Method of making package assembly including stress relief structures Grant 10,522,477 - Chen Dec	2019-12-31
Semiconductor device and method of manufacture Grant 10,515,874 - Hu , et al. Dec	2019-12-24
Underfill control structures and method Grant 10,515,865 - Chen , et al. Dec	2019-12-24
Methods of forming connector pad structures, interconnect structures, and structures thereof Grant 10,515,915 - Chang , et al. Dec	2019-12-24
Multi-chip integrated fan-out package Grant 10,515,922 - Chen , et al. Dec	2019-12-24
Integrated circuit package pad and methods of forming Grant 10,510,556 - Chen , et al. Dec	2019-12-17
Dummy metal with zigzagged edges Grant 10,510,654 - Hsieh , et al. Dec	2019-12-17
Integrated circuit package and method of forming same Grant 10,510,629 - Chen , et al. Dec	2019-12-17
Fan-out package having a main die and a dummy die, and method of forming Grant 10,510,674 - Lin , et al. Dec	2019-12-17
Semiconductor structure and manufacturing method thereof Grant 10,510,715 - Yu , et al. Dec	2019-12-17
Method of fabricating semiconductor device Grant 10,510,668 - Chen , et al. Dec	2019-12-17
Integrated circuit packages and methods for forming the same Grant 10,510,635 - Tu , et al. Dec	2019-12-17
Eliminate sawing-induced peeling through forming trenches Grant 10,510,678 - Chen , et al. Dec	2019-12-17

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