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Semiconductor package structure and manufacturing method thereof
Grant 11,456,243 - Lin , et al. September 27, 2 | 2022-09-27 |
Semiconductor Package And Fabricating Method Thereof
App 20220302061 - CHANG-CHIEN; Shang-Yu ; et al. | 2022-09-22 |
Package structure and manufacturing method thereof
Grant 11,367,678 - Chang Chien , et al. June 21, 2 | 2022-06-21 |
Package Structure And Manufacturing Method Thereof
App 20220173051 - Chang Chien; Shang-Yu ; et al. | 2022-06-02 |
Package Structure And Manufacturing Method Thereof
App 20220165673 - Chang Chien; Shang-Yu ; et al. | 2022-05-26 |
Packaging structure and manufacturing method thereof
Grant 11,309,283 - Chang Chien , et al. April 19, 2 | 2022-04-19 |
Semiconductor package and manufacturing method thereof
Grant 11,309,296 - Lin , et al. April 19, 2 | 2022-04-19 |
Integrated antenna package structure and manufacturing method thereof
Grant 11,296,041 - Chang Chien , et al. April 5, 2 | 2022-04-05 |
Semiconductor package with conductive via in encapsulation connecting to conductive element
Grant 11,257,747 - Fan , et al. February 22, 2 | 2022-02-22 |
Package structure and manufacturing method thereof
Grant 11,251,170 - Chang Chien , et al. February 15, 2 | 2022-02-15 |
Package Structure And Manufacturing Method Thereof
App 20220045041 - Chang Chien; Shang-Yu ; et al. | 2022-02-10 |
Package Structure And Manufacturing Method Thereof
App 20220045028 - Chang Chien; Shang-Yu ; et al. | 2022-02-10 |
Package Structure And Manufacturing Method Thereof
App 20220045115 - Chang Chien; Shang-Yu ; et al. | 2022-02-10 |
Package structure and manufacturing method thereof
Grant 11,211,321 - Chang Chien , et al. December 28, 2 | 2021-12-28 |
Semiconductor package and manufacturing method thereof
Grant 11,211,350 - Hsu , et al. December 28, 2 | 2021-12-28 |
Semiconductor package structure with circuit substrate and manufacturing method thereof
Grant 11,171,106 - Lin , et al. November 9, 2 | 2021-11-09 |
Chip package structure and manufacturing method thereof
Grant 11,127,699 - Lin , et al. September 21, 2 | 2021-09-21 |
Package structure and method of manufacturing the same
Grant 11,094,654 - Lin , et al. August 17, 2 | 2021-08-17 |
Chip package structure using silicon interposer as interconnection bridge
Grant 11,088,080 - Tsai , et al. August 10, 2 | 2021-08-10 |
Semiconductor package and manufacturing method thereof
Grant 11,088,100 - Hsu , et al. August 10, 2 | 2021-08-10 |
Package Structure And Manufacturing Method Thereof
App 20210202459 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202363 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Package Device And Manufacturing Method Thereof
App 20210202268 - Lin; Nan-Chun ; et al. | 2021-07-01 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20210202368 - Lin; Nan-Chun ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202437 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Packaging Structure And Manufacturing Method Thereof
App 20210202440 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202364 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Semiconductor package and manufacturing method thereof
Grant 10,978,408 - Chang Chien , et al. April 13, 2 | 2021-04-13 |
Package structure including at least one connecting module and manufacturing method thereof
Grant 10,950,593 - Chang Chien , et al. March 16, 2 | 2021-03-16 |
Chip Package Structure Using Silicon Interposer As Interconnection Bridge
App 20210074645 - Tsai; Pei-Chun ; et al. | 2021-03-11 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20210074661 - Lin; Nan-Chun ; et al. | 2021-03-11 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20210050296 - Tsai; Pei-Chun ; et al. | 2021-02-18 |
Fan-out Chip Package Assembly And Fan-out Bottom Package With Fine Pitch Silicon Through Via
App 20210050294 - Tsai; Pei-Chun ; et al. | 2021-02-18 |
Fan-out Semiconductor Package Structure And Packaging Method Thereof
App 20210050275 - CHANG-CHIEN; Shang-Yu ; et al. | 2021-02-18 |
Package Structure And Method Of Manufacturing The Same
App 20210035936 - Lin; Nan-Chun ; et al. | 2021-02-04 |
Manufacturing method of chip package structure comprising encapsulant having concave surface
Grant 10,840,200 - Fang , et al. November 17, 2 | 2020-11-17 |
Package Structure And Manufacturing Method Thereof
App 20200343231 - Chang Chien; Shang-Yu ; et al. | 2020-10-29 |
Semiconductor Package And Manufacturing Method Thereof
App 20200343184 - Fujishima; Hiroyuki ; et al. | 2020-10-29 |
Integrated Antenna Package Structure And Manufacturing Method Thereof
App 20200328497 - Lin; Han-Wen ; et al. | 2020-10-15 |
Chip Package Structure And Manufacturing Method Thereof
App 20200328161 - Lin; Nan-Chun ; et al. | 2020-10-15 |
Semiconductor Package And Manufacturing Method Thereof
App 20200328144 - Fan; Wen-Jeng ; et al. | 2020-10-15 |
Integrated Antenna Package Structure And Manufacturing Method Thereof
App 20200328167 - Chang Chien; Shang-Yu ; et al. | 2020-10-15 |
Manufacturing method of package structure
Grant 10,796,931 - Lin , et al. October 6, 2 | 2020-10-06 |
Semiconductor Package And Manufacturing Method Thereof
App 20200273803 - Hsu; Hung-Hsin ; et al. | 2020-08-27 |
Semiconductor Package And Manufacturing Method Thereof
App 20200273829 - Hsu; Hung-Hsin ; et al. | 2020-08-27 |
Method thereof of package structure
Grant 10,756,065 - Chang Chien , et al. A | 2020-08-25 |
Method Thereof Of Package Structure
App 20200152609 - Chang Chien; Shang-Yu ; et al. | 2020-05-14 |
Manufacturing Method Of Package Structure
App 20200126815 - Lin; Han-Wen ; et al. | 2020-04-23 |
Semiconductor package and manufacturing method thereof
Grant 10,629,559 - Chang Chien , et al. | 2020-04-21 |
Semiconductor Package And Manufacturing Method Thereof
App 20200091126 - Lin; Nan-Chun ; et al. | 2020-03-19 |
Semiconductor Package And Manufacturing Method Thereof
App 20200091103 - Chang Chien; Shang-Yu ; et al. | 2020-03-19 |
Package structure and manufacturing method thereof
Grant 10,593,647 - Chang Chien , et al. | 2020-03-17 |
Semiconductor Package And Manufacturing Method Thereof
App 20200075510 - Chang Chien; Shang-Yu ; et al. | 2020-03-05 |
Package Structure And Manufacturing Method Thereof
App 20200006290 - Chang Chien; Shang-Yu ; et al. | 2020-01-02 |
Semiconductor package and manufacturing method thereof
Grant 10,522,512 - Chang Chien , et al. Dec | 2019-12-31 |
Package Structure And Manufacturing Method Thereof
App 20190393200 - Chang Chien; Shang-Yu ; et al. | 2019-12-26 |
Package structure and manufacturing method thereof
Grant 10,515,936 - Chang Chien , et al. Dec | 2019-12-24 |
Semiconductor Package And Manufacturing Method Thereof
App 20190378803 - Chang Chien; Shang-Yu ; et al. | 2019-12-12 |
Semiconductor Package And Manufacturing Method Thereof
App 20190341369 - Chang Chien; Shang-Yu ; et al. | 2019-11-07 |
Package structure and manufacturing method thereof
Grant 10,438,931 - Lin , et al. O | 2019-10-08 |
Testing method of packaging process and packaging structure
Grant 10,381,278 - Hsu , et al. A | 2019-08-13 |
Package Structure And Manufacturing Method Thereof
App 20190164909 - Chang Chien; Shang-Yu ; et al. | 2019-05-30 |
Package Structure And Manufacturing Method Thereof
App 20190164888 - Chang Chien; Shang-Yu ; et al. | 2019-05-30 |
Package Structure And Manufacturing Method Thereof
App 20190164948 - Chang Chien; Shang-Yu ; et al. | 2019-05-30 |
Semiconductor package structure and manufacturing method thereof
Grant 10,276,526 - Hsu , et al. | 2019-04-30 |
Testing Method Of Packaging Process And Packaging Structure
App 20190080971 - Hsu; Hung-Hsin ; et al. | 2019-03-14 |
Package Method For Generating Package Structure With Fan-out Interfaces
App 20190057931 - Hsu; Hung-Hsin ; et al. | 2019-02-21 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20190051625 - Hsu; Hung-Hsin ; et al. | 2019-02-14 |
Manufacturing Method Of Chip Package Structure
App 20190051626 - Fang; Li-Chih ; et al. | 2019-02-14 |
Package Structure And Manufacturing Method Thereof
App 20190013214 - Lin; Han-Wen ; et al. | 2019-01-10 |
Semiconductor package and manufacturing method thereof
App 20190013283 - FUJISHIMA; HIROYUKI ; et al. | 2019-01-10 |
Chip packaging method by using a temporary carrier for flattening a multi-layer structure
Grant 10,177,011 - Hsu , et al. J | 2019-01-08 |
Semiconductor package and method of forming the same
App 20180374717 - Hsu; Hung-Hsin ; et al. | 2018-12-27 |
Chip package structure comprising encapsulant having concave surface
Grant 10,163,834 - Fang , et al. Dec | 2018-12-25 |
Package Structure And Manufacturing Method Thereof
App 20180350708 - Chang Chien; Shang-Yu ; et al. | 2018-12-06 |
Semiconductor package structure and manufacturing method thereof
Grant 10,141,276 - Hsu , et al. Nov | 2018-11-27 |
Chip Packaging Method By Using A Temporary Carrier For Flattening A Multi-layer Structure
App 20180301352 - Hsu; Hung-Hsin ; et al. | 2018-10-18 |
Package Structure And Manufacturing Method Thereof
App 20180301418 - Chang Chien; Shang-Yu ; et al. | 2018-10-18 |
Test method for a redistribution layer
Grant 10,079,218 - Lin , et al. September 18, 2 | 2018-09-18 |
Package Structure And Manufacturing Method Thereof
App 20180204822 - Lin; Han-Wen ; et al. | 2018-07-19 |
Test method for a redistribution layer
Grant 10,002,848 - Lin , et al. June 19, 2 | 2018-06-19 |
Stacked Type Chip Package Structure And Manufacturing Method Thereof
App 20180076179 - Hsu; Hung-Hsin ; et al. | 2018-03-15 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20180076157 - Hsu; Hung-Hsin ; et al. | 2018-03-15 |
Chip Package Structure And Manufacturing Method Thereof
App 20180076158 - Fang; Li-Chih ; et al. | 2018-03-15 |
Optoelectronic package and method of manufacturing the same
Grant 9,401,463 - Jow , et al. July 26, 2 | 2016-07-26 |
Optoelectronic Package And Method Of Manufacturing The Same
App 20150270457 - JOW; EN-MIN ; et al. | 2015-09-24 |
Optoelectronic package and method of manufacturing the same
Grant 9,082,943 - Jow , et al. July 14, 2 | 2015-07-14 |
Optoelectronic Package And Method Of Manufacturing The Same
App 20140183591 - JOW; EN-MIN ; et al. | 2014-07-03 |
LED dimming control circuit
Grant 7,843,146 - Chang Chien , et al. November 30, 2 | 2010-11-30 |
Led Dimming Control Circuit
App 20090189546 - Chang Chien; Shang-Yu ; et al. | 2009-07-30 |
Reverse Current Protection Apparatus For A Synchronous Switching Voltage Converter
App 20090128111 - Chang Chien; Shang-Yu | 2009-05-21 |
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