| Patent | Date |
|---|
Microelectronic Assemblies
App 20220278057 - Elsherbini; Adel A. ; et al. | 2022-09-01 |
Microelectronic Assemblies
App 20220254754 - ELSHERBINI; Adel A. ; et al. | 2022-08-11 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20220231394 - ELSHERBINI; Adel A. ; et al. | 2022-07-21 |
Microelectronic assemblies
Grant 11,393,777 - Elsherbini , et al. July 19, 2 | 2022-07-19 |
Embedded very high density (VHD) layer
Grant 11,387,187 - Collins , et al. July 12, 2 | 2022-07-12 |
High density interconnect structures configured for manufacturing and performance
Grant 11,387,188 - Braunisch , et al. July 12, 2 | 2022-07-12 |
Electromagnetic interference shield created on package using high throughput additive manufacturing
Grant 11,380,624 - Eid , et al. July 5, 2 | 2022-07-05 |
Dielectric Waveguide Including A Dielectric Material With Cavities Therein Surrounded By A Conductive Coating Forming A Wall For The Cavities
App 20220173489 - Dogiamis; Georgios ; et al. | 2022-06-02 |
Microelectronic assemblies
Grant 11,348,897 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Low loss and low cross talk transmission lines having l-shaped cross sections
Grant 11,329,358 - Elsherbini , et al. May 10, 2 | 2022-05-10 |
Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities
Grant 11,329,359 - Dogiamis , et al. May 10, 2 | 2022-05-10 |
Enabling Long Interconnect Bridges
App 20220130763 - Mahajan; Ravindranath V. ; et al. | 2022-04-28 |
Low Leakage Thin Film Capacitors Using Titanium Oxide Dielectric With Conducting Noble Metal Oxide Electrodes
App 20220102483 - Sounart; Thomas ; et al. | 2022-03-31 |
Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials
Grant 11,282,800 - Braunisch , et al. March 22, 2 | 2022-03-22 |
Enabling long interconnect bridges
Grant 11,222,847 - Mahajan , et al. January 11, 2 | 2022-01-11 |
Components For Millimeter-wave Communication
App 20210408656 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408654 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408657 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408655 - Prabhu Gaunkar; Neelam ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408653 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408652 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
High-throughput Additively Manufactured Power Delivery Vias And Traces
App 20210407903 - Elsherbini; Adel ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210407934 - Prabhu Gaunkar; Neelam ; et al. | 2021-12-30 |
Power Delivery Structures
App 20210398895 - Elsherbini; Adel ; et al. | 2021-12-23 |
High-density Interconnects For Integrated Circuit Packages
App 20210358855 - Strong; Veronica ; et al. | 2021-11-18 |
Interconnection Structure Fabrication Using Grayscale Lithography
App 20210343635 - Swan; Johanna ; et al. | 2021-11-04 |
High-density interconnects for integrated circuit packages
Grant 11,133,263 - Strong , et al. September 28, 2 | 2021-09-28 |
Interconnect Stack With Low-k Dielectric
App 20210287979 - Strong; Veronica Aleman ; et al. | 2021-09-16 |
Single side band transmission over a waveguide
Grant 11,108,433 - Braunisch , et al. August 31, 2 | 2021-08-31 |
Interconnection structure fabrication using grayscale lithography
Grant 11,101,205 - Swan , et al. August 24, 2 | 2021-08-24 |
Scalable Embedded Silicon Bridge Via Pillars In Lithographically Defined Vias, And Methods Of Making Same
App 20210225807 - ELSHERBINI; Adel A. ; et al. | 2021-07-22 |
Semiconductor Packaging With High Density Interconnects
App 20210193583 - ELSHERBINI; Adel A. ; et al. | 2021-06-24 |
Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same
Grant 11,004,824 - Elsherbini , et al. May 11, 2 | 2021-05-11 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20210134726 - BRAUNISCH; Henning ; et al. | 2021-05-06 |
Organic interposers for integrated circuit packages
Grant 10,998,272 - Aleksov , et al. May 4, 2 | 2021-05-04 |
Simplified multimode signaling techniques
Grant 10,992,342 - Mekonnen , et al. April 27, 2 | 2021-04-27 |
Semiconductor packaging with high density interconnects
Grant 10,971,453 - Elsherbini , et al. April 6, 2 | 2021-04-06 |
Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide
Grant 10,964,992 - Dogiamis , et al. March 30, 2 | 2021-03-30 |
Organic Interposers For Integrated Circuit Packages
App 20210082822 - Aleksov; Aleksandar ; et al. | 2021-03-18 |
Dual Sided Thermal Management Solutions For Integrated Circuit Packages
App 20210080500 - Braunisch; Henning ; et al. | 2021-03-18 |
High-density Interconnects For Integrated Circuit Packages
App 20210082825 - Strong; Veronica ; et al. | 2021-03-18 |
Interconnection Structure Fabrication Using Grayscale Lithography
App 20210074620 - Swan; Johanna ; et al. | 2021-03-11 |
Reconstituted wafer assembly
Grant 10,943,851 - Elsherbini , et al. March 9, 2 | 2021-03-09 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20210057345 - Braunisch; Henning ; et al. | 2021-02-25 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,923,429 - Braunisch , et al. February 16, 2 | 2021-02-16 |
High density interconnect structures configured for manufacturing and performance
Grant 10,867,926 - Braunisch , et al. December 15, 2 | 2020-12-15 |
Coreless package architecture for multi-chip opto-electronics
Grant 10,845,552 - Liff , et al. November 24, 2 | 2020-11-24 |
Microelectronic devices for isolating drive and sense signals of sensing devices
Grant 10,845,380 - Eid , et al. November 24, 2 | 2020-11-24 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200357747 - BRAUNISCH; Henning ; et al. | 2020-11-12 |
High density interconnect structures configured for manufacturing and performance
Grant 10,833,020 - Braunisch , et al. November 10, 2 | 2020-11-10 |
In Situ Package Integrated Thin Film Capacitors For Power Delivery
App 20200350303 - SOUNART; Thomas ; et al. | 2020-11-05 |
Waveguide and transceiver interference mitigation
Grant 10,819,445 - Kamgaing , et al. October 27, 2 | 2020-10-27 |
Electromagnetic Interference Shield Created On Package Using High Throughput Additive Manufacturing
App 20200312782 - EID; Feras ; et al. | 2020-10-01 |
Substrate Integrated Inductors Using High Throughput Additive Deposition Of Hybrid Magnetic Materials
App 20200312796 - BRAUNISCH; Henning ; et al. | 2020-10-01 |
Stacked Platforms With Waveguide Interconnects
App 20200315052 - Kamgaing; Telesphor ; et al. | 2020-10-01 |
Dispersion Compensation For Electromagnetic Waveguides
App 20200304215 - Correas-Serrano; Diego ; et al. | 2020-09-24 |
Dispersive Waveguide Crosstalk Mitigation
App 20200304171 - Braunisch; Henning ; et al. | 2020-09-24 |
Contactless High-frequency Interconnect
App 20200303328 - Braunisch; Henning ; et al. | 2020-09-24 |
Microelectronic Package With Radio Frequency (rf) Chiplet
App 20200303329 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Waveguide Fan-out
App 20200303327 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Multi-package On-board Waveguide Interconnects
App 20200296823 - Kamgaing; Telesphor ; et al. | 2020-09-17 |
Waveguide Interconnect For Packages
App 20200294940 - Dogiamis; Georgios ; et al. | 2020-09-17 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,763,216 - Braunisch , et al. Sep | 2020-09-01 |
Transceiver Die Interconnect Interfaces
App 20200273824 - Kamgaing; Telesphor ; et al. | 2020-08-27 |
Microelectronic Assemblies
App 20200273839 - ELSHERBINI; Adel A. ; et al. | 2020-08-27 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,734,236 - Oster , et al. | 2020-08-04 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20200235449 - ELSHERBINI; Adel A. ; et al. | 2020-07-23 |
Microelectronic Assemblies
App 20200235061 - Elsherbini; Adel A. ; et al. | 2020-07-23 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20200168553 - Braunisch; Henning ; et al. | 2020-05-28 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
Grant 10,651,525 - Elsherbini , et al. | 2020-05-12 |
Zero-misalignment via-pad structures
Grant 10,645,813 - Rawlings , et al. | 2020-05-05 |
Orthogonal frequency division multiplexing single sideband transmission over a waveguide
Grant 10,623,106 - Lee , et al. | 2020-04-14 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200075493 - BRAUNISCH; Henning ; et al. | 2020-03-05 |
Simplified Multimode Signaling Techniques
App 20200021330 - Mekonnen; Yidnekachew S. ; et al. | 2020-01-16 |
Embedded Very High Density (vhd) Layer
App 20200006236 - Collins; Andrew Paul ; et al. | 2020-01-02 |
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
App 20200006258 - ALEKSOV; Aleksandar ; et al. | 2020-01-02 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,510,669 - Braunisch , et al. Dec | 2019-12-17 |
Reduced Dispersion Dielectric Waveguides
App 20190356033 - Dogiamis; Georgios ; et al. | 2019-11-21 |
Via architecture for increased density interface
Grant 10,475,736 - Aleksov , et al. Nov | 2019-11-12 |
Enabling Long Interconnect Bridges
App 20190318993 - Mahajan; Ravindranath V. ; et al. | 2019-10-17 |
Coreless Package Architecture For Multi-chip Opto-electronics
App 20190317285 - LIFF; Shawna M. ; et al. | 2019-10-17 |
Semiconductor Packaging With High Density Interconnects
App 20190259705 - Elsherbini; Adel A. ; et al. | 2019-08-22 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20190259622 - OSTER; Sasha N. ; et al. | 2019-08-22 |
Interconnector With Bundled Interconnects
App 20190252321 - Braunisch; Henning ; et al. | 2019-08-15 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20190252322 - Braunisch; Henning ; et al. | 2019-08-15 |
Lithographacally defined vias for organic package substrate scaling
Grant 10,381,291 - Elsherbini , et al. A | 2019-08-13 |
Dual-sided die packages
Grant 10,361,142 - Braunisch , et al. | 2019-07-23 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,304,686 - Oster , et al. | 2019-05-28 |
Orthogonal Frequency Division Multiplexing Single Sideband Transmission Over A Waveguide
App 20190149243 - Lee; Hyung-Jin ; et al. | 2019-05-16 |
Zero-misalignment Via-pad Structures
App 20190150291 - RAWLINGS; Brandon M. ; et al. | 2019-05-16 |
Single Side Band Transmission Over A Waveguide
App 20190115951 - Braunisch; Henning ; et al. | 2019-04-18 |
Multiband Waveguide Interconnect
App 20190097293 - Dogiamis; Georgios ; et al. | 2019-03-28 |
Via Architecture For Increased Density Interface
App 20190096798 - Aleksov; Aleksandar ; et al. | 2019-03-28 |
Waveguide And Transceiver Interference Mitigation
App 20190089409 - Kamgaing; Telesphor ; et al. | 2019-03-21 |
Multimode Waveguide
App 20190081705 - Braunisch; Henning ; et al. | 2019-03-14 |
Zero-misalignment via-pad structures
Grant 10,187,998 - Rawlings , et al. Ja | 2019-01-22 |
Package-integrated microchannels
Grant 10,186,465 - Eid , et al. Ja | 2019-01-22 |
Microelectronic Devices For Isolating Drive And Sense Signals Of Sensing Devices
App 20180328957 - EID; Feras ; et al. | 2018-11-15 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20180288868 - ELSHERBINI; Adel A. ; et al. | 2018-10-04 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20180286687 - OSTER; Sasha N. ; et al. | 2018-10-04 |
Optical I/O system using planar light-wave integrated circuit
Grant 10,054,737 - Kobrinsky , et al. August 21, 2 | 2018-08-21 |
Lithographacally Defined Vias For Organic Package Substrate Scaling
App 20180233431 - ELSHERBINI; Adel A. ; et al. | 2018-08-16 |
Package-integrated Microchannels
App 20180226310 - EID; Feras ; et al. | 2018-08-09 |
Scalable Embedded Silicon Bridge Via Pillars In Lithographically Defined Vias, And Methods Of Making Same
App 20180182707 - Elsherbini; Adel A. ; et al. | 2018-06-28 |
Low loss and low cross talk transmission lines using shaped vias
Grant 9,992,859 - Elsherbini , et al. June 5, 2 | 2018-06-05 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20180145031 - BRAUNISCH; Henning ; et al. | 2018-05-24 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 9,875,969 - Braunisch , et al. January 23, 2 | 2018-01-23 |
Dual-sided Die Packages
App 20170287808 - BRAUNISCH; Henning ; et al. | 2017-10-05 |
Zero-misalignment Via-pad Structures
App 20170280568 - Rawlings; Brandon M. ; et al. | 2017-09-28 |
Zero-misalignment via-pad structures
Grant 9,713,264 - Rawlings , et al. July 18, 2 | 2017-07-18 |
Dual-sided die packages
Grant 9,711,428 - Braunisch , et al. July 18, 2 | 2017-07-18 |
Shielded bundle interconnect
App 20170187419 - Zhang; Yu ; et al. | 2017-06-29 |
Optical I/o System Using Planar Light-wave Integrated Circuit
App 20170131469 - Kobrinsky; Mauro J. ; et al. | 2017-05-11 |
Low Loss and Low Cross Talk Transmission Lines using Shaped Vias
App 20170093007 - ELSHERBINI; Adel A. ; et al. | 2017-03-30 |
Package Integrated Power Inductors Using Lithographically Defined Vias
App 20170092412 - Manusharow; Mathew J. ; et al. | 2017-03-30 |
Optical I/O system using planar light-wave integrated circuit
Grant 9,507,086 - Kobrinsky , et al. November 29, 2 | 2016-11-29 |
Optical connection techniques and configurations
Grant 9,435,967 - Braunisch , et al. September 6, 2 | 2016-09-06 |
Dual-sided Die Packages
App 20160211190 - BRAUNISCH; Henning ; et al. | 2016-07-21 |
Thermal management in packaged VCSELs
Grant 9,391,427 - Eid , et al. July 12, 2 | 2016-07-12 |
Zero-Misalignment Via-Pad Structures
App 20160183370 - Rawlings; Brandon M. ; et al. | 2016-06-23 |
Optical Connection Techniques And Configurations
App 20160124166 - Braunisch; Henning ; et al. | 2016-05-05 |
Optical connection techniques and configurations
Grant 9,310,553 - Braunisch , et al. April 12, 2 | 2016-04-12 |
Electro-optical assembly including a glass bridge
Grant 9,250,406 - Chang , et al. February 2, 2 | 2016-02-02 |
Integrated inductor structure and method of fabrication
Grant 9,153,547 - Crawford , et al. October 6, 2 | 2015-10-06 |
Magnetic core inductor (MCI) structures for integrated voltage regulators
Grant 9,129,817 - Elsherbini , et al. September 8, 2 | 2015-09-08 |
Matrix matching crosstalk reduction device and method
Grant 9,093,990 - Braunisch July 28, 2 | 2015-07-28 |
Matrix Matching Crosstalk Reduction Device And Method
App 20150077157 - Braunisch; Henning | 2015-03-19 |
Thermal Management In Packaged Vcsels
App 20140314111 - Eid; Feras ; et al. | 2014-10-23 |
Magnetic Core Inductor (mci) Structures For Integrated Voltage Regulators
App 20140264732 - Elsherbini; Adel A. ; et al. | 2014-09-18 |
Optical I/o System Using Planar Light-wave Integrated Circuit
App 20140203175 - Kobrinsky; Mauro J. ; et al. | 2014-07-24 |
Electro-optical Assembly Including A Glass Bridge
App 20140177625 - Chang; Peter L.D. ; et al. | 2014-06-26 |
In-street Die-to-die Interconnects
App 20140120696 - Aleksov; Aleksandar ; et al. | 2014-05-01 |
Optical Connection Techniques And Configurations
App 20130272649 - Braunisch; Henning ; et al. | 2013-10-17 |
Multimode signaling on decoupled input/output and power channels
Grant 8,450,201 - Braunisch , et al. May 28, 2 | 2013-05-28 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20120261838 - Braunisch; Henning ; et al. | 2012-10-18 |
Method of mounting an optical device
Grant 8,230,589 - Lu , et al. July 31, 2 | 2012-07-31 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 8,227,904 - Braunisch , et al. July 24, 2 | 2012-07-24 |
Input/output package architectures
Grant 8,188,594 - Ganesan , et al. May 29, 2 | 2012-05-29 |
In-street Die-to-die Interconnects
App 20120007211 - Aleksov; Aleksandar ; et al. | 2012-01-12 |
Multimode Signaling on Decoupled Input/Output and Power Channels
App 20110247195 - Braunisch; Henning ; et al. | 2011-10-13 |
Multimode signaling on decoupled input/output and power channels
Grant 7,989,946 - Braunisch , et al. August 2, 2 | 2011-08-02 |
Multimode Signaling on Decoupled Input/Output and Power Channels
App 20110019386 - Braunisch; Henning ; et al. | 2011-01-27 |
Multi-chip package and method of providing die-to-die interconnects in same
App 20100327424 - Braunisch; Henning ; et al. | 2010-12-30 |
Multimode signaling on decoupled input/output and power channels
Grant 7,816,779 - Braunisch , et al. October 19, 2 | 2010-10-19 |
Wafer based optical interconnect
Grant 7,720,337 - Lu , et al. May 18, 2 | 2010-05-18 |
Flip-chip mountable optical connector for chip-to-chip optical interconnectability
Grant 7,703,991 - Lu , et al. April 27, 2 | 2010-04-27 |
Input/output package architectures, and methods of using same
Grant 7,705,447 - Ganesan , et al. April 27, 2 | 2010-04-27 |
Input/output package architectures, and methods of using same
App 20100096743 - Ganesan; Sanka ; et al. | 2010-04-22 |
Input/output Package Architectures, And Methods Of Using Same
App 20100078781 - Ganesan; Sanka ; et al. | 2010-04-01 |
Methods and apparatus to mount a waveguide to a substrate
Grant 7,684,660 - Braunisch , et al. March 23, 2 | 2010-03-23 |
Thermal management of dies on a secondary side of a package
Grant 7,646,093 - Braunisch , et al. January 12, 2 | 2010-01-12 |
Multimode signaling on decoupled input/output and power channels
App 20100002398 - Braunisch; Henning ; et al. | 2010-01-07 |
Optical Package
App 20090244873 - LU; Daoqiang ; et al. | 2009-10-01 |
Integrated Inductor Structure And Method Of Fabrication
App 20090201113 - Crawford; Ankur Mohan ; et al. | 2009-08-13 |
Wafer based optical interconnect
App 20090162005 - Lu; Daoqiang ; et al. | 2009-06-25 |
Mounting flexible circuits onto integrated circuit substrates
Grant 7,518,238 - Lu , et al. April 14, 2 | 2009-04-14 |
Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
Grant 7,517,228 - Baskaran , et al. April 14, 2 | 2009-04-14 |
Breakable interconnects and structures formed thereby
Grant 7,507,604 - Lu , et al. March 24, 2 | 2009-03-24 |
Lowering resistance in a coreless package
App 20090001528 - Braunisch; Henning ; et al. | 2009-01-01 |
Hybrid flex-and-board memory interconnect system
App 20080228964 - Braunisch; Henning | 2008-09-18 |
Breakable Interconnects And Structures Formed Thereby
App 20080153207 - Lu; Daoqiang ; et al. | 2008-06-26 |
Thermal Management Of Dies On A Secondary Side Of A Package
App 20080150125 - Braunisch; Henning ; et al. | 2008-06-26 |
Methods and apparatus to optically couple an optoelectronic chip to a waveguide
Grant 7,372,120 - George, legal representative , et al. May 13, 2 | 2008-05-13 |
Optical interconnect with passive optical alignment
Grant 7,344,318 - Lu , et al. March 18, 2 | 2008-03-18 |
Split socket optical interconnect
Grant 7,344,383 - Lu , et al. March 18, 2 | 2008-03-18 |
High efficiency micro-display system
Grant 7,324,254 - Bell , et al. January 29, 2 | 2008-01-29 |
Optical package
Grant 7,283,699 - Lu , et al. October 16, 2 | 2007-10-16 |
Integrated transformer structure and method of fabrication
Grant 7,280,024 - Braunisch October 9, 2 | 2007-10-09 |
Optical interconnect with passive optical alignment
App 20070223865 - Lu; Daoqiang ; et al. | 2007-09-27 |
Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
App 20070149000 - Baskaran; Rajashree ; et al. | 2007-06-28 |
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
Grant 7,236,666 - George, legal representative , et al. June 26, 2 | 2007-06-26 |
Mounting flexible circuits onto integrated circuit substrates
App 20070126118 - Lu; Daoqiang ; et al. | 2007-06-07 |
Integrated Inductor Structure And Method Of Fabrication
App 20070069333 - Crawford; Ankur Mohan ; et al. | 2007-03-29 |
Low cost microelectronic circuit package
Grant 7,183,658 - Towle , et al. February 27, 2 | 2007-02-27 |
High efficiency micro-display system
Grant 7,180,646 - Bell , et al. February 20, 2 | 2007-02-20 |
Manufacturable connectorization process for optical chip-to-chip interconnects
Grant 7,177,504 - George, legal representative , et al. February 1 | 2007-02-13 |
Methods and apparatus to mount a waveguide to a substrate
App 20060291771 - Braunisch; Henning ; et al. | 2006-12-28 |
Breakable interconnects and structures formed thereby
App 20060286721 - Lu; Daoqiang ; et al. | 2006-12-21 |
Flip-chip mountable optical connector for chip-to-chip optical interconnectability
App 20060251360 - Lu; Daoqiang ; et al. | 2006-11-09 |
Integrated transformer structure and method of fabrication
App 20060170527 - Braunisch; Henning | 2006-08-03 |
Waveguide coupling mechanism
Grant 7,085,449 - Braunisch , et al. August 1, 2 | 2006-08-01 |
Passively aligned optical-electrical interface
Grant 7,068,892 - Lu , et al. June 27, 2 | 2006-06-27 |
High-speed signaling interface with broadside dynamic wave coupling
Grant 7,053,466 - Prokoflev , et al. May 30, 2 | 2006-05-30 |
Integrated inductor and method of fabrication
App 20060088971 - Crawford; Ankur Mohan ; et al. | 2006-04-27 |
Manufacturable connectorization process for optical chip-to-chip interconnects
App 20060067624 - Towle; Steven ; et al. | 2006-03-30 |
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
App 20060067606 - Towle; Steven ; et al. | 2006-03-30 |
Optical package
App 20060067609 - Lu; Daoqiang ; et al. | 2006-03-30 |
Wafer-level thick film standing-wave clocking
Grant 7,012,015 - Braunisch , et al. March 14, 2 | 2006-03-14 |
Waveguide coupling mechanism
App 20060051021 - Braunisch; Henning ; et al. | 2006-03-09 |
High efficiency micro-display system
App 20060033997 - Bell; Cynthia S. ; et al. | 2006-02-16 |
Wafer-level Thick Film Standing-wave Clocking
App 20050266675 - Braunisch, Henning ; et al. | 2005-12-01 |
High efficiency micro-display system
App 20050225824 - Bell, Cynthia S. ; et al. | 2005-10-13 |
Wafer-level thick film standing-wave clocking
Grant 6,927,496 - Braunisch , et al. August 9, 2 | 2005-08-09 |
High-speed signaling interface and method for communicating across across an interface
App 20050082687 - Prokofiev, Victor ; et al. | 2005-04-21 |
Wafer-level thick film standing-wave clocking
App 20050070087 - Braunisch, Henning ; et al. | 2005-03-31 |
Curved surface for improved optical coupling between optoelectronic device and waveguide
App 20050036728 - Braunisch, Henning | 2005-02-17 |
Optical thumbtack
Grant 6,792,179 - Lu , et al. September 14, 2 | 2004-09-14 |
Optical assembly
App 20040126064 - Vandentop, Gilroy J. ; et al. | 2004-07-01 |
Optical Thumbtack
App 20040126058 - Lu, Daoqiang ; et al. | 2004-07-01 |
High-speed signaling interface with broadside dynamic wave coupling
App 20040113239 - Prokofiev, Victor ; et al. | 2004-06-17 |
Electronic package with integrated clock distribution structure
Grant 6,720,814 - Braunisch , et al. April 13, 2 | 2004-04-13 |
Electronic package with integrated clock distribution structure
App 20030201814 - Braunisch, Henning ; et al. | 2003-10-30 |
Electronic Package With Integrated Clock Distribution Structure
App 20030132789 - Braunisch, Henning ; et al. | 2003-07-17 |
Electronic package with integrated clock distribution structure
Grant 6,593,793 - Braunisch , et al. July 15, 2 | 2003-07-15 |
Low cost microelectronic circuit package
App 20030045083 - Towle, Steven ; et al. | 2003-03-06 |
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