Advanced Chip Engineering Technology Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Advanced Chip Engineering Technology Inc..The latest application filed is for "conductor package structure and method of the same".

Company Profile

0.36.99

Advanced Chip Engineering Technology Inc. - Hsinchu County TW
Advanced Chip Engineering Technology Inc. -
Advanced Chip Engineering Technology Inc. - Hukou Township TW
Advanced Chip Engineering Technology Inc - Hsinchu County TW
Advanced Chip Engineering Technology, Inc. - TW TW
Advanced Chip Engineering Technology Inc. - Hukuo Township TW
Advanced Chip Engineering Technology Inc. - Hsinchu Hsien TW
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Wafer level package with die receiving through-hole and method of the same Grant 8,178,963 - Yang May 15, 2	2012-05-15
Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same Grant 8,178,964 - Yang May 15, 2	2012-05-15
Package structure and manufacturing method thereof Grant 8,058,102 - Lin , et al. November 15, 2	2011-11-15
Conductor Package Structure And Method Of The Same App 20110209908 - Lin; Diann-Fang ; et al.	2011-09-01
Package Structure App 20110193216 - Lin; Diann-Fang ; et al.	2011-08-11
Conductor Package Structure And Method Of The Same App 20110180891 - Lin; Diann-Fang ; et al.	2011-07-28
Manufacturing tool for wafer level package and method of placing dies Grant 7,985,626 - Yang , et al. July 26, 2	2011-07-26
Package Structure And Manufacturing Method Thereof App 20110108977 - Lin; Diann-Fang ; et al.	2011-05-12
RF module package for releasing stress Grant 7,911,044 - Yang , et al. March 22, 2	2011-03-22
Conductor Package Structure And Method Of The Same App 20110031594 - Lin; Diann-Fang ; et al.	2011-02-10
Conductor Package Structure And Method Of The Same App 20110031607 - Lin; Diann-Fang ; et al.	2011-02-10
Image sensor package and forming method of the same Grant 7,863,105 - Yang , et al. January 4, 2	2011-01-04
Wafer level package with die receiving through-hole and method of the same Grant 7,812,434 - Yang October 12, 2	2010-10-12
Semiconductor device package with multi-chips and method of the same Grant 7,763,494 - Yang , et al. July 27, 2	2010-07-27
Back Side Protective Structure For A Semiconductor Package App 20100109156 - Hu; Yu-Shan ; et al.	2010-05-06
Semiconductor device package having a back side protective scheme Grant 7,687,923 - Yang , et al. March 30, 2	2010-03-30
Fan out type wafer level package structure and method of the same Grant 7,667,318 - Yang , et al. February 23, 2	2010-02-23
Wafer level package with good CTE performance Grant 7,655,501 - Yang , et al. February 2, 2	2010-02-02
Inter-connecting Structure For Semiconductor Package And Method For The Same App 20100007017 - Wei; Shih-Chuan ; et al.	2010-01-14
System-in-package and manufacturing method of the same App 20090321915 - Hu; Dyi-Chung ; et al.	2009-12-31
Re-distribution Conductive Line Structure And The Method Of Forming The Same App 20090212428 - Yang; Wen-Kun ; et al.	2009-08-27
Image sensor module Grant 7,566,854 - Yang , et al. July 28, 2	2009-07-28
Conductive line structure and the method of forming the same App 20090184425 - Hu; Yu-Shan ; et al.	2009-07-23
Fan out type wafer level package structure and method of the same Grant 7,557,437 - Yang , et al. July 7, 2	2009-07-07
Inter-connecting Structure For Semiconductor Device Package And Method Of The Same App 20090166873 - Yang; Wen-Kun ; et al.	2009-07-02
Under Bump Metallurgy Structure Of Semiconductor Device Package App 20090160052 - Yang; Wen-Kun ; et al.	2009-06-25
Stacking die package structure for semiconductor devices and method of the same App 20090127686 - Yang; Wen-Kun ; et al.	2009-05-21
Method for circuits inspection and method of the same Grant 7,534,632 - Hu , et al. May 19, 2	2009-05-19
Image sensor with a protection layer Grant 7,525,139 - Yang , et al. April 28, 2	2009-04-28
Semiconductor device package having multi-chips with side-by-side configuration and method of the same Grant 7,525,185 - Yang , et al. April 28, 2	2009-04-28
Inter-connecting Structure For Semiconductor Package And Method Of The Same App 20090096093 - Yang; Wen-Kun ; et al.	2009-04-16
Inter-connecting Structure For Semiconductor Package And Method Of The Same App 20090096098 - Yang; Wen-Kun ; et al.	2009-04-16
Fan out type wafer level package structure and method of the same Grant 7,514,767 - Yang April 7, 2	2009-04-07
Structure of image sensor module and method for manufacturing of wafer level package Grant 7,501,310 - Yang , et al. March 10, 2	2009-03-10
Structure of image sensor module and a method for manufacturing of wafer level package Grant 7,498,646 - Yang , et al. March 3, 2	2009-03-03
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20090051025 - Yang; Wen-Kun ; et al.	2009-02-26
Semiconductor Device Package Having A Back Side Protective Scheme App 20090039497 - Yang; Wen-Kun ; et al.	2009-02-12
Semiconductor Device Package Having A Back Side Protective Scheme App 20090039532 - Yang; Wen-Kun ; et al.	2009-02-12
Method for forming filling paste structure of WL package Grant 7,476,565 - Yang , et al. January 13, 2	2009-01-13
Image Sensor Package Utilizing A Removable Protection Film And Method Of Making The Same App 20090008729 - Yang; Wen-Kun ; et al.	2009-01-08
Inter-connecting Structure For Semiconductor Device Package And Method Of The Same App 20090008777 - Lin; Diann-Fang ; et al.	2009-01-08
Structure and process for WL-CSP with metal cover Grant 7,468,544 - Yang December 23, 2	2008-12-23
Trace Structure And Method For Fabricating The Same App 20080308307 - Chang; Jui-Hsien ; et al.	2008-12-18
Semiconductor image device package with die receiving through-hole and method of the same Grant 7,459,729 - Yang , et al. December 2, 2	2008-12-02
Structure of dielectric layers in built-up layers of wafer level package Grant 7,453,148 - Yang , et al. November 18, 2	2008-11-18
Semiconductor device package with multi-chips and method of the same App 20080274593 - Yang; Wen-Kun ; et al.	2008-11-06
Wafer level image sensor package with die receiving cavity and method of making the same App 20080274579 - Yang; Wen-Kun ; et al.	2008-11-06
Method and system of trace pull test Grant 7,446,546 - Yang , et al. November 4, 2	2008-11-04
Panel/wafer Molding Apparatus And Method Of The Same App 20080265462 - Yang; Wen-Kun ; et al.	2008-10-30
Method Of Plasma Etching With Pattern Mask App 20080268647 - Yang; Wen-Kun ; et al.	2008-10-30
Stack Package With Releasing Layer And Method For Forming The Same App 20080265393 - Lin; Diann-Fang ; et al.	2008-10-30
Semiconductor Device Package To Improve Functions Of Heat Sink And Ground Shield App 20080258293 - YANG; Wen-Kun ; et al.	2008-10-23
Semiconductor device package having multi-chips with side-by-side configuration and method of the same App 20080251908 - Yang; Wen-Kun ; et al.	2008-10-16
Wafer Level Package With Good Cte Performance App 20080248614 - Yang; Wen-Kun ; et al.	2008-10-09
Semiconductor Device Package With Die Receiving Through-hole And Dual Build-up Layers Over Both Side-surfaces For Wlp And Method Of The Same App 20080237828 - YANG; Wen-Kun	2008-10-02
Chip Packaging Structure And Chip Packaging Process App 20080237834 - Hu; Dyi-Chung ; et al.	2008-10-02
Semiconductor device package having multi-chips with side-by-side configuration and method of the same App 20080230884 - Yang; Wen-Kun ; et al.	2008-09-25
Self chip redistribution apparatus and method for the same App 20080229574 - Yang; Wen-Kun ; et al.	2008-09-25
Image sensor module having build-in package cavity and the method of the same App 20080224248 - Yang; Wen-Kun ; et al.	2008-09-18
Structure of semiconductor device package and method of the same App 20080217761 - Yang; Wen-Kun ; et al.	2008-09-11
Sensor module package structure and method of the same Grant 7,423,335 - Yang , et al. September 9, 2	2008-09-09
Package structure to improve the reliability for WLP App 20080211080 - Yang; Wen-Kun ; et al.	2008-09-04
Image Sensor Chip Scale Package Having Inter-adhesion With Gap And Method Of The Same App 20080211075 - Yang; Wen-Kun ; et al.	2008-09-04
Image Sensor Package And Forming Method Of The Same App 20080206918 - Yang; Wen-Kun ; et al.	2008-08-28
Semiconductor device protective structure and method for fabricating the same Grant 7,416,920 - Yang , et al. August 26, 2	2008-08-26
Wafer level image sensor package with die receiving cavity and method of making the same App 20080197435 - Yang; Wen-Kun ; et al.	2008-08-21
Method for circuits inspection and the method of the same App 20080199391 - Hu; Yu-Shan ; et al.	2008-08-21
Semiconductor device package with multi-chips and method of the same App 20080197480 - Yang; Wen-Kun ; et al.	2008-08-21
Semiconductor device package with multi-chips and method of the same App 20080197474 - Yang; Wen-Kun ; et al.	2008-08-21
Multi-chips package with reduced structure and method for forming the same App 20080197469 - Yang; Wen-Kun ; et al.	2008-08-21
Image sensor package with die receiving opening and method of the same App 20080191333 - Yang; Wen-Kun ; et al.	2008-08-14
Wafer Level Image Sensor Package With Die Receiving Cavity And Method Of The Same App 20080191297 - Yang; Wen-Kun ; et al.	2008-08-14
Cmos Image Sensor Chip Scale Package With Die Receiving Opening And Method Of The Same App 20080191335 - Yang; Wen-Kun ; et al.	2008-08-14
Image sensor module and the method of the same App 20080173792 - Yang; Wen-Kun ; et al.	2008-07-24
RF module package App 20080157341 - Yang; Wen-Kun ; et al.	2008-07-03
Multi-chips package and method of forming the same App 20080157316 - Yang; Wen-Kun	2008-07-03
Wafer level package with die receiving through-hole and method of the same App 20080157396 - Yang; Wen-Kun	2008-07-03
Wafer level package with die receiving through-hole and method of the same App 20080157336 - Yang; Wen-Kun	2008-07-03
Package with a marking structure and method of the same App 20080157342 - Yang; Wen-Kun	2008-07-03
Structure of super thin chip scale package and method of the same App 20080157303 - Yang; Wen-Kun	2008-07-03
Semiconductor image device package with die receiving through-hole and method of the same App 20080157312 - Yang; Wen-Kun ; et al.	2008-07-03
RF module package App 20080157340 - Yang; Wen-Kun ; et al.	2008-07-03
Wafer level package with die receiving through-hole and method of the same App 20080157358 - Yang; Wen-Kun	2008-07-03
Sensor Module Package Structure And Method Of The Same App 20080157250 - Yang; Wen-Kun ; et al.	2008-07-03
Package On Package Structure For Semiconductor Devices And Method Of The Same App 20080157327 - Yang; Wen-Kun	2008-07-03
Semiconductor device package having pseudo chips App 20080157398 - Yang; Wen-Kun ; et al.	2008-07-03
Structure Of Dielectric Layers In Built-up Layers Of Wafer Level Package App 20080150130 - Yang; Wen-Kun ; et al.	2008-06-26
3d Electronic Packaging Structure With Enhanced Grounding Performance And Embedded Antenna App 20080142941 - Yew; Ming-Chih ; et al.	2008-06-19
Tools Structure For Chip Redistribution And Method Of The Same App 20080142939 - Yang; Wen-Kun ; et al.	2008-06-19
Wafer Level Package With Good Cte Performance App 20080142946 - Yang; Wen-Kun ; et al.	2008-06-19
Structure And Process For Wl-csp With Metal Cover App 20080136026 - Yang; Wen-Kun	2008-06-12
Multi-chip Package Structure And Method Of Forming The Same App 20080136004 - Yang; Wen-Kun ; et al.	2008-06-12
Multi-chips Package And Method Of Forming The Same App 20080136002 - Yang; Wen-Kun	2008-06-12
Image Sensor Module App 20080135728 - Yang; Wen-Kun ; et al.	2008-06-12
Imagine Sensor Package And Forming Method Of The Same App 20080136012 - Yang; Wen-Kun ; et al.	2008-06-12
Method And Structure Of Pattern Mask For Dry Etching App 20080116169 - Yang; Wen-Kun ; et al.	2008-05-22
Wafer level package with die receiving cavity and method of the same App 20080116564 - Yang; Wen-Kun ; et al.	2008-05-22
Method And Structure Of Pattern Mask For Dry Etching App 20080118707 - Yang; Wen-Kun ; et al.	2008-05-22
Structure Of Image Sensor Module And Method For Manufacturing Of Wafer Level Package App 20080108168 - Yang; Wen-Kun ; et al.	2008-05-08
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20080105967 - Yang; Wen-Kun ; et al.	2008-05-08
Wafer Level Package Structure With Build Up Layers App 20080088004 - Yang; Wen-Kun ; et al.	2008-04-17
Cmos Image Sensor Chip Scale Package With Die Receiving Through-hole And Method Of The Same App 20080083980 - Yang; Wen-Kun ; et al.	2008-04-10
Semiconductor Packaging Method By Using Large Panel Size App 20080085572 - Yang; Wen-Kun ; et al.	2008-04-10
Chip Package And Chip Package Array App 20080073774 - Yang; Wen-Kun ; et al.	2008-03-27
Wafer street buffer layer Grant 7,342,296 - Yang , et al. March 11, 2	2008-03-11
Chip-size package structure and method of the same Grant 7,339,279 - Yang March 4, 2	2008-03-04
Method for image sensor protection Grant 7,335,870 - Yang , et al. February 26, 2	2008-02-26
Filling paste structure and process for WL-CSP App 20080044945 - Yang; Wen-Kun ; et al.	2008-02-21
Method For Separating Package Of Wlp App 20080029877 - Yang; Wen-Kun ; et al.	2008-02-07
Structure of image sensor module and a method for manufacturing of wafer level package App 20080020511 - Yang; Wen-Kun ; et al.	2008-01-24
Structure of image sensor module and a method for manufacturing of wafer level package App 20080017941 - Yang; Wen Kun ; et al.	2008-01-24
Method and system of trace pull test Grant 7,319,043 - Yang , et al. January 15, 2	2008-01-15
3D electronic packaging structure having a conductive support substrate App 20070296065 - Yew; Ming-Chih ; et al.	2007-12-27
Method Of Plasma Etching With Pattern Mask App 20070262051 - Yang; Wen-Kun ; et al.	2007-11-15
FBGA and COB package structure for image sensor Grant 7,279,782 - Yang , et al. October 9, 2	2007-10-09
Chip-size Package Structure And Method Of The Same App 20070205494 - Yang; Wen Kun	2007-09-06
Structure of package Grant 7,259,468 - Yang August 21, 2	2007-08-21
Method And System Of Trace Pull Test App 20070152693 - Yang; Wen-Kun ; et al.	2007-07-05
Chip-size package structure and method of the same Grant 7,238,602 - Yang July 3, 2	2007-07-03
Semiconductor package structure and method for separating package of wafer level package App 20070128835 - Yang; Wen-Kun ; et al.	2007-06-07
Package structure Grant 7,224,061 - Yang , et al. May 29, 2	2007-05-29
Semiconductor Device Protective Structure And Method For Fabricating The Same App 20070082428 - Yang; Wen-Kun ; et al.	2007-04-12
Method and system of trace pull test App 20070069207 - Yang; Wen-Kun ; et al.	2007-03-29
Method for separating package of WLP App 20070072338 - Yang; Wen-Kun ; et al.	2007-03-29
Fan out type wafer level package structure and method of the same App 20070059866 - Yang; Wen-Kun ; et al.	2007-03-15
Semiconductor device protective structure and method for fabricating the same Grant 7,176,567 - Yang , et al. February 13, 2	2007-02-13
Semiconductor Device Protective Structure And Method For Fabricating The Same App 20070007648 - Yang; Wen-Kun ; et al.	2007-01-11
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20060231958 - Yang; Wen-Kun	2006-10-19
Filling paste structure and process for WL-CSP App 20060145364 - Yang; Wen-Kun ; et al.	2006-07-06
FBGA and COB package structure for image sensor App 20060145325 - Yang; Wen-Kun ; et al.	2006-07-06
Structure of image sensor module and a method for manufacturing of wafer level package Grant 7,061,106 - Yang , et al. June 13, 2	2006-06-13
Method for package burn-in testing App 20060105594 - Yang; Wen-Kun	2006-05-18
Chip-size package structure and method of the same App 20060087036 - Yang; Wen-Kun	2006-04-27
Manufacturing tool for wafer level package and method of placing dies App 20050247398 - Yang, Wen Kun ; et al.	2005-11-10
Imagine sensor with a protection layer App 20050242409 - Yang, Wen-Kun ; et al.	2005-11-03

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