LEAP

Uniqarta, Inc.

Application Filed: 2019-05-06
Trademark Application Details
Trademark Logo LEAP

Mark For: LEAP™ trademark registration is intended to cover the categories of adhesive tape for industrial and commercial use, namely, semiconductor assembly and semiconductor packaging equipment adhesive tape; adhesive tape for industrial use. [all]

Status

2020-05-10 UTC
LIVE APPLICATION Under Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and that this application has been assigned to an examiner.


Research OneLook Acronym Finder
Serial Number88417729
Mark Literal ElementsLEAP
Mark Drawing Type4 - STANDARD CHARACTER MARK
Mark TypeTRADEMARK
RegisterPRINCIPAL
Current LocationINTENT TO USE SECTION 2019-11-12
Basis1(b)
Class StatusACTIVE
Primary US Classes
  • 001: Raw or Partly Prepared Materials
  • 005: Adhesives
  • 012: Construction Materials
  • 013: Hardware, Plumbing and Steamfitting Supplies
  • 035: Belting, Hose, Machinery Packing and Non-Metallic Tires
  • 050: Merchandise Not Otherwise Classified
Primary International Class
  • 017 - Primary Class
  • (Rubber goods) Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
Filed UseNo
Current UseNo
Intent To UseYes
Filed ITUYes
44D FiledNo
44E CurrentNo
66A CurrentNo
Current BasisNo
No BasisNo
Attorney NamePerry J. Viscounty
Attorney Docket Number053789-0002
Law Office AssignedN20
Employee NameMIRANDA, JOHN SALVADOR

Timeline

2019-05-06Application Filed
2019-09-17Published
2019-09-17Published for Opposition
2019-11-12Location: INTENT TO USE SECTION
2019-11-12Status: Live/Pending
2019-11-12Transaction Date
2020-04-07Status: A first request for extension of time to file a Statement of Use has been granted.

Trademark Parties (Applicants & Owners)

Party: Uniqarta, Inc.
Address42 Trowbridge St., Unit 1 Cambridge, MASSACHUSETTS UNITED STATES 02138
Legal Entity TypeCorporation
Legal Entity StateDELAWARE

Documents

DrawingJPEG2019-05-06
TEAS RF New ApplicationMULTI2019-05-06
Offc Action OutgoingXML2019-07-24
XSearch Search SummaryXML2019-07-24
Response to Office ActionAPPLICATION/XML,IMAGE/TIFF2019-07-29
Amendment and Mail Process CompleteMULTI2019-07-31
TRAM Snapshot of App at Pub for OppostnMULTI2019-07-31
Notice of PublicationXML2019-08-28
Notification Of Notice of PublicationXML2019-08-28
OG Publication ConfirmationAPPLICATION/XML2019-09-17
Notice of AllowanceAPPLICATION/XML2019-11-12
Extension of Time to File SOUXML2020-04-07
ITU Extension ApprovalAPPLICATION/XML2020-04-09
ITU Unit ActionAPPLICATION/XML,IMAGE/JPEG2020-04-09

Attorney of Record

PERRY J. VISCOUNTY
LATHAM & WATKINS LLP
650 TOWN CENTER DRIVE, SUITE 2000
COSTA MESA, CA 92626

Good, Services, and Codes


IC 007. US 013 019 021 023 031 034 035. G & S: Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Semiconductor manufacturing machines, namely, flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; Semiconductor manufacturing machines, namely, electronic assembly manufacturing machines
IC 017. US 001 005 012 013 035 050. G & S: adhesive tape for industrial and commercial use, namely, semiconductor assembly and semiconductor packaging equipment adhesive tape; adhesive tape for industrial use

International Codes:7
U.S. Codes:013,019,021,023,031,034,035
International Codes:17
U.S. Codes:001,005,012,013,035,050
Type CodeType
GS0071Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Semiconductor manufacturing machines, namely, flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; Semiconductor manufacturing machines, namely, electronic assembly manufacturing machines

Trademark Filing History

DescriptionDateProceeding Number
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED2020-04-09
TEAS EXTENSION RECEIVED2020-04-07
EXTENSION 1 GRANTED2020-04-0798765
EXTENSION 1 FILED2020-04-0798765
NOA E-MAILED - SOU REQUIRED FROM APPLICANT2019-11-12
PUBLISHED FOR OPPOSITION2019-09-17
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED2019-09-17
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED2019-08-28
ASSIGNED TO LIE2019-08-0868171
TEAS/EMAIL CORRESPONDENCE ENTERED2019-07-3088889
APPROVED FOR PUB - PRINCIPAL REGISTER2019-07-30
TEAS RESPONSE TO OFFICE ACTION RECEIVED2019-07-29
CORRESPONDENCE RECEIVED IN LAW OFFICE2019-07-2988889
NOTIFICATION OF NON-FINAL ACTION E-MAILED2019-07-246325
NON-FINAL ACTION WRITTEN2019-07-2492568
NON-FINAL ACTION E-MAILED2019-07-246325
ASSIGNED TO EXAMINER2019-07-1892568
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM2019-05-21
NEW APPLICATION ENTERED IN TRAM2019-05-09

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