BLUELINE

Mark For: BLUELINE™ trademark registration is intended to cover the categories of industrial adhesives, namely resin-based adhesives for attaching electronic components to circuit substrates, resin-based capillary underfill, resin-based no-flow underfill and resin-based water-level underfill, and electronic component packaging materials, namely resin-based transfer molding compound materials and resin-based encapsulant materials used to enclose or protect semiconductor devices, all for use in the manufacture of electronic component assemblies and radio frequency component assemblies. [all]

>The drawing is lined for the colors blue and yellow, but color is not a feature of the mark.

Status

2022-09-09 UTC
⟳ Refresh

DEAD APPLICATION Refused Dismissed or Invalidated

Research	OneLook Acronym Finder
Serial Number	76214446
Mark Literal Elements	BLUELINE
Mark Drawing Type	3 - AN ILLUSTRATION DRAWING WHICH INCLUDES WORD(S)/ LETTER(S)/NUMBER(S)
Mark Type	TRADEMARK
Standard Character Claim	No
Register	PRINCIPAL
Current Location	INTENT TO USE SECTION 2004-10-29
Basis	1(b)
Class Status	ACTIVE
Primary US Classes	001: Raw or Partly Prepared Materials 005: Adhesives 006: Chemicals and Chemical Compositions 010: Fertilizers 026: Measuring and Scientific Appliances 046: Foods and Ingredients of Foods
Primary International Class	001 - Primary Class (Chemicals) Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
Filed Use	No
Current Use	No
Intent To Use	Yes
Filed ITU	Yes
44D Filed	No
44E Current	No
66A Current	No
Current Basis	No
No Basis	No
Attorney Name	Stephen J. Holmes
Attorney Docket Number	T00757-US
Law Office Assigned	L60
Employee Name	NELSON, EDWARD H

Timeline

(ABANDONED)
IC 001. US 001 005 006 010 026 046. G & S: Industrial adhesives, namely resin-based adhesives for attaching electronic components to circuit substrates, resin-based capillary underfill, resin-based no-flow underfill and resin-based water-level underfill, and electronic component packaging materials, namely resin-based transfer molding compound materials and resin-based encapsulant materials used to enclose or protect semiconductor devices, all for use in the manufacture of electronic component assemblies and radio frequency component assemblies(ABANDONED)
IC 003. US 001 004 006 050 051 052. G & S: cleaning materials for use in removing flux residues from soldered assemblies(ABANDONED)
IC 006. US 002 012 013 014 023 025 050. G & S: industrial and metal-based materials, namely laminates, solder, solder alloys, solder paste, solder flux and coated flux for use in the manufacture of electronic components assemblies and radio frequency component assemblies