TSK

Mark For: TSK™ trademark registration is intended to cover the categories of semiconductor manufacturing equipment, namely, semiconductor wafer scrubbing and washing machine, wire slicing machine, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon emounting and cleaning machine, wafer probing machine, and chemical mechanical planarizers. [all]

Status

2022-10-07 UTC
⟳ Refresh

DEAD APPLICATION Refused Dismissed or Invalidated

Research	OneLook Acronym Finder
Serial Number	76101266
Mark Literal Elements	TSK
Mark Drawing Type	3 - AN ILLUSTRATION DRAWING WHICH INCLUDES WORD(S)/ LETTER(S)/NUMBER(S)
Mark Type	TRADEMARK
Standard Character Claim	No
Register	PRINCIPAL
Current Location	INTENT TO USE SECTION 2005-08-04
Basis	1(b)
Class Status	ACTIVE
Primary US Classes	013: Hardware, Plumbing and Steamfitting Supplies 019: Vehicles 021: Electrical Apparatus, Machines and Supplies 023: Cutlery, Machinery, Tools and Parts Thereof 031: Filters and Refrigerators 034: Heating, Lighting and Ventilating Apparatus 035: Belting, Hose, Machinery Packing and Non-Metallic Tires
Primary International Class	007 - Primary Class (Machinery) Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
Filed Use	No
Current Use	No
Intent To Use	Yes
Filed ITU	Yes
44D Filed	No
44E Current	No
66A Current	No
Current Basis	No
No Basis	No
Domestic Representative	Merchant & Gould P.C.
Attorney Name	Curtis B. Hamre
Law Office Assigned	M50
Employee Name	ALT, JILL C

Timeline

(ABANDONED)
IC 007. US 013 019 021 023 031 034 035. G & S: Semiconductor manufacturing equipment, namely, semiconductor wafer scrubbing and washing machine, wire slicing machine, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon emounting and cleaning machine, wafer probing machine, and chemical mechanical planarizers(ABANDONED)
IC 009. US 021 023 026 036 038. G & S: Precision measuring machines, namely, wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three-dimensional measuring machine, contour measuring machine, coordinate measuring machines; data processing for coordinate measuring machines, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring instrument, namely, electric current or voltage detectors, magnetic measuring apparatus, namely, magnetic sensors, capacity measures; optical apparatus, namely, microscopes; electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders; automatic distribution vending machines; network system comprised of computer hardware and software for wafer probing machines; wafer inspection units