U.S. patent number RE48,587 [Application Number 16/528,968] was granted by the patent office on 2021-06-08 for ultrasonic probe apparatus and ultrasonic imaging apparatus using the same.
This patent grant is currently assigned to SAMSUNG MEDISON CO., LTD.. The grantee listed for this patent is SAMSUNG MEDISON CO., LTD.. Invention is credited to Jin Ho Gu.
United States Patent |
RE48,587 |
Gu |
June 8, 2021 |
Ultrasonic probe apparatus and ultrasonic imaging apparatus using
the same
Abstract
An ultrasonic probe apparatus and an ultrasonic imaging
apparatus are disclosed. The ultrasonic probe apparatus includes:
an ultrasonic transducer configured to output an electrical signal
upon receiving ultrasonic waves; a sound absorption unit, one
surface of which is an installation surface of the ultrasonic
transducer and is electrically connected to the ultrasonic
transducer; a first electronic circuit electrically connected to
the sound absorption unit; and a substrate connection unit disposed
between the sound absorption unit and the first electronic circuit,
configured to electrically interconnect the first electronic
circuit and the sound absorption unit. The ultrasonic imaging
apparatus includes the above ultrasonic probe and a main body.
Inventors: |
Gu; Jin Ho (Seongnam-si,
KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG MEDISON CO., LTD. |
Gangwon-do |
N/A |
KR |
|
|
Assignee: |
SAMSUNG MEDISON CO., LTD.
(Gangwon-do, KR)
|
Family
ID: |
1000005292068 |
Appl.
No.: |
16/528,968 |
Filed: |
August 1, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
Reissue of: |
14684019 |
Apr 10, 2015 |
9746448 |
Aug 29, 2017 |
|
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Foreign Application Priority Data
|
|
|
|
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Dec 26, 2014 [KR] |
|
|
10-2014-0190566 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01N
29/24 (20130101); G01N 29/28 (20130101); G10K
11/002 (20130101); B06B 1/0622 (20130101); A61B
8/4494 (20130101); G01N 2291/0289 (20130101); A61B
8/4444 (20130101); G01N 2291/269 (20130101) |
Current International
Class: |
G01N
29/24 (20060101); G01N 29/28 (20060101); B06B
1/06 (20060101); G10K 11/00 (20060101); A61B
8/00 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
European Communication dated Jan. 27, 2020 issued in European
Patent Application No. 15174040.4. cited by applicant .
Chinese Office Action dated Mar. 10, 2020 issued in Chinese Patent
Application No. 201510706654.0 (with English translation). cited by
applicant .
Extended European Search Report issued in European Application No.
15174040.4 dated Jul. 4, 2016. cited by applicant.
|
Primary Examiner: Nasser; Robert L
Attorney, Agent or Firm: Morgan, Lewis & Bockius LLP
Claims
What is claimed is:
1. An ultrasonic probe apparatus comprising: an ultrasonic
transducer configured to output an electrical signal upon receiving
ultrasonic waves; a sound absorption unit, one surface of which is
an installation surface of the ultrasonic transducer, and being
electrically connected to the ultrasonic transducer; a first
electronic circuit electrically connected to the sound absorption
unit; and a second electronic circuit disposed between the sound
absorption unit and the first electronic circuit, configured to
electrically interconnect the first electronic circuit and the
sound absorption unit, wherein one surface of the second electronic
circuit faces another surface of the sound absorption unit, and
another surface of the second electronic circuit faces one surface
of the first electronic circuit .Iadd.wherein the sound absorption
unit includes at least one first connection unit electrically
connected to the ultrasonic transducer, wherein the second
electronic circuit includes: a first substrate connection unit
provided to pass through from the one surface of the second
electronic circuit to the another surface of the second electronic
circuit, connected to the at least one first connection unit and
configured to electrically connect the sound absorption unit and
the first electronic circuit; and a second substrate connection
unit provided at a position not in contact with the at least one
first connection unit of the sound absorption unit and configured
to electrically connect the first electronic circuit and an output
unit of the second electronic circuit.Iaddend..
.[.2. The ultrasonic probe apparatus according to claim 1, wherein
the second electronic circuit includes a substrate connection unit
electrically connected to the first electronic circuit..].
.[.3. The ultrasonic probe apparatus according to claim 2, wherein
the substrate connection unit includes a first substrate connection
unit configured to electrically interconnect the sound absorption
unit and the first electronic circuit..].
.[.4. The ultrasonic probe apparatus according to claim 3, wherein
the first substrate connection unit is electrically connected to
the ultrasonic transducer..].
.[.5. The ultrasonic probe apparatus according to claim 4, wherein
the sound absorption unit includes at least one first connection
unit electrically connected to the ultrasonic transducer, wherein
the first substrate connection unit contacts the first connection
unit..].
6. The ultrasonic probe apparatus according to claim .[.2.].
.Iadd.1.Iaddend., wherein the .[.second electronic circuit includes
at least one.]. output unit .Iadd.is .Iaddend.configured to output
a signal processed by the first electronic circuit.[., wherein the
substrate connection unit includes a second substrate connection
unit configured to electrically interconnect the first electronic
circuit and the at least one output unit.]..
7. The ultrasonic probe apparatus according to claim .[.2.].
.Iadd.1.Iaddend., wherein the .Iadd.first .Iaddend.substrate
connection unit .[.includes.]. .Iadd.and the second substrate
connection unit include.Iaddend.: a first opening configured to
pass through a range from the one surface to the another surface of
the second electronic circuit; and a conductor installed at an
inner lateral surface of the first opening and electrically coupled
to the first electronic circuit.
8. The ultrasonic probe apparatus according to claim 7, wherein the
conductor is configured to shield the first opening.
9. The ultrasonic probe apparatus according to claim 7, wherein the
.Iadd.first .Iaddend.substrate connection unit .Iadd.and the second
substrate connection unit .Iaddend.further .[.includes.].
.Iadd.include .Iaddend.a second opening formed to pass through the
conductor.
10. The ultrasonic probe apparatus according to claim 9, wherein
the .Iadd.first .Iaddend.substrate connection unit .Iadd.and the
second substrate connection unit .Iaddend.further .[.includes.].
.Iadd.include .Iaddend.a filling material configured to shield the
second opening.
11. The ultrasonic probe apparatus according to claim 7, wherein
the conductor is deposited on the inner lateral surface of the
first opening.
12. The ultrasonic probe apparatus according to claim 7, wherein
the conductor is installed at the one surface of the second
electronic circuit located in a vicinity of the first opening.
13. The ultrasonic probe apparatus according to claim 1, wherein
the second electronic circuit includes a rigid flexible printed
circuit board (PCB).
14. The ultrasonic probe apparatus according to claim 13, wherein
the second electronic circuit includes at least one of a first
region that is not curved and a second region that is flexibly
curved.
15. The ultrasonic probe apparatus according to claim 14, wherein
.[.the second electronic circuit includes a substrate connection
unit that is electrically connected to the first electronic circuit
and is.]. .Iadd.the first substrate connection unit and the second
substrate connection unit are .Iaddend.formed in the first
region.
16. The ultrasonic probe apparatus according to claim .[.2.].
.Iadd.1.Iaddend., wherein: a second connection unit is mounted
.[.to.]. .Iadd.on .Iaddend.the first electronic circuit .Iadd.and
includes a third connection unit and a fourth connection
unit.Iaddend., the .[.second.]. .Iadd.third .Iaddend.connection
unit being attached to the .Iadd.first .Iaddend.substrate
connection unit of the second electronic circuit .Iadd.and the
fourth connection unit, being attached to the second substrate
connection unit, of the second electronic circuit.Iaddend..
17. The ultrasonic probe apparatus according to claim 16, further
comprising: a separation unit disposed between the second
electronic circuit and the first electronic circuit, and formed of
a nonconductive material that prevents the second electronic
circuit from directly contacting the first electronic circuit.
18. The ultrasonic probe apparatus according to claim 17, wherein
the second connection unit .[.is mounted to the first electronic
circuit so as to pass.]. .Iadd.passes .Iaddend.through the
separation unit.
19. The ultrasonic probe apparatus according to claim 1, further
comprising: a heat conduction unit mounted to another surface of
the first electronic circuit, and to perform heat transmission of
the first electronic circuit.
20. The ultrasonic probe apparatus according to claim 1, wherein
the sound absorption unit includes: a sound absorption material for
absorbing sound; and .[.a first.]. .Iadd.the at least one first
.Iaddend.connection unit configured to pass through the sound
absorption material so as to electrically interconnect the
ultrasonic transducer and the first electronic circuit.
21. The ultrasonic probe apparatus according to claim 20, wherein
.Iadd.the .Iaddend.at least one first connection unit is mounted to
a single ultrasonic transducer.
.[.22. The ultrasonic probe apparatus according to claim 1, further
comprising: an acoustic enhancer disposed between the ultrasonic
transducer and the sound absorption unit, and configured to amplify
the electrical signal generated from the ultrasonic
transducer..].
23. The ultrasonic probe apparatus according to claim 1, wherein
the sound absorption unit is formed of a sound absorption material
configured to absorb sound waves or ultrasonic waves.
.[.24. The ultrasonic probe apparatus according to claim 1,
wherein: a seating surface at which the ultrasonic transducer or an
acoustic enhancer is seated is formed at the one surface of the
sound absorption unit, wherein the acoustic enhancer is coupled to
the ultrasonic transducer so as to amplify the electrical signal
generated from the ultrasonic transducer..].
25. The ultrasonic probe apparatus according to claim 1, wherein
the first electronic circuit includes a processor configured to
focus signals generated from the ultrasonic transducer.
26. The ultrasonic probe apparatus according to claim 1, wherein
the first electronic circuit includes at least one application
specific integrated circuit (ASIC).
27. An ultrasonic imaging apparatus comprising: an ultrasonic probe
configured to receive ultrasonic waves; and a main body configured
to control operations of the ultrasonic probe, and to perform image
processing of an ultrasound image corresponding to the received
ultrasonic waves, wherein the ultrasonic probe includes: an
ultrasonic transducer configured to output an electrical signal
upon receiving the ultrasonic waves; a sound absorption unit, one
surface of which is an installation surface of the ultrasonic
transducer and is electrically connected to the ultrasonic
transducer; a first electronic circuit electrically connected to
the sound absorption unit; and a second electronic circuit disposed
between the sound absorption unit and the first electronic circuit,
configured to electrically interconnect the first electronic
circuit and the sound absorption unit, wherein one surface of the
second electronic circuit faces another surface of the sound
absorption unit, and another surface of the second electronic
circuit faces one surface of the first electronic circuit
.Iadd.wherein the sound absorption unit includes at least one first
connection unit electrically connected to the ultrasonic
transducer, wherein the second electronic circuit includes: a first
substrate connection unit provided to pass through from the one
surface of the second electronic circuit to the another surface of
the second electronic circuit, connected to the at least one first
connection unit, and configured to electrically connect the sound
absorption unit and the first electronic circuit; and a second
substrate connection unit provided a position not in contact with
the at least one first connection unit of the sound absorption
unit, and configured to electrically connect the first electronic
circuit and an output unit of the second electronic
circuit.Iaddend..
.[.28. The ultrasonic imaging apparatus according to claim 27,
wherein the second electronic circuit includes a substrate
connection unit electrically connected to the first electronic
circuit..].
.[.29. The ultrasonic imaging apparatus according to claim 28,
wherein the substrate connection unit includes a first substrate
connection unit configured to electrically interconnect the sound
absorption unit and the first electronic circuit..].
.[.30. The ultrasonic imaging apparatus according to claim 29,
wherein the first substrate connection unit is electrically
connected to the ultrasonic transducer..].
.[.31. The ultrasonic imaging apparatus according to claim 30,
wherein the sound absorption unit includes at least one first
connection unit electrically connected to the ultrasonic
transducer, wherein the first substrate connection unit contacts
the first connection unit..].
32. The ultrasonic imaging apparatus according to claim .[.28.].
.Iadd.27.Iaddend., wherein the .[.second electronic circuit
includes at least one.]. output unit .Iadd.is .Iaddend.configured
to output a signal processed by the first electronic circuit.[.,
wherein the substrate connection unit includes a second substrate
connection unit configured to electrically interconnect the first
electronic circuit and the at least one output unit.]..
33. The ultrasonic imaging apparatus according to claim 27, wherein
the second electronic circuit includes a rigid flexible printed
circuit board (PCB).
34. The ultrasonic imaging apparatus according to claim 33, wherein
the second electronic circuit includes at least one of a first
region that is not curved and a second region that is flexibly
curved.
35. The ultrasonic imaging apparatus according to claim 34, wherein
.[.the second electronic circuit includes a substrate connection
unit that is electrically connected to the first electronic circuit
and is.]. .Iadd.the first substrate connection unit and the second
substrate connection unit are .Iaddend.formed in the first
region.
36. The ultrasonic imaging apparatus according to claim .[.29.].
.Iadd.27.Iaddend., wherein: a second connection unit is mounted
.[.to.]. .Iadd.on .Iaddend.the first electronic circuit .Iadd.and
includes a third connection unit and a fourth connection
unit.Iaddend., the .[.second.]. .Iadd.third .Iaddend.connection
unit being attached to the .Iadd.first .Iaddend.substrate
connection unit of the second electronic circuit .Iadd.and the
fourth connection unit being attached to the second substrate
connection unit of the second electronic circuit.Iaddend..
37. The ultrasonic imaging apparatus according to claim 36, further
comprising: a separation unit disposed between the second
electronic circuit and the first electronic circuit, and formed of
a nonconductive material that prevents the second electronic
circuit from directly contacting the first electronic circuit.
38. The ultrasonic imaging apparatus according to claim 37, wherein
the second connection unit .[.is mounted to the first electronic
circuit so as to pass.]. .Iadd.passes .Iaddend.through the
separation unit.
39. The ultrasonic imaging apparatus according to claim 27, further
comprising: a heat conduction unit mounted to another surface of
the first electronic circuit, and to perform heat transmission of
the first electronic circuit.
40. The ultrasonic imaging apparatus according to claim 27, wherein
the sound absorption unit includes: a sound absorption material for
absorbing sound; and .[.a first.]. .Iadd.the at least one first
.Iaddend.connection unit configured to pass through the sound
absorption material so as to electrically interconnect the
ultrasonic transducer and the first electronic circuit.
41. The ultrasonic imaging apparatus according to claim 40, wherein
.Iadd.the .Iaddend.at least one first connection unit is mounted to
a single ultrasonic transducer.
.[.42. The ultrasonic imaging apparatus according to claim 27,
further comprising: an acoustic enhancer disposed between the
ultrasonic transducer and the sound absorption unit, and configured
to amplify the electrical signal generated from the ultrasonic
transducer..].
43. The ultrasonic imaging apparatus according to claim 27, wherein
the sound absorption unit is formed of a sound absorption material
configured to absorb sound waves or ultrasonic waves.
.[.44. The ultrasonic imaging apparatus according to claim 27,
wherein: a seating surface at which the ultrasonic transducer or an
acoustic enhancer is seated is formed at the one surface of the
sound absorption unit, wherein the acoustic enhancer is coupled to
the ultrasonic transducer so as to amplify the electrical signal
generated from the ultrasonic transducer..].
45. The ultrasonic imaging apparatus according to claim 27, wherein
the first electronic circuit includes a processor configured to
focus signals generated from the ultrasonic transducer.
46. The ultrasonic imaging apparatus according to claim 27, wherein
the first electronic circuit includes at least one application
specific integrated circuit (ASIC).
Description
CROSS-REFERENCE TO RELATED APPLICATION
This application claims the benefit of Korean Patent Application
No. 10-2014-0190566, filed on Dec. 26, 2014 in the Korean
Intellectual Property Office, the disclosure of which is
incorporated herein by reference.
BACKGROUND
1. Field
Examplary embodiments relate to an ultrasonic probe apparatus and
an ultrasonic imaging apparatus.
2. Description of the Related Art
An imaging apparatus captures an image of an object using visible
light, infrared light, radiation, ultrasonic waves, microwaves, or
Free Induction Decay (FID) signals derived from a magnetic
resonance phenomenon, and generates an internal or external image
of the object. Examples of the imaging apparatus may include a
camera, an infrared camera, a radiation imaging apparatus, an
ultrasonic imaging apparatus, etc.
The ultrasonic imaging apparatus obtains images by capturing an
internal image of the object using ultrasonic waves, and displays
the obtained images for user recognition. The ultrasonic imaging
apparatus directly irradiates ultrasonic waves to a target site
contained in the object, collects the ultrasonic waves reflected
from the target site, and thus generates an ultrasound image using
the collected ultrasonic waves. The ultrasonic imaging apparatus
may collect ultrasonic waves generated from a target site contained
in the object using laser beams or the like, and may thus generate
an ultrasound image using the collected ultrasonic waves.
The ultrasonic imaging apparatus may irradiate ultrasonic waves to
the inside of the object using an ultrasonic probe or may receive
ultrasonic waves from the inside of the object using the ultrasonic
probe. There are various kinds of ultrasonic probes according to
categories of objects and categories of the image-captured parts of
the objects or according to categories of target sites contained in
the objects.
SUMMARY
Therefore, it is an aspect of the present invention to so provide
an ultrasonic probe apparatus and an ultrasonic imaging apparatus,
which can efficiently absorb ultrasonic waves emitted in a
direction opposite to an object using ultrasonic elements.
Additional aspects of the invention will be set forth in part in
the description which follows and, in part, will be obvious from
the description, or may be learned by practice of the
invention.
In accordance with one aspect of the present invention, an
ultrasonic probe apparatus includes: an ultrasonic transducer
configured to output an electrical signal upon receiving ultrasonic
waves; a sound absorption unit, one surface of which is an
installation surface of the ultrasonic transducer and is
electrically connected to the ultrasonic transducer; a first
electronic circuit electrically connected to the sound absorption
unit; and a substrate connection unit disposed between the sound
absorption unit and the first electronic circuit, configured to
electrically interconnect the first electronic circuit and the
sound absorption unit.
The substrate connection unit may include a second electronic
circuit configured to electrically interconnect the first
electronic circuit and the sound absorption unit.
The second electronic circuit may include a substrate connection
unit electrically connected to the first electronic circuit.
The substrate connection unit may include a first substrate
connection unit configured to electrically interconnect the sound
absorption unit and the first electronic circuit.
The first substrate connection unit may be electrically connected
to the ultrasonic transducer.
The sound absorption unit may include at least one first connection
unit electrically connected to the ultrasonic transducer, wherein
the first substrate connection unit contacts the first connection
unit.
The second electronic circuit may include at least one output unit
configured to output a signal processed by the first electronic
circuit, wherein the substrate connection unit includes a second
substrate connection unit configured to electrically interconnect
the first electronic circuit and the at least one output unit.
The substrate connection unit may include: a first opening
configured to pass through a range from one surface to the other
surface of the second electronic circuit; and a conductor installed
at an inner lateral surface of the first opening and electrically
coupled to the first electronic circuit.
The conductor may be configured to shield the first opening.
The substrate connection unit may further include a second opening
formed to pass through the conductor.
The substrate connection unit may further include a filling
material configured to shield the second opening.
The conductor may be deposited on an inner lateral surface of the
first opening.
The conductor may be installed at one surface of the second
electronic circuit located in a vicinity of the first opening.
The second electronic circuit may include a rigid flexible printed
circuit board (PCB).
The second electronic circuit may include at least one of a first
region that is not curved and a second region that is flexibly
curved.
The second electronic circuit may include a substrate connection
unit that is electrically connected to the first electronic circuit
and is formed in the first region.
A second connection unit (a bump) may be mounted to the first
electronic circuit, wherein the second connection unit is attached
to the substrate connection unit of the second electronic
circuit.
The ultrasonic probe may further include: a separation unit
disposed between the second electronic circuit and the first
electronic circuit, and formed of a nonconductive material that
prevents the second electronic circuit from directly contacting the
first electronic circuit.
The second connection unit may be mounted to the first electronic
circuit so as to pass through the separation unit.
The ultrasonic probe apparatus may further include: a heat
conduction unit mounted to the other surface of the first
electronic circuit, and to perform heat transmission of the first
electronic circuit.
The sound absorption unit may include: a sound absorption material
for absorbing sound; and a first connection unit configured to pass
through the sound absorption material so as to electrically
interconnect the ultrasonic transducer and the first electronic
circuit.
At least one first connection unit may be mounted to a single
ultrasonic transducer.
The ultrasonic probe may further include: an acoustic enhancer
disposed between the ultrasonic transducer and the sound absorption
unit, and configured to amplify the electrical signal generated
from the ultrasonic transducer.
The sound absorption unit may be formed of a sound absorption
material formed to absorb sound waves or ultrasonic waves.
A seating surface at which the ultrasonic transducer or an acoustic
enhancer seated may be formed at one surface of the sound
absorption unit, wherein the acoustic enhancer is coupled to the
ultrasonic transducer so as to amplify the electrical signal
generated from the ultrasonic transducer.
The first electronic circuit may include a processor configured to
focus signals generated from the ultrasonic transducer.
The first electronic circuit may include at least one application
specific integrated circuit (ASIC).
In accordance with another aspect of the present invention, an
ultrasonic imaging apparatus includes: an ultrasonic probe
configured to receive ultrasonic waves; and a main body configured
to control operations of the ultrasonic probe, and to perform image
processing of an ultrasound image corresponding to the received
ultrasonic waves. The ultrasonic probe includes: an ultrasonic
transducer configured to output an electrical signal upon receiving
the ultrasonic waves; a sound absorption unit, one surface of which
is an installation surface of the ultrasonic transducer and is
electrically connected to the ultrasonic transducer; a first
electronic circuit electrically connected to the sound absorption
unit; and a substrate connection unit disposed between the sound
absorption unit and the first electronic circuit, configured to
electrically interconnect the first electronic circuit and the
sound absorption unit.
The substrate connection unit may include a second electronic
circuit configured to electrically interconnect the first
electronic circuit and the sound absorption unit.
The second electronic circuit may include a substrate connection
unit electrically connected to the first electronic circuit.
The substrate connection unit may include a first substrate
connection unit configured to electrically interconnect the sound
absorption unit and the first electronic circuit.
The first substrate connection unit may be electrically connected
to the ultrasonic transducer.
The sound absorption unit may include at least one first connection
unit electrically connected to the ultrasonic transducer, wherein
the first substrate connection unit contacts the first connection
unit.
The second electronic circuit may include at least one output unit
configured to output a signal processed by the first electronic
circuit, wherein the substrate connection unit includes a second
substrate connection unit configured to electrically interconnect
the first electronic circuit and the at least one output unit.
The second electronic circuit may include a rigid flexible printed
circuit board (PCB).
The second electronic circuit may include at least one of a first
region that is not curved and a second region that is flexibly
curved.
The second electronic circuit may include a substrate connection
unit that is electrically connected to the first electronic circuit
and is formed in the first region.
A second connection unit may be mounted to the first electronic
circuit. The second connection unit may be attached to the
substrate connection unit of the second electronic circuit.
The ultrasonic imaging apparatus may further include: a separation
unit disposed between the second electronic circuit and the first
electronic circuit, and formed of a nonconductive material that
prevents the second electronic circuit from directly contacting the
first electronic circuit.
The second connection unit may be mounted to the first electronic
circuit so as to pass through the separation unit.
The ultrasonic imaging apparatus may further include: a heat
conduction unit mounted to the other surface of the first
electronic circuit, and to perform heat transmission of the first
electronic circuit.
The sound absorption unit may include: a sound absorption material
for absorbing sound; and a first connection unit configured to pass
through the sound absorption material so as to electrically
interconnect the ultrasonic transducer and the first electronic
circuit.
At least one first connection unit may be mounted to a single
ultrasonic transducer.
The ultrasonic imaging apparatus may further include: an acoustic
enhancer disposed between the ultrasonic transducer and the sound
absorption unit, and configured to amplify the electrical signal
generated from the ultrasonic transducer.
The sound absorption unit may be formed of a sound absorption
material configured to absorb sound waves or ultrasonic waves.
A seating surface at which the ultrasonic transducer or an acoustic
enhancer seated may be formed at one surface of the sound
absorption unit, wherein the acoustic enhancer is coupled to the
ultrasonic transducer so as to amplify the electrical signal
generated from the ultrasonic transducer.
The first electronic circuit may include a processor configured to
focus signals generated from the ultrasonic transducer.
The first electronic circuit may include at least one application
specific integrated circuit (ASIC).
BRIEF DESCRIPTION OF THE DRAWINGS
These and/or other aspects of the invention will become apparent
and more readily appreciated from the following description of the
embodiments, taken in conjunction with the accompanying drawings of
which:
FIG. 1 is a perspective view illustrating an ultrasonic imaging
apparatus according to an embodiment of the present invention.
FIG. 2A is a block diagram illustrating an ultrasonic imaging
apparatus according to an embodiment of the present invention.
FIG. 2B is a conceptual diagram illustrating a beamforming process
according to an embodiment of the present invention.
FIG. 3 illustrates the internal structure of an ultrasonic probe
according to an embodiment of the present invention.
FIG. 4 is an exploded perspective view illustrating the internal
structure of an ultrasonic probe according to a first embodiment of
the present invention.
FIG. 5A is a conceptual diagram illustrating arrangement of an
ultrasonic element unit according to a first embodiment of the
present invention.
FIG. 5B is a conceptual diagram illustrating arrangement of an
ultrasonic element unit according to a second embodiment of the
present invention.
FIG. 6 is a conceptual diagram illustrating functions of a sound
absorption unit.
FIG. 7 is a perspective view illustrating a sound absorption unit
according to a first embodiment of the present invention.
FIG. 8 is a plan view illustrating a sound absorption unit
according to a first embodiment of the present invention.
FIG. 9 is a lateral perspective view illustrating a sound
absorption unit according to a first embodiment of the present
invention.
FIG. 10 is a perspective view illustrating a sound absorption unit
according to a second embodiment of the present invention.
FIG. 11 is a plan view illustrating a sound absorption unit
according to a second embodiment of the present invention.
FIG. 12 is a lateral cross-sectional view illustrating a sound
absorption unit according to a second embodiment of the present
invention.
FIG. 13 is a view illustrating a sound absorption unit according to
a second embodiment of the present invention.
FIG. 14 is a view illustrating a second electronic circuit
according to a first embodiment of the present invention.
FIG. 15 illustrates a curved structure of a second electronic
circuit.
FIG. 16 is a cross-sectional view illustrating a second electronic
circuit.
FIG. 17A is a plan view illustrating a second electronic circuit
including a substrate connection unit according to a first
embodiment of the present invention.
FIG. 17B is an exploded side view illustrating a second electronic
circuit including a substrate connection unit according to a first
embodiment of the present invention.
FIG. 18A is a plan view illustrating a second electronic circuit
including a substrate connection unit according to a second
embodiment of the present invention.
FIG. 18B is an exploded side view illustrating a second electronic
circuit including a substrate connection unit according to a second
embodiment of the present invention.
FIG. 19A is a plan view illustrating a second electronic circuit
including a substrate connection unit according to a third
embodiment of the present invention.
FIG. 19B is an exploded side view illustrating a second electronic
circuit including a substrate connection unit according to a third
embodiment of the present invention.
FIG. 20A is a plan view illustrating a second electronic circuit
including a substrate connection unit according to a fourth
embodiment of the present invention.
FIG. 20B is a bottom view illustrating a second electronic circuit
including a substrate connection unit according to a fourth
embodiment of the present invention.
FIG. 20C is an exploded side view illustrating a second electronic
circuit including a substrate connection unit according to a fourth
embodiment of the present invention.
FIG. 21 is a view illustrating a second electronic circuit
according to a second embodiment of the present invention.
FIG. 22A is a perspective view illustrating a first electronic
circuit according to an embodiment of the present invention.
FIG. 22B is a view illustrating a first electronic circuit
according to an embodiment of the present invention.
FIG. 22C is a view illustrating a heat conduction unit installed at
a back surface of the first electronic circuit.
FIG. 23A is a conceptual diagram illustrating a process for
transmitting a control signal to a first processor mounted to an
ultrasonic probe.
FIG. 23B is a conceptual diagram illustrating a process for
transmitting a control signal to a first processor mounted to an
ultrasonic probe.
FIG. 23C is a conceptual diagram illustrating a process for
transmitting a control signal to an ultrasonic element.
FIG. 24 is a conceptual diagram illustrating a process for
irradiating ultrasonic waves using an ultrasonic element.
FIG. 25 is a conceptual diagram illustrating a process for
receiving ultrasonic waves using an ultrasonic element.
FIG. 26 is a conceptual diagram illustrating a transmission process
of an electrical signal corresponding to ultrasonic waves received
by the ultrasonic element
FIG. 27 is a conceptual diagram illustrating a process for
transmitting processed signals to a main body.
FIG. 28 is a conceptual diagram illustrating a process for
transmitting processed signals to a main body.
FIG. 29 is a conceptual diagram illustrating a process for
fabricating a sound absorption unit.
FIG. 30 is a conceptual diagram illustrating a process for
fabricating a sound absorption unit.
DETAILED DESCRIPTION
Reference will now be made in detail to the embodiments of the
present invention, examples of which are illustrated in the
accompanying drawings, wherein like reference numerals refer to
like elements throughout.
FIG. 1 is a perspective view illustrating an ultrasonic imaging
apparatus according to an embodiment of the present invention. FIG.
2A is a block diagram illustrating an ultrasonic imaging apparatus
according to an embodiment of the present invention.
Referring to FIGS. 1 and 2A, the ultrasonic imaging apparatus 1 may
include an ultrasonic probe 100 and a main body 200.
The ultrasonic probe 100 may collect ultrasonic waves, and may
transmit an electrical signal corresponding to the collected
ultrasonic waves to the main body 200. In accordance with the
embodiment, the ultrasonic probe 100 may perform beamforming of
ultrasonic waves of the collected channels, and may also transmit
the beamformed signals to the main body 200.
The main body 200 may control overall operations of the ultrasonic
imaging apparatus 1. In addition, the main body 200 may generate an
ultrasound image such as a B-mode image by performing either
beamforming or image processing using electrical signals received
from the ultrasonic probe 100, and may display the generated
ultrasound image on the display unit 280 for user recognition. In
addition, various electronic components for controlling overall
operations of either the ultrasonic probe 100 or the main body 200
may be contained in the main body 200. The main body 200 may
receive various commands from the user who uses an input unit 290,
generate a control signal corresponding to the user command, and
thus control the ultrasonic imaging apparatus 1.
The ultrasonic probe 100 may transmit/receive data to/from the main
body 200 through a cable 93 or a wireless communication module.
In accordance with one embodiment, the ultrasonic probe 100 and the
main body 200 may communicate with each other using the connection
cable 93 shown in FIG. 1. The electrical signal generated from the
ultrasonic probe 100 may be transmitted to the main body 200
through the connection cable 93. In addition, a control command
generated from the main body 200 may also be transmitted to the
ultrasonic probe 100 through the connection cable 93.
A connector 94 may be provided at one end of the connection cable
93. The connector 94 may be detachably coupled to the port 95
provided at the external frame 201 of the main body 200. If the
connector 94 is coupled to the port 95, the ultrasonic probe 100
and the main body 200 may be interconnected to communicate with
each other. In the meantime, according to one embodiment, the
ultrasonic probe 100 may be fixed to the other end of the
connection cable 93. That is, the ultrasonic probe 100 and the
connection cable may be integrated. In accordance with another
embodiment, the connector (not shown) capable of being coupled to
or detached from the port contained in the ultrasonic probe 100 may
also be provided at the other end of the connection cable 93.
In accordance with another embodiment, the ultrasonic probe 100 and
the main body 200 may transmit electrical signals generated from
the ultrasonic probe 100 to the main body 200 over a wireless
communication network or may also transmit the electrical signal
generated from the main body 200 to the ultrasonic probe 100. In
this case, a wireless communication module including an antenna and
a wireless communication chip may be installed in each of the
ultrasonic probe and the main body 200. The wireless communication
module may be a short-range wireless communication module based on
various short-range communication technologies, for example,
Bluetooth, Bluetooth low energy, infrared data association (IrDA),
Wireless Fidelity (Wi-Fi), Wi-Fi Direct, Ultra Wideband (UWB), Near
Field Communication (NFC), etc. Alternatively, the wireless
communication module may be a mobile communication module
supporting 3GPP, 3GPP2 or IEEE wireless communication networks
defined by the International Telecommunication Union (ITU).
The ultrasonic probe 100 will hereinafter be described in
detail.
The ultrasonic probe 100 may receive ultrasonic waves generated
from the object, and may convert the received ultrasonic waves into
an electrical signal. For convenience of description and better
understanding of the present invention, the electrical signal
obtained by conversion of the received ultrasonic waves will
hereinafter be referred to as an ultrasonic signal.
The ultrasonic probe 100 may include an ultrasonic element unit 110
for generating or receiving ultrasonic waves; and a first processor
130. The first processor 130 may be electrically connected to the
ultrasonic element unit 110, may control operations of the
ultrasonic element unit 110, or may perform signal processing using
the electrical signal generated from the ultrasonic element
unit.
The ultrasonic element unit 110 may include an ultrasonic
transducer for generating ultrasonic waves or generating an
electrical signal corresponding to the ultrasonic waves. The
ultrasonic transducer may convert AC (Alternating Current) energy
having a predetermined frequency into mechanical vibration having
the same frequency, may generate ultrasonic waves, or may convert
mechanical vibration having a predetermined frequency based on
ultrasound into AC energy. Therefore, the ultrasonic transducer may
generate ultrasonic waves or may output electrical signals
corresponding to the received ultrasonic waves. In more detail,
upon receiving AC power from a battery or the like, a piezoelectric
vibrator or a thin film of the ultrasonic transducer vibrates
according to the AC power, such that a plurality of ultrasonic
waves is generated.
Here, the ultrasonic transducer may be one of, for example, a
magnetostrictive ultrasonic transducer using the magnetostrictive
effect of a magnetic body, a piezoelectric ultrasonic transducer
using the piezoelectric effect of a piezoelectric material, and a
capacitive micromachined ultrasonic transducer (cMUT)
transmitting/receiving ultrasonic waves using vibration of hundreds
or thousands of micromachined thin films. Further, the ultrasonic
transducer may be one of other kinds of transducers which may
generate ultrasonic waves according to an electrical signal or
generate an electrical signal according to ultrasonic waves.
Referring to FIG. 2A, the ultrasonic element unit 110 may include
an ultrasonic transmission element 110a and an ultrasonic reception
element 110b. The ultrasonic transmission element 110a may generate
ultrasonic waves having a frequency corresponding to a frequency of
a pulse signal according to a pulse signal received from the first
processor 130 or the second processor 220. The generated ultrasonic
waves may be irradiated to a target site 98 of the object 99. The
generated ultrasonic waves may be focused on at least one target
site 98 contained in the object 99. In this case, the irradiated
ultrasonic waves may be focused on a single target site 98 (i.e.,
single focusing), and may also be focused on a plurality of target
sites 98 (i.e., multi-focusing).
The ultrasonic reception element 110b may receive ultrasonic waves
reflected from the target site 98 or may receive ultrasonic waves
generated from the target site 98 according to laser or the like,
and may convert the received signals into an ultrasonic signal. The
ultrasonic reception element 110b may include a plurality of
ultrasonic transducers, each of which outputs an ultrasonic signal,
so that the ultrasonic reception element 110b may output ultrasonic
signals of a plurality of channels.
In accordance with the embodiment, the ultrasonic element unit 110
may include ultrasonic transmission/reception (Tx/Rx) elements (not
shown) capable of generating and receiving ultrasonic waves. In
this case, the ultrasonic transmission element 110a and the
ultrasonic reception element 110b may be omitted as necessary.
The ultrasonic element unit 110 may be mounted to one surface of
the sound absorption unit 120. A first connection unit 121
corresponding to each ultrasonic element unit 110 may be mounted to
the sound absorption unit 120. In accordance with one embodiment,
the first connection unit 121 may be mounted to the sound
absorption unit 120 after passing through the sound absorption unit
120. In this case, the first connection unit 121 may be installed
to pass through the range from one surface to the other surface of
the sound absorption unit 120. In this case, one surface may
indicate a surface to which the ultrasonic element unit 110 is
mounted, and the other surface may indicate a surface to which the
substrate connection unit (e.g., a second electronic circuit) is
mounted. A detailed description of the sound absorption unit 120
and the first connection unit 121 will be given below.
The first processor 130 may generate and output the electrical
signal for controlling the ultrasonic element unit 110, or may
perform various kinds of signal processing using an ultrasonic
signal received from the ultrasonic element unit 110.
The electrical signal generated from the first processor 130 may be
transferred to the ultrasonic element unit 110 (e.g., the
ultrasonic transmission element 110a) through the first connection
unit 121. The ultrasonic transmission element 110a may be driven in
response to the received electrical signal. In addition, the first
processor 130 may receive the electrical signal corresponding to
ultrasonic waves received by the ultrasonic element unit 110 (e.g.,
the ultrasonic reception element 110b) through the first connection
unit 121.
The first processor 130 may be implemented by at least one
semiconductor chip and associated electronic components. In
accordance with the embodiment, the first processor 130 may also be
implemented by at least one Application Specific Integrated Circuit
(ASIC).
In accordance with the embodiment shown in FIG. 2A, the first
processor 130 may include at least one of a pulser 131, an
amplifier 132, an analog-to-digital converter (ADC) 133, and a
beamformer 134.
The pulser 131 may generate a voltage having a predetermined
frequency for driving the ultrasonic element unit 110, and may
transmit the generated voltage to the ultrasonic element unit 110.
The ultrasonic element unit 110 may be vibrated according to an
amplitude and frequency of the output voltage of the pulser 131,
and thus generate ultrasonic waves. The frequency and intensity of
ultrasonic waves generated from the ultrasonic element unit 110 may
be determined according to the amplitude and frequency of the
voltage generated from the pulser 131. The output voltage of the
pulser 131 may be applied to the ultrasonic element unit 110 at
intervals of a predetermined time, so that ultrasonic waves
generated from the ultrasonic element unit 110 may be focused on
the target site 98 or may be steered in a specific direction.
In accordance with the embodiment, the pulser 131 may be mounted to
the second processor 221. In this case, the first processor 130 may
not include the pulser 131.
The amplifier (AMP) 132 may amplify ultrasonic signals generated
from the ultrasonic reception element 110b of the ultrasonic
element unit 110. A gain of the amplifier 132 may be arbitrarily
determined by a system designer or a user. The amplifier 132 may
differently amplify multi-channel ultrasonic signals generated from
the plurality of ultrasonic element units 110 according to the
embodiment, so that a difference in intensity between multi-channel
ultrasonic signals can be compensated for.
If the amplified ultrasonic signals are analog signals, the ADC 132
may convert the analog signals into digital signals. The ADC 132
may perform sampling of ultrasonic signals acting as analog signals
according to a predetermined sampling rate, so that it may output a
digital signal.
A beamformer (B.F) 134 may focus ultrasonic signals input to a
plurality of channels. The beamformer 134 may focus signals
received from the ultrasonic element unit 110, the amplifier 132 or
the ADC 133, and thus generate the beamformed signal. The
beamformer 134 may perform various functions of multi-channel
signals, for example, electronic beam scanning-, steering-,
focusing-, apodizing-, and aperture-functions of multi-channel
signals.
FIG. 2B is a conceptual diagram illustrating a beamforming process
according to an embodiment of the present invention.
In accordance with the embodiment, the beamformer 134 may include a
time-difference correction unit 135 and a receiver focusing unit
136 as shown in FIG. 2B.
The time-difference correction unit 135 may correct a time
difference between multi-channel ultrasonic signals. There may
arise a time difference between multi-channel ultrasonic signals
generated from several ultrasonic element units 110 according to a
distance from the target 98 to each ultrasonic element unit 110 or
characteristics of the ultrasonic element unit 110. The
time-difference correction unit 135 may delay transmission of some
parts of multi-channel signals, so that it may correct a time
difference between multi-channel signals. The time-difference
correction unit 135 may be mounted to each channel of ultrasonic
signals generated from the ultrasonic element unit 110.
The receiver focusing unit 136 may synthesize multi-channel
ultrasonic signals, a time difference of which is corrected by the
time-difference correction unit 135. The receiver focusing unit 136
may synthesize multi-channel ultrasonic signals by applying a
predetermined weight to ultrasonic signals of respective channels.
The predetermined weight may be determined irrespective of the
ultrasonic signals, and may also be determined according to the
ultrasonic signals. According to the synthesizing result of
multi-channel ultrasonic signals, the receiver focusing unit 136
may output the beamformed signal. The beamformed signal may be
transferred to the main body 200.
If the beamformer 134 is mounted to the first processor 130, it is
necessary for the ultrasonic probe 100 to transmit only the
beamformed signal to the main body 200. Accordingly, since the
ultrasonic probe 100 need not transmit ultrasonic signals of all
channels to the main body 200, system complexity can be reduced
whereas system reliability can be increased.
The pulser 131, the amplifier 132, the ADC 133, and the beamformer
134 of the first processor 130 may be logically separated from each
other. In this case, the first processor 130 may be implemented by
one semiconductor chip and associated electronic components. In
accordance with another embodiment, the pulser 131, the amplifier
132, and the ADC 133, and the beamformer 134 of the first processor
130 may also be physically separated from each other. If the pulser
131, the amplifier 132, and the ADC 133, and the beamformer 134 of
the first processor 130 are physically separated from each other,
each thereof may be implemented by one or at least two
semiconductor chips and associated electronic components.
In accordance with the embodiment, at least one of the amplifier
132, the ADC 134, and the beamformer 134 of the first processor 130
may also be mounted to the main body 200. In this case, at least
one of the amplifier 132, the ADC 134, and the beamformer 134 may
be implemented by a Central Processing Unit (CPU) mounted to the
main body 200 or a Graphics Processing Unit (GPU). If the amplifier
132, the ADC 134, and the beamformer 134 are mounted to the main
body 200, signals generated from the ultrasonic element unit 110
may also be transferred to the main body 200 without
conversion.
For example, the ultrasonic probe 100 may be a linear array probe,
a convex array probe, or a sector phased array probe. In addition,
the ultrasonic probe 100 may be a mechanical sector array
probe.
A detailed internal structure of the ultrasonic probe 100 will
hereinafter be described in detail.
The main body 200 will hereinafter be described with reference to
FIG. 2A.
Referring to FIG. 2A, the main body 200 may include a signal
processing unit 210, an image processing unit 211, a volume data
generation unit 212, a storage unit 213, and a controller 220.
The signal processing unit 210 may perform signal processing of the
beamformed signal in various ways. For example, the signal
processor 210 may perform at least one of a filtering process, a
detection process, and a compression process. The filtering process
includes applying a filter to the beamformed signal so as to remove
signals other than signals of a specific bandwidth. The filtering
process may include a harmonic imaging process for removing a basic
frequency component and passing harmonic signals. A detection
process may convert a radio frequency (RF) format of a voltage of
an ultrasonic signal into a video signal format. The compression
process may reduce a difference in amplitude between ultrasonic
signals. The signal processing unit 210 may be omitted as
necessary.
The image processing unit 211 may convert the beamformed signal or
signals processed by the signal processing unit 210 into an
ultrasound image based on a still image or an ultrasound image
based on a moving image. In addition, the image processing unit 211
may perform predetermined image processing of a still image or
moving image.
The image processing unit 211 may generate an ultrasound image
using scan conversion. The generated ultrasound image may include
an A-mode ultrasound image, a B-mode ultrasound image, or an M-mode
ultrasound image. The A-mode ultrasound image may indicate an
ultrasound image obtained when reflection intensity is
amplitude-imaged on the basis of the distance or time from the
target site 98 to the ultrasonic probe 100. The B-mode ultrasound
image may indicate an ultrasound image obtained when the ultrasonic
intensity is represented using brightness. The M-mode ultrasound
image may indicate an ultrasound image obtained when a variation of
the operations of the object is imaged. The ultrasound image may
include a Doppler image based on the Doppler effect.
The image processing unit 211 may correct the generated ultrasound
image. For example, the image processing unit 211 may correct
brightness, luminance, sharpness, contrast, or color of all or some
regions of the ultrasound image in such a manner that a user can
definitely view tissues contained in the ultrasound image. The
image processing unit 211 may remove noise from the ultrasound
image or may perform pixel interpolation of the ultrasound
image.
The image processing unit 211 may transmit the generated or
corrected ultrasound image to the storage unit 213 or may display
the generated or corrected ultrasound image on the display unit
280. In addition, the image processing unit 211 may transmit the
generated or corrected ultrasound image to the volume data
generation unit 212, so that it can obtain ultrasonic volume
data.
The volume data generation unit 212 may obtain ultrasonic volume
data that indicates a three-dimensional (3D) volume using a
two-dimensional (2D) ultrasound image generated or corrected by the
image processing unit 211.
The signal processing unit 210, the image processing unit 211, or
the volume data generation unit 212 may be implemented by a CPU or
GPU. The CPU or GPU may be implemented by one or at least two
semiconductor chips and associated electronic components.
The storage unit 213 may store various programs associated with
functions of the controller 200, data, ultrasound images, and
various kinds of information associated with the ultrasound images.
The storage unit 213 may be implemented using a semiconductor
storage unit, a magnetic disc storage unit, a magnetic tape storage
unit, or the like.
The controller 220 may control overall operations of the ultrasonic
imaging apparatus 1 according to a user command or a predefined
configuration. For example, after the controller 220 generates a
predetermined control command according to a frequency of
ultrasonic waves to be irradiated, the controller 220 may transmit
the generated control command to the pulser 131 of the first
processor 130. The pulser 131 may apply a voltage having a
predetermined frequency to the ultrasonic element unit 110
according to a control command. Accordingly, the ultrasonic element
unit 110 may generate ultrasonic waves having a predetermined
frequency, and thus apply the ultrasonic waves to the target site
98 of the object 99.
The controller 220 may include a second processor 221; and a
storage unit 222, such as ROM or RAM, to assist the operations of
the second processor 221. The second processor 221 may be
implemented by a CPU. The CPU may be implemented by one or at least
two semiconductor chips and associated electronic elements.
The display unit 280 may display an ultrasound image for user
recognition. The display unit 280 may use a plasma display panel
(PDP), a light emitting diode (LED), a liquid crystal display
(LCD), or the like. The LED may include an organic light emitting
diode (OLED). In addition, the display unit 280 may use a 3D
display configured to represent a 3D image.
The input unit 290 may receive various commands related to control
of the ultrasonic imaging apparatus 1 from the user. The input unit
290 may output an electrical signal in response to user
manipulation, and may transmit the electrical signal to the second
processor 220.
The input unit 290 may include a manipulation panel 291 to which
various input devices are installed. For example, the input devices
may include at least one of a keyboard, a mouse, a track ball, a
knob, a touchpad, a paddle, various levers, a handle, a joystick,
and various input devices.
The input unit 290 may include a touchscreen unit 292. The user may
input various commands by touching a touch panel using a touch
tool, such as a finger or a touch pen, of the touchscreen unit
292.
The touchscreen unit 292 may be implemented by a resistive
touchscreen panel or a capacitive touchscreen panel. In addition,
the touchscreen unit 292 may also use ultrasonic waves or infrared
light.
The internal structure of the ultrasonic probe 100 will hereinafter
be described in detail.
FIG. 3 illustrates the internal structure of an ultrasonic probe
according to an embodiment of the present invention. FIG. 4 is an
exploded perspective view illustrating the internal structure of an
ultrasonic probe according to a first embodiment of the present
invention.
Referring to FIGS. 3 and 4, the ultrasonic probe 100 may include an
acoustic lens 109 installed at one end of the probe housing 107; an
ultrasonic element unit 110 located close to the acoustic lens 109;
a sound absorption unit 120, one surface of which contacts the
ultrasonic element unit 110 seated therein; a second electronic
circuit acting as a substrate connection unit installed at the
other surface of the sound absorption unit 120; a first electrical
circuit 150 electrically connected to the second electronic circuit
and disposed at the other surface of the second electronic circuit
140; a heat conduction unit 160 configured to absorb heat generated
from the first electronic circuit 150; and a conductive line (or a
conductive wire) 108 configured to transmit the electrical signal
generated from the first electronic circuit 150 to the main body
200.
The ultrasonic element unit 110, the sound absorption unit 120, the
second electronic circuit 140, the first electronic circuit 150,
the heat conduction unit 160, and the conductive line 180 may be
installed in the probe housing 107. A cable 93 may be fixed to the
other end of the probe housing 107 or may be detached from the
other end of the probe housing 107.
The housing 107 may allow various electronic components of the
ultrasonic probe 100 to be stably fixed, or may protect the
electronic components from external impact. The housing 107 may be
implemented by various metals or synthetic resins, and may be
formed in various shapes according to a use purpose of the
ultrasonic probe 100 or according to categories of objects or
target sites.
The acoustic lens 109 may focus or emit sound waves or ultrasonic
waves. The acoustic lens 109 may focus ultrasonic waves generated
from the ultrasonic element unit 110 on the target site 98. The
acoustic lens 109 may be formed of glass or synthetic fibers.
The ultrasonic element unit 110 may be mounted to one surface of
the sound absorption unit 120. The ultrasonic element unit 110 may
contact the acoustic lens 109 or may be disposed close to the
acoustic lens 109.
FIG. 5A is a conceptual diagram illustrating arrangement of an
ultrasonic element unit according to a first embodiment of the
present invention.
Referring to FIG. 5A, the ultrasonic element unit 110 may include a
matching layer 111 capable of being implemented as one or at least
two layers, an ultrasonic transducer 113, and an acoustic enhancer
114.
The matching layer 111 may maintain straightness or intensity of
the ultrasonic waves generated from the ultrasonic transducer 113,
or may minimize the problem in that the emitted ultrasonic waves do
not reach the target site 98 and are reflected from a surface of
the object 99 (e.g., the skin of a human being).
The matching layer 111 may include a plurality of matching layers,
i.e., a first matching layer 111a and a second matching layer 111b.
Each of the first matching layer 111a and the second matching layer
111b may be formed of a material having medium impedance between
impedance of each transducer 113 and tissue impedance. If the
matching layer 111 includes a plurality of matching layers (111a,
111b), the respective matching layers (111a, 111b) may contact each
other.
One surface of the first matching layer 111a may contact the
acoustic lens 109 or may be disposed close to the acoustic lens
109. The other surface of the first matching layer 111a may be
attached to one surface of the second matching layer 111b. The
ultrasonic transducer 113 may be attached to the other surface of
the second matching layer 111b. In this case, one ultrasonic
element unit 110 may also be attached to the other surface of the
second matching layer 111b, and a plurality of ultrasonic element
units may also be attached thereto.
In accordance with the embodiment, the acoustic matching layer 111
may include only one matching layer or may also include three or
more matching layers.
As described above, the ultrasonic transducer 113 may convert the
ultrasonic waves into electrical signals or vice versa. One surface
of the ultrasonic transducer 113 may be attached to the second
matching layer 111b.
The acoustic enhancer 114 may be attached to the other surface of
the ultrasonic transducer 113. The acoustic enhancer 114 may
amplify signals received from the first connection unit 121 so that
the ultrasonic transducer 113 may generate the amplified ultrasonic
waves. The ultrasonic transducer 113 may be attached to one surface
of the acoustic enhancer 114. The other surface facing one surface
of the acoustic enhancer 114 may contact the sound absorption unit
120 and the first connection unit 121. The acoustic enhancer 114
may be formed of a conductive material through which electricity
flows.
FIG. 5B is a conceptual diagram illustrating arrangement of an
ultrasonic element unit according to a second embodiment of the
present invention.
Referring to FIG. 5B, the acoustic enhancer 114 may be omitted, and
only the matching layer 111 and the ultrasonic transducer 113 may
be installed. In this case, the sound absorption unit 120 and the
first connection unit 121 may be directly mounted to the ultrasonic
transducer 113. The matching layer 111 and the ultrasonic
transducer 113 are identical to those of FIG. 5A, and as such a
detailed description thereof will herein be omitted for convenience
of description.
Embodiments of the sound absorption unit 120 in which the
ultrasonic element unit 110 is seated will hereinafter be described
in detail.
FIG. 6 is a conceptual diagram illustrating functions of the sound
absorption unit. FIG. 7 is a perspective view illustrating the
sound absorption unit according to a first embodiment of the
present invention. FIG. 8 is a plan view illustrating the sound
absorption unit according to a first embodiment of the present
invention. FIG. 9 is a lateral perspective view illustrating the
sound absorption unit according to a first embodiment of the
present invention.
As shown in FIG. 4, the ultrasonic element unit 110 may be attached
to one surface of the sound absorption unit 120 according to the
first embodiment, and the second electronic circuit 140 acting as
the substrate connection unit may be attached to the other surface
facing one surface.
Referring to FIG. 6, if the ultrasonic transducer 113 of the
ultrasonic element unit 110 generates ultrasonic waves in response
to a reception voltage, the generated ultrasonic waves may be
emitted in the direction (u1) of the object, and may also be
emitted in the direction (u2) of the sound absorption unit. As
described above, the ultrasonic waves (u2) emitted in the direction
of the sound absorption unit may cause noise in the ultrasound
image. In order to prevent the occurrence of noise, the sound
absorption unit 120 may be formed of a sound absorption material
122. The sound absorption material 122 may be a material capable of
absorbing sound waves or ultrasonic waves. The sound absorption
material 112 may absorb ultrasonic waves emitted in the direction
from the ultrasonic transducer 113 to the sound absorption unit,
and may reduce intensity of ultrasonic waves proceeding in an
undesired direction. As a result, noise capable of being generated
in the ultrasound image can be reduced.
The sound absorption material 122 of the sound absorption unit 120
may be formed of epoxy resin or a hafnium oxide material such as
hafnium oxide metal powder. In addition, the sound absorption
material 122 may be a mixture of epoxy resins, metals, and various
synthetic resins. In addition, various materials capable of
providing a function of absorbing sound waves or ultrasonic waves
may be used as the sound absorption material 122.
In accordance with one embodiment, the sound absorption material
122 may be formed in a hexahedral shape as shown in FIGS. 7 to 9.
The sound absorption material 122 may be formed in any of various
columns or spheres. The external appearance of the sound absorption
material 122 may be arbitrarily determined according to selection
of a system designer.
Referring to FIGS. 4 to 9, at least one first connection unit 121
configured to pass through the range from one surface 122a to the
other surface of the sound absorption material 122 may be mounted
to the sound absorption material 122. Here, the other surface may
be a surface facing one surface 122a of the sound absorption
material 120. The first connection unit 121 may be provided to pass
through the sound absorption material 122, so that the first
connection unit 121 may be exposed to the outside at both of one
surface 122a and the other surface of the sound absorption material
122.
The first connection unit 121 may be formed of a conductive
material through which electricity flows. In this case, the
conductive material may be any one of various metals through which
electricity flows, for example, copper (Cu), gold (Au), or the
like. Therefore, the first connection unit 121 may transmit an
electrical signal generated from the ultrasonic element unit 110 to
either the first electronic circuit 150 or the second electronic
circuit 140, or may transmit an electrical signal generated from
the first electronic circuit 150 or the second electronic circuit
140 to the ultrasonic element unit 110.
The first connection unit 121 may be formed in a hexahedral shape
as shown in FIGS. 7 to 9. However, the shape of the first
connection unit 121 is not limited thereto. In accordance with the
embodiment, the first connection unit 121 may be formed in a
cylindrical shape or various polygonal shapes. The shape of the
first connection unit 121 may also be arbitrarily determined
according to selection of a system designer.
The ultrasonic element unit 110 may be mounted to one surface 122a
of the sound absorption material 122. In this case, one surface
122a of the sound absorption material 122 may also be formed in a
planar shape. In addition, one surface 122a of the sound absorption
material 122 may be formed as a curved surface having a
predetermined curvature.
Referring to FIGS. 7 and 8, one or at least two seating units 125
in which the ultrasonic element unit 110 is seated may be mounted
to one surface 122a of the sound absorption material 122. The
seating unit 125 may include a seating surface 124 and a groove 123
formed in the vicinity of the seating surface 124. The ultrasonic
element unit 110 may be disposed on the seating surface 124. In
accordance with the embodiment, the ultrasonic transducer 113 may
be disposed on the seating surface 124, or the acoustic enhancer
124 may be disposed thereon. The groove 123 may separate the
seating surface 124 and other parts of one surface 122a from each
other.
One end of the first connection unit 121 may be exposed on the
seating surface 124. As described above, the first connection unit
121 may be formed to pass through the range from one surface 122a
to the other surface of the sound absorption material 120. In this
case, one first connection unit 121 may be exposed on the single
seating surface 124. The first connection unit 121 may be exposed
to the outside either at the center part of the seating surface 124
or in the vicinity of the center part of the seating surface 124.
If the ultrasonic element unit 110 is seated on the seating surface
124, the first connection unit 121 may contact one end of the
ultrasonic element unit 110. Therefore, the first connection unit
121 may be electrically coupled to the ultrasonic element unit
110.
The second electronic circuit 140 may be mounted to the other
surface of the sound absorption material 122.
FIG. 10 is a perspective view illustrating the sound absorption
unit according to a second embodiment of the present invention.
FIG. 11 is a plan view illustrating the sound absorption unit
according to a second embodiment of the present invention. FIG. 12
is a lateral cross-sectional view illustrating the sound absorption
unit according to a second embodiment of the present invention.
FIG. 13 is a view illustrating the sound absorption unit according
to a second embodiment of the present invention.
Referring to FIGS. 10 to 12, the sound absorption unit 120a of the
second embodiment may include a sound absorption material 122, one
surface 122a of which contacts the ultrasonic element unit 110 in
the same manner as in the sound absorption unit 120 of the first
embodiment. The first connection unit 121 may be configured to pass
through the range from one surface 122a to the other surface of the
sound absorption material 122.
One or at least two seating units 125 may be provided at one
surface 122a of the sound absorption unit 120a of the second
embodiment. The seating unit 125 may include a seating surface 124
and a groove 124 formed in the vicinity of the seating surface
124.
A plurality of first connection units (121a to 121d) may be exposed
on the seating surface 124. As can be seen from FIGS. 10 to 13,
each of the first connection units (121a to 121d) may be exposed to
the outside at the corners of the seating surface 124. As can be
seen from FIG. 13, if the ultrasonic element unit 110 is seated on
the seating surface 124, the first connection units (121a to 121d)
may contact one end of the ultrasonic element unit 110, and may
contact, for example, one surface of the acoustic enhancer 114. In
other words, the first connection units (121a to 121d) may support
one ultrasonic element unit 110. Therefore, the first connection
units (121a to 121d) may be electrically connected to the
ultrasonic element unit 110.
The first connection units (121a to 121d) may have various shapes
according to embodiments. For example, each of the first connection
units (121a to 121d) may be formed in a prismatic or cylindrical
shape. Besides, the first connection units (121a to 121d) may be
selected by the system designer. An exposed surface of each first
connection unit (121a to 121d) of the sound absorption unit 120a of
the second embodiment may be identical in width to or be smaller or
larger in width than the first connection unit 121 of the sound
absorption unit 120 of the first embodiment.
The second electronic circuit 140 will hereinafter be described as
an example of the substrate connection unit.
In accordance with the embodiment, the substrate connection unit
may include the second electronic circuit 140.
FIG. 14 is a view illustrating the second electronic circuit
according to a first embodiment of the present invention. FIG. 15
illustrates a curved structure of the second electronic circuit.
FIG. 16 is a cross-sectional view illustrating the second
electronic circuit.
In accordance with the embodiment, the second electronic circuit
140 may include a substrate, various circuits formed on the
substrate, and a semiconductor chip or other electronic components
connected to the various circuits. In accordance with the
embodiment, at least one of the substrate, the various circuits
formed on the substrate, the semiconductor chip or other electronic
components connected to the various circuits may be omitted as
necessary.
Referring to FIG. 14, the substrate of the second electrical
circuit 140 may be a rigid flexible PCB. The rigid flexible PCB may
be a multi-layered substrate composed of a flexible PCB 144 and a
rigid PCB 145. In more detail, the rigid flexible PCB may be
implemented by overlapping the rigid substrate 145 with some parts
of the flexible substrate 144.
The flexible substrate 144 may be easily bent, and the rigid
substrate 145 may not be easily bent. Therefore, as shown in 144a
and 144b of FIG. 15, one region (e.g., a first region) of the
second electronic circuit 140 may be flexibly curved in various
directions. The other region, for example, the second region, may
not be curved. In this case, the statement that the above region is
not curved does not indicate that the above region is not curved at
all, but indicates that the above region is not generally used as a
curved form.
An output unit 146 for communicating with the external part and its
associated various circuits and electronic components may be
mounted to the flexible substrate 144. A port coupled to the
connector provided at the end of the external conductive line 147
may be included in the output unit 146.
For example, the flexible substrate 144 may have a multi-layered
structure as shown in FIG. 16. In more detail, the flexible
substrate 144 may include a plurality of polyimide cover layers
(1441, 1447), a plurality of polyimide substrate layers (1443,
1445), and an adhesive layer to which the polyimide cover layers
and the polyimide substrate layers are adhered.
Various electronic components related to control of the ultrasonic
probe 100 may be mounted to the rigid substrate 145. The rigid
substrate 145 may be formed of a rigid material 1451. The rigid
material 1451 may be attached to the polyimide cover layers (1441,
1447) of the flexible substrate 144 through an adhesive. The
substrate connection unit 141 may be formed on the rigid substrate
145.
As shown in FIGS. 4 and 16, the substrate connection unit 141 may
pass through the second electronic circuit 140. In this case, the
substrate connection unit 141 may pass through the flexible
substrate 144 and the rigid substrate 145. The substrate connection
unit 141 may be electrically coupled to the first electronic
circuit 150.
Referring to FIG. 4, the substrate connection unit 141 may include
a first substrate connection unit 142 configured to electrically
interconnect the first connection unit 121 and the first electronic
circuit 150; and a second substrate connection unit 143 configured
to electrically interconnect the output unit 146 of the second
electronic circuit 140 and the first electronic circuit 150.
One end of the first substrate connection unit 142 may contact a
third connection unit 153 of the first electronic circuit 150, and
the other end thereof may contact the first connection unit 121 of
the sound absorption unit 120. Therefore, the first substrate
connection unit 142 may be electrically coupled to the third
connection unit 153 and the first connection unit 121. Therefore,
the first substrate connection unit 142 may transmit the electrical
signal generated from the third connection unit 153 of the first
electronic circuit 150 to the first connection unit 121 of the
sound absorption unit 120. The first substrate connection unit 142
may be provided at a specific part to which the flexible substrate
144 and the rigid substrate 145 are attached. In this case, the
first substrate connection unit 142 may pass through both
substrates (144, 145). The first substrate connection unit 142 may
be concentrated at a specific position (see `A` of FIG. 4) in such
a manner that the first substrate connection unit 142 can contact
the first connection unit 121 of the sound absorption unit 120.
One end of the second substrate connection unit 143 may be coupled
to a fourth connection unit 154 of the first electronic circuit
150, and the other end or the center part of the second substrate
connection unit 143 may be electrically coupled to the output unit
146. In this case, the second substrate connection unit 143 may be
electrically connected to the output unit 146 through the second
electronic circuit 140 (e.g., a circuit provided at a flexible
substrate 144). The electrical signal generated from the fourth
connection unit 154 of the first electronic circuit 150 may be
applied to the output unit 146 through the second substrate
connection unit 143. The second substrate connection unit 143 may
pass through both substrates (144, 145) at a specific part to which
the flexible substrate 144 and the rigid substrate 145 are
attached. The second substrate connection unit 143 may be provided
at a specific position (see `B` of FIG. 4) at which the second
substrate connection unit 143 does not contact the first connection
unit 121 of the sound absorption unit 120. For example, the second
substrate connection unit 143 may be installed at a specific
position of the rigid substrate 145, where the specific position
corresponds to the outer wall of the sound absorption unit 120.
Although only the mutual connection parts of the first substrate
connection unit 142 and the second substrate connection unit 143
are different from each other, the first substrate connection unit
142 and the second substrate connection unit 143 may be identical
in shape. Of course, according to some embodiments, the first
substrate connection unit 142 may be different in shape from the
second substrate connection unit 143 may be different from each
other.
Various embodiments of the substrate connection unit 141 will
hereinafter be described in detail.
FIG. 17A is a plan view illustrating the second electronic circuit
including the substrate connection unit according to a first
embodiment of the present invention. FIG. 17B is an exploded side
view illustrating the second electronic circuit including the
substrate connection unit according to a first embodiment of the
present invention.
The substrate connection unit 141 may include a via hole. As shown
in FIGS. 17A and 17B, the substrate connection unit 1420 of the
first embodiment may include a via hole. The via hole may include a
first opening (also called a first aperture) 1421 that passes
through the range from one surface to the other surface of the
second electronic circuit 140, and a conductive material 1422
mounted to the inner lateral surface of the first opening 1421.
The first opening 1421 may have a circular shape from the viewpoint
of a vertical upward direction of the second electronic circuit
140. In accordance with the embodiment, the first opening 1421 may
have a polygonal shape such as a triangular or rectangular shape.
In addition, the first opening 1421 may also have an elliptical
shape. The first opening 1421 may be formed in the second
electronic circuit 140 by puncturing the second electronic circuit
140 using a puncturing machine such as an electric drill.
The conductor 1422 may be provided at an inner lateral surface of
the first opening 1421. In more detail, a conductive material such
as metal is deposited on the inner lateral surface of the first
opening 1421, so that the conductor 1422 may be provided at the
inner lateral surface of the first opening 1421. A second opening
1423 may further be formed at the center part of the conductor
1422. The second opening 1423 may have a circular or polygonal
shape. In addition, the conductor 1422 may protrude in the opposite
direction from the center part of the second opening 1423 at both
surfaces of the second electronic circuit 140, and some parts of
both surfaces of the second electronic circuit 140 may be deposited
as shown in 1422a and 1422b.
FIG. 18A is a plan view illustrating the second electronic circuit
including the substrate connection unit according to a second
embodiment of the present invention. FIG. 18B is an exploded side
view illustrating the second electronic circuit including the
substrate connection unit according to a second embodiment of the
present invention.
Referring to FIGS. 18A and 18B, the substrate connection unit 1430
of the second embodiment may include a first opening 1431
configured to pass through the range from one surface to the other
surface of the second electronic circuit 140; a conductor 1432
formed at the inner lateral surface of the first opening 1431 and
including a second opening 1433 formed at an inner surface; and a
filter 1434 configured to shield the second opening 1433.
In the same manner as described above, the first opening 1431 may
have a polygonal shape such as a circular, triangular, or
rectangular shape or other shapes such as an elliptical shape from
the viewpoint of a vertical upward direction of the second
electronic circuit 140. The first opening 1431 may be formed in the
second electronic circuit 140 by puncturing the second electronic
circuit 140.
The conductor 1432 may be provided at the inner lateral surface of
the first opening 1431 by depositing a conductive material on the
inner lateral surface of the first opening 1431. The second opening
1433 provided at the conductor 1432 may have a circular or
polygonal shape.
The filling material 1434 is inserted into the second opening 1433
so as to shield the second opening 1433. The filling material 1434
may be formed of a material having no conductivity. The filling
material 1434 may also be formed of any of various synthetic
resins.
In the case of the substrate connection unit 1430 of the second
embodiment, the conductor 1432 protrudes in the opposite direction
from the center part of the second opening 1433 at both surfaces of
the second electronic circuit 140, and some parts of both surfaces
of the second electronic circuit 140 may be deposited as shown in
1432a and 1432b.
FIG. 19A is a plan view illustrating the second electronic circuit
including the substrate connection unit according to a third
embodiment of the present invention. FIG. 19B is an exploded side
view illustrating the second electronic circuit including the
substrate connection unit according to a third embodiment of the
present invention.
Referring to FIGS. 19A and 19B, the substrate connection unit 1440
of the third embodiment may include a first opening 1441 configured
to pass through the range from one surface to the other surface of
the second electronic circuit 140; and a conductor 1442 provided at
the inner surface of the first opening 1441. The conductor 1442 may
completely shield the first opening 1441. In other words, the
conductor 1442 may not form the second openings (1423, 1433) as
described above.
In the same manner as described above. the first opening 1441 may
have various shapes, and may be formed in the second electronic
circuit 140 using a puncturing machine.
FIG. 20A is a plan view illustrating the second electronic circuit
including the substrate connection unit according to a fourth
embodiment of the present invention. FIG. 20B is a bottom view
illustrating the second electronic circuit including the substrate
connection unit according to a fourth embodiment of the present
invention. FIG. 20C is an exploded side view illustrating the
second electronic circuit including the substrate connection unit
according to a fourth embodiment of the present invention.
Referring to FIGS. 20A to 20C, the substrate connection unit 1450
of the fourth embodiment may include a first opening 1451
configured to pass through the range from one surface to the other
surface of the second electronic circuit 140; and a conductor 1452
installed at the inner lateral surface of the first opening unit
1451.
In the same manner as described above, the first opening 1451 may
have various shapes, and may be formed in the second electronic
circuit 140 using the puncturing machine.
The conductor 1452 may be provided at the inner lateral surface of
the first opening 1451 by depositing a metal material or the like
on the inner lateral surface of the first opening 1451. The second
openings (1423, 1433) may be formed at a center part of the
conductor 1452, or may not be formed at the center part of the
conductor 1452.
Meanwhile, the conductor 1452 may protrude in the opposite
direction form the center part of the second opening 1423 at only
one surface of the second electronic circuit 140 (see 1452b). In
other words, the conductor 1452 may not be deposited on any one
surface of the second electronic circuit 140, or may be deposited
only on the other surface of the second electronic circuit 140.
FIG. 21 is a view illustrating a second electronic circuit
according to a second embodiment of the present invention.
Referring to FIG. 21, the second electronic circuit 140 may include
a plurality of output units (146, 148). The output units (146, 148)
may be provided at the flexible substrate 145. The output units
(146, 148) may output different electrical signals, and may
transmit the different electrical signals to the main body 200. The
respective output units (146, 148) may be connected to different
second substrate connection units 143. The different second
substrate connection units 143 may transmit the electrical signals
generated from the first electronic circuit 150 to the respective
output units (146, 148).
The first electronic circuit will hereinafter be described in
detail.
FIG. 22A is a perspective view illustrating a first electronic
circuit according to an embodiment of the present invention. FIG.
22B is a view illustrating the first electronic circuit according
to an embodiment of the present invention.
In accordance with the embodiment, the first electronic circuit 150
may include a substrate, various circuits formed on the substrate,
and a semiconductor chip and various electronic components
connected to the various circuits. For example, the first
electronic circuit 150 may include at least one Application
Specific Integrated Circuit (ASIC). In accordance with the
embodiment, at least one of the substrate of the first electronic
circuit 150, various circuits formed on the substrate, and a
semiconductor chip and various electronic components connected to
the various circuits may be omitted for convenience of
description.
Referring to FIGS. 4, 22A and 22B, one surface of the first
electronic circuit 150 may contact one surface of the second
electronic circuit 140. In more detail, the first electronic
circuit 150 may be mounted to a surface at which a support 120 of
the second electronic circuit 140 is not installed.
One or at least two second connection units 152 may be provided at
the first electronic circuit 150. The second connection unit 152
may be formed of a conductive metal material such as gold (Au) or
lead (Pb). The second connection unit 152 may be implemented as a
bump. The second connection unit 152 implemented as a bump may be,
for example, a solder ball. A thin electrode may also be provided
at one end of the second connection unit 152.
The second connection unit 152 may electrically contact the
substrate connection unit 141 of the second electronic circuit 140.
In this case, the thin electrode may also contact the substrate
connection unit 141. Since the second connection unit 152 contacts
the substrate connection unit 141 of the second electronic circuit
140, the first electronic circuit 150 and the second electronic
circuit 140 may be electrically interconnected by the substrate
connection unit 141 and the second connection unit 152. The second
connection unit 152 contained in the first electronic circuit 150
may have a position corresponding to the substrate connection unit
141 of the second electronic circuit 140, and the number of second
connection units 152 contained in the first electronic circuit 150
may correspond to the number of the substrate connection units 141
of the second electronic circuit 140.
Referring to FIG. 22B, the first electronic circuit 150 and the
second electronic circuit 140 may be adjacent to each other on the
basis of a predetermined gap. A separation unit 151 may be disposed
between the first electronic circuit 150 and the second electronic
circuit 140. The separation unit 151 may prevent the first
electronic circuit 150 from directly contacting the second
electronic circuit 140. The separation unit 151 may be formed of a
nonconductive material. For example, the separation unit 151 may
also be formed of epoxy resin. The epoxy resin may provide an
adhesive function, and the second electronic circuit 140 and the
first electronic circuit 150 may be adhered to each other using the
separation unit 151 formed of epoxy resin.
Referring to FIG. 22B, the second connection unit 152 may pass
through the separation unit 151 so that it may protrude toward the
outside of the separation unit 151. In other words, the first
electronic circuit 150 and various electronic components mounted to
the first electronic circuit 150 may be shielded by the separation
unit 151 formed of epoxy resin, so that they are not exposed to the
outside. However, only the second connection unit 152 may be
exposed to the outside of the separation unit 151. The second
connection unit 152 protruding toward the outside may contact the
substrate connection unit 141.
The separation unit 151 may be disposed between the first
electronic circuit 150 and the second electronic circuit 140 using
various methods.
For example, the first electronic circuit 150 and the second
electronic circuit are located close to each other in such a manner
that the second connection unit 152 contacts the substrate
connection unit 141, and a gap formed between the first electronic
circuit 150 and the second electronic circuit is filled with epoxy
resin, so that the separation unit 151 may be disposed between the
first electronic circuit 150 and the second electronic circuit.
In another example, after the epoxy resin is deposited on the first
electronic circuit 150 having the second connection unit 152 in
such a manner that some parts of the second connection unit 152 are
exposed to the outside, the second electronic circuit 140 is
installed on the epoxy resin, so that the separation unit 151 may
be disposed between the first electronic circuit 150 and the second
electronic circuit.
The second connection unit 152 may include a third connection unit
153 contacting a first substrate connection unit 142 and a fourth
connection unit 154 contacting a second substrate connection unit
143. The second connection unit 153 may be provided at a specific
position at which the second connection unit 153 can contact the
first substrate connection unit 142. The second connection unit 154
may be provided at a specific position at which the second
connection unit 154 can contact the second substrate connection
unit 143.
The first electronic circuit 150 may include a semiconductor chip
acting as the first processor 130 and electronic components
associated with the semiconductor chip. The first processor 130 may
be installed at a substrate of the first electronic circuit 150.
The second connection unit 152 may be provided at the first
electronic circuit 150, and may be disposed on the circuit
electrically connected to the first processor 130, so that the
second connection unit 152 may be electrically connected to the
first processor 130. The electrical signals generated from not only
the semiconductor chip acting as the first processor 130 but also
the associated components may be applied to the substrate
connection unit 141 or the output unit 146 through the second
connection unit 152. For example, the electrical signals (e.g.,
ultrasonic signals) transferred through the substrate connection
unit 141 may be applied to the first processor 130 through the
second connection unit 152.
FIG. 22C is a view illustrating a heat conduction unit installed at
a back surface of the first electronic circuit.
Referring to FIG. 4, the second electronic circuit 140 may be
attached to one surface of the first electronic circuit 150, and
the heat conduction unit 160 may be installed at the other surface
of the first electronic circuit 150. The heat conduction unit 160
may be attached to the other surface of the first electronic
circuit 150 using an adhesive or the like. Referring to FIG. 22C,
if the first processor 130 or the like installed at the first
electronic circuit 150 performs data calculation processing, heat
may occur in the first electronic circuit 150. The generated heat
may cause malfunction of the first electronic circuit 150 or may
cause malfunction of other electronic components (e.g., the second
electronic circuit 140) disposed in the vicinity of the first
electronic circuit 150.
The heat conduction unit 160 may emit the heat generated from the
first electronic circuit 150 to the outside. In more detail, after
heat generated from the first electronic circuit 150 is transferred
to the heat conduction unit 160, the heat may emit in the air along
the heat conduction unit 160.
The heat conduction unit 160 may be implemented using various heat
conductive materials. For example, the heat conduction unit 160 may
be formed of graphite, tungsten, tungsten oxide, silicon, aluminum
oxide, glass microballoon filling material, or the like.
A process of radiating ultrasonic waves using the above-mentioned
ultrasonic probe 100, a process for receiving ultrasonic waves and
converting the received ultrasonic waves into an electrical signal,
and a process for transferring the electrical signal to the main
body 200 will hereinafter be described in detail.
FIG. 23A is a conceptual diagram illustrating a process for
transmitting a control signal to the first processor mounted to the
ultrasonic probe. FIG. 23B is a conceptual diagram illustrating the
process for transmitting a control signal to the first processor
mounted to the ultrasonic probe. FIG. 23C is a conceptual diagram
illustrating a process for transmitting a control signal to the
ultrasonic element. FIG. 24 is a conceptual diagram illustrating a
process of radiating ultrasonic waves using the ultrasonic
element.
Referring to FIG. 23A, if the controller 220 of the main body 200
outputs a control signal, the control signal may be applied to the
circuit 149 contained in the second electronic circuit 140 through
the cable 93 and the conductive line 147 (S1). Referring to FIG.
23B, the control signal received through the conductive line 147
may be applied to the first processor 130 contained in the first
electronic circuit 150 through not only the second substrate
connection unit 143 connected to the circuit 149 but also the
fourth connection unit electrically connected to the second
substrate connection unit 143 (S2).
Referring to FIG. 23C, the first processor 130 contained in the
first electronic circuit 150 may output a control command related
to ultrasonic irradiation as an electrical signal format. The
electrical signal may be a pulse having a predetermined frequency.
The output control command may be applied to one or at least two
third connection units 153 through the circuit of the first
electronic circuit 150.
Referring to FIG. 23C, the electrical signals received by the third
connection unit 153 may pass through the second electronic circuit
140 through the substrate connection unit 141 attached to the third
connection unit 153, for example, through the first substrate
connection unit 142. After the electrical signal passes through the
second electronic circuit 140, the electrical signal may be applied
to the first connection unit 121 provided at the sound absorption
unit 120. The electrical signal applied to the first connection
unit 121 may be transmitted to the ultrasonic element unit 110
along the first connection unit 121 (S3).
Referring to FIG. 24, if the electrical signal is applied to the
ultrasonic element unit 110, the ultrasonic transducer 113 (e.g., a
piezoelectric element) of the ultrasonic element unit 110 may be
vibrated according to the received electrical signal so as to
generate ultrasonic waves (S4). The generated ultrasonic waves are
emitted to the outside. The generated ultrasonic waves may be
emitted in the direction of the object 99. Meanwhile, the generated
ultrasonic waves may also be emitted in the direction of the sound
absorption unit 120. In this case, the sound absorption unit 120
may absorb ultrasonic waves emitted in the direction of the sound
absorption unit 120.
FIGS. 25 and 26 are conceptual diagrams illustrating a process for
receiving ultrasonic waves using the ultrasonic element.
Referring to FIGS. 25 and 26, the ultrasonic element unit 110 may
receive ultrasonic waves from the external part (S5). The
ultrasonic waves received from the external part may be obtained
when ultrasonic waves generated from the ultrasonic element unit
110 are reflected from the target site 98 contained in the object
99. In accordance with the embodiment, the ultrasonic waves
received from the external part may be generated from the target
site 98 by irradiating laser or the like to the target site 98.
The ultrasonic transducer 113 of the ultrasonic element unit 110
may be vibrated with a frequency corresponding to a frequency of
the received ultrasonic waves. so as to output the alternating
current (AC) electrical signal. The electrical signal may be
transmitted to the processor 130 along an opposite path of the
ultrasonic irradiation case (S6). In more detail, the electrical
signal generated from the ultrasonic element unit 110 may be
applied to the first processor 130 through the first connector 121
provided at the sound absorption unit 120, the first substrate
connection unit 142, the third connection unit 153, and a circuit
contained in the first electronic circuit 150.
The first processor 130 may amplify the received electrical signal,
perform analog-to-digital conversion (ADC) of the amplified signal,
and perform beamforming for focusing multi-channel electric signals
generated from the respective ultrasonic element units 110. The
beamformed signals may be temporarily stored in a storage unit
(e.g., RAM) for assisting the first processor 130.
FIGS. 27 and 28 are conceptual diagrams illustrating a process for
transmitting processed signals to the main body.
The first processor 130 may output the beamformed signal, and the
beamformed signal may be applied to the fourth connection unit 143
along the circuit provided in the first electronic circuit 150. The
beamformed signal applied to the fourth connection unit 143 may be
transmitted to the second substrate connection unit 143 contacting
the fourth connection unit 143 (S7). The beamformed signal may be
applied to the output unit 146 through the circuit 149 coupled to
the second substrate connection unit 143.
The beamformed signal is output through the output unit 146, and
may be applied to the main body 200 through the conductive line 147
and the cable 93 connected to the output unit 146 (S8). The main
body 200 may perform signal processing and image processing of the
received beamformed signal, may generate an ultrasound image
corresponding to the beamformed signal, and may display the
ultrasound image on the display unit 280 for user recognition.
A process for fabricating the sound absorption unit will
hereinafter be described with reference to FIGS. 29 and 30.
FIGS. 29 and 30 are conceptual diagrams illustrating the process
for fabricating the sound absorption unit. FIG. 29 is a plan view
illustrating the sound absorption material 10 in which the
conductor 11 is inserted. FIG. 30 is a lateral cross-sectional view
illustrating the sound absorption material 10 in which the
conductor 11 is inserted. For convenience of description and better
understanding of the present invention, an upper part of FIG. 30
will hereinafter be referred to as an upward direction, and a
direction from the upper part to the lower part of FIG. 30 will
hereinafter be referred to as a vertical direction. In addition, a
specific direction orthogonal to the vertical direction will
hereinafter be referred to as a horizontal direction.
As can be seen from FIG. 29, the conductor 11 may be inserted into
the sound absorption material 10, and the conductor 11 may be diced
as necessary. The inserted conductor 11 may be used as the
above-mentioned support connection unit 121.
From the viewpoint of the upward direction, the conductor 12 may be
diced to have a square shape. The width (w1) or the height (h1) of
the conductor 11 may be designed in various ways according to
selection of the system designer. For example, the width (w1) of
the conductor 11 may be 50 micrometers (.mu.m), and the height (h1)
of the conductor 11 may be 50 micrometers (.mu.m). In addition, the
conductor 13 may be diced to have a rectangular shape. In this
case, the conductor 13 may have various widths (w2) and heights
(h2) according to selection of the system designer. For example,
the width (w2) of the conductor 12 may be 60 micrometers (.mu.m),
and the height (h2) of the conductor 12 may be 50 micrometers
(.mu.m).
If the conductor 11 is inserted into the sound absorption material
10, the sound absorption material 10 is severed in a horizontal
direction so that both ends of the conductor 11 are exposed to the
outside, as shown in FIG. 30. In more detail, the sound absorption
material 10 is cut along the first sectional surface (c1) and the
second sectional surface (c2) shown in FIG. 30. As a result, the
sound absorption material 10 formed when the conductor 11 is
exposed at the upper and lower parts can be obtained. The obtained
sound absorption material 10 may be used as the above-mentioned
sound absorption unit 120.
As is apparent from the above description, the ultrasonic probe
apparatus and the ultrasonic imaging apparatus according to the
embodiments can efficiently absorb ultrasonic waves emitted in the
direction from the ultrasonic elements to the ultrasonic probe,
resulting in implementation of improved acoustic throughput.
According to the ultrasonic probe apparatus and the ultrasonic
imaging apparatus, a processor of the ultrasonic probe apparatus
can be connected to a main body thereof without exposing the
conductive lines to the outside, so that product durability, such
as mechanical stability, electrical deterioration, corrosiveness,
and heat-resistance, can be improved, resulting in increased
product reliability.
According to the ultrasonic probe apparatus and the ultrasonic
imaging apparatus, the accuracy of impedance matching of signal
lines of a low volume dissemination system of semiconductors and a
time error between two signals needed for constructing one pair of
patterns, resulting in reduction of signal loss.
According to the ultrasonic probe apparatus and the ultrasonic
imaging apparatus, heat generated from the processor contained in
the ultrasonic probe and a substrate on which the processor is
disposed can be easily and quickly emitted to the outside.
According to the ultrasonic probe apparatus and the ultrasonic
imaging apparatus, the ultrasonic probe is reduced in weight,
resulting in greater convenience.
Although a few embodiments of the present invention have been shown
and described, it would be appreciated by those skilled in the art
that changes may be made in these embodiments without departing
from the principles and spirit of the invention, the scope of which
is defined in the claims and their equivalents.
* * * * *