U.S. patent application number 13/054092 was filed with the patent office on 2011-05-19 for ultrasonic probe having heat sink.
This patent application is currently assigned to Humanscan Co., Ltd.. Invention is credited to Sung Min Rhim.
Application Number | 20110114303 13/054092 |
Document ID | / |
Family ID | 41570461 |
Filed Date | 2011-05-19 |
United States Patent
Application |
20110114303 |
Kind Code |
A1 |
Rhim; Sung Min |
May 19, 2011 |
ULTRASONIC PROBE HAVING HEAT SINK
Abstract
The present invention provides an ultrasonic probe which
includes a heat sink (150) provided in a rear layer (140) to
dissipate heat. The heat sink is coupled to a rear surface (141) of
the rear layer such that contact area there between are increased.
The heat sink includes a plurality of heat conductive protrusions
(151) on one surface thereof. The heat conductive protrusions are
inserted into respective heat conductive depressions (142) formed
in the rear layer. Each heat conductive depression has a shape
corresponding to the respective heat conductive protrusion.
Preferably, each heat conductive protrusion has a bar shape.
Inventors: |
Rhim; Sung Min;
(Gyeonggi-do, KR) |
Assignee: |
Humanscan Co., Ltd.
Gyeonggi-do
KR
|
Family ID: |
41570461 |
Appl. No.: |
13/054092 |
Filed: |
July 6, 2009 |
PCT Filed: |
July 6, 2009 |
PCT NO: |
PCT/KR2009/003677 |
371 Date: |
January 14, 2011 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
A61B 8/546 20130101;
A61B 8/00 20130101; G10K 11/004 20130101; A61B 8/4483 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 22, 2008 |
KR |
10-2008-0071290 |
Claims
1. An ultrasonic probe, comprising: a rear layer; and a heat sink
provided in the rear layer to dissipate heat.
2. The ultrasonic probe according to claim 1, wherein the heat sink
is coupled to a rear surface of the rear layer such that contact
area therebetween are increased.
3. The ultrasonic probe according to claim 2, wherein the heat sink
includes a plurality of heat conductive protrusions on one surface
thereof, the heat conductive protrusions being inserted into
respective heat conductive depressions formed in the rear layer,
each of the heat conductive depressions having a shape
corresponding to the respective heat conductive protrusion.
4. The ultrasonic probe according to claim 3, wherein each of the
heat conductive protrusions has a bar shape.
5. The ultrasonic probe according to claim 4, wherein each of the
heat conductive protrusions has an inclined surface on an end
thereof to form an acute end.
6. The ultrasonic probe according to claim 4, wherein each of the
heat conductive protrusions includes an insert hole, the insert
hole penetrating from a distal end of the heat conductive
protrusion to a proximal end thereof.
7. The ultrasonic probe according to claim 6, wherein the insert
hole has a conical shape.
8. The ultrasonic probe according to claim 3, wherein each of the
heat conductive protrusions has a conical shape.
9. The ultrasonic probe according to claim 2, wherein the heat sink
includes an insert part to be inserted toward a rear surface of the
rear layer.
10. The ultrasonic probe according to claim 9, wherein the insert
part includes a coil-shaped wire.
Description
TECHNICAL FIELD
[0001] The present invention relates, in general, to ultrasonic
probes and, more particularly, to an ultrasonic probe having a heat
sink which prevents deterioration of the characteristics of a
piezoelectric device, thus preventing deterioration in performance
and durability of the ultrasonic probe, and also prevents an
acoustic lens from becoming excessively heated, thereby reducing
the temperature of the surface of the ultrasonic probe in contact
with a patient.
BACKGROUND ART
[0002] Generally, ultrasonic imaging apparatuses mainly include an
ultrasonic probe which performs conversion between electric and
ultrasonic signals, a signal processing unit which processes
transmitted or received signals, and a display which expresses
images by using signals received from the ultrasonic probe and
signals processing unit.
[0003] The ultrasonic probe performing signal conversions is a very
important part determining the quality of ultrasonic images. In
detail, the ultrasonic probe performs conversion between electrical
energy and acoustic energy. The ultrasonic probe must satisfy basic
conditions: which are good electric-acoustic conversion efficiency
(electromechanical coupling coefficient), ultrasonic pulse
characteristics, and focusability of ultrasonic beams.
[0004] A representative example of conventional medical ultrasonic
probes will be explained with reference to the attached
drawings.
[0005] FIG. 1 is a cross sectional view illustrating a conventional
medical ultrasonic probe. As shown in the drawing, the medical
ultrasonic probe 10 includes an acoustic lens 11, a matching layer
12, a piezoelectric device 13 and a rear layer 14, which are
arranged in sequence from a front front end contacting with a
patient.
[0006] The acoustic lens 11 covers the front surface of the
matching layer 12 and functions to focus ultrasonic waves.
[0007] The matching layer 12 is provided on an electrode of an
ultrasonic wave sending/receiving surface of the piezoelectric
device 13 and functions to enhance the reflectivity and efficiency
of ultrasonic waves.
[0008] The piezoelectric device 13 is attached to the front surface
of the rear layer 14 and is connected to a main PCB (printed
circuit board) through a FPCB (flexible printed circuit board; 15).
The piezoelectric device 130 converts electrical signals into
ultrasonic waves which are acoustic signals and emits the
ultrasonic waves into air. As well, the piezoelectric device 130
converts ultrasonic reflection signals, which are returned from air
by reflection, into electrical signals and transmits the electrical
signals to a main apparatus.
[0009] The rear layer 14 is fastened to a casing 16 in such a way
as to apply silicon to the rear layer 14 and the casing 16 after
they are closed together. The rear layer 14 functions to absorb
ultrasonic waves which are undesirably emitted backwards.
[0010] According to the intended purpose, the conventional medical
ultrasonic probes 10 having the above-mentioned construction are
classified into two kinds of probes, i.e., an image sensing probe
of image diagnostic apparatuses and, a medical treatment probe used
in HIFU (high intensity focused ultrasound) treatment systems for
cancer treatment or fat burning.
[0011] With regard to the ultrasonic probes used for imaging,
recently, the number of devices mounted to a small area of the
ultrasonic probes has gradually increased to enhance the
resolution. Here, small devices increase the difference in
electrical impedance between the image diagnostic apparatuses and
the probes, so that electrical energy which is not converted into
ultrasonic waves is converted into thermal energy and is lost.
[0012] The ultrasonic probe used for medical treatment requires
relatively high output, unlike the ultrasonic probe for imaging.
Thus, the amount of heat generated from devices used in the probe
is higher.
[0013] Heat generation in such a mediCal ultrasonic probe must be
restrained due to the two following reasons.
[0014] First, the piezoelectric device used in the ultrasonic probe
has the characteristic that it cannot stand much heat. Therefore,
if the ultrasonic probe is continuously maintained at a high
temperature, the characteristics of the piezoelectric device
deteriorate, resulting in deterioration of performance and
durability of the probe.
[0015] Second, the ultrasonic probe is typically brought into
contact with a patient when it is in operation, so that the
temperature of the contact surface of the ultrasonic probe with the
patient must be limited. In the case of ultrasonic probes which
generate a lot of heat, a comparatively low voltage is applied to
the ultrasonic probe when it is operated, because the temperature
of the contact surface of the ultrasonic probe with the patient
must not exceed the limiting temperature owing to heat generation
of the ultrasonic probe itself. However, this decreases the output
of the ultrasonic probe, thus deteriorating the performance
thereof.
DISCLOSURE OF INVENTION
Technical Problem
[0016] In an effort to overcome the above-mentioned problems
experienced with the conventional medical ultrasonic probes, as
methods of restraining heat generation to prevent deterioration of
the performance and durability of the ultrasonic probes, a
piezoelectric device having a high dielectric constant may be used,
and heat dissipation efficiency of the ultrasonic probe may be
increased.
[0017] In the case where the piezoelectric device having a high
dielectric constant is used, because a difference in electrical
impedance between the piezoelectric device and the system is
reduced, heat generation of the ultrasonic probe can be restrained.
Though, a stack type piezoelectric device or a piezoelectric device
having a high dielectric constant may be used to achieve the above
purposes, there is a limitation owing to limited availability of
such piezoelectric device or difficulty in manufacturing the stack
type piezoelectric device.
[0018] Furthermore, even if a rear layer is made of material having
high heat conductivity to increase heat diffusion, there is a
limitation in the use of material having high heat conductivity in
that the rear layer must satisfy a damping characteristic of an
ultrasonic wave. In particular, in the case of the structure for
increasing the heat dissipation efficiency of the ultrasonic probe,
there is a restriction in that heat generation in a contact surface
of the probe with a patient must be minimized and such heat
dissipation structure must not affect the performance of the
ultrasonic probe.
[0019] Accordingly, the present invention has been made keeping in
mind the above problems occurring in the prior art, and an object
of the present invention is to provide an ultrasonic probe which is
constructed such that heat is dissipated through a rear layer to
prevent heat from being emitted through a contact surface
contacting with a patient and such heat dissipation structure does
not deteriorate the performance of the ultrasonic probe.
Solution to Problem
[0020] In order to accomplish the above object, the present
invention provides an ultrasonic probe which includes a heat sink
provided in a rear layer to dissipate heat.
Advantageous Effects of Invention
[0021] In the present invention, heat generated from a
piezoelectric device is rapidly conducted to a heat sink via a rear
layer and dissipated. Therefore, deterioration in characteristics
of the piezoelectric device can be prevented, so that deterioration
in performance and durability of the ultrasonic probe can be
prevented. As well, a temperature of the contact surface of the
ultrasonic probe with the patient can be reduced by preventing heat
generation in an acoustic lens. Furthermore, ultrasonic waves
absorbed into the rear layer are prevented from being re-reflected
towards the front surface of the rear layer, so that the
performance of the ultrasonic probe can be maintained.
BRIEF DESCRIPTION OF DRAWINGS
[0022] FIG. 1 is a cross sectional view illustrating a conventional
medical ultrasonic probe;
[0023] FIG. 2 is a perspective view illustrating an ultrasonic
probe having a heat sink in accordance with a first embodiment of
the present invention;
[0024] FIG. 3 is a cross sectional view of the ultrasonic probe
having the heat sink in accordance with the first embodiment of the
present invention;
[0025] FIG. 4 is a perspective view showing the heat sink of the
ultrasonic probe in accordance with the first embodiment of the
present invention;
[0026] FIG. 5 is a perspective view illustrating an ultrasonic
probe having a heat sink, in accordance with a second embodiment of
the present invention;
[0027] FIG. 6 is a cross sectional view of the ultrasonic probe
having the heat sink in accordance with the second embodiment of
the present invention;
[0028] FIG. 7 is a perspective view showing the heat sink of the
ultrasonic probe in accordance with the second embodiment of the
present invention;
[0029] FIG. 8 is a cross sectional view of an ultrasonic probe
having a heat sink in accordance with a third embodiment of the
present invention;
[0030] FIG. 9 is a perspective view showing the heat sink of the
ultrasonic probe in accordance with the third embodiment of the
present invention;
[0031] FIG. 10 is a cross sectional view of an ultrasonic probe
having a heat sink in accordance with a fourth embodiment of the
present invention;
[0032] FIG. 11 is a perspective view showing the heat sink of the
ultrasonic probe in accordance with the fourth embodiment of the
present invention;
[0033] FIG. 12 is a cross sectional view of an ultrasonic probe
having a heat sink in accordance with a fifth embodiment of the
present invention; and
[0034] FIG. 13 is a perspective view showing the heat sink of the
ultrasonic probe in accordance with the fifth embodiment of the
present invention.
MODE FOR THE INVENTION
[0035] Hereinafter, preferred embodiments of the present invention
will be described in detail with reference to the accompanying
drawings. In the description of the present invention, detailed
explanation of well-known functions and constructions will be
omitted so that the present invention can be described more
clearly.
[0036] FIG. 2 is a perspective view illustrating an ultrasonic
probe 100 having a heat sink 150, in accordance with a first
embodiment of the present invention. FIG. 3 is a cross sectional
view of the ultrasonic probe 100 having the heat sink 150 in
accordance with the first embodiment of the present invention. FIG.
4 is a perspective view showing the heat sink 150 of the ultrasonic
probe 100 in accordance with the first embodiment of the present
invention. As shown in the drawings, the ultrasonic probe 100
having the heat sink 150 in accordance with the first embodiment of
the present invention includes, from the front end to be contacted
with a patient sequentially, an acoustic lens 110, a matching layer
120, a piezoelectric device 130 and a rear layer 140. The heat sink
150 is provided in the rear layer 140.
[0037] The acoustic lens 110 is attached to the matching layer 120
in a shape which covers the front surface of the matching layer
120. The acoustic lens 110 serves to focus ultrasonic waves.
[0038] The matching layer 120 is provided on an electrode of an
ultrasonic wave receive/send surface of the piezoelectric device
130 to increase ultrasonic wave transmitting efficiency and
reflectivity of ultrasonic waves.
[0039] The piezoelectric device 130 is adhered to the front surface
of the rear layer 140. First and second electrodes which are
connected to a PCB (not shown) through an FPCB 160 (flexible
printed circuit board) are provided on the respective opposite
surfaces of the piezoelectric device 130. The piezoelectric device
130 converts electrical signals into ultrasonic waves, which are
acoustic signals, and emits the ultrasonic waves into air. The
piezoelectric device 130 converts ultrasonic reflection signals,
which are returned from the air by reflection, into electrical
signals and transmits the electrical signals to a main
apparatus.
[0040] The rear layer 140 is coupled to the heat sink 150 and
absorbs unnecessary ultrasonic waves that are emitted backwards.
For the coupling with the heat sink 150, the rear layer 140 may be
integrally molded with the heat sink 150.
[0041] The heat sink 150 is made of high heat conductivity, e.g.,
metal such as aluminum (Al) and copper (Cu). The heat sink 150 is
fastened to a rear surface 141 of the rear layer 140, that is, to a
surface of the rear layer 140 which is opposite the surface to
which the piezoelectric device 130 is adhered. The heat sink 150 is
fastened to a casing 170 by applying silicon to the heat sink 150
and the casing 170 after they are closed together.
[0042] It is preferable that the heat sink 150 is coupled to the
rear surface 141 of the rear layer 140 such that the contact area
therebetween can be large enough to increase heat transfer
therebetween. To achieve the above purpose, a plurality of heat
transfer protrusions 152 for increasing heat transfer efficiency
with the rear layer 140 is provided on one surface of a base body
151 of the heat sink 150. Furthermore, a plurality of heat
conductive depressions 142 which have shapes corresponding to the
heat conductive protrusions 152 is formed in the rear layer 140, so
that the heat conductive protrusions 152 are inserted into the
respective heat conductive depressions 142. As such, because the
rear layer 140 has the heat conductive depressions 142 having
shapes corresponding to the heat conductive protrusions 152, a
closer contact between the heat conductive depressions 142 and the
heat conductive protrusions 152 is provided, thus enhancing heat
transfer between the rear layer 140 and the heat sink 150.
[0043] As shown in FIG. 4, each heat conductive protrusion 152
preferably has a bar shape, thus maximizing the contact area with
the rear layer 140 which is connected to the heat conductive
protrusions 152 through the heat conductive depressions 142.
[0044] In the ultrasonic probe 100 having the heat sink 150 in
accordance with the first embodiment of the present invention
having the above-mentioned construction, heat generated from the
piezoelectric device 130 is conducted to the heat sink 150 via the
rear layer 140 and dissipated, thus increasing a heat transfer rate
to the rear layer 140. In particular, because the ultrasonic probe
100 is constructed such that the heat conductive protrusions 152 of
the heat sink 150 are inserted into the respective heat conductive
depressions 142 of the rear layer 140, the contact surface between
the rear layer 140 and the heat sink 150 is increased, so that the
heat transfer from the rear layer 140 to the heat sink 150 can be
markedly enhanced.
[0045] As such, in the present invention, heat generated from the
piezoelectric device 130 can be rapidly dissipated by using the
heat sink 150. Therefore, the piezoelectric device 130 can be
protected from heat, thus preventing deterioration in
characteristics of the piezoelectric device 130. In addition, the
rear layer 140 can maintain its ultrasonic attenuation
characteristic. Accordingly, deterioration in performance and
durability of the ultrasonic probe 100 can be prevented. Further,
since heat conduction to the acoustic lens 110 is reduced, the
temperature of the contact surface of the ultrasonic probe 100 to
be contacted with the patient can be reduced.
[0046] FIG. 5 is a perspective view illustrating an ultrasonic
probe 200 having a heat sink 250 in accordance with a second
embodiment of the present invention. FIG. 6 is a cross sectional
view of the ultrasonic probe 200 having the heat sink 250 in
accordance with the second embodiment of the present invention. As
shown in the drawings, the ultrasonic probe 200 having the heat
sink 250 in accordance with the second embodiment of the present
invention includes, sequentially from the front end to be brought
into contact with a patient, an acoustic lens 210, a matching layer
220, a piezoelectric device 230 and a rear layer 240. The heat sink
250 is provided in the rear layer 240. The general construction of
the ultrasonic probe 200 in accordance with the second embodiment,
except for the heat sink 250, remains the same as that of the
ultrasonic probe 100 in accordance with the first embodiment, and
therefore further explanation is deemed unnecessary.
[0047] To couple the heat sink 250 to the rear layer 240 such that
the contact area therebetween are increased, heat conductive
protrusions 252 are perpendicularly provided on one surface of a
base body 251 of the heat sink 250 and are inserted into respective
heat conductive depressions 242 which are formed in the rear layer
240. As shown in FIG. 7, each heat conductive protrusion 252 has a
bar shape which has an inclined surface 252a on an end thereof to
form an acute end.
[0048] Each of the heat conductive depressions 242 of the rear
layer 240 has a shape corresponding to that of the corresponding
heat conductive protrusion 252, so that the entire surfaces of heat
conductive protrusions 252 can be in close contact with the rear
layer 240.
[0049] In the ultrasonic probe 200 having the heat sink 250 in
accordance with the second embodiment of the present invention
having the above-mentioned construction, heat generated from the
piezoelectric device 230 is rapidly conducted to the heat sink 250
via the rear layer 240 and is dissipated, thus preventing
deterioration of characteristics of the piezoelectric device 230.
Accordingly, deterioration in performance and durability of the
ultrasonic probe 200 can be prevented. As well, the temperature of
the contact surface of the ultrasonic probe 200 to be contacted
with the patient can be reduced by virtue of a reduction in
temperature of the acoustic lens 210.
[0050] Furthermore, as shown in FIG. 6, ultrasonic waves absorbed
into the rear layer 240 are reflected in transverse directions by
the inclined surfaces 252a that are formed on the heat conductive
protrusions 252 of the heat sink 250. Thus, ultrasonic waves
absorbed into the rear layer 240 are prevented from being
re-reflected towards the front surface of the ultrasonic probe 200,
so that the ultrasonic waves can be reabsorbed in the rear layer
240 and thus extinguished. Therefore, the intended purpose of the
rear layer 240, that is, the purpose of absorbing back reflection
waves, can be achieved, thus preventing deterioration in
performance of the ultrasonic probe 200.
[0051] FIG. 8 is a cross sectional view of an ultrasonic probe 300
having a heat sink 350 in accordance with a third embodiment of the
present invention. FIG. 9 is a perspective view showing the heat
sink 350 of the ultrasonic probe 300 in accordance with the third
embodiment of the present invention. As shown in the drawings, the
ultrasonic probe 300 having the heat sink 350 in accordance with
the third embodiment of the present invention includes,
sequentially from the front end which is to be brought into contact
with a patient, an acoustic lens 310, a matching layer 320, a
piezoelectric device 330 and a rear layer 340. The heat sink 350 is
provided in the rear layer 340. The general construction of the
ultrasonic probe 300 in accordance with the third embodiment,
except for the heat sink 350, remains the same as that of the
ultrasonic probe 100 in accordance with the first embodiment,
therefore further explanation is deemed unnecessary.
[0052] To couple the heat sink 350 to the rear layer 340 such that
the contact area therebetween is increased, heat conductive
protrusions 352 are perpendicularly provided on one surface of a
base body 351 of the heat sink 350 and are inserted into respective
heat conductive depressions 342 which are formed in the rear layer
340. Each heat conductive protrusion 352 is formed in a bar shape
and has therein an insert hole 352a which penetrated from the
distal end of the heat conductive protrusion 352 towards the
proximal end thereof.
[0053] The insert hole 352a has a conical shape to prevent
ultrasonic waves absorbed into the rear layer 340 from being
re-reflected towards the front surface of the ultrasonic probe 300
by the heat sink 350.
[0054] Each of the heat conductive depressions 342 of the rear
layer 340 has a shape corresponding to that of the corresponding
heat conductive protrusion 352, so that the entire surface of heat
conductive protrusions 352 can be in close contact with the rear
layer 340. In other words, each heat conductive depression 342 has
a shape capable of receiving the corresponding heat conductive
protrusion 352, and an insert protrusion 342a is provided in each
heat conductive depression 342 and inserted into the insert hole
352a of the corresponding heat conductive protrusion 352.
[0055] In the ultrasonic probe 300 having the heat sink 350 in
accordance with the third embodiment of the present invention
having the above-mentioned construction, heat generated from the
piezoelectric device 330 is rapidly conducted to the heat sink 350
via the rear layer 340 and is dissipated, thus preventing
deterioration of characteristics of the piezoelectric device 330.
Accordingly, deterioration in performance and durability of the
ultrasonic probe 300 can be prevented. As well, the temperature of
the contact surface of the ultrasonic probe 300 to be contacted
with the patient can be reduced by virtue of a reduction in
temperature of the acoustic lens 310.
[0056] Furthermore, ultrasonic waves absorbed into the rear layer
340 are repeatedly reflected by the inner surfaces of the insert
holes 352a of the heat sink 350 and are eventually cancelled out,
thus reducing reflection of the ultrasonic waves towards the front
surface of the rear layer 340, thereby preventing deterioration in
performance of the ultrasonic probe 300.
[0057] FIG. 10 is a cross sectional view of an ultrasonic probe 400
having a heat sink 450 in accordance with a fourth embodiment of
the present invention. FIG. 11 is a perspective view showing the
heat sink 450 of the ultrasonic probe 400 in accordance with the
fourth embodiment of the present invention. As shown in the
drawings, the ultrasonic probe 400 having the heat sink 450 in
accordance with the fourth embodiment of the present invention
includes, sequentially from the front end which is to be brought
into contact with a patient, an acoustic lens 410, a matching layer
420, a piezoelectric device 430 and a rear layer 440. The heat sink
450 is provided in the rear layer 440. The general construction of
the ultrasonic probe 400 in accordance with the fourth embodiment
remains the same as that of the ultrasonic probe 100 in accordance
with the first embodiment except for the heat sink 450, and
therefore further explanation is deemed unnecessary.
[0058] To couple the heat sink 450 to the rear layer 440 such that
the contact area therebetween is increased, heat conductive
protrusions 452 are perpendicularly provided on one surface of a
base body 451 of the heat sink 450 and are inserted into respective
heat conductive depressions 442 which are formed in the rear layer
440. Each heat conductive depression 442 has a shape corresponding
to that of the corresponding heat conductive protrusion 452. Each
heat conductive protrusion 452 has a conical shape to prevent
ultrasonic waves absorbed into the rear layer 440 from being
re-reflected towards the front surface of the rear layer 440.
[0059] Furthermore, each of the heat conductive depressions 442 of
the rear layer 440 has a shape, i.e., a conical shape,
corresponding to the corresponding heat conductive protrusion 452,
so that the entire surface of the heat conductive protrusions 452
can be in close contact with the rear layer 440.
[0060] In the same manner as the prior embodiments, in the
ultrasonic probe 400 having the heat sink 450 in accordance with
the fourth embodiment of the present invention having the
above-mentioned construction, heat generated from the piezoelectric
device 430 is rapidly conducted to the heat sink 450 via the rear
layer 440 and is dissipated, thus preventing deterioration of
characteristics of the piezoelectric device 430. Accordingly,
deterioration in performance and durability of the ultrasonic probe
400 can be prevented. As well, the temperature of the surface of
the ultrasonic probe 400 coming into contact with the patient can
be reduced by virtue of a reduction in temperature of the acoustic
lens 410.
[0061] Furthermore, since ultrasonic waves absorbed into the rear
layer 440 are reflected in transverse directions by the conical
heat conductive protrusions 452 of the heat sink 450, the
ultrasonic waves are prevented from being re-reflected towards the
front surface of the rear layer 440 and are reabsorbed into
portions of the rear layer 440 which are disposed around the heat
conductive protrusions 452. The reabsorbed ultrasonic waves are
eventually cancelled out. Therefore, deterioration in performance
of the ultrasonic probe 400 can be prevented.
[0062] FIG. 12 is a cross sectional view of an ultrasonic probe 500
having a heat sink 550 in accordance with a fifth embodiment of the
present invention. FIG. 13 is a perspective view showing the heat
sink 550 of the ultrasonic probe 500 in accordance with the fifth
embodiment of the present invention. As shown in the drawings, the
ultrasonic probe 500 having the heat sink 550 in accordance with
the fifth embodiment of the present invention includes,
sequencially from the front end which is to be brought into contact
with a patient, an acoustic lens 510, a matching layer 520, a
piezoelectric device 530 and a rear layer 540. The heat sink 550 is
provided in the rear layer 540. The general construction of the
ultrasonic probe 500 in accordance with the fifth embodiment,
except for the rear layer 540 and the heat sink 550, remains the
same as that of the ultrasonic probe 100 in accordance with the
first embodiment, and therefore further explanation is deemed
unnecessary.
[0063] With regard to the coupling of the heat sink 550 to the rear
layer 540, an insert part 552 is provided on one surface of a base
body 551 of the heat sink 550 and is embedded in the rear surface
541 of the rear layer 540.
[0064] It is preferable that the insert part 552 be made of a wire
552a having a coil shape to increase heat conductivity between the
rear layer 540 and the heat sink 550.
[0065] The insert part 552 includes a plurality of coil-shaped
wires 552a which are, for example, arranged in parallel with each
other on a base body 551 of the heat sink 550. Each coil-shaped
wire 552a may be provided in such a way that the opposite ends
thereof are integrated with the base body 551 when the base body
551 is formed or, alternatively, in such a way that the opposite
ends thereof force-fitted into the base body 551. Furthermore, the
coil-shaped wires 552a is embedded in the rear layer 540 when the
rear layer 540 is formed on the base body 551 of the heat sink 550
by molding. Accordingly, the base body 551 of the heat sink 550 is
coupled to the rear layer 540. Furthermore, interference with
ultrasonic waves absorbed into the rear layer 540 is minimized,
thus preventing the ultrasonic waves from being re-reflected
towards the front surface of the rear layer 540.
[0066] In the same manner as the prior embodiments, in the
ultrasonic probe 500 having the heat sink 550 in accordance with
the fifth embodiment of the present invention having the
above-mentioned construction, heat generated from the piezoelectric
device 530 is rapidly conducted to the heat sink 550 via the rear
layer 540 and is dissipated, thus preventing deterioration of
characteristics of the piezoelectric device 430. Accordingly,
deterioration in performance and durability of the ultrasonic probe
400 can be prevented. Further, the temperature of the acoustic lens
410 can be reduced. In particular, the coil-shaped wires 552a which
are embedded in the rear layer 540 serve to increase the area of a
heat conduction passage between the rear layer 540 and the heat
sink 550, thus further enhancing the heat transfer efficiency of
the heat sink 550.
[0067] As well, in the fifth embodiment, since ultrasonic waves
absorbed into the rear layer 540 pass between the coil-shaped wires
552a, the ultrasonic waves are prevented from being re-reflected
towards the front surface of the rear layer 540, thus preventing
deterioration in performance of the ultrasonic probe 500.
[0068] As described above, in accordance with the preferred
embodiments of the present invention, heat generated from a
piezoelectric device is rapidly conducted to a heat sink via a rear
layer and dissipated. Therefore, deterioration in characteristics
of the piezoelectric device can be prevented, so that deterioration
in performance and durability of the ultrasonic probe can be
prevented. Further, the temperature of the surface of the
ultrasonic probe which comes into contact with the patient can be
reduced by virtue of a reduction in temperature of the acoustic
lens.
[0069] Furthermore, ultrasonic waves absorbed into the rear layer
are prevented from being re-reflected towards the front surface of
the rear layer, so that the performance of the ultrasonic probe can
be maintained. In addition, heat conductive protrusions of the heat
sink have shapes to prevent absorbed ultrasonic waves from being
re-reflected towards the front surface of the rear layer. Hence,
the present invention can overcome a disadvantage in which the heat
sink cannot be disposed adjacent to the piezoelectric device due to
the possibility of re-reflection of ultrasonic waves to the front
surface of the rear layer. Accordingly, the efficiency of heat
transfer to the rear layer can be markedly enhanced.
[0070] Although the preferred embodiments of the present invention
have been disclosed for illustrative purposes, those skilled in the
art will appreciate that various modifications, additions and
substitutions are possible, without departing from the scope and
spirit of the invention as disclosed in the accompanying
claims.
* * * * *