U.S. patent number RE46,589 [Application Number 14/797,980] was granted by the patent office on 2017-10-24 for group iii nitride led with undoped cladding layer and multiple quantum well.
This patent grant is currently assigned to Cree, Inc.. The grantee listed for this patent is Cree, Inc.. Invention is credited to Michael John Bergmann, Kathleen Marie Doverspike, John Adam Edmond, David Todd Emerson, Hua-shuang Kong.
United States Patent |
RE46,589 |
Edmond , et al. |
October 24, 2017 |
**Please see images for:
( Certificate of Correction ) ** |
Group III nitride LED with undoped cladding layer and multiple
quantum well
Abstract
The present invention is a semiconductor structure for light
emitting devices that can emit in the red to ultraviolet portion of
the electromagnetic spectrum. The structure includes a first n-type
cladding layer of Al.sub.xIn.sub.yGa.sub.1-x-yN, where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and (x+y).ltoreq.1; a
second n-type cladding layer of Al.sub.xIn.sub.yGa.sub.1-x-yN,
where 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and (x+y).ltoreq.1,
wherein the second n-type cladding layer is further characterized
by the substantial absence of magnesium; an active portion between
the first and second cladding layers in the form of a multiple
quantum well having a plurality of In.sub.xGa.sub.1-xN well layers
where 0<x<1 separated by a corresponding plurality of
Al.sub.xIn.sub.yGa.sub.1-x-yN barrier layers where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y.ltoreq.1; a p-type layer of a
Group III nitride, wherein the second n-type cladding layer is
positioned between the p-type layer and the multiple quantum well;
and wherein the first and second n-type cladding layers have
respective bandgaps that are each larger than the bandgap of the
well layers. In preferred embodiments, a Group III nitride
superlattice supports the multiple quantum well.
Inventors: |
Edmond; John Adam (Durham,
NC), Doverspike; Kathleen Marie (Cary, NC), Kong;
Hua-shuang (Cary, NC), Bergmann; Michael John (Raleigh,
NC), Emerson; David Todd (Hillsoborough, NC) |
Applicant: |
Name |
City |
State |
Country |
Type |
Cree, Inc. |
Durham |
NC |
US |
|
|
Assignee: |
Cree, Inc. (Durham,
NC)
|
Family
ID: |
1000002669879 |
Appl.
No.: |
14/797,980 |
Filed: |
July 13, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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09760635 |
Oct 5, 2004 |
6800876 |
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60294445 |
May 30, 2001 |
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Reissue of: |
10159893 |
May 30, 2002 |
6906352 |
Jun 14, 2005 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
33/32 (20130101); H01L 33/06 (20130101); H01S
5/34333 (20130101); B82Y 20/00 (20130101); H01S
5/343 (20130101); H01L 33/32 (20130101); H01L
33/02 (20130101); H01L 33/06 (20130101); B82Y
20/00 (20130101); H01L 33/14 (20130101) |
Current International
Class: |
H01L
33/00 (20100101); H01L 33/06 (20100101); H01S
5/343 (20060101); H01L 33/02 (20100101); H01L
33/32 (20100101); B82Y 20/00 (20110101); H01L
33/14 (20100101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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10-321942 |
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Dec 1998 |
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JP |
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2001-036196 |
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Feb 2001 |
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JP |
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WO 9918617 |
|
Apr 1999 |
|
WO |
|
Other References
Kubota, et al;"Preparation and properties of III-V nitride thin
films"; J. Appl. Phys. 66(7); Oct. 1, 1989; pp. 2984-2988. cited by
applicant .
Chan, et al.; "Metallization of GaN Thin Films Prepared by Ion Beam
Assisted Molecular Beam Epitaxy"; Materials Research Society
Symposium Proc. vol. 339; 1994; pp. 223-227. cited by applicant
.
Lin, et al.; "Low resistance ohmic contacts on wide band-gap GaN";
Appl. Phys. Lett. 64(8); Feb. 21, 1994; pp. 1003-1005. cited by
applicant .
Wright, et al.; "First-principles calculations for zinc-blende
AllnN alloys"; Appl. Phys. Lett. 66(25); Jun. 19, 1995; pp.
3465-3467. cited by applicant .
Sakai, et al.; "GaN/GaIn/GaN Double Heterostructure Light Emitting
Diode Fabricated Using Plasma-Assisted Molecular Beam Epitaxy";
Jpn. Appl. Phys. vol. 34; 1995; pp. 1429-1430. cited by applicant
.
McIntosh, et al.; "Growth and characterization of AllGaN quaternary
alloys"; Appl. Phys. Lett. 68(1); Jan. 1, 1996; pp. 40-42. cited by
applicant .
Mack; "Characteristics of Indium-Gallium-Nitride
Multiple-Quantum-Well Blue Laser Diodes Grown by MOCVD"; MRS
Internet Journal of Nitride Semiconductor Research; vol. 2, Article
41; 1997. cited by applicant .
Matsuoka; "Calculation of unstable mixing region in wurtzite
In1-x-y Ga x Al y N"; Appl. Phys. Lett. 71(1); Jul. 7, 1997, pp.
105-106. cited by applicant .
Monemar, et al; "Radiative recombination in In 0.15 Ga 0.85 N/GaN
multiple quantum well structures"; MRS Internet Journal Nitride
Semiconductor Research; 1999. cited by applicant .
Kariya, et al; "Mosaic Structure of Ternary Al 1-x In x N Films on
GaN Grown by Metalorganic Vapor Phase Epitaxy"; Jpn. Appl. Phys.
vol. 38; 1999; pp. 984-988. cited by applicant .
Kariya, et al; "Structural characterization of Al 1-x In x N
lattice-matched to GaN"; Journal of Crystal Growth 209; 2000; pp.
419-423. cited by applicant .
Kariya, et al; "Structural Properties of Al 1-x In x N Ternary
Alloys on GaN Grown by Metalorganic Vapor Phase Epitaxy"; Jpn.
Appl. Phys., vol. 37; 1998; pp. 697-699. cited by applicant .
Yamaguchi, et al; "Anomalous features in the optical properties of
Al 1-x In x N on GaN grown by metal organic vapor phase epitaxy";
Applied Physics Letters, vol. 76(7); Feb. 14, 2000; pp. 876-878.
cited by applicant.
|
Primary Examiner: Menefee; James
Attorney, Agent or Firm: Myers Bigel, P.A.
Parent Case Text
This is a continuation in part of application Ser. No. 09/760,635
filed Jan. 16, 2001 for, "Group III Nitride LED with Undoped
Cladding Layer." This application also claims priority from
Provisional Application No. 60/294,445 filed May 30, 2001 for,
"Multi-Quantum Well Light Emitting Diode Structure." This
application incorporates entirely by reference co-pending and
commonly-assigned applications Ser. No. 09/706,057 filed Nov. 3,
2000 for "Group III Nitride Light Emitting Devices with
Gallium-Free Layers," and Ser. No. 60/298,835 filed Jun. 15, 2001
for "Ultraviolet Light Emitting Diode."
Claims
That which is claimed is:
1. A semiconductor structure for light emitting devices that can
emit in the red to ultraviolet portion of the electromagnetic
spectrum, said structure comprising: a first n-type cladding layer
of Al.sub.xIn.sub.yGa.sub.1-x-yN, where 0.ltoreq.x.ltoreq.1 and
0.ltoreq.y<1 and (x+y).ltoreq.1; a second n-type cladding layer
of Al.sub.xIn.sub.yGa.sub.1-x-yN where 0.ltoreq.x.ltoreq.1 and
0.ltoreq.y<1 and (x+y).ltoreq.1, wherein said second n-type
cladding layer is further characterized by the substantial absence
of magnesium.Iadd., and wherein a composition of said second n-type
cladding layer is graded.Iaddend.; an active portion between said
first and second cladding layers in the form of a multiple quantum
well having a plurality of In.sub.xGa.sub.1-xN well layers where
0<x<1 separated by a corresponding plurality of
Al.sub.xIn.sub.yGa.sub.1-x-yN barrier layers where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y.ltoreq.1; a p-type layer of a
Group III nitride, wherein said second n-type cladding layer is
positioned between said p-type layer and said multiple quantum
well; wherein said first and second n-type cladding layers have
respective bandgaps that are each larger than the bandgap of said
well layers.Iadd., wherein a p-n junction is defined between said
second n-type cladding layer and said p-type layer.Iaddend..
2. A structure according to claim 1 wherein said barrier layers
comprise Al.sub.xIn.sub.yGa.sub.1-x-yN where 0.ltoreq.x<1 and
0<y<1.
3. A structure according to claim 1 wherein said barrier layers
comprise Al.sub.xIn.sub.yGa.sub.1-x-yN where 0<x<1 and
0.ltoreq.y<1 and x+y.ltoreq.1.
4. A structure according to claim 1 wherein said barrier layers in
said multiple quantum well have larger bandgaps than said well
layers in said multiple quantum well.
5. A structure according to claim 1 wherein at least one of said
barrier layers in said multiple quantum well is undoped.
6. A structure according to claim 1 wherein at least one of said
well layers in said multiple quantum well is undoped.
7. A semiconductor structure according to claim 1, wherein said
multiple quantum well has a first surface and a second surface,
said first surface of said multiple quantum well being in contact
with said first n-type cladding layer and said second surface of
said multiple quantum well being in contact with said second n-type
cladding layer.
8. A semiconductor structure according to claim 1, wherein said
second n-type cladding layer has a first surface and a second
surface, said first surface of said second n-type cladding layer
being in contact with said multiple quantum well, and said second
surface of said second n-type cladding layer being in contact with
said p-type layer, wherein the composition of said second n-type
cladding layer is progressively graded such that the crystal
lattice at said first surface of said second n-type cladding layer
more closely matches the crystal lattice of said multiple quantum
well, and the crystal lattice at said second surface of said second
n-type cladding layer more closely matches the crystal lattice of
said p-type layer.
9. A semiconductor structure according to claim 1, wherein said
p-type layer is in contact with said second n-type cladding layer,
opposite said multiple quantum well.
10. A semiconductor structure according to claim 1, wherein said
second n-type cladding layer consists essentially of
Al.sub.xGa.sub.1-xN, where 0<x <1.
11. A semiconductor structure according to claim 1, wherein said
active .[.layer.]. .Iadd.portion .Iaddend.consists essentially of
In.sub.yGa.sub.1-yN, where 0<y<1.
12. A semiconductor structure according to claim 1, wherein said
p-type layer is magnesium-doped gallium nitride.
13. A semiconductor structure according to claim 12, wherein said
second n-type cladding layer is thick enough to deter migration of
magnesium from said p-type layer to said multiple quantum well, yet
thin enough to facilitate recombination in said multiple quantum
well.
14. A semiconductor structure according to claim 1, wherein said
p-type layer is indium nitride.
15. A semiconductor structure according to claim 1, wherein said
p-type layer is In.sub.xGa.sub.1-xN, where 0<x<1.
16. A semiconductor structure according to claim 1, wherein said
p-type layer comprises a superlattice formed from a plurality of
Group III nitride layers selected from the group consisting of
gallium nitride, indium nitride, and In.sub.xGa.sub.1-xN, where
0<x<1.
17. A semiconductor structure according to claim 16, wherein said
superlattice is formed from alternating layers of two Group III
nitride layers selected from the group consisting of gallium
nitride, indium nitride, and In.sub.xGa.sub.1-xN, where
0<x<1.
18. A semiconductor structure according to claim 1, further
comprising a third n-type layer of Al.sub.xIn.sub.yGa.sub.1-x-yN,
where 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and (x+y).ltoreq.1,
wherein said third n-type layer is positioned between said second
n-type cladding layer and said .[.p-type layer.]. .Iadd.multiple
quantum well.Iaddend..
19. A semiconductor structure according to claim 18, wherein said
third n-type layer has a first surface and a second surface, said
first surface of said third n-type layer being in contact with said
.[.p-type layer.]. .Iadd.multiple quantum well .Iaddend.and said
second surface of said third n-type layer being in contact with
said second n-type cladding layer.
20. A semiconductor structure according to claim 1, further
comprising an n-type silicon carbide substrate, wherein said first
n-type cladding layer is positioned between said silicon carbide
substrate and said multiple quantum well.
21. A semiconductor structure according to claim 15, further
comprising.Iadd.: a silicon carbide substrate, wherein said first
n-type cladding layer is positioned between said silicon carbide
substrate and said multiple quantum well; and .Iaddend. discrete
crystal portions selected from the group consisting of gallium
nitride and indium gallium nitride, said discrete crystal portions
positioned between said first n-type cladding layer and said
silicon carbide substrate, said discrete crystal portions being
present in an amount sufficient to reduce .[.the.]. .Iadd.a
.Iaddend.barrier between said first n-type cladding layer and said
silicon carbide substrate, but less than an amount that would
detrimentally affect .[.the function.]. .Iadd.functionality
.Iaddend.of .[.any resulting.]. .Iadd.a .Iaddend.light emitting
device formed on said silicon carbide substrate.
22. A semiconductor structure according to claim 1, further
comprising: an n-type-silicon carbide substrate; and a conductive
buffer layer positioned between said silicon carbide substrate and
said first n-type cladding layer.
23. A semiconductor structure according to claim 22, wherein said
conductive buffer layer has a first surface and a second surface,
said first surface of said conductive buffer layer being in contact
with said silicon carbide substrate and said second surface of said
conductive buffer layer being in contact with said first n-type
cladding layer.
24. A semiconductor structure according to claim 22, wherein said
conductive buffer layer consists essentially of aluminum gallium
nitride having the formula Al.sub.xGa.sub.1-1N, where
0<x<1.
25. A semiconductor structure according to claim 22, further
comprising an n-type transition layer of a Group III nitride, said
transition layer being positioned between said conductive buffer
layer and said first n-type cladding layer.
26. A semiconductor structure according to claim 22, further
comprising discrete crystal portions selected from the group
consisting of gallium nitride and indium gallium nitride, said
discrete crystal portions positioned between said conductive buffer
layer and said silicon carbide substrate, said discrete crystal
portions being present in an amount sufficient to reduce .[.the.].
.Iadd.a .Iaddend.barrier between said conductive buffer layer and
said silicon carbide substrate, but less than an amount that would
detrimentally affect .[.the function.]. .Iadd.functionality
.Iaddend.of .[.any resulting.]. .Iadd.a .Iaddend.light emitting
device formed on said silicon carbide substrate.
27. A semiconductor structure for light emitting devices that can
emit in the red to ultraviolet portion of the electromagnetic
spectrum, said structure comprising: an active portion in the form
of a multiple quantum well having a plurality of
In.sub.xGa.sub.1-xN well layers where 0<x<1 separated by a
corresponding plurality of Al.sub.xIn.sub.yGa.sub.1-x-yN barrier
layers where 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y.ltoreq.1; a Group
III nitride superlattice supporting said multiple quantum well; a
layer of Al.sub.xIn.sub.yGa.sub.1-x-yN, where 0<x.ltoreq.1 and
0.ltoreq.y.ltoreq.1 and (x+y).ltoreq.1 adjacent said multiple
quantum well and opposite from said superlattice with respect to
said multiple quantum well and being characterized by the
substantial absence of magnesium.Iadd., wherein a composition of
said layer of Al.sub.xIn.sub.yGa.sub.1-x-yN is graded.Iaddend.; a
first p-type layer of a Group III nitride adjacent said
.[.AlInGaN.]. layer .Iadd.of Al.sub.xIn.sub.yGa.sub.1-x-yN
.Iaddend.and opposite said multiple quantum well with respect to
said .[.AlInGaN.]. layer .Iadd.of Al.sub.xIn.sub.yGa.sub.1-x-yN,
wherein a p-n junction is defined between said layer of
Al.sub.xIn.sub.yGa.sub.1-x-yN and said first p-type layer.Iaddend.;
and an n-type Group III nitride layer supporting said superlattice
and opposite from said multiple quantum well with respect to said
superlattice.
28. A semiconductor structure according to claim 27 and further
comprising a silicon carbide substrate and a conductive Group III
nitride buffer layer on said substrate, with said substrate and
said conductive buffer layer supporting .[.the.]. .Iadd.a
.Iaddend.remainder of said structure.
29. A semiconductor structure according to claim 28 and further
comprising: an additional n-type GaN layer between said conductive
buffer layer and said supporting n-type layer; a p-type contact
layer on said first p-type layer; an ohmic contact to said p-type
contact layer; and an ohmic contact to said substrate.
30. A semiconductor structure according to claim 27 wherein said
superlattice comprises alternating layers of In.sub.xGa.sub.1-xN
and In.sub.yGa.sub.1-yN where 0.ltoreq.x.ltoreq.1 and
0.ltoreq.y.ltoreq.1 and x does not equal y.
31. A semiconductor structure according to claim 30 wherein x
equals 0 and 0<y<1.
32. A semiconductor structure according to claim 30 wherein said
superlattice contains between 5 and 50 periods.
33. A semiconductor structure according to claim 30 wherein said
superlattice contains 25 periods.
34. A semiconductor structure according to claim 30 wherein said
superlattice contains 10 periods.
35. A semiconductor structure for light emitting devices that can
emit in the red to ultraviolet portion of the electromagnetic
spectrum, said structure comprising: a silicon carbide substrate; a
conductive Group III nitride buffer layer on said substrate; a
first n-type GaN layer on said conductive buffer layer; a second
n-type Group III nitride layer on said first .Iadd.n-type
.Iaddend.GaN layer; a superlattice on said second .[.GaN.].
.Iadd.n-type Group III nitride .Iaddend.layer and formed of
alternating layers of GaN and In.sub.yGa.sub.1-yN where
0<y<1; an active portion on said superlattice in the form of
a multiple quantum well having a plurality of In.sub.xGa.sub.1-xN
well layers where 0<x<1 separated by a corresponding
plurality of Al.sub.xIn.sub.yGa.sub.1-x-yN barrier layers where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y.ltoreq.1; a layer of
Al.sub.xIn.sub.yGa.sub.1-x-yN, where 0.ltoreq.x.ltoreq.1 and
0.ltoreq.y.ltoreq.1 and (x+y).ltoreq.1 on said multiple quantum
well and being characterized by the substantial absence of
magnesium.Iadd., wherein a composition of said layer of
Al.sub.xIn.sub.yGa.sub.1-x-yN is graded.Iaddend.; a first p-type
layer of a Group III nitride on said .[.AlInGaN.]. layer .Iadd.of
Al.sub.xIn.sub.yGa.sub.1-x-yN, wherein a p-n junction is defined
between said layer of Al.sub.xIn.sub.yGa.sub.1-x-yN and said first
p-type layer.Iaddend.; a p-type contact layer on said first p-type
layer; an ohmic contact to said p-type contact layer; and an ohmic
contact to said substrate.
36. A structure according to claim 35 wherein said barrier layers
in said multiple quantum well have large bandgaps than said well
layers in said multiple quantum well.
37. A structure according to claim 35 wherein at least one of said
barrier .[.layer.]. .Iadd.layers .Iaddend.in said multiple quantum
well is undoped.
38. A structure according to claim 35 wherein at least one of said
well layers in said multiple quantum well is undoped.
39. A semiconductor structure according to claim 35, further
comprising discrete crystal portions selected from the group
consisting of gallium nitride and indium gallium nitride, said
discrete crystal portions positioned between said .[.first n-type
cladding.]. .Iadd.conductive Group III nitride buffer
.Iaddend.layer and said silicon carbide substrate, said discrete
crystal portions being present in an amount sufficient to reduce
.[.the.]. .Iadd.a .Iaddend.barrier between said .[.first n-type
cladding.]. .Iadd.conductive Group III nitride buffer
.Iaddend.layer and said silicon carbide substrate, but less than an
amount that would detrimentally affect .[.the function.].
.Iadd.functionality .Iaddend.of .[.any resulting.]. .Iadd.a
.Iaddend.light emitting device formed on said silicon carbide
substrate.
.Iadd.40. A structure according to claim 1 wherein the composition
of said second n-type cladding layer is graded in a stepwise
fashion. .Iaddend.
.Iadd.41. A structure according to claim 1 wherein the composition
of said second n-type cladding layer is graded in a continuous
fashion. .Iaddend.
.Iadd.42. A structure according to claim 1, wherein the p-n
junction comprises a p-n homojunction between said second n-type
cladding layer and said p-type layer. .Iaddend.
.Iadd.43. A structure according to claim 1, wherein, at the p-n
junction, said second n-type cladding layer and said p-type layer
comprise aluminum. .Iaddend.
.Iadd.44. A semiconductor structure according to claim 27, wherein,
at the p-n junction, said layer of Al.sub.xIn.sub.yGa.sub.1-x-yN
and said first p-type layer comprise aluminum. .Iaddend.
.Iadd.45. A semiconductor structure according to claim 35, wherein,
at the p-n junction, said layer of Al.sub.xIn.sub.yGa.sub.1-x-yN
and said first p-type layer comprise aluminum. .Iaddend.
Description
BACKGROUND OF THE INVENTION
The present invention relates to semiconductor structures of light
emitting devices, particularly light emitting diodes and laser
diodes formed from Group III nitrides, which are capable of
emitting light in the red to ultraviolet portions of the
electromagnetic spectrum.
Photonic semiconductor devices fall into three categories: devices
that convert electrical energy into optical radiation (e.g., light
emitting diodes and laser diodes); devices that detect optical
signals (e.g., photodetectors); and devices that convert optical
radiation into electrical energy (e.g., photovoltaic devices and
solar cells). Although all three kinds of devices have useful
applications, the light emitting diode may be the most commonly
recognized because of its application to various consumer products
and applications.
Light emitting devices (e.g., light emitting diodes and laser
diodes), herein referred to as LEDs, are photonic, p-n junction
semiconductor devices that convert electrical power into emitted
light. Perhaps most commonly, LEDs form the light source in the
visible portion of the electromagnetic spectrum for various
signals, indicators, gauges, and displays used in many consumer
products (e.g., audio systems, automobiles, household electronics,
and computer systems). LEDs are desirable as light output devices
because of their generally long lifetime, their low power
requirements, and their high reliability.
Despite widespread use, LEDs are somewhat functionally constrained,
because the color that a given LED can produce is limited by the
nature of the semiconductor material used to fabricate the LED. As
well known to those of ordinary skill in this and related arts, the
light produced by an LED is referred to as "electroluminescence,"
which represents the generation of light by an electric current
passing through a material under an applied voltage. Any particular
composition that produces electroluminescent light tends to do so
over a relatively narrow range of wavelengths.
The wavelength of light (i.e., its color) that can be emitted by a
given LED material is limited by the physical characteristics of
that material, specifically its bandgap energy. Bandgap energy is
the amount of energy that separates a lower-energy valence band and
a higher energy conduction band in a semiconductor. The bands are
energy states in which carriers (i.e., electrons or holes) can
reside in accordance with well-known principles of quantum
mechanics. The "bandgap" is a range of energies between the
conduction and valence bands that are forbidden to the carriers
(i.e., the carriers cannot exist in these energy states). Under
certain circumstances, when electrons and holes cross the bandgap
and recombine, they will emit energy in the form of light. In other
words, the frequency of electromagnetic radiation (i.e., the color)
that can be produced by a given semiconductor material is a
function of that material's bandgap energy.
In this regard, narrower bandgaps produce lower energy, longer
wavelength photons. Conversely, wider bandgap materials produce
higher energy, shorter wavelength photons. Blue light has a shorter
wavelength--and thus a higher frequency--than most other colors in
the visible spectrum. Consequently, blue light must be produced
from transitions that are greater in energy than those transitions
that produce green, yellow, orange, or red light. Producing photons
that have wavelengths in the blue or ultraviolet portions of the
visible spectrum requires semiconductor materials that have
relatively large bandgaps.
The entire visible spectrum runs from the violet at or about 390
nanometers to the red at about 780 nanometers. In turn, the blue
portion of the visible spectrum can be considered to extend between
the wavelengths of about 425 and 480 nanometers. The wavelengths of
about 425 nanometers (near violet) and 480 nanometers (near green)
in turn represent energy transitions of about 2.9 eV and about 2.6
eV, respectively. Accordingly, only a material with a bandgap of at
least about 2.6 eV can produce blue light.
Shorter wavelength devices offer a number of advantages in addition
to color. In particular, when used in optical storage and memory
devices, such as CD-ROM optical disks, shorter wavelengths enable
such storage devices to hold significantly more information. For
example, an optical device storing information using blue light can
hold substantially more information in the same space as one using
red light.
The basic mechanisms by which light-emitting diodes operate are
well understood in this art and are set forth, for example, by Sze,
Physics of Semiconductor Devices, 2d Edition (1981) at pages
681-703.
The common assignee of the present patent application was the first
in this field to successfully develop commercially viable LEDs that
emitted light in the blue color spectrum and that were available in
large, commercial quantities. These LEDs were formed in silicon
carbide, a wide-bandgap semiconductor material. Examples of such
blue LEDs are described in U.S. Pat. Nos. 4,918,497 and 5,027,168
to Edmond each titled "Blue Light Emitting Diode Formed in Silicon
Carbide." Other examples of Group III nitride LED structures and
laser structures are described in commonly assigned U.S. Pat. Nos.
5,523,589; 5,592,501; and 5,739,554.
In addition to silicon carbide, candidate materials for blue light
emitting devices are gallium nitride (GaN) and its associated Group
III (i.e., Group III of the periodic table) nitride compounds such
as aluminum gallium nitride (AlGaN), indium gallium nitride
(InGaN), and aluminum indium gallium nitride (AlInGaN). These
materials are particularly attractive because they offer direct
energy transitions with bandgaps between about 1.9 to about 6.2 eV
at room temperature. More common semiconductor materials such as
silicon, gallium phosphide, or gallium arsenide are unsuitable for
producing blue light because their bandgaps are approximately 2.26
eV or less, and in the case of silicon, are indirect semiconductors
and inefficient light emitters.
As known to those familiar with LEDs and electronic transitions, a
direct transition occurs in a semiconductor when the valence band
maxima and the conduction band minima have the same momentum state.
This means that crystal momentum is readily conserved during
recombination of electrons and holes so that the energy produced by
the transition can go predominantly and efficiently into the
photon, (i.e., to produce light rather than heat). When the
conduction band minimum and valence band maximum do not have the
same momentum state, a phonon (i.e., a quantum of vibrational
energy) is required to conserve crystal momentum and the transition
is called "indirect." The necessity of a third particle, the
phonon, makes indirect radiative transitions less likely, thereby
reducing the light emitting efficiency of the device.
Generally speaking, an LED formed in a direct bandgap material will
perform more efficiently than one formed in an indirect bandgap
material. Therefore, the direct transition characteristics of Group
III nitrides offer the potential for brighter and more efficient
emissions--and thus brighter and more efficient LEDs--than do the
emissions from indirect materials such as silicon carbide.
Accordingly, much interest in the last decade has also focused on
producing light emitting diodes in gallium nitride and related
Group III nitrides.
Although Group III nitrides offer a direct transition over a wide
bandgap energy range, the material presents a particular set of
technical manufacturing problems. In particular, no
commercially-viable technique has yet emerged for producing bulk
single crystals of gallium nitride (GaN) that are capable of
functioning as appropriate substrates for the gallium nitride
epitaxial layers on which photonic devices would be formed.
All semiconductor devices require some kind of structural
substrate. Typically, a substrate formed of the same material as
the active region offers significant advantages, particularly in
crystal growth and lattice matching. Because bulk crystals of
gallium nitride are difficult to form, particularly in sizes
commercially useful for semiconductor device manufacture, gallium
nitride photonic devices are typically formed as epitaxial layers
on non-GaN substrates.
Recent work in the field of Group III nitride substrates includes
copending and commonly assigned U.S. Pat. No. 6,296,956, for
"Growth of Bulk Single Crystals of Aluminum Nitride;" U.S. Pat. No.
6,066,205, for "Growth of Bulk Single Crystals of Aluminum Nitride
from a Melt;" U.S Pat. No. 6,045,612, for "Growth of Bulk Single
Crystals of Aluminum Nitride;" U.S. Pat. No. 6,048,813, for "Growth
of Bulk Single Crystals of Aluminum Nitride: Silicon Carbide
Alloys;" and pending application Ser. No. 09/154,363 filed Sep. 16,
1998 for "Vertical Geometry In GaN LED." All of these patents and
pending applications are incorporated entirely herein by
reference.
Using different substrates, however, causes an additional set of
problems, mostly in the area of crystal lattice matching. In nearly
all cases, different materials have different crystal lattice
parameters. As a result, when a gallium nitride epitaxial layer is
grown on a different substrate, some crystal lattice mismatching
and thermal expansion coefficient mismatching will occur. The
resulting epitaxial layer is referred to as being "strained" by
this mismatch. Crystal lattice mismatches, and the strain they
produce, introduce the potential for crystal defects. This, in
turn, affects the electronic characteristics of the crystals and
the junctions, and thus tends to degrade the performance of the
photonic device. These kinds of defects are even more problematic
in high power structures.
In early Group III nitride LEDs, the most common substrate for
gallium nitride devices was sapphire (i.e., aluminum oxide Al2O3).
Certain contemporary Group III nitride devices continue to use
it.
Sapphire is optically transparent in the visible and ultraviolet
ranges, but has a crystal lattice mismatch with gallium nitride of
about 16 percent. Furthermore, sapphire is insulating rather than
conductive, and is unsuitable for conductivity doping.
Consequently, the electric current that must be passed through an
LED to generate the light emission cannot be directed through a
sapphire substrate. Thus, other types of connections to the LED
must be made.
In general, LEDs with vertical geometry use conductive substrates
so that ohmic contacts can be placed at opposite ends of the
device. Such vertical LEDs are preferred for a number of reasons,
including their easier manufacture and simpler incorporation into
end-use devices than non-vertical devices. In the absence of a
conductive substrate, however, vertical devices cannot be
formed.
In contrast with sapphire, Gallium nitride only has a lattice
mismatch of about 2.4 percent with aluminum nitride (AlN) and
mismatch of about 3.5 percent with silicon carbide. Silicon carbide
has a somewhat lesser mismatch of only about 1 percent with
aluminum nitride.
Group III ternary and quaternary nitrides (e.g., indium gallium
nitride and aluminum indium gallium nitride) have also been shown
to have relatively wide bandgaps. Accordingly, such Group III
nitride solid solutions also offer the potential for blue and
ultraviolet semiconductor lasers and LEDs. These compounds,
however, present the same problems as gallium nitride, namely, the
lack of an identical single crystal substrate. Thus, each is
typically used in the form of epitaxial layers grown on different
substrates. This presents the same potential for crystal defects
and associated electronic problems.
Accordingly, the assignee of the present invention has developed
the use of silicon carbide substrates for gallium nitride and other
Group III devices as a means of solving the conductivity problems
of sapphire as a substrate. Because silicon carbide can be doped
conductively, vertical LEDs can be formed. As noted, a vertical
structure facilitates both the manufacture of LEDs and their
incorporation into circuits and end-use devices.
As known to those familiar with Group III nitrides, their
properties differ based on the identity and mole fraction of the
present Group III elements (e.g., gallium, aluminum, indium). For
example, increasing the mole fraction of aluminum tends to increase
the bandgap, while decreasing the amount of aluminum tends to
increase the refractive index. Similarly, a larger proportion of
indium will decrease the bandgap of the material, thus permitting
the bandgap to be adjusted or "tuned" to produce photons of desired
frequencies. Changing the molar proportions in the solutions also
changes the crystal lattice spacing. Accordingly, and despite much
effort in this area, a need still exists for devices that
incorporate vertical geometry, and that take advantage of the
characteristics that result when the proportions of indium,
aluminum, and gallium are desirably adjusted in the active layers,
cladding layers, and buffer layers of Group III nitride photonic
devices.
It is a further object of the present invention to provide light
emitting devices having decreased nonradiative recombination and
improved efficiency.
OBJECT AND SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to produce
light emitting diodes and laser diodes from Group III nitrides in a
manner that takes advantage of their favorable properties.
The invention meets this object with a semiconductor structure for
light emitting devices that can emit in the red to ultraviolet
portion of the electromagnetic spectrum. The structure comprises a
first n-type cladding layer of AlxInyGa1-x-yN, where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and (x+y).ltoreq.1; a
second n-type cladding layer of AlxInyGa1-x-yN, where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and (x+y).ltoreq.1, wherein
the second n-type cladding layer is further characterized by the
substantial absence of magnesium; an active portion between the
first and second cladding layers in the form of a multiple quantum
well having a plurality of InxGa1-xN well layers where 0<x<1
separated by a corresponding plurality of AlxInyGa1-x-yN barrier
layers where 0<x<1 and 0<y<1; and a p-type layer of a
Group III nitride, wherein the second n-type cladding layer is
positioned between the p-type layer and the multiple quantum well;
and wherein the first and second n-type cladding layers have
respective bandgaps that are each larger than the bandgap of the
well layers.
In another aspect, the invention is a semiconductor structure
comprising an n-type single crystal silicon carbide substrate of a
polytype selected from the group consisting of 3C, 411, 6H, and
15R; a p-type layer formed of at least one Group III nitride
selected from the group consisting of gallium nitride, indium
nitride, and InxGa1-xN, where 0<x<1; an active portion
between the substrate and the p-type layer in the form of a
multiple quantum well having a plurality of InxGa1-xN well layers
where 0<x<1 separated by a corresponding plurality of
AlxInyGa1-x-yN barrier layers where 0<x<1 and 0<y<1; a
first n-type cladding layer of AlxInyGa1-x-yN, where 0<x<1
and 0<y<1 and (x+y)<1, wherein the first n-type cladding
layer is positioned between the silicon carbide substrate and the
multiple quantum well; a second n-type cladding layer of
AlxInyGa1-x-yN, where 0<x<1 and 0<y<1 and (x+y)<1,
wherein the second n-type cladding layer is positioned between the
multiple quantum well and the p-type layer; and wherein the first
and second n-type cladding layers have respective bandgaps that are
each larger than the bandgap of the wells in the multiple quantum
well.
In yet another aspect, the invention is a semiconductor structure
comprising an active portion in the form of a multiple quantum well
having a plurality of InxGa1-xN well layers where 0<x<1
separated by a corresponding plurality of AlxInyGa1-x-yN barrier
layers where 0<x<1 and 0<y<1; a Group III nitride
superlattice supporting the multiple quantum well; a layer of
AlxInyGa1-x-yN, where 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and
(x+y).ltoreq.1 adjacent the multiple quantum well and opposite from
the superlattice with respect to the multiple quantum well and
being characterized by the substantial absence of magnesium; a
first p-type layer of a Group III nitride adjacent the AlInGaN
layer and opposite the multiple quantum well with respect to the
AlInGaN layer; and an n-type Group III nitride layer supporting the
superlattice and opposite from the multiple quantum well with
respect to the superlattice.
The foregoing, as well as other objectives and advantages of the
invention and the manner in which the same are accomplished, is
further specified within the following detailed description and its
accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross-sectional schematic view of the aspects of a
semiconductor structure for a light emitting device according to
the present invention;
FIG. 2 is a plot of bandgap energy versus lattice parameter for
Group III nitrides alloys of aluminum, indium, and gallium
(assuming a linear interpolation);
FIG. 3 is a cross-sectional schematic view of an embodiment of the
semiconductor structure;
FIG. 4 is a cross-sectional schematic view of an embodiment of the
semiconductor structure;
FIG. 5 is a cross-sectional schematic view of an embodiment of the
semiconductor structure;
FIG. 6 is a cross-sectional schematic view of an embodiment of the
semiconductor structure;
FIG. 7 is a cross-sectional schematic view of an embodiment of the
semiconductor structure;
FIGS. 8 and 9 are bandgap diagrams corresponding to certain prior
art devices;
FIGS. 10-12 are bandgap diagrams for devices according to the
present invention;
FIG. 13 is a cross-sectional schematic view of another embodiment
of the present invention; and
FIG. 14 is a cross-sectional view of the superlattice portion of
the present invention.
DETAILED DESCRIPTION
The present invention is a semiconductor structure for light
emitting devices that can emit in the red to ultraviolet portion of
the electromagnetic spectrum. In a first embodiment, the structure
includes a Group III nitride active portion positioned between a
first n-type Group III nitride cladding layer and a second n-type
Group III nitride cladding layer. The active portion preferably
includes an active layer and a quantum well or a multiple quantum
well as described further later herein. The second n-type cladding
layer is characterized by the substantial absence of magnesium
(i.e., magnesium may be present, but only in amounts that are so
small as to have no functional effect on the semiconductor device).
The semiconductor structure itself is further characterized by a
p-type Group III nitride layer, which is positioned in the
semiconductor structure such that the second n-type cladding layer
is between the p-type layer and the active layer. In addition, the
active layer has a bandgap that is smaller than each respective
bandgap of the first and second n-type cladding layers. As used
herein, the term "layer" generally refers to a single crystal
epitaxial layer.
A particular conductivity type (i.e., n-type or p-type) may be
unintentional, but is more commonly a result of specifically doping
the Group III nitrides using the appropriate donor or acceptor
atoms. It is desirable to include layers of opposite conductivity
types in order to form a p-n junction in the device. Under forward
voltage bias, minority carriers injected across the p-n junction
recombine to produce the desired luminescent emissions. Appropriate
doping of Group III nitrides is well understood in the art and will
not be further discussed herein other than as necessary to describe
the invention.
In general, the active portion and the cladding layers comprise
Group III-nitride compounds. The Group III elements in such
compounds may be aluminum, indium, gallium, or a combination of two
or more such elements.
As will be understood by those having ordinary skill in the art,
the molar fraction of aluminum, indium, and gallium in the active
layer, the first n-type cladding layer, and the second n-type
cladding layer may be generally expressed by the formula,
AlxInyGa1-x-yN, where 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and
(x+y).ltoreq.1. In this regard, the relative concentrations of
aluminum, indium, and gallium may vary from layer to layer. It will
be understood by those skilled in the art, however, that a cladding
layer cannot be indium nitride (i.e., y=1) because InN has the
lowest bandgap of all possible combinations and the active layer
cannot be aluminum nitride (i.e., x=1) because AIN has the highest
bandgap of all possible combinations. It will be understood in
these embodiments that the cladding layers will have a larger
energy band gap than the active layer.
An understanding of the invention may be achieved with reference to
FIG. 1, which is a cross-sectional schematic view of a
semiconductor structure for an LED according to the present
invention. The semiconductor structure, which is generally
designated at 10, includes a first n-type cladding layer 11 of
AlxInyGa1-x-yN, where 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1
and(x+y).ltoreq.1.
The semiconductor structure 10 also includes a second n-type
cladding layer of AlxInyGa1-x-yN, where 0.ltoreq.x<1 and
0.ltoreq.y<1 and (x+y)<1, or in a more specific embodiment,
an indium-free aluminum gallium nitride n-type cladding layer 12
having the formula, AlxGa1-xN, where 0<x<1. In this regard,
the range for the variable x excludes both 0 and 1, which will be
understood by those skilled in the art as requiring the presence of
both aluminum and gallium (i.e., an alloy of aluminum and gallium).
As noted, the second n-type cladding layer 12 specifically excludes
magnesium, and may be doped or undoped. The cladding layers may be
unintentionally n-type, i.e. undoped.
An n-type active layer 13 having the formula AlxInyGa1-x-yN, where
0.ltoreq.x<1 and 0.ltoreq.y.ltoreq.1 and (x+y).ltoreq.1, is
positioned between the first n-type cladding layer and the second
n-type cladding layer 12. In a more specific embodiment, the active
layer 13 is aluminum-free, consisting essentially of an indium
gallium nitride having the formula, InyGa1-yN, where 0<y<1.
In this regard, the range for the variable y excludes both 0 and 1,
which will be understood by those skilled in the art as requiring
the presence of both indium and gallium (i.e., an alloy of indium
and gallium).
The semiconductor structure is further characterized by a p-type
Group III nitride layer 18, which as previously noted, is
positioned in the semiconductor structure such that the second
n-type cladding layer 12 is between the p-type layer 18 and the
active layer 13. In preferred embodiments, the p-type layer is made
of gallium nitride (preferably magnesium-doped gallium nitride);
indium nitride; or indium gallium nitride of the formula InxGa1-xN,
where 0<x<1.
Note that in embodiments wherein the p-type layer 18 is made of
magnesium-doped gallium nitride, the second n-type cladding layer
12 should be thick enough to deter migration of magnesium from the
p-type layer 18 to the active layer 13, yet thin enough to
facilitate recombination of electrons and holes in the active layer
13. This helps to maximize emissions from the active layer 13.
Moreover, because the p-n junction is not formed at the interface
between an InGaN layer and an AlGaN layer--i.e. an InGaN/AlGaN p-n
junction is avoided--the interface should have a reduced density of
interface states. Such a reduction in interface states should
result in more efficient recombination of carriers in the active
layer, with a corresponding increase in overall device
efficiency.
In another embodiment, the p-type layer comprises a p-type
superlattice formed of selectively doped p-type Group III nitride
layers selected from the group consisting of gallium nitride;
indium nitride; and indium gallium nitride of the formula
InxGa1-xN, where 0<x<1. In particular, the superlattice is
best formed from alternating layers of any two of these Group III
nitride layers. In such a superlattice, alternating layers of
gallium nitride and indium gallium nitride are most preferred.
The active layer 13 may be doped or undoped. As is known to those
familiar with Group III nitride properties, the undoped material
will generally be unintentionally n-type, and that is the case for
the second n-type cladding layer 12. In particular, the first
n-type cladding layer 11 and the second n-type cladding layer 12
have respective bandgaps that are each larger than the bandgap of
the active layer 13.
The Group III mole fractions can be selected to provide these
characteristics. For example, FIG. 2 theoretically describes
bandgap energy versus lattice parameter. The triangular region of
FIG. 2 represents the range of bandgap energies available for Group
III nitrides of aluminum, indium, and gallium. FIG. 2 reveals that
for any particular lattice parameter, eliminating gallium maximizes
the bandgap energy (i.e., the bandgap for an aluminum indium
nitride is defined by the AIN--InN segment).
As is known to those familiar with semiconductor
structures--especially laser structures, the active layer must have
a lower bandgap than the adjacent n-type cladding layers, and a
higher refractive index than the adjacent cladding layers. Such a
structure gives two benefits important for laser capability. First,
if the active layer has the lowest bandgap, it may form a quantum
well into which carriers tend to fall. This helps to enhance the
device efficiency. Second, waveguiding occurs in the material that
has the highest refractive index in the structure. Accordingly,
when the bandgap of the active layer is less than that of the
adjacent layers and its refractive index is greater than that of
the adjacent layers, the lasing capabilities of the device are
enhanced.
Moreover, as known to those of ordinary skill in this art, the
composition of ternary and quaternary Group III nitrides can affect
both their refractive index and their bandgap. Generally speaking,
a larger proportion of aluminum increases the bandgap and decreases
the refractive index. Thus, in preferred embodiments, in order for
the cladding layers 11 and 12 to have a bandgap larger than the
active layer 13 and a refractive index smaller than the active
layer 13, the cladding layers 11 and 12 preferably have a higher
fraction of aluminum or gallium as compared to the active layer 13.
The larger bandgap of the cladding layers 11 and 12 encourages
carriers to be confined in the active layer 13, thereby increasing
the efficiency of the device. Similarly, the lower refractive index
of the heterostructure layers 11 and 12 encourages the light to be
more preferably guided along (i.e., confined to) the active layer
13.
As previously noted, the recited variables (e.g., x and y) refer to
the structural layer they describe. That is, the value of a
variable with respect to one layer is immaterial to the value of
the variable with respect to another layer. For example, in
describing the semiconductor structure, the variable x may have one
value with respect to first n-type cladding layer 11, another value
with respect to second n-type cladding layer 12, and yet another
value with respect to active described layer 13. As will also be
understood by those of ordinary skill in the art, the limitation
0.ltoreq.(x+y).ltoreq.1 in the expression AlxInyGa1-x-yN simply
requires that the Group III elements and the nitride be present in
a 1:1 molar ratio.
In certain of the preferred embodiments, the active layer 13
comprises an InGaN layer having a mole fraction of indium between
about 0.05 and 0.55. Referring to FIGS. 1 and 3, the cladding layer
12 is preferably an AlxGa1-xN layer having a mole fraction of
aluminum between about 0.14 and 0.24, while the cladding layer 11
is preferably an AlxGa1-xN layer having a mole fraction of aluminum
between about 0 and 0.15. Referring to FIG. 3, the p-type layer 19
is preferably an AlxGa1-xN layer having a mole fraction of aluminum
between about 0 and 0.15.
It will be appreciated by those of ordinary skill in the art that,
as used herein, the concept of one layer being "between" two other
layers does not necessarily imply that the three layers are
contiguous (i.e., in intimate contact). Rather, as used herein the
concept of one layer being between two other layers is meant to
describe the relative positions of the layers within the
semiconductor structure. Similarly, as used herein, the concept of
a first layer being in contact with a second layer, "opposite" a
third layer, merely describes the relative positions of the first
and second layers within the semiconductor structure.
That said, in preferred embodiments of the semiconductor structure,
the active layer 13 has a first surface 14 contiguous to the first
n-type cladding layer 11 and a second surface 15 contiguous to the
second n-type cladding layer 12. In other words, in such
embodiments, the active layer 13 is sandwiched directly between the
first n-type cladding layer 11 and the second n-type cladding layer
12, with no additional layers disturbing this three-layer isotype
heterostructure (i.e. a heterostructure in which all of the
materials have the same conductivity type), which is designated by
the bracket 16. In another preferred embodiment, the p-type layer
18 is in contact with said second n-type cladding layer 12,
opposite said active layer 13.
The structural designation "heterostructure" is used in a manner
well understood in this art. Aspects of these structures are
discussed, for example, in Sze, Physics of Semiconductor Devices,
Second Edition (1981) at pages 708-710. Although the cited Sze
discussion refers to lasers, it nonetheless illustrates the nature
of, and the distinction between, homostructure, single
heterostructure, and double heterostructure devices. Isotype
heterostructures are discussed by Hartman et al. in U.S. Pat. No.
4,313,125, which is hereby incorporated herein in its entirety.
The semiconductor device may also include additional n-type layers
of AlxInyGa1-x-yN, where 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1
and (x+y).ltoreq.1. In one embodiment depicted in FIG. 3, a third
n-type layer 19 is positioned between second n-type cladding layer
12 and p-type layer 18. Preferably, the third n-type layer 19 has a
first surface that is in contact with the p-type layer 18 and a
second surface that is in contact with second n-type cladding layer
12.
Third n-type layer 19 is lattice matched with p-type layer 18.
Preferably, third n-type layer 19 forms a p-n homojunction with
p-type layer 18. Having a p-n homojunction reduces the number of
interface states at the junction. Because such states may result in
nonradiative recombination, reducing the number of such states
improves the recombination efficiency, thus improving overall
device efficiency.
The semiconductor device 10 can further comprise a silicon carbide
substrate 17 that has the same conductivity type as the first
n-type cladding layer 11 (i.e., an n-type silicon carbide
substrate). The silicon carbide substrate 17 preferably has a
polytype of 3C, 4H, 6H, or 15R. The first n-type cladding layer 11
is positioned between the silicon carbide substrate 17 and the
active layer 13. In one embodiment of the invention, the silicon
carbide substrate 17 is in contact with the first n-type cladding
layer 11, opposite the active layer 13 (i.e., there are no
intervening layers between silicon carbide substrate 17 and first
n-type cladding layer 11).
The silicon carbide substrate 17 is most preferably a single
crystal. As is well understood by those of ordinary skill in this
art, a high quality single crystal substrate provides a number of
structural advantages that in turn provide significant performance
and lifetime advantages. The silicon carbide substrate 17 can be
formed by the methods described in U.S. Pat. No. 4,866,005 (now
U.S. Pat. No. RE 34,861). Preferably, the silicon carbide substrate
17 and the first cladding layer 11 are n-type.
In a preferred embodiment depicted by FIG. 4, the first n-type
cladding layer 11 has a first surface 21 that is in contact with
the silicon carbide substrate 17 and a second surface 22 that is in
contact with the active layer 13. In particular, the composition of
the first n-type cladding layer 11 is progressively graded such
that the crystal lattice at its first surface 21 more closely
matches the crystal lattice of the silicon carbide 17, and the
crystal lattice at its second surface 22 more closely matches the
crystal lattice of the active layer 13. A sufficient mole fraction
of indium should be present in the first n-type cladding layer 11
to ensure that it remains conductive at its first surface 21,
adjacent to the silicon carbide substrate 17.
As will be understood by those of ordinary skill in the art,
progressively grading embraces both step grading and linear
grading. Accordingly, as used herein, the concept of more closely
matching respective crystal lattices does not imply perfect
matching, but rather that a layer whose composition has been
progressively, compositionally graded so that its lattice at a
layer interface is more compatible with the crystal lattice of the
adjacent layer. When fabricating devices, a number of
considerations must be balanced, one of which is lattice matching.
If other factors are more important, a perfect or close lattice
match may be less important, and vice versa.
In this regard, n-type cladding layers, especially aluminum indium
nitride n-type cladding layers, can be selectively lattice matched
to gallium-containing active layers, especially gallium nitride and
indium gallium nitride active layers, in order to reduce strain and
defects. In particular, aluminum indium nitrides are useful because
they can be lattice matched to other Group III nitrides with lower
bandgaps and therefore are useful as cladding layer materials. See
FIG. 2. The benefits of lattice-matching can also apply to the
structures herein that include a multiple quantum well for the
active portion and one or more superlattice structures.
As will be understood by those having ordinary skill in the art,
lattice matching of the cladding layers and the active layer can be
a one-sided lattice match (i.e., where a lattice match occurs on
one side of the active layer) or a two-sided lattice match (i.e.,
where a lattice match occurs on both sides of the active
layer).
In another embodiment depicted by FIG. 5, the semiconductor
structure further includes a conductive buffer layer 23 positioned
between the silicon carbide substrate 17 and the first n-type
cladding layer 11. In a variant of this embodiment, the conductive
buffer layer 23 is sandwiched between the silicon carbide substrate
17 and the first n-type cladding layer 11, with no intervening
layers. The conductive buffer layer 23 preferably consists
essentially of aluminum gallium nitride having the formula
AlxGa1-xN, where 0<x<1. Alternatively, when the first n-type
cladding layer 11 consists essentially of aluminum indium nitride
having the formula, AlxInl-xN, where 0<x<1, the conductive
buffer layer 23 preferably consists essentially of aluminum indium
nitride having the formula, AlxInl-xN, where 0<x<1. Other
acceptable buffers and buffer structures include those described in
commonly assigned U.S. Pat. Nos. 5,523,589, 5,393,993, and
5,592,501, the contents of each hereby being incorporated entirely
herein by reference.
To facilitate the transition between the first n-type cladding
layer 11 and the conductive buffer layer 23, the semiconductor
structure can further include a Group III nitride transition layer
24, preferably formed of gallium nitride, that is positioned
between the conductive buffer layer 23 and the first n-type
cladding layer 11. See FIG. 6. The transition layer 24 has the same
conductivity type as the first n-type cladding layer 11 (i.e., an
n-type transition layer).
Alternatively, as depicted by FIG. 7, the conductive buffer layer
23 and transition layer 24 can be replaced by discrete crystal
portions 28 that are disclosed more fully in commonly assigned U.S.
patent application Ser. No. 08/944,547, filed Oct. 7, 1997, now
U.S. Pat. No. 6,201,262, for "Group III Nitride Photonic Devices on
Silicon Carbide Substrates with Conductive Buffer Interlayer
Structure," which is incorporated entirely herein by reference.
In yet another embodiment, the semiconductor structure 10 further
includes a first ohmic contact 25 and a second ohmic contact 26. As
indicated in FIG. 1, the first ohmic contact 25 is positioned in
the semiconductor structure such that the silicon carbide substrate
17 is between the first ohmic contact 25 and the first n-type
cladding layer 11. The second ohmic contact 26 is positioned in the
semiconductor structure such that the p-type layer 18 is between
the second ohmic contact 26 and the second n-type cladding layer
12.
Preferably, the first ohmic contact 25 is placed directly on the
silicon carbide substrate 17, opposite the first n-type cladding
layer 11 (or opposite the conductive buffer layer 23 or discrete
crystal portions 28, depending on the particular structural
embodiment), and the second ohmic contact 26 is placed directly on
the p-type layer 18, opposite the second n-type cladding layer 12.
In a variant of this embodiment, the p-type layer 18 is sandwiched
between the second ohmic contact 26 and a second p-type layer (not
shown).
As recognized by those of ordinary skill in this art, the
conductive buffer layer 23 provides a physical and electronic
transition between the silicon carbide substrate 17 and the first
n-type cladding layer 11. In many circumstances, the presence of
the conductive buffer layer 23 helps ease the physical strain that
can result from the lattice differences between the silicon carbide
substrate 17 and the first n-type cladding layer 11. Furthermore,
to preserve the vertical function of the device, the conductive
buffer layer 23 has to be sufficiently conductive to carry the
desired or required current to operate the semiconductor device 10.
Likewise, the transition layer 24 serves a similar physical and
electronic transition.
The ohmic contacts 25 and 26, which complete the advantageous
vertical structure of the invention, are preferably formed of a
metal such as aluminum (Al), nickel (Ni), titanium (Ti), gold (Au),
platinum (Pt), vanadium (V), alloys, or blends thereof, or
sequential layers of two or more of these metals, but also may be
formed of other ohmic contact materials known by those skilled in
the art provided that they exhibit ohmic character and do not
otherwise interfere with the structure or function of the
light-emitting device 10.
To the extent that the first ohmic contact 25 is formed to the
silicon carbide substrate 17, the invention is distinguished from
those devices that employ sapphire. Sapphire cannot be made
conductive, and so cannot be connected to an ohmic contact.
Consequently, sapphire-based devices cannot be formed into the
kinds of vertical structures that are most preferred for LEDs.
Accordingly, in one preferred embodiment the invention is a
semiconductor structure for light emitting devices that includes an
n-type single crystal silicon carbide substrate 17 of a 3C, 4H, 6H,
or 15R polytype; a p-type layer 18 formed of at least one Group III
nitride selected from the group consisting of gallium nitride
(preferably magnesium-doped gallium nitride), indium nitride, and
indium gallium nitride having the formula InxGa1-xN, where
0<x<1; an undoped active layer of AlxInyGa1-x-yN, where
0.ltoreq.x<1 and 0.ltoreq.y.ltoreq.1 and (x+y).ltoreq.1; a first
n-type cladding layer 11 of AlxInyGa1-x-yN, where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y.ltoreq.1 and (x+y).ltoreq.1; and
a second n-type cladding layer 12 of AlxInyGa1-x-yN, where
0.ltoreq.x.ltoreq.1 and 0.ltoreq.y<1 and (x+y).ltoreq.1. Most
preferably, the p-type layer 18 comprises a superlattice formed
from alternating layers of any two of the aforementioned Group III
nitrides.
As disclosed previously, the first n-type cladding layer 11 and the
second n-type cladding layer 12 have respective bandgaps that are
each larger than the bandgap of the active layer 13. Moreover, the
first n-type cladding layer 11 is positioned between the silicon
carbide substrate 17 and the active layer 13, the second n-type
cladding layer 12 is positioned between the active layer 13 and the
p-type layer 18, and the active layer 13 is positioned between the
first n-type cladding layer 11 and the second n-type cladding layer
12.
The composition of the first n-type cladding layer 11 can be
progressively graded such that the crystal lattice at its first
surface 21 more closely matches the crystal lattice of the silicon
carbide 17, and the crystal lattice at its second surface 22 more
closely matches the crystal lattice of the active layer 13.
Similarly, the composition of the second n-type cladding layer 12
can be progressively graded such that the crystal lattice at its
second surface more closely matches the crystal lattice of the
p-type layer 18. As previously noted, progressively grading across
an epitaxial layer embraces both grading in steps and grading
continuously (i.e., without steps). Causing the n-type cladding 12
to be substantially lattice matched to the p-type layer 18 reduces
the number of interface states at the p-n junction formed between
the layers. Because such states may result in nonradiative
recombination, reducing the number of such states improves the
recombination efficiency, thus improving overall device efficiency
in the active layer 13.
Furthermore, and in accordance with the previous descriptions, this
preferred structure may also include one or more of the following
layers-a third n-type cladding layer 19, the conductive buffer
layer 23, the Group III nitride transition layer 24, the discrete
crystal portions 28, and the ohmic contacts 25 and 26. In this
regard, the conductive buffer layer 23 most preferably is aluminum
gallium nitride having the formula AlxGa1-xN, where
0.ltoreq.x.ltoreq.1.
FIGS. 8, 9, 10, 11 and 12 are bandgap diagrams of various
structures, including embodiments of the present invention. All of
the bandgap diagrams 8 through 12 represent the bandgaps under
forward bias (i.e. "flat-band" conditions). It will be understood
by a skilled person that the bandgap diagrams 8 through 12 are
schematic in nature and are not necessarily drawn to scale. While
they illustrate important aspects of the invention, it will be
understood that the actual band structure may vary slightly from
the illustration. In FIGS. 8-12, whenever possible, identical
numerical designations will refer to identical portions of the
diagrams.
Additionally, it will be understood that although FIGS. 8-12
illustrate a single active layer, the illustrated relationships
apply in the same manner when the active portion is the multiple
quantum well that is described in more detail later herein.
FIG. 8 is a bandgap diagram of a prior art device showing an n-type
gallium nitride clad layer 30, an indium gallium nitride active
layer 31, and a p-type aluminum gallium nitride layer 32. In this
device, the p-n junction is represented by the dotted line at
33.
With respect to the physical structure of the device and the
interface quality between layers, interfaces between identical
materials are the easiest to make of high quality. Among the Group
III nitrides, the interface between gallium nitride and gallium
nitride is the easiest to make of high quality, with the interface
between gallium nitride and aluminum gallium nitride being more
difficult, but easier than most others. The next-to-worst is the
interface between gallium nitride and indium gallium nitride, with
the worst interface quality being typically demonstrated between
indium gallium nitride and aluminum gallium nitride.
Furthermore, it will be recalled that the disassociation
temperature of indium gallium nitride is generally less than all of
the other Group III nitrides. Accordingly, once the InGaN active
layer--including a multiple quantum well as the active portion--has
been grown, the growth temperatures for the remaining layers must
be limited to temperatures that avoid undesired disassociation or
degradation of the indium gallium nitride layer. Stated
differently, if the InGaN active layer or multiple quantum well
were absent, the AIGaN and GaN layers could be grown at higher
temperatures that are more favorable (all other factors being
equal) for higher quality epitaxial layers of these materials.
As a result, at the lower growth temperatures used to grow the
aluminum gallium nitride layers that are required to protect the
indium gallium nitride layer, the resulting quality of the aluminum
gallium nitride layers is somewhat less than it would be if the
layers could be grown at a higher temperature.
Accordingly, although ordinarily an AlGaN--AlGaN interface would be
considered to make a good homojunction, under the lower growth
temperatures required to protect the desired indium gallium nitride
active layer of the present invention, the aluminum gallium nitride
layers are of poor quality, with the p-type aluminum gallium
nitride layers being particularly bad. As a result, for devices
that incorporate indium gallium nitride active layers, interfaces
and junctions between p-type aluminum gallium nitride and n-type
aluminum gallium nitride, are generally of very low quality. Thus
the invention's avoidance of such junctions is counterintuitive and
produces an unexpectedly better device. Stated differently, prior
art devices that incorporate the structure of FIG. 8 require
interfaces between Group III nitrides that are difficult to form
with high quality.
FIG. 9 illustrates a device described in copending and commonly
assigned application Ser. No. 09/154,363 filed Sep. 16, 1998. As in
FIG. 8, the n-type gallium nitride layer is designated at 30, the
indium gallium nitride active layer is at 31, the p-n junction is
at 33, and the p-type aluminum gallium nitride is designated at 32.
The device illustrated in FIG. 9, however, also includes an
additional n-type gallium nitride clad layer 34 that provides a
slightly better interface with the indium gallium nitride active
layer 31; i.e. the adjacent GaN--InGaN layer tends to provide the
opportunity for a higher quality interface than do adjacent
AlGaN--InGaN layers. FIG. 9 also illustrates an n-type aluminum
gallium nitride layer 35 between the second gallium nitride layer
34 and the p-type aluminum gallium nitride layer 32. Finally, FIG.
9 includes an additional p-type gallium nitride layer 36 as a top
contact layer. This device offers the advantage of having the p-n
junction 33 formed between adjacent layers of aluminum gallium
nitride, and the GaN layer 34 likewise provides a slightly better
interface with the indium gallium nitride active layer 31 than does
the AlGaN layer 32 of FIG. 8.
FIG. 10 illustrates the bandgap relationships of the embodiment of
the present invention as illustrated in FIG. 1 in which the n-type
gallium nitride layer 30 (11 in FIG. 1) is again a clad layer for
the indium gallium nitride active layer 31 (13 in FIG. 1). The
opposing clad layer 36 is formed of n-type aluminum gallium
nitride, and the device is completed with the p-type gallium
nitride layer 36, thus defining the p-n junction 33 between the
n-type AlGaN layer 35 and the p-type gallium nitride layer 36. This
offers the advantage of having the p-n junction at the interface
between the n-type aluminum gallium nitride 35 and the p-type
gallium nitride 36. As noted above, other than an GaN--GaN
junction, the AlGaN--GaN junction is the one most easily formed at
the quality required for successful devices.
FIG. 11 illustrates another embodiment of the present invention in
which the first clad layer is the n-type gallium nitride layer 30,
the active layer is indium gallium nitride 31, and the second clad
layer is n-type aluminum gallium nitride 35. This embodiment,
however, includes an additional layer of n-type gallium nitride 37
adjacent the n-type aluminum gallium nitride layer 35. As a result
the p-n junction is formed between n-type gallium nitride 37 and
p-type gallium nitride 36 giving a GaN--GaN interface that provides
the highest quality from a structural standpoint.
FIG. 12 illustrates another preferred embodiment in which the
n-type gallium nitride layer 30 again forms one clad layer for the
indium gallium nitride active layer 31. Similarly, the top contact
layer is a p-type gallium nitride layer 36 as in FIGS. 10 and 11.
As a clad and transition layer, FIG. 12 includes the portion 40
that is progressively compositionally graded between n-type
aluminum gallium nitride at the interface with the InGaN active
layer 31 and substantially entirely n-type gallium nitride at the
interface with the p-type gallium nitride layer 36. As a result,
the p-n junction 33 is again made as a homojunction between the
n-GaN portion of the graded layer 40 and the p-GaN layer 36.
The thickness of the layer or layers between the active layer and
the p-n junction affects the functionality of the device. Layers
that are too thin fail to offer the appropriate confinement, while
layers that are too thick allow too much recombination to take
place in the thick layer rather than in the active layer as
desired. Accordingly, with respect to the embodiment depicted in
FIG. 1, clad layer 12 should be between about 30 and 70 .ANG.
thick. With respect to the embodiment depicted in FIG. 3, clad
layer 12 should be between about 20 and 50 .ANG. thick, and layer
19 should be between about 30 and 50 .ANG. thick. The total
thickness of layers 12 and 19 should preferably be no more than
about 100 .ANG.. With respect to the efficiency of the devices, one
goal is to minimize the nonradiative recombination current (Jnr)
while maximizing the radiative combination current (Jr). In this
regard, the structure shown in FIG. 8 has the greatest (i.e., least
desirable) nonradiative recombination current. The nonradiative
recombination current of the device of FIG. 9 is somewhat less than
that of FIG. 8, but still greater than the more favorably lower
nonradiative recombination current of FIG. 10, 11 or 12.
FIGS. 13 and 14 illustrate in more detail one of the embodiments of
the invention in which the active portion is a multiple quantum
well ("MQW") and which incorporates a superlattice as part of the
device structure. In general, a superlattice (alternating layers of
two different semiconductor materials, each several nanometers
thick) can encourage and support good crystal growth and better
transitions among the layers of a device. Superlattices can provide
strain relief in the cladding layers of Group III nitride photonic
devices (e.g. thick AlGaN cladding layers tend to crack) and can
also enhance carrier concentration as compared to bulk films.
Multiple quantum wells (thin layers of semiconductor within which
the potential energy of an electron is less than outside the layer)
increase a device's efficiency by progressively collecting
carriers. A multiple quantum well structure also provides another
method for tuning the output (wavelength and frequency) of a
photonic device, typically by controlling the mole fraction of the
Group III elements, the dopant concentration, and the thickness of
the well and barrier layers.
In FIGS. 13 and 14, an LED structure 45 comprises a substrate 50
which is preferably 4H or 6H n-type silicon carbide. The substrate
50 may also comprise sapphire, bulk gallium nitride or another
suitable substrate.
The embodiment illustrated in FIG. 13 includes a layered
semiconductor structure comprising gallium nitride-based
semiconductor layers grown on the substrate 50. Namely, the
embodiment illustrated includes the following layers: a conductive
buffer layer 51, a first silicon-doped GaN layer 52, a second
silicon doped GaN layer 54, a superlattice structure 56 comprising
alternating layers of silicon-doped GaN and/or InGaN, an active
region 60 comprising a multi-quantum well structure, an undoped GaN
or AlGaN layer 62, an AlGaN layer 64 doped with a p-type impurity,
and a GaN contact layer 66, also doped with a p-type impurity. The
structure further includes an ohmic contact 70 formed on the n-type
substrate 50 and an ohmic contact 72 formed on the p-type contact
layer 66.
The buffer layer 51 is preferably n-type AlGaN. Examples of buffer
layers between silicon carbide and Group III-nitride materials are
provided in commonly assigned U.S. Pat. Nos. 5,393,993 and
5,523,589, and U.S. application Ser. No. 09/154,363 entitled
"Vertical Geometry InGaN Light Emitting Diode" assigned to the
assignee of the present invention, the disclosures of which are
incorporated entirely by reference as if fully set forth herein.
The first GaN layer 52 is preferably between about 500 and 3000 nm
thick inclusive and is most preferably about 1500 nm thick. The GaN
layer 52 is doped with silicon at a level of about 1-2E18 cm.sup.-3
(1-2.times.10.sup.18 cm.sup.-3) The second GaN layer 54 is
preferably between about 10 and 50 .ANG. thick inclusive, and is
most preferably about 80 .ANG. thick. The GaN layer 54 is doped
with silicon at a level of less than about 1E19 cm.sup.-3.
The superlattice structure 56 comprises alternating layers of
In.sub.XGa.sub.1-XN and In.sub.YGa.sub.1-YN, wherein x is between 0
and 1 inclusive and x is not equal to y. Preferably, x=0 (i.e.,
Indium is absent from such layers), and the thickness of each of
the alternating layers of InGaN is about 8-12 .ANG. thick
inclusive, while the thickness of each of the alternating layers of
GaN is about 15-20 .ANG. thick, inclusive. The superlattice
structure 56 comprises about 5-50 periods (where one period equals
one repetition each of the In.sub.XGa.sub.1-XN and
In.sub.YGa.sub.1-YN layers that comprise the superlattice). In one
embodiment, the superlattice structure 56 comprises 25 periods. In
another embodiment, the superlattice structure 56 comprises 10
periods.
The active region 60 comprises a multiple-quantum well structure
which includes multiple InGaN quantum well layers 74 separated by
barrier layers 76. The barrier layers 76 comprise
In.sub.XGa.sub.1-XN wherein 0<x<1. Preferably, the indium
composition of the barrier layers 76 is less than that of the
quantum well layers 74, so that the barrier layers 76 have a higher
bandgap than the quantum well layers 74. The barrier layers 76 and
the quantum well layers 74 may be undoped (i.e. not intentionally
doped with an impurity atom such as silicon or magnesium). If UV
emission is desired, it may be preferable to dope the barrier
layers 76 with Si at a level less than 1E 19 cm.sup.-3.
In another embodiment, the barrier layers 76 comprise
AI.sub.XIn.sub.YGa.sub.(1-X-Y)N where 0<x<1, 0<y<1 and
(x+y)<1. By including aluminum in the crystal of the barrier
layers 76, the barrier layers 76 may be lattice-matched to the
quantum well layers 74, thereby providing improved crystalline
quality in the quantum well layers 74, which increases the
luminescent efficiency of the device.
Referring to FIG. 14, in one embodiment, the active region 60
comprises a periodically repeating structure 77 comprising a well
support layer 76a having high crystal quality, a quantum well layer
74 and a cap layer 76b that serves as a protective cap layer for
the quantum well layer 74. When the structure 77 is grown, the cap
layer 76b and the well support layer 76a together form the barrier
layer between the adjacent quantum wells 74. Preferably, the high
quality well support layer 76a is grown at a higher temperature
than that used to grow the InGaN quantum well layer 74. For
example, in order to achieve a high quality surface for growing the
InGaN quantum well layer 74, the well support layer 76a is grown at
a growth temperature of between about 750 and 900.degree. C. Then,
the temperature of the growth chamber is lowered by about
50.degree. C. to permit growth of a high-quality InGaN quantum well
layer 74. Then, while the temperature is kept at the lower InGaN
growth temperature, the cap layer 76b is grown. In that manner, a
multi-quantum well region comprising high quality InGaN layers may
be fabricated.
The active region 60 is preferably grown in a nitrogen atmosphere,
which provides increased InGaN crystal quality. The barrier layers
76 are between about 50-400 .ANG. thick inclusive. Preferably, the
barrier layers 76 are greater than about 90 .ANG. thick and most
preferably are about 225 .ANG. thick. The quantum well layers 74
are between about 15-35 .ANG. thick inclusive. Preferably, the
quantum well layers are greater than 20 .ANG. thick and most
preferably are about 25 .ANG. thick. As noted earlier, the
thickness and percentage of indium in the quantum well layers 74
may be varied to produce light having a desired wavelength.
The layer 62 that is grown on the active region 60 is preferably
undoped GaN or AlGaN, and is between about 0 and 50 .ANG. thick
inclusive, and more preferably about 35 .ANG. thick. If the layer
62 comprises AlGaN, the aluminum percentage in such layer is
preferably about 10-30% and most preferably about 24%. The level of
aluminum in the layer 62 may also be graded in a stepwise or
continuously decreasing fashion. The layer 62 may be grown at a
higher temperature than the growth temperatures for the quantum
well region 60 in order to improve the crystal quality of the layer
62. Additional layers of undoped GaN or AlGaN may be included in
the vicinity of the layer 62. For example, the LED 45 may include
an additional layer of undoped AlGaN about 6-9 .ANG. thick
underneath layer 62.
An AlGaN layer 64 doped with a p-type impurity such as magnesium is
grown on layer 62. The AlGaN layer 64 is between about 50 and 200
.ANG. thick inclusive and is preferably about 85 .ANG. thick. A
contact layer 66 is formed of p-type GaN and is preferably about
1600 .ANG. thick.
Ohmic contacts 70 and 72 are applied to the p-GaN contact layer 66
and the substrate 50, respectively.
Additional information about the growth of multiple quantum wells
and superlattices is set forth in previously-incorporated
application No. 60/298,835.
In the drawings and the specification, typical embodiments of the
invention have been disclosed. Specific terms have been used only
in a generic and descriptive sense, and not for purposes of
limitation. The scope of the invention is set forth in the
following claims.
* * * * *