U.S. patent number RE43,939 [Application Number 10/754,094] was granted by the patent office on 2013-01-22 for headset noise reducing.
This patent grant is currently assigned to Bose Corporation. The grantee listed for this patent is Michael J. Monahan, Roman Sapiejewski. Invention is credited to Michael J. Monahan, Roman Sapiejewski.
United States Patent |
RE43,939 |
Sapiejewski , et
al. |
January 22, 2013 |
Headset noise reducing
Abstract
.[.A headset has an earcup with front opening adjacent to an
annular cushion formed with a plurality of openings facing the
inside of the earcup that acoustically couples the earcup volume to
the cushion volume. A driver is seated inside the earcup with a
microphone adjacent to the driver. Active noise reducing circuitry
intercouples the driver and microphone. An acoustic load that may
comprise a wire mesh resistive cover and/or air mass adjacent the
microphone is constructed and arranged to reduce the effect of
resonances in the earcup volume..]. .Iadd.A headset has an earcup
with front opening adjacent to an annular cushion. A driver is
seated inside the earcup with a microphone adjacent to the driver.
Active noise reducing circuitry intercouples the driver and
microphone. An acoustic load is constructed and arranged to reduce
the effect of resonances in the earcup volume. .Iaddend.
Inventors: |
Sapiejewski; Roman (Boston,
MA), Monahan; Michael J. (Southborough, MA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Sapiejewski; Roman
Monahan; Michael J. |
Boston
Southborough |
MA
MA |
US
US |
|
|
Assignee: |
Bose Corporation (Framingham,
MA)
|
Family
ID: |
23389047 |
Appl.
No.: |
10/754,094 |
Filed: |
January 8, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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Reissue of: |
09353425 |
Jul 15, 1999 |
6597792 |
Jul 22, 2003 |
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Current U.S.
Class: |
381/71.6;
381/372; 381/74; 381/71.1; 381/371 |
Current CPC
Class: |
H04R
1/1083 (20130101); H04R 5/033 (20130101); H04R
1/1008 (20130101); H04R 1/1075 (20130101) |
Current International
Class: |
H03B
29/00 (20060101); H04R 25/00 (20060101); H04R
1/10 (20060101) |
Field of
Search: |
;381/71.6,74,71.1,312,371,372,71.5 ;181/129 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1101203 |
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Apr 1995 |
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CN |
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1213262 |
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Apr 1999 |
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CN |
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3212519 |
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Jan 1991 |
|
DE |
|
003212519 |
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Jan 1991 |
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DE |
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0582404 |
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Feb 1994 |
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EP |
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0582404 |
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Feb 1994 |
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EP |
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0688143 |
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Dec 1995 |
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EP |
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0688143 |
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Dec 1995 |
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EP |
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0873040 |
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Oct 1998 |
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EP |
|
0873040 |
|
Oct 1998 |
|
EP |
|
62002798 |
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Jan 1987 |
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JP |
|
62-061593 |
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Apr 1987 |
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JP |
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62061593 |
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Apr 1987 |
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JP |
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1196999 |
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Aug 1989 |
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JP |
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5036991 |
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May 1993 |
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JP |
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Other References
Translation of DE003212519C1. cited by examiner .
Examination Report, dated Mar. 10, 2008, issued in corresponding
European Application Serial No. EP 05 113 070.6. cited by applicant
.
Joint Notice of Prior Art for U.S. Patent 5,181,252 and U.S. Patent
6,597,792, United States International Trade Commission,
Washington, D.C. 20436, Honorable Charles E. Bullock,
Administrative Law Judge, Dated Apr. 21, 2008. cited by applicant
.
Public Version of Joint Motion to Terminate Investigation, dated
Dec. 1, 2008. cited by applicant .
Commission Notice of Determination, dated Jan. 2, 2009. cited by
applicant .
The extended European Search Report in corresponding European
application, dated Apr. 9, 2009. cited by applicant .
Translation of Japanese Office Action in counterpart Application
No. 2000-214735 dated Nov. 17, 2009, 5 pages. cited by applicant
.
CN Office Action dated Mar. 24, 2010 for CN 200610084225.5. cited
by applicant .
CN Office Action dated Jun. 22, 2010 for CN 200410097494.6. cited
by applicant .
Japanese Patent Office Action in counterpart Application No.
2000-214735 dated Oct. 12, 2010, 4 pages. cited by applicant .
Chinese Second Office Action in counterpart Application No.
200610084225.5 dated Oct. 9, 2010, 10 pages. cited by applicant
.
Notice of Allowance for the corresponding U.S. Appl. No. 12/576,699
dated Oct. 18, 2011. cited by applicant .
Japanese Office Action in counterpart Application No. 2011-028867,
dated Mar. 13, 2013, 3 pages. cited by applicant.
|
Primary Examiner: Lee; Ping
Attorney, Agent or Firm: Fish & Richardson P.C.
Claims
What is claimed is:
.[.1. A headset comprising, an earcup having a front opening
adapted to be adjacent to the ear of the user, a driver inside said
earcup, a cushion around the periphery of said front opening formed
with an ear opening constructed and arranged to accommodate the ear
of a user and formed with a plurality of openings around said
opening constructed and arranged to acoustically add the volume of
said cushion to the volume of said earcup and enhance passive
attenuation..].
2. A headset .[.in accordance with claim 1 and further.].
comprising, .Iadd.an earcup having a front opening adapted to be
adjacent to the ear of the user, a driver inside said earcup, a
cushion around the periphery of said front opening formed with an
ear opening constructed and arranged to accommodate the ear of a
user and formed with a plurality of openings around said opening
constructed and arranged to acoustically add the volume of said
cushion to the volume of said ear cup and enhance passive
attenuation, .Iaddend. a microphone inside said earcup adjacent to
said driver, and active noise reducing circuitry intercoupling said
microphone and said driver constructed and arranged to provide
active noise reduction, whereby said cushion with said plurality of
openings is further constructed and arranged to furnish additional
damping to help smooth the audio response at the ear of a user and
control stability with the headset off the head.
3. A headset in accordance with claim 2 and further comprising, an
acoustic load in close proximity to said microphone constructed and
arranged to reduce the effects of resonances in said earcup.
4. A headset in accordance with claim 3 wherein said acoustic load
comprises a wire mesh resistive cover.
5. A headset in accordance with claim 4 wherein said wire mesh
resistive cover is formed with an opening near said microphone.
6. A headset in accordance with claim 4 wherein said wire mesh
resistive cover coacts with said driver to substantially enclose
said microphone.
.Iadd.7. The headset in accordance with claim 2, wherein said
cushion comprises foam..Iaddend.
.Iadd.8. The headset in accordance with claim 7, wherein said foam
is visible through the plurality of openings..Iaddend.
.Iadd.9. The headset in accordance with claim 2, wherein said
cushion is formed with a plurality of discrete openings having
substantially the same area..Iaddend.
.Iadd.10. The headset in accordance with claim 2, wherein said
cushion comprises an annular ridge surrounding said ear
opening..Iaddend.
.Iadd.11. The headset in accordance with claim 10 wherein said
plurality of openings are formed along the circumferential length
of said annular ridge..Iaddend.
.Iadd.12. The headset in accordance with claim 11 wherein said
plurality of openings are equidistantly spaced along the
circumferential length of the annular ridge..Iaddend.
.Iadd.13. The headset in accordance with claim 2 further comprising
a mass port extending through a closed end of said
earcup..Iaddend.
.Iadd.14. The headset in accordance with claim 13 further
comprising a resistive port extending through said closed end of
said earcup..Iaddend.
.Iadd.15. The headset in accordance with claim 2 further comprising
a resistive port extending through a closed end of the
earcup..Iaddend.
.Iadd.16. The headset in accordance with claim 14 wherein said
resistive port is covered by a wire mesh..Iaddend.
.Iadd.17. The headset in accordance with claim 2 further comprising
a driver plate to support said driver..Iaddend.
.Iadd.18. The headset in accordance with claim 17 wherein said
driver plate is positioned and arranged to substantially divide
said earcup into a front volume adjacent said front opening and a
rear volume enclosed by a closed end of the earcup..Iaddend.
.Iadd.19. The headset in accordance with claim 18 wherein said
front volume is substantially larger than said rear
volume..Iaddend.
.Iadd.20. A headset comprising, an earcup having a front opening
adapted to be adjacent to the ear of the user, a driver inside said
earcup, a cushion around the periphery of said front opening formed
with an ear opening constructed and arranged to accommodate the ear
of a user and formed with a plurality of openings around said
opening constructed and arranged to acoustically add the volume of
said cushion to the volume of said ear cup and enhance passive
attenuation, a microphone inside said earcup adjacent to said
driver, and active noise reducing circuitry intercoupling said
microphone and said driver constructed and arranged to provide
active noise reduction, whereby said cushion with said plurality of
openings is further constructed and arranged to furnish additional
damping to help smooth the audio response at the ear of a user and
control stability with the headset off the head, a driver plate to
support said driver, wherein said driver plate is positioned and
arranged to substantially divide said earcup into a front volume
adjacent said front opening and a rear volume enclosed by a closed
end of the earcup, wherein said front volume is substantially
larger than said rear volume, wherein said front volume is about 50
cubic centimeters..Iaddend.
.Iadd.21. A headset comprising, an earcup having a front opening
adapted to be adjacent to the ear of the user, a driver inside said
earcup, a cushion around the periphery of said front opening formed
with an ear opening constructed and arranged to accommodate the ear
of a user and formed with a plurality of openings around said
opening constructed and arranged to acoustically add the volume of
said cushion to the volume of said ear cup and enhance passive
attenuation, a microphone inside said earcup adjacent to said
driver, and active noise reducing circuitry intercoupling said
microphone and said driver constructed and arranged to provide
active noise reduction, whereby said cushion with said plurality of
openings is further constructed and arranged to furnish additional
damping to help smooth the audio response at the ear of a user and
control stability with the headset off the head, a driver plate to
support said driver, wherein said driver plate is positioned and
arranged to substantially divide said earcup into a front volume
adjacent said front opening and a rear volume enclosed by a closed
end of the earcup, wherein said front volume is substantially
larger than said rear volume, wherein said rear volume is about 15
cubic centimeters..Iaddend.
.Iadd.22. A headset comprising, an earcup, a driver inside said
earcup, a microphone disposed between said driver and ear of the
user, feedback active noise reducing circuitry intercoupling said
microphone and said driver constructed and arranged to provide
active noise reduction, a wire mesh screen disposed between the ear
of a user and said microphone to load at least one of said
microphone and said driver and thereby improve stability of the
headset as compared to an otherwise identical headset without such
wire mesh screen, and a cushion extending around the periphery of
said open end of earcup formed with openings through the cushion
along an annular ring to acoustically add the volume of said
cushion to the volume of said earcup and thereby improve the
stability of said feedback active noise reducing circuitry when the
headset is off of the head of the user, as compared to an otherwise
identical headset without such cushion..Iaddend.
.Iadd.23. A headset comprising, an earcup having open end adapted
to be adjacent to the ear of the user, a driver inside said earcup,
a microphone inside said earcup adjacent to said driver, feedback
active noise reducing circuitry intercoupling said microphone and
said driver constructed and arranged to provide active noise
reduction, and a cushion extending around the periphery of said
open end of earcup formed with openings along an annular ring to
acoustically add the volume of said cushion to the volume of said
earcup and thereby improve the stability of said feedback active
noise reducing circuitry when the headset is off of the head of the
user, as compared to an otherwise identical headset without such
cushion..Iaddend.
.Iadd.24. The headset in accordance with claim 23 wherein said
cushion comprises foam..Iaddend.
.Iadd.25. The headset in accordance with claim 24 wherein said foam
is substantially visible through said openings along said annular
ring..Iaddend.
.Iadd.26. The headset in accordance with claim 25 wherein said
openings area plurality of discrete openings each having
substantially the same area..Iaddend.
.Iadd.27. The headset in accordance with claim 23 wherein said
plurality of openings are equidistantly spaced along the
circumferential length of said annular ring..Iaddend.
.Iadd.28. The headset in accordance with claim 23 further
comprising a mass port extending through a closed end of said
earcup..Iaddend.
.Iadd.29. The headset in accordance with claim 23 further
comprising a resistive port extending through a closed end of said
earcup..Iaddend.
Description
The present invention relates in general to headset noise reducing
and more particularly concerns novel apparatus and techniques for
actively and/or passively reducing the noise perceived by the user
of a headset.
BACKGROUND OF THE INVENTION
For background reference is made to U.S. Pat. Nos. 5,305,387,
5,208,868, 5,181,252, 4,989,271, 4,922,542, 4,644,581 and
4,455,675. Reference is also made to the Bose active noise-reducing
headsets that are or were commercially available from Bose
Corporation that are incorporated by reference herein.
It is an important object of the invention to provide improved
noise-reducing for headsets.
BRIEF SUMMARY OF THE INVENTION
According to the invention, there is an earcup closed at the back
away from the ear of a user and open at the front adjacent to the
ear of the user. There is a driver inside the earcup. The earcup
has a cushion that is seated in the front opening and formed with
an ear opening for accommodating the ear of the user and an annular
ridge surrounding the ear opening formed with a plurality of
openings with adjacent openings typically spaced from each other by
of the order of the width of an opening measured along the
circumference of the ear opening with each opening having a radial
width generally perpendicular to the circumference of the ear
opening slightly less than the radial width of the annular ridge.
For active noise reduction, there is a microphone adjacent to the
driver coupled to the driver by electronic circuitry that furnishes
active noise reduction and an acoustical load around the microphone
and driver. The acoustic load may comprise a resistive mesh screen
and/or air in a tube. Other features, objects and advantages will
become apparent from the following detailed description when read
in connection with the accompanying drawings in which:
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
FIG. 1A is a perspective view of a headset earcup assembly
embodying the invention with the cushion shown in FIG. 1B according
to the invention removed;
FIG. 2 is a sectional view of an earcup assembly according to the
invention;
FIG. 3 is a pictorial perspective view into the earcup assembly
with the microphone and resistive cover plate removed;
FIG. 4 is a perspective view showing the outside of an earcup;
and
FIG. 5 is a block diagram of a system embodying the invention.
DETAILED DESCRIPTION
With reference now to the drawings and, more particularly, FIGS. 1A
and 1B thereof, there is shown a perspective view of an earcup
assembly according to the invention with the perforated cushion of
FIG. 1B removed. Earcup 11 is closed at the rear away from the ear
of a user and supports driver 12 and a closely adjacent microphone
(not seen in FIG. 1A) that is covered by resistive mesh screen 13
typically formed with an opening 13A exposing the microphone and
comprising an acoustical load. Electronic circuitry intercouples
the microphone and driver 12 to provide active noise reduction and
exchange audio signals through cable 14 for transduction by driver
12 into desired sound signal for the wearing user and by the
microphone into a noise-reducing audio signal.
Referring also to FIG. 1B, cushion 15 covers the exposed front
opening adjacent to the ear of the wearing user and is formed with
an ear opening 15A for accommodating the ear of the wearing user
and an annular ridge 16 surrounding ear opening 15A that is formed
with a plurality of openings, such as 16A, through which an annular
ring of foam is visible that rests against driver 12 when
assembled.
Referring to FIG. 2, there is shown a diagrammatic sectional view
through an assembled earcup. Driver 12 is seated in earcup 11 with
driver plate 12A extending rearward from a lip 11A of earcup 11 to
a ridge 11B with microphone 17 closely adjacent to driver 12 and
covered by wire mesh resistive cover 13. Cushion 15 covers the
front opening of earcup 11 and includes foam 15B.
Referring to FIG. 3, there is shown a pictorial perspective view
into earcup 11 with cushion 15, microphone 17 and wire mesh
resistive cover 13 removed to illustrate certain structural
details. Earcup 11 is formed with a cable entry 11C for
accommodating cable 14 for receiving audio signals for transduction
by driver 12 and intercoupling external electronic circuitry with
the drive and microphone. Driver plate 12A carries resistive cover
holders 21A and 21B for supporting the wire mesh resistive cover
13. Microphone holder 22 extends from the rear wall of earcup 11
for supporting microphone 17 and encloses air that comprises
acoustical loading. Driver plate mounting bosses 12B and 12C
furnish a means for attaching driver plate 12A to earcup 11. Driver
12 divides earcup 11 into a front volume typically about 50 CC
adjacent to the front opening and a rear volume typically about 15
CC enclosed by the closed end of earcup 11.
Referring to FIG. 4, there is shown a rear view of earcup 11
showing mass port 11C and resistive port 11D covered by a wire
mesh.
With reference now to the drawing and more particularly FIG. 5
thereof, there is shown a block diagram illustrating the logical
arrangement of a system incorporating the invention corresponding
substantially to FIG. 1 of the aforesaid '581 patent. A signal
combiner 30 algebraically combines the signal desired to be
reproduced by the earphone on input terminal 24 with a feedback
signal provided by microphone preamplifier 35. Signal combiner 30
provides the combined signal to compressor 31 which limits the
level of the high level signals. The output of compressor 31 is
applied to compensator 31A. Compensator 31A includes compensation
circuits to insure that the open loop gain meets the Nyquist
stability criteria, so that the system will not oscillate when the
loop is closed. The system shown is duplicated once each for the
left and right ears.
Power amplifier 31 amplifies the signal from compensator 31A and
energizes earphone driver 2 to provide an acoustical signal in the
front cavity that is combined with an outside noise signal that
enters the front cavity from a region represented as acoustical
input terminal 25 to produce a combined acoustic pressure signal in
the front cavity represented as a circle 36 to provide a combined
acoustic pressure signal applied to and transduced by microphone 7.
Microphone amplifier 35 amplifies the transduced signal and
delivers it to signal combiner 30.
Having described the structural arrangement of an embodiment of the
invention, principles of operation will be described. A problem in
active noise-reducing circumaural headphones arises from earcup
resonances causing a rough acoustic response that is a function of
the head of the user, making electronic compensation difficult.
One approach for smoothing the acoustic response is to place
damping material, typically highly absorptive foam, around the
walls of the earcup. This approach typically requires a significant
thickness of foam to provide sufficient damping and requires
earcups of relatively large volume to accommodate the thick foam.
Furthermore, the damping of the highly absorptive foam is a
sensitive function of the physical dimensions of the foam and
atmospheric conditions, causing inconsistent acoustical
response.
Resonance in the earcup may produce instability by causing
oscillation at certain frequencies that typically limits the amount
of feedback for active noise reduction. By acoustically loading the
microphone and driver with the wire mesh resistive cover 13 and/or
the enclosed air, resonances are significantly reduced, allowing
increased gain in the feedback loop and significantly improved
active noise reduction in an earcup of relatively small volume.
By forming openings in annular ridge 16 of cushion 15 to expose
foam material 15B, the effective volume of the earcup is
significantly increased to embrace the volume occupied by cushion
15 and thereby increase passive attenuation and provides additional
damping to help smooth the audio response at the ear and control
stability with the headset off the head.
The invention has a number of advantages. Cup size is relatively
small, yet there is considerable effective volume with the
additional effective volume afforded by cushion 15 accessed through
openings such as 16A. The effect of resonances inside earcup 11 is
significantly reduced with wire mesh resistive cover 13 and/or the
enclosed air, thereby allowing a significant increase in loop gain
of the active noise reducing system.
It is evident that those skilled in the art may now make numerous
uses and modifications of and departures from the specific
apparatus and techniques herein disclosed without departing from
the inventive concepts. Consequently, the invention is to be
construed as embracing each and every novel feature and novel
combination of features present in or possessed by the apparatus
and techniques herein disclosed and limited solely by the spirit
and scope of the appended claims.
* * * * *