U.S. patent number RE43,162 [Application Number 12/759,827] was granted by the patent office on 2012-02-07 for semiconductor memory module, electronic apparatus and method for operating thereof.
This patent grant is currently assigned to Qimonda AG. Invention is credited to Siva RaghuRam.
United States Patent |
RE43,162 |
RaghuRam |
February 7, 2012 |
Semiconductor memory module, electronic apparatus and method for
operating thereof
Abstract
A semiconductor memory module (1) includes a circuit substrate
(2), a first (100), a second (200), a third (300) and a fourth
(400) rank of memory chips (3), a first register (10) and a second
register (20). The first register (10) and the second register (20)
each comprise a first input (11, 21) for receiving a respective
chip select signal (CS0, CS2), a second input (12, 22) for
receiving a respective other chip select signal (CS1, CS3) at least
one third input (13, 23) for receiving command/address signals
(CA), and at least one third output (16, 26). The at least one
third output (16, 26) of the respective first (10) and second (20)
register transmits the command/address signals (CA), if at least
one of the respective chip select signal (CS0, CS2) received at the
respective first input (11, 21) of the respective register (10, 20)
and the respective other chip select signal (CS1, CS3) received at
the respective second input (12, 22) of the respective register
(10, 20) is active, and blocks a transmission of the
command/address signals (CA), if both the respective chip select
signal (CS0, CS2) received at the respective first input (11, 21)
of the respective register (10, 20) and the respective other chip
select signal (CS1, CS3) received at the respective second input
(12, 22) of the respective register (10, 20) are inactive.
Inventors: |
RaghuRam; Siva
(Unterschiei.beta.heim, DE) |
Assignee: |
Qimonda AG (Munich,
DE)
|
Family
ID: |
38329502 |
Appl.
No.: |
12/759,827 |
Filed: |
April 14, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
Reissue of: |
11364135 |
Feb 28, 2006 |
7359257 |
Apr 15, 2008 |
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Current U.S.
Class: |
365/191; 365/198;
365/51; 365/194 |
Current CPC
Class: |
G11C
5/04 (20130101) |
Current International
Class: |
G11C
7/00 (20060101) |
Field of
Search: |
;365/51,194,191,198 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Jun. 15, 2011 German Office Action in German Patent Application No.
10 2007 009 817.2 which claims priority to U.S. patent application
No. 11/364,135 (German language document). cited by other.
|
Primary Examiner: Luu; Pho M
Attorney, Agent or Firm: Economou; John S.
Claims
What is claimed is:
1. A semiconductor memory module comprising: a circuit substrate; a
first, a second, a third and a fourth rank of memory chips each
rank including a plurality of memory chips and each being disposed
on said circuit substrate; a first register and a second register
each disposed on said circuit substrate, said first register and
said second register each comprising: a first input for receiving
.[.a.]. .Iadd.an associated first .Iaddend.chip select signal
having one of an active or an inactive level; a second input for
receiving .[.a other.]. .Iadd.an associated second .Iaddend.chip
select signal having one of an active or an inactive level; at
least one third input for receiving command/address signals; a
first output coupled to transmit said .Iadd.associated first
.Iaddend.chip select signal to said memory chips of said first rank
.[.and.]. .Iadd.or .Iaddend.said third rank.Iadd., said first
output of said first register coupled to transmit said associated
first chip select signal to said memory chips of said first rank
and said first output of said second register coupled to transmit
said associated first chip select signal to said memory chips of
said third rank.Iaddend.; a second output coupled to transmit said
.[.other.]. .Iadd.associated second .Iaddend.chip select signal to
said memory chips of said second rank .[.and.]. .Iadd.or
.Iaddend.said fourth rank.Iadd., said second output of said first
register coupled to transmit said associated second chip select
signal to said memory chips of said second rank and said second
output of said second register coupled to transmit said associated
second chip select signal to said memory chips of said fourth
rank.Iaddend.; .Iadd.and.Iaddend. at least one third output
.Iadd.for outputting command/address signals.Iaddend., wherein said
at least one third output of said first register is coupled to
transmit said command/address signals to said memory chips of said
first rank and to said memory chips of said second rank, if at
least one of said .Iadd.associated first .Iaddend.chip select
signal received at said first input of said first register and said
.[.other.]. .Iadd.associated second .Iaddend.chip select signal
received at said second input of said first register is active, and
to block a transmission of said command/address signals to said
memory chips of said first rank and to said memory chips of said
second rank, if both said .Iadd.associated first .Iaddend.chip
select signal received at said first input of said first register
and said .[.other.]. .Iadd.associated second .Iaddend.chip select
signal received at said second input of said first register are
inactive; and said at least one third output of said second
register is coupled to transmit said command/address signals to
said memory chips of said third rank and to said memory chips of
said fourth rank, if at least one of said .Iadd.associated first
.Iaddend.chip select signal received at said first input of said
second register and said .[.other.]. .Iadd.associated second
.Iaddend.chip select signal received at said second input of said
second register is active, and to block a transmission of said
command/address signals to said memory chips of said third rank and
to said memory chips of said fourth rank, if both said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said second register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said second register are inactive.
2. The semiconductor memory module according to claim 1, wherein
said circuit substrate has a first surface and a second surface,
wherein said first register and said memory chips of said first
rank are disposed on said first surface and said memory chips of
said second rank are stacked upon said memory chips of said first
rank, and wherein said second register and said memory chips of
said third rank are disposed on said second surface and said memory
chips of said fourth rank are stacked upon said memory chips of
said third rank.
3. The semiconductor memory module according to claim 1, wherein
said circuit substrate comprises an edge connector having contacts
for transmitting electrical signals between said circuit substrate
and an external device.
4. The semiconductor memory module according to claim 3, wherein
ends of said contacts are coupled via respective conductive lines
disposed on said circuit substrate to said first input, to said
second input and to said at least one third input of each of said
first register and said second register.
5. The semiconductor memory module according to claim 4, wherein
said electrical signals comprise said .Iadd.associated first
.Iaddend.chip select signals, said .[.other.]. .Iadd.associated
second .Iaddend.chip select signals and said command/address
signals.
6. The semiconductor memory module according to claim 1, wherein
each of said first register and said second register comprises a
fourth input for receiving a control signal having one of an active
and an inactive level; said at least one third output of said first
register coupled to transmit said command/address signals, if said
control signal is active and if at least one of said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said first register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said first register is active, and to block
said command/address signals, if said control signal is active and
if both said .Iadd.associated first .Iaddend.chip select signal
received at said first input of said first register and said
.[.other.]. .Iadd.associated second .Iaddend.chip select signal
received at said second input of said first register are inactive;
said at least one third output of said first register coupled to
transmit said command/address signals, if said control signal is
inactive; said at least one third output of said second register
coupled to transmit said command/address signals, if said control
signal is active and if at least one of said .Iadd.associated first
.Iaddend.chip select signal received at said first input of said
second register and said .[.other.]. .Iadd.associated second
.Iaddend.chip select signal received at said second input of said
second register is active, and to block said command/address
signals, if said control signal is active and if both said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said second register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said second register are inactive; and said at
least one third output of said second register coupled to transmit
said command/address signals if said control signal is
inactive.
7. The semiconductor memory module according to claim 1, wherein
said semiconductor module has a socket disposed on said circuit
substrate, said semiconductor memory module further comprising:
another circuit substrate having a plug disposed thereon; a fifth,
a sixth, a seventh, and an eighth rank of memory chips each
including a plurality of memory chips and each being disposed on
said other circuit substrate; a third register and a fourth
register each disposed on said other circuit substrate, said third
register and said fourth register each comprising: a first input
for receiving .[.a.]. .Iadd.an associated .Iaddend.third chip
select signal having one of an active or an inactive level; a
second input for receiving .[.a.]. .Iadd.an associated
.Iaddend.fourth chip select signal having one of an active or an
inactive level; at least one third input for receiving
command/address signals; a first output coupled to transmit said
.Iadd.associated .Iaddend.third chip select signal to said memory
chips of said fifth rank .[.and.]. .Iadd.or .Iaddend.said seventh
rank.Iadd., said first output of said third register coupled to
transmit said associated third chip select signal to said memory
chips of said fifth rank and said first output of said fourth
register coupled to transmit said associated third chip select
signal to said memory chips of said seventh rank.Iaddend.; a second
output coupled to transmit said .Iadd.associated .Iaddend.fourth
chip select signal to said memory chips of said sixth rank
.[.and.]. .Iadd.or .Iaddend.said eighth rank.Iadd., said second
output of said third register coupled to transmit said associated
fourth chip select signal to said memory chips of said sixth rank
and said second output of said fourth register coupled to transmit
said associated second chip select signal to said memory chips of
said eighth rank.Iaddend.; and at least one third output, wherein
said socket of said circuit board and said plug of said other
circuit board are coupled and provide an electrical connection for
the transmission of said .Iadd.associated first .Iaddend.chip
select .[.signal.]. .Iadd.signals.Iaddend., said .[.other.].
.Iadd.associated second .Iaddend.chip select .[.signal.].
.Iadd.signals.Iaddend., said .Iadd.associated .Iaddend.third chip
select .[.signal.]. .Iadd.signals.Iaddend., said .Iadd.associated
.Iaddend.fourth chip select .[.signal.]. .Iadd.signals .Iaddend.and
said command/address .[.signal.]. .Iadd.signals .Iaddend.between
said circuit board and said other circuit board; said at least one
third output of said third register is coupled to transmit said
command/address signals, if at least one of said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said third register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said third register
is active, and to block said command/address signals, if both said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said third register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said third register are inactive; and said at least one third
output of said fourth register is coupled to transmit said
command/address signals, if at least one of said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said fourth register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said fourth register
is active, and to block said command/address signals, if both said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said fourth register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said fourth register are inactive.
8. The semiconductor memory module according to claim 7, wherein
said other circuit substrate has a first surface and a second
surface, wherein said third register, said memory chips of said
fifth rank and said memory chips of said sixth rank are disposed on
said first surface, and wherein said fourth register, said memory
chips of said seventh rank and said memory chips of said eighth
rank are disposed on said second surface.
9. The semiconductor memory module according to claim 7, wherein
each of said third register and said fourth register comprises a
fourth input for receiving a control signal having one of an active
and an inactive level; said at least one third output of said third
register coupled to transmit said command/address signals, if said
control signal is active and if at least one of said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said third register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said third register is active, and to block said command/address
signals, if said control signal is active and if both said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said third register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said third register are inactive; said at least one third output of
said third register coupled to transmit said command/address
signals, if said control signal is inactive; said at least one
third output of said fourth register coupled to transmit said
command/address signals, if said control signal is active and if at
least one of said .Iadd.associated .Iaddend.third chip select
signal received at said first input of said fourth register and
said .Iadd.associated .Iaddend.fourth chip select signal received
at said second input of said fourth register is active, and to
block said command/address signals, if said control signal is
active and if both said .Iadd.associated .Iaddend.third chip select
signal received at said first input of said fourth register and
said .Iadd.associated .Iaddend.fourth chip select signal received
at said second input of said fourth register are inactive; and said
at least one third output of said fourth register coupled to
transmit said command/address signals if said control signal is
inactive.
10. The semiconductor memory module according to claim 1, wherein
said memory chips comprise dynamic random access memory chips.
11. The semiconductor memory module according to claim 1, wherein
said memory chips comprise synchronous dynamic random access memory
chips.
12. The semiconductor memory module according to claim 1, wherein
said semiconductor memory module comprises a dual inline memory
module.
13. An electronic apparatus comprising: a controller device; a bus
system; at least one semiconductor memory module comprising: a
circuit substrate; a first, a second, a third and a fourth rank of
memory chips each rank including a plurality of memory chips and
each being disposed on said circuit substrate; a first register and
a second register each disposed on said circuit substrate, said
first register and said second register each comprising: a first
input coupled to said controller device for receiving .[.a.].
.Iadd.an associated first .Iaddend.chip select signal having one of
an active or an inactive level; a second input coupled to said
controller device for receiving .[.a other.]. .Iadd.an associated
second .Iaddend.chip select signal having one of an active or an
inactive level; at least one third input coupled to said controller
device via said bus system for receiving command/address signals; a
first output coupled to transmit said .Iadd.associated first
.Iaddend.chip select signal to said memory chips of said first rank
.[.and.]. .Iadd.or .Iaddend.said third rank.Iadd., said first
output of said first register coupled to transmit said associated
first chip select signal to said memory chips of said first rank
and said first output of said second register coupled to transmit
said associated first chip select signal to said memory chips of
said third rank.Iaddend.; a second output coupled to transmit said
.[.other.]. .Iadd.associated second .Iaddend.chip select signal to
said memory chips of said second rank .[.and.]. .Iadd.or
.Iaddend.said fourth rank.Iadd., said second output of said first
register coupled to transmit said associated second chip select
signal only to said memory chips of said second rank and said
second output of said second register coupled to transmit said
associated second chip select signal only to said memory chips of
said fourth rank.Iaddend.; .Iadd.and.Iaddend. at least one third
output .Iadd.for outputting command/address signals.Iaddend.,
wherein said at least one third output of said first register is
coupled to transmit said command/address signals to said memory
chips of said first rank and to said memory chips of said second
rank, if at least one of said .Iadd.associated first .Iaddend.chip
select signal received at said first input of said first register
and said .[.other.]. .Iadd.associated second .Iaddend.chip select
signal received at said second input of said first register is
active, and to block a transmission of said command/address signals
to said memory chips of said first rank and to said memory chips of
said second rank, if both said .Iadd.associated first .Iaddend.chip
select signal received at said first input of said first register
and said .[.other.]. .Iadd.associated second .Iaddend.chip select
signal received at said second input of said first register are
inactive; and said at least one third output of said second
register is coupled to transmit said command/address signals to
said memory chips of said third rank and to said memory chips of
said fourth rank, if at least one of said .Iadd.associated first
.Iaddend.chip select signal received at said first input of said
second register and said .[.other.]. .Iadd.associated second
.Iaddend.chip select signal received at said second input of said
second register is active, and to block a transmission of said
command/address signals to said memory chips of said third rank and
to said memory chips of said fourth rank, if both said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said second register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said second register are inactive.
14. The electronic apparatus according to claim 13, wherein said
circuit substrate has a first surface and a second surface, wherein
said first register and said memory chips of said first rank are
disposed on said first surface and said memory chips of said second
rank are stacked upon said memory chips of said first rank, and
wherein said second register and said memory chips of said third
rank are disposed on said second surface and said memory chips of
said fourth rank are stacked upon said memory chips of said third
rank.
15. The electronic apparatus according to claim 13, wherein said
circuit substrate comprises an edge connector having contacts for
transmitting electrical signals between said circuit substrate and
an external device.
16. The electronic apparatus according to claim 15, wherein ends of
said contacts are coupled via respective conductive lines disposed
on said circuit substrate to said first input, to said second input
and to said at least one third input of each of said first register
and said second register.
17. The electronic apparatus according to claim 16, wherein said
electrical signals comprise said .Iadd.associated first
.Iaddend.chip select signals, said .[.other.]. .Iadd.associated
second .Iaddend.chip select signals and said command/address
signals.
18. The electronic apparatus according to claim 13, wherein each of
said first register and said second register comprises a fourth
input for receiving a control signal having one of an active and an
inactive level; said at least one third output of said first
register coupled to transmit said command/address signals, if said
control signal is active and if at least one of said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said first register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said first register is active, and to block
said command/address signals, if said control signal is active and
if both said .Iadd.associated first .Iaddend.chip select signal
received at said first input of said first register and said
.[.other.]. .Iadd.associated second .Iaddend.chip select signal
received at said second input of said first register are inactive;
said at least one third output of said first register coupled to
transmit said command/address signals, if said control signal is
inactive; said at least one third output of said second register
coupled to transmit said command/address signals, if said control
signal is active and if at least one of said .Iadd.associated first
.Iaddend.chip select signal received at said first input of said
second register and said .[.other.]. .Iadd.associated second
.Iaddend.chip select signal received at said second input of said
second register is active, and to block said command/address
signals, if said control signal is active and if both said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said second register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said second register are inactive; and said at
least one third output of said second register coupled to transmit
said command/address signals if said control signal is
inactive.
19. The electronic apparatus according to claim 13, wherein said
semiconductor module has a socket disposed on said circuit
substrate, said semiconductor memory module further comprising:
another circuit substrate having a plug disposed thereon; a fifth,
a sixth, a seventh, and an eighth rank of memory chips each
including a plurality of memory chips and each being disposed on
said other circuit substrate; a third register and a fourth
register each disposed on said other circuit substrate, said third
register and said fourth register each comprising: a first input
coupled to said controller device for receiving .[.a.]. .Iadd.an
associated .Iaddend.third chip select signal having one of an
active or an inactive level; a second input coupled to said
controller device for receiving .[.a.]. .Iadd.an associated
.Iaddend.fourth chip select signal having one of an active or an
inactive level; at least one third input coupled to said controller
device via said bus system for receiving command/address signals; a
first output coupled to transmit said .Iadd.associated
.Iaddend.third chip select signal to said memory chips of said
fifth rank .[.and.]. .Iadd.or .Iaddend.said seventh rank.Iadd.,
said first output of said third register coupled to transmit said
associated third chip select signal only to said memory chips of
said fifth rank and said first output of said fourth register
coupled to transmit said associated third chip select signal only
to said memory chips of said seventh rank.Iaddend.; a second output
coupled to transmit said .Iadd.associated .Iaddend.fourth chip
select signal to said memory chips of said sixth rank .[.and.].
.Iadd.or .Iaddend.said eighth rank.Iadd., said second output of
said third register coupled to transmit said associated fourth chip
select signal only to said memory chips of said sixth rank and said
second output of said fourth register coupled to transmit said
associated second chip select signal only to said memory chips of
said eighth rank.Iaddend.; and at least one third output, wherein
said socket of said circuit board and said plug of said other
circuit board are coupled and provide an electrical connection for
the transmission of said .Iadd.associated first .Iaddend.chip
select .[.signal.]. .Iadd.signals.Iaddend., said .[.other.].
.Iadd.associated second .Iaddend.chip select .[.signal.].
.Iadd.signals.Iaddend., said .Iadd.associated .Iaddend.third chip
select .[.signal.]. .Iadd.signals.Iaddend., said .Iadd.associated
.Iaddend.fourth chip select .[.signal.]. .Iadd.signals .Iaddend.and
said command/address .[.signal.]. .Iadd.signals .Iaddend.between
said circuit board and said other circuit board; said at least one
third output of said third register is coupled to transmit said
command/address signals, if at least one of said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said third register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said third register
is active, and to block said command/address signals, if both said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said third register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said third register are inactive; and said at least one third
output of said fourth register is coupled to transmit said
command/address signals, if at least one of said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said fourth register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said fourth register
is active, and to block said command/address signals, if both said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said fourth register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said fourth register are inactive.
20. The electronic apparatus according to claim 19, wherein said
other circuit substrate has a first surface and a second surface,
wherein said third register, said memory chips of said fifth rank
and said memory chips of said sixth rank are disposed on said first
surface, and wherein said fourth register, said memory chips of
said seventh rank and said memory chips of said eighth rank are
disposed on said second surface.
21. The electronic apparatus according to claim 19, wherein each of
said third register and said fourth register comprises a fourth
input for receiving a control signal having one of an active and an
inactive level; said at least one third output of said third
register coupled to transmit said command/address signals, if said
control signal is active and if at least one of said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said third register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said third register is active, and to block said command/address
signals, if said control signal is active and if both said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said third register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said third register are inactive; said at least one third output of
said third register coupled to transmit said command/address
signals, if said control signal is inactive; said at least one
third output of said fourth register coupled to transmit said
command/address signals, if said control signal is active and if at
least one of said .Iadd.associated .Iaddend.third chip select
signal received at said first input of said fourth register and
said .Iadd.associated .Iaddend.fourth chip select signal received
at said second input of said fourth register is active, and to
block said command/address signals, if said control signal is
active and if both said .Iadd.associated .Iaddend.third chip select
signal received at said first input of said fourth register and
said .Iadd.associated .Iaddend.fourth chip select signal received
at said second input of said fourth register are inactive; and said
at least one third output of said fourth register coupled to
transmit said command/address signals if said control signal is
inactive.
22. The electronic apparatus according to claim 13, wherein said
memory chips comprise dynamic random access memory chips.
23. The electronic apparatus according to claim 13, wherein said
memory chips comprise synchronous dynamic random access memory
chips.
24. The electronic apparatus according to claim 13, wherein said
semiconductor memory module comprises a dual inline memory
module.
25. A method of operating a semiconductor memory module, said
method comprising: providing a semiconductor memory module
comprising: a circuit substrate; a first, a second, a third and a
fourth rank of memory chips each rank including a plurality of
memory chips and each being disposed on said circuit substrate; a
first register and a second register each disposed on said circuit
substrate, said first register and said second register each
comprising: a first input for receiving .[.a.]. .Iadd.an associated
first .Iaddend.chip select signal having one of an active or an
inactive level; a second input for receiving .[.a other.]. .Iadd.an
associated second .Iaddend.chip select signal having one of an
active or an inactive level; at least one third input for receiving
command/address signals; a first output coupled to transmit said
.Iadd.associated first .Iaddend.chip select signal to said memory
chips of said first rank .[.and.]. .Iadd.or .Iaddend.said third
rank.Iadd., said first output of said first register coupled to
transmit said associated first chip select signal only to said
memory chips of said first rank and said first output or said
second register coupled to transmit said associated first chip
select signal only to said memory chips of said third
rank.Iaddend.; a second output coupled to transmit said .[.other.].
.Iadd.associated second .Iaddend.chip select signal to said memory
chips of said second rank .[.and.]. .Iadd.or .Iaddend.said fourth
rank.Iadd., said second output of said first register coupled to
transmit said associated second chip select signal only to said
memory chips of said second rank and said second output of said
second register coupled to transmit said associated second chip
select signal only to said memory chips of said fourth
rank.Iaddend.; .Iadd.and.Iaddend. at least one third output
.Iadd.for outputting command/address signals.Iaddend.; determining
if one of said .Iadd.associated first .Iaddend.chip select signals
and one of said .[.other.]. .Iadd.associated second .Iaddend.chip
select signals is active; transmitting said command/address signals
to said memory chips of said first rank and to said memory chips of
said second rank via said at least one third output of said first
register if at least one of said .Iadd.associated first
.Iaddend.chip select signal received at said first input of said
first register and said .[.other.]. .Iadd.associated second
.Iaddend.chip select signal received at said second input of said
first register is active, and to block a transmission of said
command/address signals to said memory chips of said first rank and
to said memory chips of said second rank, if both said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said first register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said first register are inactive; and
transmitting said command/address signals via said at least one
third output of said second register to said memory chips of said
third rank and to said memory chips of said fourth rank, if at
least one of said .Iadd.associated first .Iaddend.chip select
signal received at said first input of said second register and
said .[.other.]. .Iadd.associated second .Iaddend.chip select
signal received at said second input of said second register is
active, and to block a transmission of said command/address signals
to said memory chips of said third rank and to said memory chips of
said fourth rank, if both said .Iadd.associated first .Iaddend.chip
select signal received at said first input of said second register
and said .[.other.]. .Iadd.associated second .Iaddend.chip select
signal received at said second input of said second register are
inactive.
26. The method according to claim 25, wherein said circuit
substrate has a first surface and a second surface, wherein said
first register and said memory chips of said first rank are
disposed on said first surface and said memory chips of said second
rank are stacked upon said memory chips of said first rank, and
wherein said second register and said memory chips of said third
rank are disposed on said second surface and said memory chips of
said fourth rank are stacked upon said memory chips of said third
rank.
27. The method according to claim 25, wherein said circuit
substrate comprises an edge connector having contacts for
transmitting electrical signals between said circuit substrate and
an external device.
28. The method according to claim 27, wherein ends of said contacts
are coupled via respective conductive lines disposed on said
circuit substrate to said first input, to said second input and to
said at least one third input of each of said first register and
said second register.
29. The method according to claim 28, wherein said electrical
signals comprise said chip select signals, said other chip select
signals and said command/address signals.
30. The method according to claim 25, wherein each of said first
register and said second register comprises a fourth input for
receiving a control signal having one of an active and an inactive
level; said at least one third output of said first register
coupled to transmit said command/address signals, if said control
signal is active and if at least one of said .Iadd.associated first
.Iaddend.chip select signal received at said first input of said
first register and said .[.other.]. .Iadd.associated second
.Iaddend.chip select signal received at said second input of said
first register is active, and to block said command/address
signals, if said control signal is active and if both said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said first register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said first register are inactive; said at
least one third output of said first register coupled to transmit
said command/address signals, if said control signal is inactive;
said at least one third output of said second register coupled to
transmit said command/address signals, if said control signal is
active and if at least one of said .Iadd.associated first
.Iaddend.chip select signal received at said first input of said
second register and said .[.other.]. .Iadd.associated second
.Iaddend.chip select signal received at said second input of said
second register is active, and to block said command/address
signals, if said control signal is active and if both said
.Iadd.associated first .Iaddend.chip select signal received at said
first input of said second register and said .[.other.].
.Iadd.associated second .Iaddend.chip select signal received at
said second input of said second register are inactive; and said at
least one third output of said second register coupled to transmit
said command/address signals if said control signal is
inactive.
31. The method according to claim 25, wherein said semiconductor
module has a socket disposed on said circuit substrate, said
semiconductor memory module further comprising: another circuit
substrate having a plug disposed thereon; a fifth, a sixth, a
seventh, and an eighth rank of memory chips each including a
plurality of memory chips and each being disposed on said other
circuit substrate; a third register and a fourth register each
disposed on said other circuit substrate, said third register and
said fourth register each comprising: a first input for receiving
.[.a.]. .Iadd.an associated .Iaddend.third chip select signal
having one of an active or an inactive level; a second input for
receiving .[.a.]. .Iadd.an associated .Iaddend.fourth chip select
signal having one of an active or an inactive level; at least one
third input for receiving command/address signals; a first output
coupled to transmit said .Iadd.associated .Iaddend.third chip
select signal to said memory chips of said fifth rank .[.and.].
.Iadd.or .Iaddend.said seventh rank.Iadd., said first output of
said third register coupled to transmit said associated third chip
select signal only to said memory chips of said fifth rank and said
first output of said fourth register coupled to transmit said
associated third chip select signal only to said memory chips of
said seventh rank.Iaddend.; a second output coupled to transmit
said .Iadd.associated .Iaddend.fourth chip select signal to said
memory chips of said sixth rank .[.and.]. .Iadd.or .Iaddend.said
eighth rank.Iadd., said second output of said third register
coupled to transmit said associated fourth chip select signal only
to said memory chips of said sixth rank and said second output of
said fourth register coupled to transmit said associated second
chip select signal only to said memory chips of said eighth
rank.Iaddend.; and at least one third output, wherein said socket
of said circuit board and said plug of said other circuit board are
coupled and provide an electrical connection for the transmission
of said .Iadd.associated first .Iaddend.chip select .[.signal.].
.Iadd.signals.Iaddend., said .[.other.]. .Iadd.associated second
.Iaddend.chip select .[.signal.]. .Iadd.signals.Iaddend., said
.Iadd.associated .Iaddend.third chip select .[.signal.].
.Iadd.signals.Iaddend., said .Iadd.associated .Iaddend.fourth chip
select .[.signal.]. .Iadd.signals .Iaddend.and said command/address
.[.signal.]. .Iadd.signals .Iaddend.between said circuit board and
said other circuit board; said at least one third output of said
third register is coupled to transmit said command/address signals,
if at least one of said .Iadd.associated .Iaddend.third chip select
signal received at said first input of said third register and said
.Iadd.associated .Iaddend.fourth chip select signal received at
said second input of said third register is active, and to block
said command/address signals, if both said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said third register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said third register
are inactive; and said at least one third output of said fourth
register is coupled to transmit said command/address signals, if at
least one of said .Iadd.associated .Iaddend.third chip select
signal received at said first input of said fourth register and
said .Iadd.associated .Iaddend.fourth chip select signal received
at said second input of said fourth register is active, and to
block said command/address signals, if both said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said fourth register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said fourth register
are inactive.
32. The method according to claim 31, wherein said other circuit
substrate has a first surface and a second surface, wherein said
third register, said memory chips of said fifth rank and said
memory chips of said sixth rank are disposed on said first surface,
and wherein said fourth register, said memory chips of said seventh
rank and said memory chips of said eighth rank are disposed on said
second surface.
33. The method according to claim 31, wherein each of said third
register and said fourth register comprises a fourth input for
receiving a control signal having one of an active and an inactive
level; said at least one third output of said third register
coupled to transmit said command/address signals, if said control
signal is active and if at least one of said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said third register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said third register
is active, and to block said command/address signals, if said
control signal is active and if both said .Iadd.associated
.Iaddend.third chip select signal received at said first input of
said third register and said .Iadd.associated .Iaddend.fourth chip
select signal received at said second input of said third register
are inactive; said at least one third output of said third register
coupled to transmit said command/address signals, if said control
signal is inactive; said at least one third output of said fourth
register coupled to transmit said command/address signals, if said
control signal is active and if at least one of said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said fourth register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said fourth register is active, and to block said command/address
signals, if said control signal is active and if both said
.Iadd.associated .Iaddend.third chip select signal received at said
first input of said fourth register and said .Iadd.associated
.Iaddend.fourth chip select signal received at said second input of
said fourth register are inactive; and said at least one third
output of said fourth register coupled to transmit said
command/address signals if said control signal is inactive.
34. The method according to claim 25, wherein said memory chips
comprise dynamic random access memory chips.
35. The method according to claim 25, wherein said memory chips
comprise synchronous dynamic random access memory chips.
36. The method according to claim 25, wherein said semiconductor
memory module comprises a dual inline memory module.
.Iadd.37. A semiconductor memory module comprising: a circuit
substrate; a first, a second, a third and a fourth rank of memory
chips each rank including a plurality of memory chips and each
being disposed on said circuit substrate; a first register disposed
on said circuit substrate, said first register comprising: a first
input for receiving an associated first chip select signal having
one of an active or an inactive level; a second input for receiving
an associated second chip select signal having one of an active or
an inactive level; at least one third input for receiving
command/address signals; a first output coupled to transmit said
associated first chip select signal to said memory chips of said
first rank; a second output coupled to transmit said associated
second chip select signal to said memory chips of said second rank;
and at least one third output for outputting command/address
signals coupled to transmit said command/address signals to said
memory chips of said first rank and to said memory chips of said
second rank, if at least one signal of a group of signals
consisting of (1) said associated first chip select signal received
at said first input of said first register and (2) said associated
second chip select signal received at said second input of said
first register is active, and to block a transmission of said
command/address signals to said memory chips of said first rank and
to said memory chips of said second rank, if both said associated
first chip select signal received at said first input of said first
register and said associated second chip select signal received at
said second input of said first register are inactive; and a second
register disposed on said circuit substrate, said second register
comprising: a first input for receiving an associated first chip
select signal having one of an active or an inactive level; a
second input for receiving an associated second chip select signal
having one of an active or an inactive level; at least one third
input for receiving command/address signals; a first output coupled
to transmit said associated first chip select signal to said memory
chips of said third rank; a second output coupled to transmit said
associated second chip select signal to said memory chips of said
fourth rank; and at least one third output coupled to transmit said
command/address signals to said memory chips of said third rank and
to said memory chips of said fourth rank, if at least one signal of
a group of signals consisting of (1) said associated first chip
select signal received at said first input of said second register
and (2) said associated second chip select signal received at said
second input of said second register is active, and to block a
transmission of said command/address signals to said memory chips
of said third rank and to said memory chips of said fourth rank, if
both said associated first chip select signal received at said
first input of said second register and said associated second chip
select signal received at said second input of said second register
are inactive..Iaddend.
.Iadd.38. The semiconductor memory module according to claim 37,
wherein said circuit substrate has a first surface and a second
surface, wherein said first register and said memory chips of said
first rank are disposed on said first surface and said memory chips
of said second rank are stacked upon said memory chips of said
first rank, and wherein said second register and said memory chips
of said third rank are disposed on said second surface and said
memory chips of said fourth rank are stacked upon said memory chips
of said third rank..Iaddend.
.Iadd.39. The semiconductor memory module according to claim 37,
wherein said circuit substrate comprises an edge connector having
contacts for transmitting electrical signals between said circuit
substrate and an external device..Iaddend.
.Iadd.40. The semiconductor memory module according to claim 39,
wherein ends of said contacts are coupled via respective conductive
lines disposed on said circuit substrate to said first input, to
said second input and to said at least one third input of each of
said first register and said second register..Iaddend.
.Iadd.41. The semiconductor memory module according to claim 40,
wherein said electrical signals comprise said associated first chip
select signals, said associated second chip select signals and said
command/address signals..Iaddend.
.Iadd.42. The semiconductor memory module according to claim 37,
wherein said first register and said second register each further
comprises a fourth input for receiving a control signal having one
of an active and an inactive level; wherein, when said control
signal is active, said first register couples said at least one
third output of said first register to transmit said
command/address signals to said first and second rank of memory
chips when at least one signal of a group of signals consisting of
(1) said associated first chip select signal received at said first
input of said first register and (2) said associated second chip
select signal received at said second input of said first register
is active and blocks said command/address signals from being
transmitted to said first and second rank of memory chips when both
said associated first chip select signal received at said first
input of said first register and said associated second chip select
signal received at said second input of said first register are
inactive, and, when said control signal is inactive, said first
register couples said at least one third output of said first
register to transmit said command/address signals to said first and
second rank of memory chips; and wherein, when said control signal
is active, said second register couples said at least one third
output of said second register to transmit said command/address
signals to said third and fourth rank of memory chips when at least
one signal of a group of signals consisting of (1) said associated
first chip select signal received at said first input of said
second register and (2) said associated second chip select signal
received at said second input of said second register is active and
blocks said command/address signals from being transmitted to said
third and fourth rank of memory chips when both said associated
first chip select signal received at said first input of said
second register and said associated second chip select signal
received at said second input of said second register are inactive,
and, when said control signal is inactive, said second register
couples said at least one third output of said second register to
transmit said command/address signals to said third and fourth rank
of memory chips..Iaddend.
.Iadd.43. The semiconductor memory module according to claim 37,
wherein said semiconductor module has a socket disposed on said
circuit substrate, said semiconductor memory module further
comprising: another circuit substrate having a plug disposed
thereon; a fifth, a sixth, a seventh, and an eighth rank of memory
chips each including a plurality of memory chips and each being
disposed on said other circuit substrate; a third register disposed
on said other circuit substrate comprising: a first input for
receiving an associated third chip select signal having one of an
active or an inactive level; a second input for receiving an
associated fourth chip select signal having one of an active or an
inactive level; at least one third input for receiving
command/address signals; a first output coupled to transmit said
associated third chip select signal to said memory chips of said
fifth rank; a second output coupled to transmit said associated
fourth chip select signal to said memory chips of said sixth rank;
and at least one third output coupled to transmit said
command/address signals to said fifth and sixth rank of memory
chips, if at least one signal of a group of signals consisting of
(1) said associated third chip select signal received at said first
input of said third register and (2) said associated fourth chip
select signal received at said second input of said third register
is active and to block said command/address signals from being
transmitted to said fifth and sixth rank of memory chips, if both
said associated third chip select signal received at said first
input of said third register and said associated fourth chip select
signal received at said second input of said third register are
inactive; and a fourth register disposed on said other circuit
substrate comprising: a first input for receiving an associated
third chip select signal having one of an active or an inactive
level; a second input for receiving an associated fourth chip
select signal having one of an active or an inactive level; at
least one third input for receiving command/address signals; a
first output coupled to transmit said associated third chip select
signal to said memory chips of said fifth rank and said seventh
rank; a second output coupled to transmit said associated fourth
chip select signal to said memory chips of said sixth rank and said
eighth rank; and at least one third output coupled to transmit said
command/address signals to said seventh and eighth rank of memory
chips, if at least one signal of a group of signals consisting of
(1) said associated third chip select signal received at said first
input of said fourth register and (2) said associated fourth chip
select signal received at said second input of said fourth register
is active and to block said command/address signals from being
transmitted to said seventh and eighth rank of memory chips, if
both said associated third chip select signal received at said
first input of said fourth register and said associated fourth chip
select signal received at said second input of said fourth register
are inactive; wherein said socket of said circuit board and said
plug of said other circuit board are coupled and provide an
electrical connection for the transmission of said associated first
chip select signals, said associated second chip select
signals..Iaddend.
.Iadd.44. The semiconductor memory module according to claim 43,
wherein said other circuit substrate has a first surface and a
second surface, wherein said third register, said memory chips of
said fifth rank and said memory chips of said sixth rank are
disposed on said first surface, and wherein said fourth register,
said memory chips of said seventh rank and said memory chips of
said eighth rank are disposed on said second surface..Iaddend.
.Iadd.45. The semiconductor memory module according to claim 43,
wherein said third register and said fourth register each comprises
a fourth input for receiving a control signal having one of an
active and an inactive level; wherein, when said control signal is
active, said third register couples said at least one third output
of said third register to transmit said command/address signals to
said fifth and sixth rank of memory chips when at least one signal
of a group of signals consisting of (1) said associated first chip
select signal received at said first input of said third register
and (2) said associated second chip select signal received at said
second input of said third register is active and blocks said
command/address signals from being transmitted to said fifth and
sixth rank of memory chips when both said associated first chip
select signal received at said first input of said third register
and said associated second chip select signal received at said
second input of said third register are inactive, and, when said
control signal is inactive, said third register couples said at
least one third output of said third register to transmit said
command/address signals to said fifth and sixth rank of memory
chips; and wherein, when said control signal is active, said fourth
register couples said at least one third output of said fourth
register to transmit said command/address signals to said seventh
and eighth rank of memory chips when at least one signal of a group
of signals consisting of (1) said associated first chip select
signal received at said first input of said fourth register and (2)
said associated second chip select signal received at said second
input of said fourth register is active and blocks said
command/address signals from being transmitted to said seventh and
eighth rank of memory chips when both said associated first chip
select signal received at said first input of said fourth register
and said associated second chip select signal received at said
second input of said fourth register are inactive, and, when said
control signal is inactive, said fourth register couples said at
least one third output of said fourth register to transmit said
command/address signals to said seventh and eighth rank of memory
chips..Iaddend.
.Iadd.46. The semiconductor memory module according to claim 37,
wherein said memory chips comprise dynamic random access memory
chips..Iaddend.
.Iadd.47. The semiconductor memory module according to claim 37,
wherein said memory chips comprise synchronous dynamic random
access memory chips..Iaddend.
.Iadd.48. The semiconductor memory module according to claim 37,
wherein said semiconductor memory module comprises a dual inline
memory module..Iaddend.
Description
TECHNICAL FIELD
The present invention relates to semiconductor memory modules and
electronic apparatuses comprising a semiconductor memory module and
more specifically to semiconductor memory modules consuming low
power.
BACKGROUND
Computer systems typically have a processing unit and a memory
system connected to it for storing data. The memory system includes
a memory controller and one or more semiconductor memory modules.
The processing unit is connected to the memory controller via a bus
system and the memory controller is coupled to the semiconductor
memory modules via a memory bus system. Each of the semiconductor
memory modules comprises at least one register and a number of
ranks of memory chips coupled to the register. The registers
transmit command/address signals and chip select signals received
from the memory controller to the ranks of memory chips. For
selecting a specific rank of memory chips for a memory access,
respective chip select signals are used to activate the respective
rank. Typically, command/address inputs of memory chips of several
ranks are coupled in parallel to one output of a single register.
The register transmits command/address signals to the respective
ranks of memory chips if at least one of the respective chip select
signals is active. Therefore, command/address signals are
transmitted unnecessarily to ranks of memory chips coupled to the
register but not being addressed by a memory access.
Due to the capacitance of the memory chips and the lines coupling
the memory chips with the register, power is consumed by the
semiconductor memory module each time data signals are transmitted.
Therefore, power is wasted during each memory access when
transmitting command/address signals to a number of ranks of memory
chips that are not addressed.
In addition, due to the increasing operating speed of the
semiconductor memory modules, the power consumption further
increases.
What is desired is a semiconductor memory module and an electronic
apparatus comprising a memory module that consumes low power and a
method of operating thereof.
SUMMARY OF THE INVENTION
One embodiment of the present invention provides a semiconductor
memory module that includes a circuit substrate, a first, a second,
a third and a fourth rank of memory chips each including a
multiplicity of memory chips and each being disposed on the circuit
substrate. The semiconductor memory module further includes a first
register and a second register each disposed on the circuit
substrate, wherein the first register and the second register each
comprise a first input for receiving a respective chip select
signal having one of an active and an inactive level, a second
input for receiving a respective other chip select signal having
one of an active and an inactive level, at least one third input
for receiving command/address signals, a first output for
transmitting the respective chip select signal to the memory chips
of the first rank and the third rank, respectively, a second output
for transmitting the respective other chip select signal to the
memory chips of the second rank and the fourth rank, respectively,
and at least one third output.
The at least one third output of the first register transmits the
command/address signals to the memory chips of the first rank and
to the memory chips of the second rank, if at least one of the chip
select signal received at the first input of the first register and
the other chip select signal received at the second input of the
first register is active, and blocks a transmission/switching of
the command/address signals to the memory chips of the first rank
and to the memory chips of the second rank, if both the chip select
signal received at the first input of the first register and the
other chip select signal received at the second input of the first
register are inactive.
The at least one third output of the second register transmits the
command/address signals to the memory chips of the third rank and
to the memory chips of the fourth rank, if at least one of the chip
select signal received at the first input of the second register
and the other chip select signal received at the second input of
the second register is active, and blocks a transmission/switching
of the command/address signals to the memory chips of the third
rank and to the memory chips of the fourth rank, if both the chip
select signal received at the first input of the second register
and the other chip select signal received at the second input of
the second register are inactive.
Another aspect of the present invention provides an electronic
apparatus including a controller device, a bus system and at least
one semiconductor memory module. The semiconductor memory module
includes a circuit substrate, a first, a second, a third and a
fourth rank of memory chips each including a multiplicity of memory
chips and each being disposed on the circuit substrate. The
semiconductor memory module further includes a first register and a
second register each disposed on the circuit substrate, wherein the
first register and the second register each include a first input
coupled to the controller device for receiving a respective chip
select signal having one of an active and an inactive level, a
second input coupled to the controller device for receiving a
respective other chip select signal having one of an active and an
inactive level, at least one third input coupled to the controller
device via the bus system for receiving command/address signals, a
first output for transmitting the respective chip select signal to
the memory chips of the first rank and the third rank,
respectively, a second output for transmitting the respective other
chip select signal to the memory chips of the second rank and the
fourth rank, respectively, and at least one third output.
The at least one third output of the first register transmits the
command/address signals to the memory chips of the first rank and
to the memory chips of the second rank, if at least one of the chip
select signal received at the first input of the first register and
the other chip select signal received at the second input of the
first register is active, and blocks a transmission/switching of
the command/address signals to the memory chips of the first rank
and to the memory chips of the second rank, if both the chip select
signal received at the first input of the first register and the
other chip select signal received at the second input of the first
register are inactive.
The at least one third output of the second register transmits the
command/address signals to the memory chips of the third rank and
to the memory chips of the fourth rank, if at least one of the chip
select signal received at the first input of the second register
and the other chip select signal received at the second input of
the second register is active, and blocks a transmission/switching
of the command/address signals to the memory chips of the third
rank and to the memory chips of the fourth rank, if both the chip
select signal received at the first input of the second register
and the other chip select signal received at the second input of
the second register are inactive.
Another aspect of the present invention provides a method of
operating a semiconductor memory module. The method includes
providing a semiconductor memory module, wherein the semiconductor
memory module includes a circuit substrate, a first, a second, a
third and a fourth rank of memory chips, each including a
multiplicity of memory chips and each being disposed on the circuit
substrate. The semiconductor memory module further includes a first
register and a second register each disposed on the circuit
substrate, wherein the first register and the second register each
include a first input for receiving a respective chip select signal
having one of an active and an inactive level, a second input for
receiving a respective other chip select signal having one of an
active and an inactive level, at least one third input for
receiving command/address signals, a first output for transmitting
the respective chip select signal to the memory chips of the first
rank and the third rank, respectively, a second output for
transmitting the respective other chip select signal to the memory
chips of the second rank and the fourth rank, respectively, and at
least one third output.
The method further includes determining, if of one of the
respective chip select signals and one of the respective other chip
select signals is active, transmitting/switching the
command/address signals to the memory chips of the first rank and
to the memory chips of the second rank via the at least one third
output of the first register, if at least one of the chip select
signal received at the first input of the first register and the
other chip select signal received at the second input of the first
register is active, and blocking a transmission/switching of the
command/address signals to the memory chips of the first rank and
to the memory chips of the second rank, if both the chip select
signal received at the first input of the first register and the
other chip select signal received at the second input of the first
register are inactive.
The method further includes transmitting/switching the
command/address signals via the at least one third output of the
second register to the memory chips of the third rank and to the
memory chips of the fourth rank, if at least one of the chip select
signal received at the first input of the second register and the
other chip select signal received at the second input of the second
register is active, and blocking a transmission/switching of the
command/address signals to the memory chips of the third rank and
to the memory chips of the fourth rank, if both the chip select
signal received at the first input of the second register and the
other chip select signal received at the second input of the second
register are inactive.
BRIEF DESCRIPTION OF THE DRAWINGS
For a more complete understanding of the present invention, and the
advantages thereof, reference is now made to the following
descriptions taken in conjunction with the accompanying drawing, in
which:
FIG. 1 depicts schematically a semiconductor memory module
according to one embodiment of the present invention;
FIG. 2 depicts a plan view of the semiconductor memory module as
depicted in FIG. 1;
FIG. 3 depicts schematically an electronic apparatus according to
one embodiment of the present invention;
FIG. 4 depicts schematically an electronic apparatus according to
one embodiment of the present invention; and
FIG. 5 depicts schematically a cross-sectional view of the
semiconductor memory module of the electronic apparatus depicted in
FIG. 4.
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
FIG. 1 depicts schematically a semiconductor memory module 1
according to one embodiment of the present invention. The
semiconductor memory module 1 comprises a circuit substrate 2
having a first surface S1 and a second surface S2. The circuit
substrate 2 is preferably a circuit board, e.g., a printed circuit
board with conductive lines disposed thereon.
A first register 10, a first rank 100 and a second rank 200 of
memory chips 3 are disposed on the first surface S1. In FIG. 1,
each of the first rank 100 and the second rank 200 of memory chips
3 includes nine memory chips 3. However, the first rank 100 and the
second rank 200 may each include eighteen memory chips 3. Each of
the first 100 and second 200 ranks of memory chips 3 comprises a
multiplicity of memory chips 3. In this embodiment, the memory
chips 3 are stacked upon each other and more specifically, the
memory chips 3 of the second rank 200 are stacked upon memory chips
3 of the first rank 100. However, memory chips 3 of the first rank
100 and of the second rank 200 may be arranged in a single layer on
the first surface S1 of the circuit substrate 2.
The first register 10 has a first input 11 for receiving a chip
select signal CS0, a second input 12 for receiving a chip select
signal CS1, at least one third input 13 for receiving
command/address signals CA and a fourth input 17 for receiving a
control signal CS GATE EN. The command/address signals CA may be
transmitted by a bus system 60. Furthermore, the first register has
a first output 14, a second output 15 and at least one third output
16. Chip select inputs 101 of memory chips 3 of the first rank 100
are coupled in parallel to the first output 14 of the first
register 10 for transmitting the chip select signal CS0 from the
first register 10 to the memory chips 3 of the first rank 100. Chip
select inputs 201 of the memory chips 3 of the second rank 200 are
coupled in parallel to the second output 15 of the first register
10 for transmitting the chip select signal CS1 from the first
register 10 to the memory chips 3 of the second rank 200.
Command/address inputs 102, 202 of the memory chips 3 of the first
rank 100 and of the second rank 200 are coupled in parallel to the
at least one third output 16 of the first register 10 for
transmitting/switching command/address signals CA from the first
register 10 to the memory chips 3 of the first rank 100 and of the
second rank 200. In FIG. 1, a connection between the at least one
third output 16 of the first register 10 with the memory chips 3 of
the first rank 100 and with the memory chips 3 of the second rank
200 is illustrated by a single line for reasons of better
clearness. However, the connection may be provided by a bus
system.
A second register 20, a third rank 300 and a fourth rank 400 of
memory chips 3 are disposed on the second surface S2. In FIG. 1,
each of the third rank 300 and the fourth rank 400 of memory chips
3 includes nine memory chips 3. However, the third rank 300 and the
fourth rank 400 may each include eighteen memory chips 3. Each of
the third 300 and fourth 400 ranks of memory chips 3 includes a
multiplicity of memory chips 3. In this embodiment, the memory
chips 3 are stacked upon each other and more specifically, the
memory chips 3 of the fourth rank 400 are stacked upon memory chips
3 of the third rank 300. However, memory chips 3 of the third rank
300 and of the fourth rank 400 may be arranged in a single layer on
the second surface S2 of the circuit substrate 2.
The second register 20 has a first input 21 for receiving a chip
select signal CS2, a second input 22 for receiving a chip select
signal CS3, at least one third input 23 for receiving
command/address signals CA and a fourth input 27 for receiving a
control signal CS GATE EN. Furthermore, the second register 20 has
a first output 24, a second output 25 and at least one third output
26. Chip select inputs 301 of memory chips 3 of the third rank 300
are coupled in parallel to the first output 24 of the second
register 20 for transmitting the chip select signal CS2 from the
second register 20 to the memory chips 3 of the third rank 300.
Chip select inputs 401 of memory chips 3 of the fourth rank 400 are
coupled in parallel to the second output 25 of the second register
20 for transmitting the chip select signal CS3 from the second
register 20 to the memory chips 3 of the fourth rank 400.
Command/address inputs 302, 402 of the memory chips 3 of the third
rank 300 and of the fourth rank 400 are coupled in parallel to the
at least one third output 26 of the second register for
transmitting/switching command/address signals to the memory chips
3 of the third rank 300 and of the fourth rank 400. In FIG. 1, a
connection between the at least one third output 26 of the second
register 20 with the memory chips 3 of the third rank 300 and with
the memory chips 3 of the fourth rank 400 is illustrated by a
single line for reasons of better clearness. However, the
connection may be provided by a bus system.
Preferably memory chips 3 are DRAM memory chips providing a dynamic
random access. However, other memory chips such as SDRAM memory
chips may be used.
A memory chip can be activated by applying an active chip select
signal to the chip select input of the memory chip. To activate the
memory chip, a value of 0 is sent to the chip select input of the
memory chips. If a value of 1 is applied to the chip select input
of the memory chip, the memory chip is inactive. The use of chip
select signals allows selecting specific chips/ranks during a
memory access for reading data from the memory chip or writing data
to the memory chip.
The control signal CS GATE EN is coupled to the fourth input 17 of
the first register 10 and to the fourth input 27 of the second
register 20 in parallel and may be provided by a motherboard of a
computer.
The control signal CS GATE EN has one of an active and an inactive
level. The semiconductor memory module can be operated in a first
mode relating to this signal being inactive and in a second mode
relating to the control signal being active.
In the first mode of operation, an inactive level of the control
signal CS GATE EN is applied to the fourth input 17 of the first
register 10 and to the fourth input 27 of the second register 20.
The command/address signals CA applied to the at least one third
input 13 of the first register 10 are transmitted via the at least
one third output 16 of the first register 10 to the memory chips 3
of the first rank 100 and of the second rank 200, and the
command/address signals CA applied to the at least one third input
23 of the second register 20 are transmitted via the at least one
third output 26 of the second register 20 to the memory chips 3 of
the third rank 300 and of the fourth rank 400.
In the second mode of operation, an active level of the control
signal CS GATE EN is applied to the fourth input 17 of the first
register 10. The transmission of command/address signals CA applied
to the at least one third input 13 to memory chips 3 via the at
least one third output 16 is dependent on the level of the chip
select signals CS0 and CS1. If at least one of the chip select
signals CS0 and CS1 is active, then the command/address signals CA
are transmitted via the at least one third output 16 to the memory
chips 3 of the first rank 100 and of the second rank 200. If both
chip select signals CS0 and CS1 are inactive, then the transmission
of the command/address signals CA via the at least one third output
16 to the memory chips 3 of the first rank 100 and of the second
rank 200 is blocked.
Furthermore, in the second mode of operation, an active level of
the control signal CS GATE EN is applied to the fourth input 27 of
the second register 20. The transmission of command/address signals
CA applied to the at least one third input 23 to memory chips 3 via
the at least one third output 26 is dependent on the level of the
chip select signals CS2 and CS3. If at least one of the chip select
signals CS2 and CS3 is active, then the command/address signals CA
are transmitted via the at least one third output 26 to the memory
chips 3 of the third rank 300 and of the fourth rank 400. If both
chip select signals CS2 and CS3 are inactive, then the transmission
of the command/address signals CA via the at least one third output
26 to the memory chips 3 of the third rank 300 and of the fourth
rank 400 is blocked.
Accordingly, in the second mode of operation, the respective at
least one third output 16, 26 of each of the first 10 and second 20
registers drives the command/address signals CA only when the
register 10, 20 receives a chip select signal that refers to a rank
that is connected to the respective register 10, 20. Therefore, the
power consumed during a memory access in which only ranks connected
to a single register are addressed, is reduced. This reduction of
power consumption also reduces the heat generated in the
semiconductor memory module 1 and, therefore, less cooling, e.g.,
provided by an air flow, of the semiconductor memory module is
required. This advantageously reduces the cost of the semiconductor
memory module and the maintenance costs.
FIG. 2 depicts a plan view of the semiconductor memory module 1 as
depicted in FIG. 1. Memory chips 3 are mounted on a first surface
S1 of a circuit substrate 2. In this embodiment, memory chips 3 are
labeled U1 to U36. Memory chips U1 to U36 are arranged in two
levels. Memory chips U1 to U18 are mounted on the circuit substrate
2 and memory chips U19 to U36 are stacked upon memory chips U1 to
U18. By stacking the memory chips upon another, the density of
memory chips on the circuit substrate 2 is increased. Memory chips
U1 to U36 are grouped in ranks of memory chips. In this embodiment
a first rank 100 comprises memory chips U1 to U18 and a second rank
200 of memory chips comprises memory chips U19 to U36. However,
other compositions of the first 100 and second ranks 200 are
possible. It is also possible that U1 to U36 are thirty-six stacked
chips, wherein U1 to U18 are placed on the first surface S1 of the
circuit substrate 2 and U19 to U36 are placed on a second surface
(not shown in FIG. 2) of the circuit substrate 2.
An edge connector 8 having pins 9 is disposed at a long end of the
circuit substrate 2. The edge connector 8 provides a connection
between the semiconductor memory module 1 and an external device
such as a controller device by, for example, a bus system. One end
of each of the pins 9 is coupled to register 10 by conductive lines
(not shown) disposed on the circuit substrate 2 for the
transmission of electrical signals. Another end of each of the pins
9 provides a connection to a socket of an external device.
FIG. 3 depicts schematically an electronic apparatus according to
one embodiment of the present invention. The electronic apparatus
includes a first semiconductor memory module 1, a second
semiconductor memory module 1', a controller device 50 and a bus
system 60.
First 1 and second 1' semiconductor memory modules are coupled to
the controller device 50 via the bus system 60 for the transmission
of electrical signals, e.g., command/address signals CA. First 1
and second 1' semiconductor memory modules preferably include a
connector such as an edge connector (not shown in FIG. 3) for
connecting to bus system 60. Typically, the bus system 60 comprises
sockets (not shown in FIG. 3) in which first 1 and second 1'
semiconductor memory modules are plugged in. The bus system 60 may
include a multiplicity of sockets for connecting a multiplicity of
semiconductor memory modules to the controller device 50. A bus
termination 61 disposed at the end of the bus system 60 terminates
the bus system 60.
Each of the first 1 and second 1' semiconductor memory modules
includes a first register 10, 30, a second register 20, 40, a first
100, 500, a second 200, 600, a third 300, 700 and a fourth rank
400, 800 of memory chips (not shown in FIG. 3).
Each of the first 10, 30 and second 20, 40 registers of the first 1
and second 1' semiconductor memory modules have a first input 11,
21, 31, 41 coupled to the controller circuit 50 for receiving a
respective chip select signal CS0, CS2, CS4, CS6, a second input
12, 22, 32, 42 coupled to the controller circuit 50 for receiving a
respective other chip select signal CS1, CS3, CS5, CS7 and at least
one third input 13, 23, 33, 43 coupled to the controller circuit 50
for receiving command/address signals CA.
Each of the first 10, 30 and second 20, 40 registers of the first 1
and second 1' semiconductor memory modules have a respective fourth
input 17, 27, 37, 47 for receiving a control signal CS GATE EN. The
control signal CS GATE EN is coupled to the fourth inputs 17, 27,
37, 47 in parallel and may be provided by a motherboard of a
computer or may be wired on the semiconductor memory module 1
itself.
Furthermore, each of the first 10, 30 and second 20, 40 registers
of the first 1 and second 1' semiconductor memory modules have a
first output 14, 24, 34, 44, a second output 15, 25, 35, 45 and at
least one third output 16, 26, 36, 46.
Chip select inputs of memory chips (not shown in FIG. 3) of the
first rank 100 of the first semiconductor memory module 1 are
coupled to the first output 14 of the first register 10 of the
first semiconductor memory module 1 for the transmission of the
chip select signal CS0 to the memory chips (not shown in FIG. 3) of
the first rank 100 of the first semiconductor memory module 1.
Chip select inputs of memory chips (not shown in FIG. 3) of the
second rank 200 of the first semiconductor memory module 1 are
coupled to the second output 15 of the first register 10 of the
first semiconductor memory module 1 for the transmission of the
chip select signal CS1 to the memory chips (not shown in FIG. 3) of
the second rank 200 of the first semiconductor memory module 1.
Chip select inputs of memory chips (not shown in FIG. 3) of the
third rank 300 of the first semiconductor memory module 1 are
coupled to the first output 24 of the second register 20 of the
first semiconductor memory module 1 for the transmission of the
chip select signal CS2 to memory chips (not shown in FIG. 3) of the
third rank 300 of semiconductor the first memory module 1.
Chip select inputs of memory chips (not shown in FIG. 3) of the
fourth rank 400 of the first semiconductor memory module 1 are
coupled to the second output 25 of the second register 20 of the
first semiconductor memory module 1 for the transmission of the
chip select signal CS3 to the memory chips (not shown in FIG. 3) of
the fourth rank 400 of first semiconductor memory module 1.
Chip select inputs of memory chips (not shown in FIG. 3) of the
first rank 500 of the second semiconductor memory module 1' are
coupled to the first output 34 of the first register 30 of the
second semiconductor memory module 1' for the transmission of the
chip select signal CS4 to the memory chips (not shown in FIG. 3) of
the first rank 500 of the second semiconductor memory module
1'.
Chip select inputs of memory chips (not shown in FIG. 3) of the
second rank 600 of the second semiconductor memory module 1' are
coupled to the second output 35 of the first register 30 of the
second semiconductor memory module 1' for the transmission of the
chip select signal CS5 to the memory chips (not shown in FIG. 3) of
the second rank 600 of the second semiconductor memory module
1'.
Chip select inputs of memory chips (not shown in FIG. 3) of the
third rank 700 of the second semiconductor memory module 1' are
coupled to the first output 44 of the second register 40 of the
second semiconductor memory module 1' for the transmission of the
chip select signal CS6 to the memory chips (not shown in FIG. 3) of
the third rank 700 of the second semiconductor memory module
1'.
Chip select inputs of memory chips (not shown in FIG. 3) of the
fourth rank 800 of the second semiconductor memory module 1' are
coupled to the second output 45 of the second register 40 of the
second semiconductor memory module 1' for the transmission of the
chip select signal CS7 to the memory chips (not shown in FIG. 3) of
the fourth rank 800 of the second semiconductor memory module
1'.
Command/address inputs of memory chips (not shown in FIG. 3) of the
first rank 100 and of the second rank 200 of the first
semiconductor memory module 1 are coupled in parallel to the at
least one third output 16 of the first register 10 of the first
semiconductor memory module 1 for the transmission of
command/address signals to the memory chips (not shown in FIG. 3)
of the first rank 100 and of the second rank 200 of the first
semiconductor memory module 1.
Command/address inputs of memory chips (not shown in FIG. 3) of the
third rank 300 and of the fourth rank 400 of the first
semiconductor memory module 1 are coupled in parallel to the at
least one third output 26 of the second register 20 of the first
semiconductor memory module 1 for the transmission of
command/address signals to the memory chips (not shown in FIG. 3)
of the third rank 300 and of the fourth rank 400 of the first
semiconductor memory module 1.
Command/address inputs of memory chips (not shown in FIG. 3) of the
first rank 500 and of the second rank 600 of the second
semiconductor memory module 1' are coupled in parallel to the at
least one third output 36 of the first register 30 of the second
semiconductor memory module 1' for the transmission of
command/address signals to the memory chips (not shown in FIG. 3)
of the first rank 500 and of the second rank 600 of the second
semiconductor memory module 1'.
Command/address inputs of memory chips (not shown in FIG. 3) of the
third rank 700 and of the fourth rank 800 of the second
semiconductor memory module 1' are coupled in parallel to the at
least one third output 46 of the second register 40 of the second
semiconductor memory module 1' for the transmission of
command/address signals to the memory chips (not shown in FIG. 3)
of the third rank 700 and of the fourth rank 800 of the second
semiconductor memory module 1'.
If an inactive level of the control signal CS GATE EN is applied to
each of the fourth inputs 17, 27, 37, 47 of the respective first
10, 30 and second 20, 40 registers of the respective first 1 and
second 1' semiconductor memory modules, then the command/address
signals CA applied to the at least one third input 13 of the first
register 10 of the first semiconductor memory module 1 are
transmitted via the at least one third output 16 of the first
register 10 of the first semiconductor memory module 1 to the
memory chips 3 of the first rank 100 and of the second rank 200 of
the first semiconductor memory module 1, the command/address
signals CA applied to the at least one third input 23 of the second
register 20 of the first semiconductor memory module 1 are
transmitted via the at least one third output 26 of the second
register 20 of the first semiconductor memory module 1 to the
memory chips 3 of the third rank 300 and of the fourth rank 400 of
the first semiconductor memory module 1, the command/address
signals CA applied to the at least one third input 33 of the first
register 30 of the second semiconductor memory module 1' are
transmitted via the at least one third output 36 of the first
register 30 of the second semiconductor memory module 1' to the
memory chips 3 of the first rank 500 and of the second rank 600 of
the second semiconductor memory module 1', the command/address
signals CA applied to the at least one third input 43 of the second
register 40 of the second semiconductor memory module 1' are
transmitted via the at least one third output 46 of the second
register 40 of the second semiconductor memory module 1' to the
memory chips 3 of the third rank 700 and of the fourth rank 800 of
the second semiconductor memory module 1'.
If an active level of the control signal CS GATE EN is applied to
each of the fourth input 17, 27, 37, 47 of the respective first 10,
30 and second 20, 40 registers of the respective first 1 and second
1' semiconductor memory modules, then the transmission of
command/address signals CA applied to respective at least one third
inputs 13, 23, 33, 43 is dependent on the respective chip select
signals CS0 to CS7.
If at least one of the chip select signals CS0 and CS1 coupled
respectively to the first input 11 and the second input 12 of the
first register 10 of the first semiconductor memory module 1 is
active, then the command/address signals CA are transmitted via the
at least one third output 16 to the memory chips 3 of the first
rank 100 and of the second rank 200 of the first semiconductor
memory module 1. If both chip select signals CS0 and CS1 are
inactive, then the transmission of command/address signals CA via
the at least one third output 16 to the memory chips 3 of the first
rank 100 and of the second rank 200 is blocked.
If at least one of the chip select signals CS2 and CS3 coupled
respectively to the first input 21 and the second input 22 of the
second register 20 of the first semiconductor memory module 1 is
active, then the command/address signals CA are transmitted via the
at least one third output 26 to the memory chips 3 of the third
rank 300 and of the fourth rank 400 of the first semiconductor
memory module 1. If both chip select signals CS2 and CS3 are
inactive, then the transmission of command/address signals CA via
the at least one third output 26 to the memory chips 3 of the third
rank 300 and of the fourth rank 400 is blocked.
If at least one of the chip select signals CS4 and CS5 coupled
respectively to the first input 31 and the second input 32 of the
first register 30 of the second semiconductor memory module 1' is
active, then the command/address signals CA are transmitted via the
at least one third output 36 to the memory chips 3 of the first
rank 500 and of the second rank 600 of the second semiconductor
memory module 1'. If both chip select signals CS4 and CS5 are
inactive, then the transmission of command/address signals CA via
the at least one third output 36 to the memory chips 3 of the first
rank 500 and of the second rank 600 is blocked.
If at least one of the chip select signals CS6 and CS7 coupled to
the respective first input 41 and the second input 42 of the second
register 40 of the second semiconductor memory module 1' is active,
then the command/address signals CA are transmitted via the at
least one third output 46 to the memory chips 3 of the third rank
700 and of the fourth rank 800 of the second semiconductor memory
module 1'. If both chip select signals CS6 and CS7 are inactive,
then the transmission of command/address signals CA via the at
least one third output 46 to the memory chips 3 of the third rank
700 and of the fourth rank 800 is blocked.
FIG. 4 depicts schematically an electronic apparatus according to
one embodiment of the invention. The electronic apparatus includes
a semiconductor memory module 1, a bus system 60 and a controller
device 50 such as a memory controller.
The semiconductor memory module 1 includes a first 100, a second
200, a third 300, a fourth 400, a fifth 500, a sixth 600, a seventh
700 and an eighth 800 rank of memory chips disposed. Furthermore,
the semiconductor memory module 1 includes a first 10, a second 20,
a third 30 and a fourth 40 register.
Each of the first 10, second 20, third 30 and fourth 40 register
has a respective first input 11, 21, 31, 41 coupled to the
controller device 50 for receiving a respective chip select signal
CS0, CS2, CS4, CS6, CS8, a respective second input 12, 22, 32, 42
coupled to the controller device 50 for receiving another
respective chip select signal CS1, CS3, CS5, CS7, and at least one
third input 13, 23, 33, 43 coupled to the controller device 50 for
receiving command/address signals CA.
Each of the first 10, second 20, third 30 and fourth 40 register
has a respective fourth input 17, 27, 37, 47 for receiving a
control signal CS GATE EN, wherein the control signal CS GATE EN is
coupled to the fourth inputs 17, 27, 37 and 47 in parallel.
Furthermore, each of the first 10, second 20, third 30 and fourth
40 register has a respective first output 14, 24, 34, 44, a
respective second output 15, 25, 35, 45 and at least one respective
third output 16, 26, 36, 46. Chip select inputs of memory chips
(not shown in FIG. 4) of the first rank 100 are coupled to the
first output 14 of the first register 10 for the transmission of
the chip select signal CS0, chip select inputs of the memory chips
(not shown in FIG. 4) of the second rank 200 are coupled to the
second output 15 of the first register 10 for the transmission of
the chip select signal CS1, chip select inputs of the memory chips
of the third rank 300 are coupled to the first output 24 of the
second register 20 for the transmission of the chip select signal
CS2, chip select inputs of the memory chips (not shown in FIG. 4)
of the fourth rank 400 are coupled to the second output 25 of the
second register 20 for the transmission of the chip select signal
CS3, chip select inputs of the memory chips (not shown in FIG. 4)
of the fifth rank 500 are coupled to the first output 34 of the
third register 30 for the transmission of the chip select signal
CS4, chip select inputs of the memory chips (not shown in FIG. 4)
of the sixth rank 600 are coupled to the second output 35 of the
third register 30 for the transmission of the chip select signal
CS5, chip select inputs of the memory chips (not shown in FIG. 4)
of the seventh rank 700 are coupled to the first output 44 of the
fourth register 40 for the transmission of the chip select signal
CS6, and chip select inputs of the memory chips (not shown in FIG.
4) of the eighth rank 800 are coupled to the second output 45 of
the fourth register 40 for the transmission of the chip select
signal CS7.
Command/address inputs of memory chips (not shown in FIG. 4) of the
first rank 100 and of the second rank 200 are coupled in parallel
to the at least one third output 16 of the first register 10 for
the transmission of command/address signals to the memory chips
(not shown in FIG. 4) of the first rank 100 and of the second rank
200.
Command/address inputs of memory chips (not shown in FIG. 4) of the
third rank 300 and of the fourth rank 400 are coupled in parallel
to the at least one third output 26 of the second register 20 for
the transmission of command/address signals to the memory chips
(not shown in FIG. 4) of the third rank 300 and of the fourth rank
400.
Command/address inputs of memory chips (not shown in FIG. 4) of the
first rank 500 and of the second rank 600 are coupled in parallel
to the at least one third output 36 of the third register 30 for
the transmission of command/address signals to the memory chips
(not shown in FIG. 4) of the fifth rank 500 and of the sixth rank
600.
Command/address inputs of memory chips (not shown in FIG. 4) of the
seventh rank 700 and of the eighth rank 800 are coupled in parallel
to the at least one third output 46 of the fourth register 40 for
the transmission of command/address signals to the memory chips
(not shown in FIG. 4) of the seventh rank 700 and of the eighth
rank 800.
If an inactive level of the control signal CS GATE EN is applied to
each of the fourth inputs 17, 27, 37, 47 of the respective first
10, second 20, third 30, fourth 40, fifth 50, sixth 60, seventh 70
and eighth 80 registers, then the command/address signals CA
applied to the at least one third input 13 of the first register 10
are transmitted via the at least one third output 16 of the first
register 10 to the memory chips 3 of the first rank 100 and of the
second rank 200, the command/address signals CA applied to the at
least one third input 23 of the second register 20 are transmitted
via the at least one third output 26 of the second register 20 to
the memory chips 3 of the third rank 300 and of the fourth rank
400, the command/address signals CA applied to the at least one
third input 33 of the third register 30 are transmitted via the at
least one third output 36 of the third register 30 to the memory
chips 3 of the fifth rank 500 and of the sixth rank 600, the
command/address signals CA applied to the at least one third input
43 of the fourth register 40 are transmitted via the at least one
third output 46 of the fourth register 40 to the memory chips 3 of
the seventh rank 700 and of the eighth rank 800.
If an active level of the control signal CS GATE EN is applied to
each of the fourth input 17, 27, 37, 47 of the respective first 10,
second 20, third 30, fourth 40, fifth 50, sixth 60, seventh 70 and
eighth 80 registers, then the transmission of command/address
signals CA applied to respective at least one third inputs 13, 23,
33, 43 is dependent on the respective chip select signals CS0 to
CS7.
If at least one of the chip select signals CS0 and CS1 coupled
respectively to the first input 11 and the second input 12 of the
first register 10 is active, then the command/address signals CA
are transmitted via the at least one third output 16 to the memory
chips 3 of the first rank 100 and of the second rank 200. If both
chip select signals CS0 and CS1 are inactive, then the transmission
of command/address signals CA via the at least one third output 16
to the memory chips 3 of the first rank 100 and of the second rank
200 is blocked.
If at least one of the chip select signals CS2 and CS3 coupled
respectively to the first input 21 and the second input 22 of the
second register 20 is active, then the command/address signals CA
are transmitted via the at least one third output 26 to the memory
chips 3 of the third rank 300 and of the fourth rank 400. If both
chip select signals CS2 and CS3 are inactive, then the transmission
of command/address signals CA via the at least one third output 26
to the memory chips 3 of the third rank 300 and of the fourth rank
400 is blocked.
If at least one of the chip select signals CS4 and CS5 coupled
respectively to the first input 31 and the second input 32 of the
third register 30 is active, then the command/address signals CA
are transmitted via the at least one third output 36 to the memory
chips 3 of the fifth rank 500 and of the sixth rank 600. If both
chip select signals CS4 and CS5 are inactive, then the transmission
of command/address signals CA via the at least one third output 36
to the memory chips 3 of the fifth rank 500 and of the sixth rank
600 is blocked.
If at least one of the chip select signals CS6 and CS7 coupled to
the respective first input 41 and the second input 42 of the fourth
register 40 is active, then the command/address signals CA are
transmitted via the at least one third output 46 to the memory
chips 3 of the seventh rank 700 and of the eighth rank 800. If both
chip select signals CS6 and CS7 are inactive, then the transmission
of command/address signals CA via the at least one third output 46
to the memory chips 3 of the seventh rank 700 and of the eighth
rank 800 is blocked.
FIG. 5 depicts schematically a cross-sectional view of the
semiconductor memory module 1 of the electronic apparatus of FIG.
4. The semiconductor memory module 1 includes a first circuit
substrate 2 and a second circuit substrate 2', each having a first
surface S1, S1' and a second surface S2, S2'.
A first register 10 is disposed on the first surface S1 of the
first circuit substrate 2, a second register 20 is disposed on the
second surface S2 of the first circuit substrate 2, a third
register 30 is disposed on the first surface S1' of the second
circuit substrate 2' and a fourth register 40 is disposed on the
second surface S2' of the second circuit substrate 2'.
A respective first rank 100, 500 and a respective second rank 200,
600 of memory chips (not shown in FIG. 5) are disposed on the
respective first surface S1, S1' of the respective circuit
substrate 2, 2'.
A respective third rank 300, 700 and a respective fourth rank 400,
800 of memory chips (not shown in FIG. 5) are disposed on the
respective second surface S2, S2' of the respective circuit
substrate 2, 2'.
Typically, memory chips (not shown in FIG. 5) are coupled to
respective circuit substrates by solder balls 80 to provide an
electrical connection between the memory chips and the circuit
substrates.
A connector 70 provides a connection between the first circuit
substrate 2 and the second circuit substrate 2' for the
transmission of electrical signals. The connector 70 includes a
plug 70B disposed on the first surface S1' of the second circuit
substrate 2' and a socket 70A disposed on the second surface S2 of
the first circuit substrate 2.
An edge connector 8 disposed on one end of the first circuit
substrate 2 provides electrical connection between the electronic
apparatus and a bus system (not shown in FIG. 5) for the
transmission of electrical signals between an external device such
as the controller device depicted in FIG. 4 and the electronic
apparatus via a bus system.
* * * * *