U.S. patent number RE42,378 [Application Number 11/491,533] was granted by the patent office on 2011-05-17 for implantable pressure sensors and methods for making and using them.
This patent grant is currently assigned to Remon Medical Technologies, Ltd.. Invention is credited to Alon Ben-Yoseph, Eyal Doron, Avi Penner, Lone Wolinsky.
United States Patent |
RE42,378 |
Wolinsky , et al. |
May 17, 2011 |
**Please see images for:
( Certificate of Correction ) ** |
Implantable pressure sensors and methods for making and using
them
Abstract
An implant includes a pressure sensor, a controller for
acquiring pressure data from the sensor, and an acoustic transducer
for converting energy between electrical energy and acoustic
energy. A capacitor is coupled to the acoustic transducer for
storing electrical energy converted by the transducer and/or for
providing electrical energy to operate the implant. The acoustic
transducer may operate alternatively or simultaneously as an energy
exchanger or an acoustic transmitter. During use, the implant is
implanted within a patient's body, and an external transducer
transmits a first acoustic signal into the patient's body, to
energize the capacitor. The implant then obtains pressure data, and
transmits a second acoustic signal to the external transducer, the
second acoustic signal including the pressure data.
Inventors: |
Wolinsky; Lone (Ramat Gan,
IL), Doron; Eyal (Kiriat-Yam, IL),
Ben-Yoseph; Alon (Ramot Menashe, IL), Penner; Avi
(Tel-Aviv, IL) |
Assignee: |
Remon Medical Technologies,
Ltd. (Caesarea, IL)
|
Family
ID: |
39535825 |
Appl.
No.: |
11/491,533 |
Filed: |
July 20, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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09690615 |
Oct 16, 2000 |
6628989 |
|
|
Reissue of: |
09888272 |
Jun 21, 2001 |
6764446 |
Jul 20, 2004 |
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Current U.S.
Class: |
600/300;
607/61 |
Current CPC
Class: |
A61N
5/062 (20130101); A61B 5/076 (20130101); A61N
5/0601 (20130101); A61B 5/14539 (20130101); A61B
5/0031 (20130101); A61N 1/37217 (20130101); A61B
5/0028 (20130101); A61B 5/0215 (20130101); A61N
1/3787 (20130101); A61B 2560/0219 (20130101); A61N
2005/0651 (20130101); A61B 5/01 (20130101); A61B
2562/028 (20130101); A61B 5/031 (20130101); A61B
5/053 (20130101); A61B 2562/0247 (20130101) |
Current International
Class: |
A61B
5/04 (20060101) |
Field of
Search: |
;607/32,33,60,61
;600/300,301 |
References Cited
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Oct 2008 |
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WO |
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|
Primary Examiner: Evanisko; George R
Attorney, Agent or Firm: Faegre & Benson LLP
Parent Case Text
This application is a Continuation-in-Part of application Ser. No.
09/690,615, filed Oct. 16, 2000 now U.S. Pat. No. 6,628,989, the
disclosure of which is expressly incorporated herein by reference.
Claims
What is claimed is:
1. .[.A surgical.]. .Iadd.An .Iaddend.implant, comprising: a sensor
for measuring intra-body diagnostic data; a controller
.[.configured for generating.]. .Iadd.that generates .Iaddend.an
electrical communication signal containing the .Iadd.measured
.Iaddend.diagnostic data; one or more acoustic transducers;
circuitry for collectively configuring the one or more acoustic
transducers to convert acoustic energy received from a location
external to the implant into electrical energy used to support
operation of the implant, and .Iadd.to .Iaddend.convert the
electrical communication signal .[.received.]. .Iadd.generated
.Iaddend.by the controller into an .[.acoustical.]. .Iadd.acoustic
.Iaddend.communication signal .[.for transmission.].
.Iadd.transmitted .Iaddend.to a location external to the implant;
and an energy storage device configured for storing the electrical
energy converted .Iadd.from acoustic energy .Iaddend.by the one or
more transducers, wherein the energy storage device comprises a
first relatively fast-charging capacitor and a second relatively
slow-charging capacitor, the first and second capacitors
.[.being.]. coupled to the one or more acoustic transducers such
that the first capacitor is charged first and the second capacitor
is charged only upon .[.substantially.]. .Iadd.substantial
.Iaddend.charging of the first capacitor.
2. The implant of claim 1, wherein the one or more acoustic
transducers are configured by the circuitry in a full-duplex mode,
such that the one or more acoustic transducers can simultaneously
convert the acoustic energy into electrical energy and convert the
electrical communication signal into the .[.acoustical
communication.]. .Iadd.acoustic communication .Iaddend.comunication
signal.
3. The implant of claim 2, wherein the one or more transducers
comprise at least one receive .[.only.]. transducer for converting
.[.the.]. acoustic energy into electrical energy, and at least one
transmit .[.only.]. transducer for converting the electrical
communication signal into the .[.acoustical.]. .Iadd.acoustic
.Iaddend.communication signal.
4. The implant of claim 2, wherein the one or more transducers
comprises at least one transducer.[., each of which is.].
configured by the circuitry for converting .[.the.]. acoustic
energy into electrical energy.Iadd., .Iaddend.and .Iadd.at least
one transducer configured .Iaddend.for converting the electrical
communication signal into the acoustic communication signal.
5. The implant of claim 1, wherein the one or more acoustic
transducers are configured by the circuitry in a half-duplex mode,
such that the one or more acoustic transducers can alternately
convert .[.the.]. acoustic energy into electrical energy.Iadd.,
.Iaddend.and convert the electrical communication signal into the
acoustic communication signal.
6. The implant of claim 1, wherein the one or more transducers are
collectively configured by the circuitry for converting an acoustic
communication signal transmitted from a location external to the
implant to another electrical communication signal, the controller
configured for detecting the other electrical communication
signal.
7. The implant of claim 6, wherein the controller is configured for
extracting one or more commands from the other electrical
communication signal and controlling the implant in response to the
one or more commands.
8. The implant of claim 7, wherein the controller is configured for
activating or deactivating the energy storage device in response to
the one or more commands.
9. The implant of claim 7, wherein the controller is configured for
monitoring when the one or more acoustic transducers .[.stop.].
.Iadd.are .Iaddend.converting .Iadd.acoustic energy into
.Iaddend.electrical energy, and for activating the implant when
.Iadd.the transducers stop converting acoustic energy into
.Iaddend.electrical energy .[.is no longer being converted by the
one or more acoustic transducers.]..
10. The implant of claim 1, wherein the one or more acoustic
transducers .[.comprise:.]. .Iadd.each comprises .Iaddend.a
substrate comprising a cavity.[.;.]. and a substantially flexible
piezoelectric layer attached to the substrate across the
cavity.
11. The implant of claim 10, .Iadd.each transducer .Iaddend.further
comprising a first electrode attached to an external surface of the
piezoelectric layer and a second electrode attached to an internal
surface of the piezoelectric layer.
12. The implant of claim 10, wherein the substrate .Iadd.of at
least one transducer .Iaddend.comprises an array of cavities,
.[.and wherein.]. .Iadd.with .Iaddend.the .Iadd.respective
.Iaddend.piezoelectric layer .[.is.]. bonded to the substrate over
the .Iadd.array of .Iaddend.cavities.
13. The implant of claim 10, wherein the piezoelectric layer
comprises poly vinylidene fluoride.
14. The implant of claim 1, wherein the energy storage device is
rechargeable.
15. The implant of claim 1, wherein the diagnostic data is pressure
data.
16. The implant of claim 1, wherein the electrical energy is
alternating current electrical energy, and wherein the
.[.controller.]. .Iadd.circuitry .Iaddend.is configured for
converting alternating current electrical energy into direct
current electrical energy for storage in the energy storage
device.
17. The implant of claim 1, wherein the controller is configured to
reset the implant when the energy storage device is being
charged.[.by the electrical energy.]..
18. The implant of claim 1, wherein the controller is configured
for automatically switching the implant off when the electrical
energy available from the energy storage device falls below a
predetermined threshold.
19. .[.A surgical.]. .Iadd.An .Iaddend.implant, comprising: a
controller configured for controlling .[.the.].
.Iadd..Iaddend.operation of the implant.Iadd.; .Iaddend.and for
generating an electrical communication signal; one or more acoustic
transducers; circuitry for collectively configuring the one or more
acoustic transducers to convert the electrical communication signal
into an .[.acoustical.]. .Iadd.acoustic .Iaddend.communication
signal .[.for transmission.]. .Iadd.transmitted .Iaddend.to a
location external to the implant, and to convert acoustic energy
received from a location external to the implant into electrical
energy used to support operation of the implant; and an energy
storage device configured for storing the electrical energy
.Iadd.converted from acoustic energy.Iaddend., wherein the energy
storage device comprises a first.Iadd., .Iaddend.relatively
fast-charging capacitor and a second.Iadd., .Iaddend.relatively
slow-charging capacitor, the first and second capacitors
.[.being.]. coupled to the one or more acoustic transducers such
that the first capacitor is charged first and the second capacitor
is charged only upon .[.substantially.]. .Iadd.substantial
.Iaddend.charging of the first capacitor.
.[.20. The implant of claim 19, wherein the one or more acoustic
transducers are configured by the circuitry in a full-duplex mode,
such that the one or more acoustic transducers can simultaneously
convert the acoustic energy into electrical energy and convert the
electrical communication signal into the acoustical comunication
signal..].
.[.21. The implant of claim 20, wherein the one or more transducers
comprise at least one receive only transducer for converting the
acoustic energy into electrical energy, and at least one transmit
only transducer for converting the electrical communication signal
into the acoustical communication signal..].
.[.22. The implant of claim 20, wherein the one or more transducers
comprises at least one transducer, each of which is configured by
the circuitry for converting the acoustic energy into electrical
energy and for converting the electrical communication signal into
the acoustic communication signal..].
.[.23. The implant of claim 19, wherein the one or more acoustic
transducers are configured by the circuitry in a half-duplex mode,
such that the one or more acoustic transducers can alternately
convert the acoustic energy into electrical energy and convert the
electrical communication signal into the acoustic communication
signal..].
.[.24. The implant of claim 19, wherein the one or more transducers
are collectively configured by the circuitry for converting an
acoustic communication signal transmitted from a location external
to the implant to another electrical communication signal, the
controller configured for detecting the other electrical
communication signal..].
.[.25. The implant of claim 24, wherein the controller is
configured for extracting one or more commands from the other
electrical communication signal and controlling the implant in
response to the one or more commands..].
.[.26. The implant of claim 25, wherein the controller is
configured for activating or deactivating the energy storage device
in response to the one or more commands..].
.[.27. The implant of claim 25, wherein the controller is
configured for monitoring when the one or more acoustic transducers
stop converting electrical energy, and for activating the implant
when electrical energy is no longer being converted by the one or
more acoustic transducers..].
28. The implant of claim 19, wherein the one or more acoustic
transducers .[.comprise:.]. .Iadd.each comprises .Iaddend.a
substrate comprising a cavity.[.;.]. and a substantially flexible
piezoelectric layer attached to the substrate across the
cavity.
.[.29. The implant of claim 28, further comprising a first
electrode attached to an external surface of the piezoelectric
layer and a second electrode attached to an internal surface of the
piezoelectric layer..].
30. The implant of claim 28, wherein the substrate .Iadd.of at
least one transducer .Iaddend.comprises an array of cavities,
.[.and wherein.]. .Iadd.with .Iaddend.the .Iadd.respective
.Iaddend.piezoelectric layer .[.is.]. bonded to the substrate over
the .Iadd.array of .Iaddend.cavities.
.[.31. The implant of claim 28, wherein the piezoelectric layer
comprises poly vinylidene fluoride..].
.[.32. The implant of claim 19, wherein the energy storage device
is rechargeable..].
.[.33. The implant of claim 19, further comprising a sensor for
acquiring diagnostic data, wherein the electrical communication
signal generated by the transmission circuit contains the
diagnostic data..].
.[.34. The implant of claim 19, wherein the electrical energy is
alternating current electrical energy, and wherein the controller
is configured for converting alternating current electrical energy
into direct current electrical energy for storage in the energy
storage device..].
.[.35. The implant of claim 19, wherein the controller is
configured to reset the implant when the energy storage device is
being charged by the electrical energy..].
.[.36. The implant of claim 19, wherein the controller is
configured for automatically switching the implant off when the
electrical energy available from the energy storage device falls
below a predetermined threshold..].
.Iadd.37. An implant, comprising: a sensor; a controller that
generates an electrical communication signal containing data
measured by the sensor; one or more acoustic transducers; circuitry
for collectively configuring the one or more acoustic transducers
to convert acoustic energy received from a location external to the
implant into electrical energy used to support operation of the
implant, and to convert the electrical communication signal
generated by the controller into an acoustic communication signal
transmitted to a location external to the implant; and an energy
storage device configured for storing the electrical energy
converted from acoustic energy by the one or more transducers,
wherein the energy storage device comprises a first, relatively
fast-charging capacitor and a second, relatively slow-charging
capacitor, the first and second capacitors coupled to the one or
more acoustic transducers such that the first capacitor is charged
first and the second capacitor is charged only upon substantial
charging of the first capacitor..Iaddend.
.Iadd.38. The implant of claim 19, wherein the one or more acoustic
transducers are configured by the circuitry in a full-duplex mode,
such that the one or more acoustic transducers can simultaneously
convert the acoustic energy into electrical energy and convert the
electrical communication signal into the acoustic communication
signal..Iaddend.
.Iadd.39. The implant of claim 38, wherein the one or more
transducers comprise at least one receive transducer for converting
acoustic energy into electrical energy, and at least one transmit
transducer for converting the electrical communication signal into
the acoustic communication signal..Iaddend.
.Iadd.40. The implant of claim 38, wherein the one or more
transducers comprises at least one transducer configured by the
circuitry for converting acoustic energy into electrical energy,
and at least one transducer for converting the electrical
communication signal into the acoustic communication
signal..Iaddend.
.Iadd.41. The implant of claim 19, wherein the one or more acoustic
transducers are configured by the circuitry in a half-duplex mode,
such that the one or more acoustic transducers can alternatively
convert the acoustic energy into the electrical energy, and convert
the electrical communication signal into the acoustic communication
signal..Iaddend.
.Iadd.42. The implant of claim 19, wherein the one or more
transducers are collectively configured by the circuitry for
converting an acoustic communication signal transmitted from a
location external to the implant to another electrical
communication signal, the controller configured for detecting the
other electrical communication signal..Iaddend.
.Iadd.43. The implant of claim 42, wherein the controller is
configured for extracting one or more commands from the other
electrical communication signal and controlling the implant in
response to the one or more commands..Iaddend.
.Iadd.44. The implant of claim 42, wherein the controller is
configured for activating or deactivating the energy storage device
in response to the one or more commands..Iaddend.
.Iadd.45. The implant of claim 42, wherein the controller is
configured for monitoring when the one or more acoustic transducers
are converting acoustic energy into electrical energy, and for
activating the implant when the transducers stop converting
acoustic energy into electrical energy..Iaddend.
.Iadd.46. The implant of claim 28, each transducer further
comprising a first electrode attached to an external surface of the
piezoelectric layer and a second electrode attached to an internal
surface of the piezoelectric layer..Iaddend.
.Iadd.47. The implant of claim 28, wherein the piezoelectric layer
comprise poly vinylidene fluoride..Iaddend.
.Iadd.48. The implant of claim 19, wherein the energy storage
device is rechargeable..Iaddend.
.Iadd.49. The implant of claim 19, further comprising a sensor for
acquiring diagnostic data, wherein the electrical communication
signal generated by the controller comprises the diagnostic
data..Iaddend.
.Iadd.50. The implant of claim 19, wherein the electrical energy is
alternating current electrical energy, and wherein the circuitry is
configured for converting alternating current electrical energy
into direct current electrical energy for storage in the energy
storage device..Iaddend.
.Iadd.51. The implant of claim 19, wherein the controller is
configured to reset the implant when the energy storage device is
being charged..Iaddend.
.Iadd.52. The implant of claim 19, wherein the controller is
configured for automatically switching the implant off when the
electrical energy available from the energy storage device falls
below a predetermined threshold..Iaddend.
Description
FIELD OF THE INVENTION
The present invention relates generally to devices for implantation
within a patient's body, particularly to pressure sensors that may
be implanted within a body, and more particularly to implantable
pressure sensors that may be energized, activated, controlled,
and/or otherwise communicate via acoustic energy.
BACKGROUND OF THE INVENTION
Devices are known that may be implanted within a patient's body to
monitor one or more physiological conditions and/or to provide
therapeutic functions. For example, sensors or transducers may be
located deep within the body for monitoring a variety of
properties, such as temperature, pressure, strain, fluid flow,
chemical properties, electrical properties, magnetic properties,
and the like. In addition, devices may be implanted that perform
one or more therapeutic functions, such as drug delivery,
defibrillation, electrical stimulation, and the like.
Often it is desirable to control such devices once they are
implanted within a patient by external command, for example, to
obtain data, and/or to activate or otherwise control the implant.
An implant may include wire leads from the implant to an exterior
surface of the patient, thereby allowing an external controller or
other device to be directly coupled to the implant. Alternatively,
the implant may be remotely controlled, e.g., using an external
induction device. For example, an external radio frequency (RF)
transmitter may be used to communicate with the implant. RF energy,
however, may only penetrate a few millimeters into a body, because
of the body's dielectric nature. Thus, RF energy may not be able to
communicate effectively with an implant that is located deep within
the body. In addition, although an RF transmitter may be able to
induce a current within an implant, the implant's receiving
antenna, generally a low impedance coil, may generate a voltage
that is too low to provide a reliable switching mechanism.
In a further alternative, electromagnetic energy may be used to
control an implant, since a body generally does not attenuate
magnetic fields. The presence of external magnetic fields
encountered by the patient during normal activity, however, may
expose the patient to the risk of false positives, i.e., accidental
activation or deactivation of the implant. Furthermore, external
electromagnetic systems may be cumbersome and may not be able to
effectively transfer coded information to an implant.
Accordingly, a sensor, such as a pressure sensor, that may
implanted within a patient's body, and may be energized by,
controlled by, and/or otherwise communicate effectively with an
external interface would be considered useful.
SUMMARY OF THE INVENTION
The present invention is generally directed to implants that may be
implanted, e.g., using open surgical or minimally invasive
techniques, or otherwise located within a mammalian body for
monitoring pressure or other physiological parameters and/or for
performing one or more therapeutic functions.
In accordance with a first aspect of the present invention, an
implant is provided that includes a pressure sensor for measuring
intra-body pressure. A controller is coupled to the pressure sensor
for acquiring pressure data from the pressure sensor. One or more
acoustic transducers are provided for converting energy between
electrical energy and acoustic energy. Preferably, the one or more
acoustic transducers are configured for converting acoustic energy
from a source external to the implant into electrical energy and/or
for transmitting an acoustic signal including the pressure data to
a location external to the implant. One or more energy storage
devices are coupled to at least one of the one or more acoustic
transducers, the energy storage device(s) configured for storing
electrical energy converted by the one or more acoustic
transducers. The energy storage device(s) may be coupled to the
controller for providing electrical energy to support operation of
the implant. The energy storage device may include one or more
capacitors, for example, a first relatively fast-charging capacitor
and a second relatively slow-charging capacitor. In addition or
alternatively, the energy storage device may include a rechargeable
and/or nonrechargeable battery.
In a preferred embodiment, the one or more acoustic transducers may
be a single transducer configured to operate alternatively as
either an energy exchanger or an acoustic transmitter.
Alternatively, the acoustic transducers may include an acoustic
transmitter coupled to the controller for transmitting the acoustic
signal to a location external to the body. In addition or
alternatively, the acoustic transducers may include an energy
exchanger coupled to the energy storage device, the energy
exchanger including a piezoelectric layer for converting acoustic
energy striking the piezoelectric layer into electrical energy.
The components of the implant may be attached to a substrate, such
as a printed circuit board (PCB), and may be secured within a
casing. The casing may include one or more openings through which
active areas of the pressure sensor and/or the energy transducer
may be exposed to a region exterior to the casing. Alternatively,
the active area of the pressure sensor may be covered with a seal,
such as silicone, Parylene C, or a relatively thin metal layer. In
a further alternative, the casing may include a relatively thin
foil or thin-walled region for sealing at least one of the pressure
sensor and the energy transducer from a region exterior to the
casing. The casing may be filled with a fluid, gel, and/or low
modulus material, such as silicone, for coupling the pressure
sensor and/or the energy transducer to the foil or thin-walled
region. Thus, the thin-walled region may be used to couple the
pressure sensor and/or energy transducer to a region exterior to
the casing.
In accordance with another aspect of the present invention, a
method is provided for making an energy exchanger for converting
between acoustic and electrical energy. First, a layer of
piezoelectric polymer is provided, such as a fluorocarbon polymer,
preferably poly vinylidene fluoride (PVDF), or a copolymer of PVDF,
such as PVDF-TrFE. The layer of polymer may be etched, e.g., to
cleave carbon-fluorine, carbon-hydrogen, and/or carbon-carbon
bonds, for example, using a sodium naphthalene solution (for
carbon-fluorine bonds), or using a gas phase plasma treatment
including oxygen, air, Argon, Helium, and/or other gas plasma
(e.g., SF.sub.6). A conductive layer may be applied onto the layer
of polymer. The layer of polymer generally includes first and
second surfaces, and first and second conductive layers are applied
onto the first and second surfaces of the layer of polymer.
An adhesive, such as an epoxy or acrylic adhesive, is applied,
e.g., atomized, over a substrate including one or more cavities
therein. The piezoelectric layer is applied to a surface of the
substrate. Pressure may be applied between the piezoelectric layer
and the substrate, thereby causing the piezoelectric layer to
become at least partially depressed within the one or more
cavities. The adhesive may be cured, for example, using heat and/or
pressure, and/or by exposure to visible or ultraviolet light.
The energy exchanger may then be incorporated into an implant, such
as that described above. A substrate, e.g., a printed circuit board
(PCB), e.g., made from FR4, Rogers, ceramic, Kapton, Teflon, PVDF,
and/or PEEK, may be provided having an opening therethrough. A
pressure sensor may be attached to the substrate adjacent the
opening, the pressure sensor including an active area exposed via
the opening for measuring intra-body pressure. A controller may be
attached to the substrate and coupled to the pressure sensor for
acquiring pressure data from the pressure sensor. An energy
exchanger may be attached to the substrate, the energy exchanger
coupled to the controller for at least one of converting acoustic
energy from a source external to the implant into electrical energy
and transmitting an acoustic signal, e.g., including the pressure
data and optionally other information, to a location external to
the implant. Finally, an energy storage device may be attached to
the substrate and coupled to the energy exchanger, the energy
storage device configured for storing electrical energy converted
by the acoustic transducer and/or for providing electrical energy
to support operation of the implant. The substrate and attached
components may then be received in a casing for sealing the
implant.
In accordance with yet another aspect of the present invention, a
method is provided for acquiring data from an implant, such as that
described above, that is implanted within a patient's body, using
an external transducer located outside the patient's body.
Generally, the external transducer transmits a first acoustic
signal into the patient's body, the first acoustic signal being
converted into electrical energy for operating the implant. The
first acoustic signal may include an identification code (e.g., a
serial number, model number, and/or other identifier) identifying a
target implant, or other information, which may be interpreted by
the implant. The implant may confirm that the identification code
matches the implant, whereupon the implant may sample data and
transmit a second acoustic signal to the external transducer.
In response, the external transducer receives the second acoustic
signal from the implant, the acoustic signal including data related
to a condition with the patient's body measured by the implant.
Preferably, the external transducer automatically switches from an
energizing mode after transmitting the first acoustic signal to a
receiving mode for receiving the second acoustic signal. Upon
completion of transmitting the data, e.g., after a power level of
the implant falls below a predetermined level and/or after a
predetermined time, the implant returns to a passive mode, awaiting
further energizing or activation by the external transducer.
Alternatively, after receiving the second acoustic signal, the
external transducer may automatically switch back and forth from
the energizing mode to the receiving mode, thereby alternately
energizing the implant and receiving data from the implant. For
example, the external transducer may transmit an energizing signal
during any pause in operation of the implant, e.g., whenever the
energy exchanger is available to receive the energizing signal.
This may allow the external transducer to maintain the implant
substantially fully charged, thereby allowing substantially
indefinite operation. In a further alternative, the first and
second acoustic signals may be transmitted simultaneously, e.g., at
different frequencies.
In an alternative embodiment, the first acoustic signal transmitted
by the external transducer may be a diagnostic signal, e.g.,
including a broad band signal or a scanning signal, that may be
used to determine an optimal frequency for communicating with the
implant. The implant may transmit at different frequencies in
response to the diagnostic signal, and the external transducer may
determine the optimal frequency for communicating with the implant.
Alternatively, when the implant detects the diagnostic signal at an
optimal frequency, it may respond with a second acoustic signal
identifying or merely transmitting at the optimal frequency.
In yet another alternative embodiment, the energy storage device of
the implant may include a relatively fast-charging device and a
relatively slow-charging device. When the implant receives a first
acoustic signal, it may immediately charge the fast-charging
device, thereby allowing the implant to transmit a prompt response
to the external transducer, e.g., within about fifty to two hundred
milliseconds or less. The transmitted response may include an
identification code, a confirmation that the implant is
operational, and the like. While the implant is responding, the
slow-charging device may continue to charge, e.g., to support
subsequent operation of the implant during data sampling and
transmission.
Other objects and features of the present invention will become
apparent from consideration of the following description taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention is herein described, by way of example only, with
reference to the accompanying drawings, wherein:
FIG. 1 is a perspective view of a preferred embodiment of a
pressure sensing implant, in accordance with the present
invention.
FIG. 2 is a schematic layout of the implant of FIG. 1.
FIG. 3A is a top view of an energy exchanger that may be provided
in an implant, such as that shown in FIGS. 1 and 2, in accordance
with the present invention.
FIG. 3B is a cross-sectional view of the energy exchanger of FIG.
3A, taken along line B--B.
FIG. 4 is a schematic of a first preferred embodiment of a
rectifier for use with an implant, such as that shown in FIG.
2.
FIG. 5 is a schematic of a second preferred embodiment of a
rectifier for use with an implant, such as that shown in FIG.
2.
FIG. 6 is a schematic of a first preferred embodiment of a
transmission circuit for use with an implant, such as that shown in
FIG. 2.
FIG. 7 is a schematic of a second preferred embodiment of a
transmission circuit for use with an implant, such as that shown in
FIG. 2.
FIG. 8A is a top view of an alternative embodiment of an implant,
in accordance with the present invention.
FIG. 8B is a side view of the implant of FIG. 8A.
FIG. 9 is a cross-sectional view of patient's body, showing an
external device communicating with an implant located within the
patient's body.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Turning to the drawings, FIGS. 1 and 2 show a preferred embodiment
of an implant 10, in accordance with the present invention.
Generally, the implant 10 includes a sensor 12, one or more energy
transducers 14, one or more energy storage devices 16, and a
controller 18.
The sensor 12 is preferably a pressure sensor for measuring
intra-body pressure. The sensor 12 may measure pressure within a
range as low as a few millibars gauge (e.g., pressure ranges
experienced within the cranium or within the pulmonary artery) and
up to about 400 millibars gauge (e.g., blood pressure ranges
experienced during systole). In addition, because the barometric
pressure may vary by location, i.e., altitude, the absolute
pressure range capacity of the sensor is preferably between about
650 and 1450 millibars absolute.
In a preferred embodiment, the sensor 12 is an absolute variable
capacitance type pressure sensor. Alternatively, a piezoresistive
pressure sensor may be used, although the energy consumption of
this type of sensor may be substantially higher than a variable
capacitance pressure sensor. For example, a typical piezoresistive
sensor may have a bridge resistance of about five kiloohms (5
k.OMEGA.). Assuming that one volt (1 V) is sufficient to allow
pressure sampling, a current of at least about 0.2 milliAmperes
(mA) would be required to operate the sensor. This may be about one
hundred times more than the current required to obtain pressure
samples using a variable capacitance pressure sensor.
Some reduction in power consumption of piezoresistive pressure
sensors may be obtained by reducing the sampling rate of the sensor
or otherwise reducing the duty cycle of the implant. Alternatively,
to reduce power consumption, a sample-and-hold circuit (not shown)
may be provided for capturing voltages, and an analog-to-digital
converter (also not shown) may be provided for converting the
voltages when desired. Thus, the current may be on for relatively
short times during each sampling cycle.
Preferably, a silicon MEMS-based pressure sensor is used, because
of its relative small size, e.g., smaller than about four
millimeters (4 mm) maximum footprint, e.g., not more than about
four millimeters (4 mm) width by four millimeters (4 mm) length.
Preferably, the sensor is no larger than about 0.8 mm width by
about 2.1 mm length by about 0.3 mm thickness. Silicon is a
particularly useful material for the sensor 12, as it generally
does not suffer from creep and fatigue, and therefore may result in
a substantially stable sensor. MEMS-based sensors are presently
preferred because they may be manufactured in large volume at
relatively low cost compared to other sensors. Other materials that
may be used include titanium, as is used for the Chronicle.TM.
device manufactured by Medtronic, Inc. Preferably, the sensor 12 is
made from biocompatible materials, although the sensor 12 may be
coated, if necessary or desired, with a biocompatible and/or
chemically resistive coating (not shown), as will be appreciated by
those skilled in the art.
In alternative embodiments, one or more other sensors may be
provided instead of or in addition to a pressure sensor. For
example, the sensor 12 may include one or more biosensors capable
of measuring physiological parameters, such as temperature,
electrical impedance, position, strain, pH, fluid flow, and the
like. U.S. Pat. Nos. 4,793,825 issued to Benjamin et al. and
5,833,603 issued to Kovacs et al. disclose exemplary embodiments of
biosensors that may be provided. The disclosure of these references
and others cited therein are expressly incorporated herein by
reference. The sensor 12 may generate a signal proportional to a
physiological parameter that may be processed and/or relayed by the
controller 18 to the energy transducer 14, as described further
below. Alternatively, the sensor 12 may be configured to monitor a
radiation dose including ionizing, magnetic and/or acoustic
radiation, to monitor flow in a bypass graft, to produce cell
oxygenation and membrane electroporation, and the like.
In further alternatives, a device for providing one or more
therapeutic functions (not shown) may be provided in addition to or
instead of the sensor 12. For example, the device may be used to
activate and/or control a therapeutic device implanted within a
patient's body, such as an atrial defibrillator, a pain relief
stimulator, a neuro-stimulator, a drug delivery device, and/or a
light source used for photodynamic therapy.
Turning to FIGS. 3A and 3B, the energy transducer 14 is preferably
an acoustic transducer for converting energy between electrical
energy and acoustic energy. As explained further below, the
acoustic transducer 14 is configured for converting acoustic energy
from a source external to the implant into electrical energy and/or
for transmitting an acoustic signal including sensor data to a
location external to the implant. In one embodiment, the energy
transducer 14 is configured to operate alternatively as either an
energy exchanger or an acoustic transmitter, or simultaneously as
an energy exchanger and an acoustic transmitter. Alternatively,
multiple energy transducers (not shown) may be provided, e.g., one
or more converting acoustic energy striking the energy exchanger
into electrical energy, and one or more transmitting acoustic
signals to a location external to the implant 10. In a further
alternative, multiple energy transducers (not shown) may be
provided for increasing the electrical energy produced for a given
acoustic energy transmitted to the implant 10.
The energy transducer 14 generally includes a substrate 20
including one or more cavities 22 therein, such as the array of
cavities 22 shown in FIG. 3A. The cavities 22 may extend completely
through the substrate 20 or only partially into the substrate 20.
The cavities 22 are preferably substantially round in
cross-section, although oval or other elongate slotted cavities
(not shown) may be provided, which may increase sensitivity and/or
efficiency as compared to a substantially round cavity. The
cavities 22 may have a cross-section of about 0.5-2.5 millimeters,
and preferably between about 1.0 and 1.3 millimeters (mm). For
elliptical or other elongate cavities (not shown), the cavities
preferably have a width of 0.2-2.5 millimeters and a length of
1.0-25 millimeters. The substrate 20 may be formed from a
relatively high modulus polymer, such as poly ether ether ketone
(PEEK), silicon, and/or a printed circuit board, e.g., of FR4,
Rogers, a ceramic, or Kapton.
A substantially flexible piezoelectric layer 24 is attached to the
substrate 20 across the cavities 22. The piezoelectric layer 24
generally includes a polymer layer 28, preferably a fluorocarbon
polymer, such as poly vinylidene fluoride (PVDF). The polymer layer
28 may have a thickness of between about three and two hundred
fifty micrometers (3-250 .mu.m), and preferably about thirty
micrometers (30 .mu.m) or less. A first conductive layer 30 is
provided on an external surface of the polymer membrane 28 and a
second conductive layer 32 provided on an internal surface of the
polymer membrane 28. The second conductive layer 32 may be coupled
to a conductive region 36 provided on a wall of the cavities 22. A
pad 34 is provided on a lower surface of the substrate 20 for
coupling the second conductive layer 32 to a printed circuit board
(not shown), as described further below.
To manufacture the energy transducer 14, a substantially flexible
polymer layer 28, such as a PVDF membrane, is provided. Because
PVDF is generally chemically inert, the polymer layer 28 may need
to be activated, e.g., using an etching process. For example, a
sodium napthalene solution may be used to chemically attack the
PVDF to cleave the carbon-fluorine bonds and/or other solutions to
cleave the carbon-hydrogen bonds and/or carbon-carbon bonds in the
material. Alternatively, a gas phase plasma treatment, e.g., using
an oxygen, air, Helium, and/or Argon plasma, may be used.
A substantially planar substrate 20 is provided, and one or more
cavities 22 are formed in a surface of the substrate 20, for
example, by mechanical drilling, laser drilling, or punching.
Alternatively, the cavities 22 may be etched into the substrate 20,
e.g., using VLSI/micro-machining technology or any other suitable
technology.
A thin layer of adhesive (not shown) may be applied over the
substrate 20, such as an epoxy or acrylic-based adhesive.
Preferably, a relatively low viscosity (e.g., less than one
thousand centi-poise) adhesive is used that may be atomized over
the substrate 20. More preferably, the adhesive is light-activated,
thereby facilitating positioning of the piezoelectric layer 24 over
the substrate 20 before the adhesive is cured. The piezoelectric
layer 24 is applied against the adhesive over the substrate 20.
Alternatively, individual piezoelectric layers (not shown) may be
bonded or otherwise attached over one or more individual cavities
22. The cavities 22 may be filled with a gas, such as air, to a
predetermined pressure, e.g., ambient pressure or a predetermined
vacuum, that may be selected to provide a desired sensitivity and
ruggedness for the energy transducer 14.
The assembled substrate 20 and piezoelectric layer 24 may be placed
in a pressure chamber, and a predetermined pressure applied against
the piezoelectric layer 24. This may cause the piezoelectric layer
24 to press against the substrate 20, e.g., to facilitate spreading
the adhesive more evenly between the substrate 20 and the
piezoelectric layer 24. In addition, the predetermined pressure
preferably causes the piezoelectric layer 24 to at least partially
enter the cavities 22, thereby creating depressions in the
piezoelectric layer 24 corresponding to the cavities 22, as best
seen in FIG. 3B. Optionally, the pressure chamber may be heated to
a predetermined temperature to facilitate creating the depressions
and/or cure the adhesive. In addition or alternatively, the
adhesive may then be cured, e.g., by exposing the assembled
substrate 20 and piezoelectric layer 24 to visible or ultraviolet
light, pressure, and/or heat for a predetermined time.
Thus, the piezoelectric layer 24 may include depressions, which may
be useful for enhancing the efficiency and/or sensitivity of the
energy transducer 12. For example, the depressions may enhance the
conversion of an acoustic pressure wave striking the piezoelectric
layer 24 into mechanical strain, resulting in an increased yield of
electrical energy for a given pressure amplitude. The depressions
may also be used to customize the natural resonant frequency of the
piezoelectric layer 24. The depth of the depressions may be between
about one and two hundred micrometers (1-200 .mu.m), and preferably
between about twenty and one hundred micrometers (20-100 .mu.m),
although depths greater than this may also increase efficiency as
compared to a planar piezoelectric layer 24 without depressions. To
ensure that these depths are consistently reproducible, the depth
of the depressions may be measured, for example, using a
non-contact optical profiler.
Both surfaces of the polymer layer 28 may be coated with conductive
layers 30, 32, preferably metallization layers, at any stage of
manufacturing. For example, the conductive layers 30, 32 may be
applied either before or after the piezoelectric layer 24 has been
bonded to the substrate 20. Because the current encountered during
use of the energy transducer 14 is relatively low (e.g., about
thirty microamperes (30 .mu.A) or less, and preferably about five
microamperes (5 .mu.A) or less), a thickness of the conductive
layers 30, 32 may be relatively thin, e.g., fifteen micrometers (15
.mu.m) or less, and more preferably about two hundred nanometers
(200 nm) or less. The thickness of the conductive layers 30, 32 may
be substantially equal to or different from one another. For
example, the first or outer conductive layer 30 may be
substantially thicker than the second or inner conductive layer 32
to protect the energy transducer 14 from environments to which it
is exposed, such as those encountered within a human body. The
conductive layers 30, 32 may be formed from biocompatible and/or
metallic materials, including one or more of gold, platinum,
titanium, tantalum, palladium, vanadium, copper, nickel, silver,
and the like.
The conductive layers 30, 32 may be coated on the surfaces of the
polymer layer 28 using any known method, such as depositing an
electro-less nickel, gold, or copper base layer, followed by
depositing a galvanic coating, including any of the materials
listed above. The conductive layers 30, 32 may be deposited using
physical vapor deposition, chemical vapor deposition, sputtering,
and/or other gas phase coating processes known to those skilled in
the art. The conductive layers 30, 32 may be applied as single
layers or as multiple layers of one or more materials in order to
optimize the layers' electrical, mechanical, and/or chemical
properties. Exemplary methods for making the piezoelectric layer 24
may be found in "Handbook of Physical Vapor Deposition (PVD)
Processing," Donald M. Mattox (ISBN 0-8155-1422-0 Noyes
publications, 1998) and "Handbook of Deposition Technologies for
Films and Coatings," Rointan F. Bunshah (ed.), (Noyes Publications;
ISBN: 0815513372 2nd edition 1994.) The disclosures of these
references, as well as any others cited therein, are incorporated
herein by reference.
The method described above may be used to make individual energy
transducers or alternatively to make a plurality of energy
transducers. For example, a plurality of energy transducers may be
made as a single panel, and, after the metallization process, the
panel may be separated into individual energy transducers. The
separation may be accomplished using known dicing systems and
methods, for example, using a dicing machine known to those in the
microelectronics industry for dicing silicon wafers, a knife
cutter, a milling machine, or a laser, e.g., a diode laser, a
neodymium YAG laser, a CO.sub.2 laser, or an excimer laser. Upon
separation of the individual energy transducers, the electrical
impedance of each of the energy transducers may be measured to
confirm their integrity and proper operation. Additional
information on acoustic transducers or energy exchangers
appropriate for use with implants in accordance with the present
invention may be found in U.S. Pat. No. 6,140,740, the disclosure
of which is expressly incorporated herein by reference.
In an alternative embodiment, the substrate 20 may be formed from
silicon, with or without electronics. The cavities 22 may be formed
therein, the piezoelectric layer 24 may be attached to the
substrate 20, and the surfaces metalized, generally as described
above. In order to avoid large capacitances, an insulating oxide or
other ring (not shown) may be provided around the cavities 22. The
bottom of the cavities 22 may be sealed using an adhesive, e.g., an
underfill adhesive used during the flip-chip process.
Returning to FIGS. 1 and 2, the energy storage device 16,
preferably one or more capacitors, is coupled to the energy
transducer 14. In a preferred embodiment, the capacitor may be a
tantalum or ceramic capacitor, e.g., a 10.0 .mu.F tantalum
capacitor, such as model no. TACL106K006R, sold by AVX.
Alternatively, the energy storage device 16 may be a battery or
other known device, preferably capable of storing electrical energy
substantially indefinitely. In addition, the energy storage device
16 may be capable of being charged from an external source, e.g.,
using acoustic energy, as described further below. In an
alternative embodiment, the energy storage device 16 may include
both a capacitor and a primary, non-rechargeable battery (not
shown). Alternatively, the energy storage device 16 may include a
secondary, rechargeable battery and/or capacitor that may be
energized before activation or use of the implant 10. For example,
the energy storage device 16 may include a first relatively
fast-charging capacitor and a second relatively slow-charging
capacitor (not shown).
Turning to FIG. 2, the controller 18 may be an Application Specific
Integrated Circuit (ASIC) and/or a plurality of discrete electronic
components. The controller 18 generally interfaces between the
sensor 12, the energy transducer 14, and/or other active or passive
components of the implant 10. The controller 18 is also coupled to
the energy storage device 16 for receiving electrical energy to
operate the controller 18 and/or other components of the implant
10. The controller 18 generally includes a rectifier 40, reset and
threshold circuitry 42, signal detect circuitry 44, transmission
circuitry 46, a clock oscillator 48, an analog-to-digital converter
50, and power management and control logic circuitry 52. In
addition, the controller 18 may include a voltage reference
circuit, e.g., a bandgap reference, a Zener device, or a buried
Zener device.
The rectifier 40 is coupled to the energy transducer 14 for
converting electrical energy generated by the energy transducer 14
into a form suitable for powering components of the implant 10. For
example, the rectifier 40 may be configured for converting incoming
alternating current (AC) voltage from the energy transducer 14 into
direct current (DC) voltage for storage by the energy storage
device 16 and/or for powering the controller 18 and other
components of the implant 10. The rectification may be performed by
diodes arranged in a configuration suitable for the requirements of
the mode of operation, preferably resulting in a passive circuit
that draws substantially no current.
FIG. 4 shows a first preferred embodiment of a full-bridge
rectifier 40' that may be provided. The energy transducer 14 and
energy storage device 16 may be connected to the rectifier 40' such
that AC current generated by the energy transducer 14 is converted
into DC current for charging the energy storage device 16. The
full-bridge configuration of the rectifier 40' may yield relatively
high current and power efficiency that may be suitable for
"full-duplex" operation of the energy transducer 14, i.e., where
the energy transducer 14 simultaneously converts external acoustic
energy into electrical energy and transmits an acoustic signal.
FIG. 5 shows a second preferred embodiment of a voltage-doubler
rectifier 40'' that may be used. The configuration of this
rectifier 40'' may yield less current than the rectifier 40' shown
in FIG. 4, although it may generate a relatively higher voltage for
a given acoustic excitation of the energy transducer 14. This
rectifier 40'' may be better suited for "half-duplex" operation,
i.e., where the energizing and transmitting functions of the energy
transducer 14 are temporally distinct. This embodiment may also
only require two diodes to operate and may keep one side of the
energy transducer 14 substantially grounded, thereby simplifying
construction of the implant 10.
Alternatively, other rectification circuits (not shown) may be
used, including Schottky diodes, voltage triplers or other
multiplier circuits, and the like. In addition, the rectifier 40
may include an overvoltage protector (not shown), which may prevent
the energy storage device 16 from overcharging, e.g., to unsafe
levels. For example, the overvoltage protector may include a Zener
diode, or a transistor that opens at a predetermined threshold
voltage.
Returning to FIG. 2, the reset and threshold circuitry 42 is
coupled to the energy storage device 16 for monitoring for
particular events. For example, the reset and threshold circuitry
42 may reset the controller 18 as the energy storage device 16 is
recharging. This "power-on" reset function may occur when the
capacitor voltage of the energy storage device 16 reaches a
predetermined charging voltage, e.g. 3.8 V. In addition, during
operation of the implant 10, the reset and threshold circuitry 42
may automatically turn the controller 18 and/or other components of
the implant 10 off when the capacitor voltage of the energy storage
device 16 drops below a predetermined shutdown voltage, e.g., 1.5
V.
The reset circuitry 42 preferably monitors the voltage of the
energy storage device 18 in a substantially passive manner. For
example, the reset circuitry 42 may include a field-effect
transistor (FET) that is switched on when its gate voltage exceeds
a predetermined threshold. Thus, the reset circuitry 42 may be
passive, i.e., drawing substantially no current from the energy
storage device 16.
The signal detect circuitry 44 generally is coupled to the energy
transducer 16 for monitoring when the energy transducer 16 is
receiving acoustic signals from a source external to the implant
10. Preferably, the signal detect circuitry 44 is a passive FET
circuit, thereby drawing substantially no current. The signal
detect circuitry 44 may also include a smoothing capacitor (not
shown) and/or logic for reducing the sensitivity of the signal
detect circuitry 44 to spurious transient signals. The signal
detect circuitry 44 may provide a communication channel into the
implant 10, e.g., to pass commands and/or information in the
acoustic excitation signals received by the energy transducer 16
for use by the controller 18. In addition, the signal detect
circuitry 44 may pass commands or other signals to controller 18,
e.g., that acoustic excitation signals have been discontinued,
and/or that the implant 10 should become operative. For example,
when the implant 10 is configured for operation in half-duplex
mode, the signal detect circuitry 44 may monitor for termination of
an energizing transmission for charging the energy storage device
16, whereupon the controller 18 may begin sampling and/or
transmitting sensor data.
The transmission circuitry 46 is coupled to the energy transducer
14, and is generally responsible for preparing signals for
transmission from the implant 10 to a location exterior to the
implant 10. The signals are preferably digital electrical signals,
which may be generated, for example, by grounding one pin of the
energy transducer 14 and alternately connecting the other pin
between ground and a predetermined voltage. Alternatively, the
signals may be generated by alternately grounding the first pin and
connecting the second pin to the predetermined voltage, and then
grounding the second pin and connecting the first pin to the
predetermined voltage. In a further alternative, the signal may be
processed or modulated, e.g., using spread spectrum, direct
sequence mixing, CDMA, or other technologies, as will be
appreciated by those skilled in the art.
FIG. 6 shows a first preferred embodiment of a transmission circuit
46' that may be used for transmitting such digital signals. The
energy transducer 14 is coupled to ground and between a pair of
transistors 47.sub.1' and 47.sub.2'. The gates of the transistors
47.sub.1' and 47.sub.2' may be coupled to the control logic
circuitry 52 (shown in FIG. 2) for receiving signals for
transmission, such as sensor data signals from the sensor 12 (also
shown in FIG. 2). Alternatively, the gates may be coupled directly
to the analog-to-digital converter 50 (also shown in FIG. 2) or to
the sensor 12. The incoming sensor data signals may alternatively
couple the energy transducer 14 between ground and +V, thereby
converting the sensor data signals into acoustic energy, which may
be transmitted to a location exterior to the implant 10.
FIG. 7 shows a second preferred embodiment of a transmission
circuit 46'' that may be provided for full-duplex operation, i.e.,
for simultaneously receiving an energizing signal and transmitting
a data signal. For example, the energy transducer 14 may receive an
energizing signal at a first frequency f.sub.1, while the
transmission circuit switches the transistor 49 on and off at a
second frequency f.sub.2, e.g., using sensor data signals. This
periodic switching induces a current in the energy transducer 14 at
frequencies f.sub.1+/-f.sub.2 and possibly others. This current
causes the energy transducer 14 to transmit acoustic signals at the
new frequencies, which may be correlated back to the sensor data by
a receiver exterior to the implant 10. In a further alternative,
the transmission circuitry 46 may include analog circuitry for
generating analog signals that may be transmitted by the energy
transducer 14.
In an alternative embodiment (not shown), a full-bridge
transmission circuit may be used for the transmission circuit.
Using this circuit, pins of the energy transducer may be coupled
alternately to ground and +V. For example, a first pin may be
coupled to ground and a second pin coupled to +V, and then the
first pin may be coupled to +V and the second pin coupled to
ground. This circuit may generate signals at about twice the
amplitude of the other embodiments described above.
Returning to FIG. 2, the clock oscillator 48 may provide timing
and/or clocking signals for the controller 18 and/or the various
components of the implant 10. For example, the clock oscillator 48
may generate signals at fixed frequencies between about twenty and
sixty kilohertz (20-60 kHz).
The analog-to-digital (A/D) converter 50 is coupled to the sensor
12, and to the control logic circuitry 52 or directly to the
transmission circuit 46. The A/D converter 50 may digitize the
sensor output for further processing by the controller 18 and/or
for transmission by the energy transducer 14, using one of a
variety of known digitization systems. For a variable capacitance
pressure sensor, a switched-capacitor sigma-delta converter may be
provided. Alternatively, for piezo-resistive or strain-gauge
sensors, a track and hold amplifier followed by a successive
approximation converter may be provided.
The A/D converter 50 may also include a calibrated voltage
reference, against which measurements may be performed. Preferably,
this is a bandgap reference, based upon the properties of silicon
transistors. Alternatively, other reference circuits, such as Zener
or buried Zener diode references, may be used.
The power management and control logic circuitry 52 may include
several subsystems, such as a power management unit, a reception
decoder, a transmission encoder, a state machine, and/or a
diagnostic unit (not shown), which may be discrete hardware
components and/or software modules. For example, an ASIC-compatible
microprocessor, such as a CoolRISC processor available from Xemics,
may be used for the power management and control logic circuitry
52. The power management unit may be provided for switching current
on and off and/or for biasing voltages of the various components of
the controller 18, particularly for any analog subcircuits, on
demand. Thus, power may be supplied only to those portions or
components currently in need of power, in order to conserve
resources of the implant 10. The reception decoder is coupled to
the signal detect circuitry 44 for decoding signals extracted by
the signal detect circuitry 44 into commands to be passed to other
components of the implant 10. These commands may include
initialization, identification, control of system parameters,
requests for sensor data or other information, and the like.
The transmission encoder is coupled to the transmission circuitry
46 and generally latches digital information supplied by the A/D
converter 50 and prepares it for serial transmission by the
transmission circuitry 46. The information may include an
acknowledgement symbol, an identification code (e.g., a model, a
serial number, or other identifier identifying the implant 10),
internal status information (such as capacitor voltage), and/or
measurements obtained by the sensor 12. Data may be sent using an
asynchronous serial protocol, including, for example, a start bit,
one or more synchronization bits, eight bits of data, a parity bit,
and/or a stop bit. The data transmission rate and bit structure are
preferably constructed so as to avoid data corruption due to
reflections and reverberations of the acoustic signal within a
body. For example, each bit of information may be made up of
sixteen oscillations of the acoustic wave in order to ensure
fidelity of the transmission. In addition, there may be
predetermined delays between sequential transmissions, e.g., to
minimize interference and/or to allow reverberations to die
out.
The state machine controls the operational mode of the control
logic circuitry 52. For example, it may determined the current mode
(e.g., idle, decode, sample, transmit, and the like), and may
contain logic for switching from one mode to another.
The diagnostic unit may include circuits used during manufacturing
and/or calibration of the implant 10. This unit may not be
operational after system integration, but may be awakened
periodically by external command, e.g., to conduct in-vivo system
diagnostics.
Turning to FIG. 1, to manufacture an implant 10, in accordance with
the present invention, the various components may be assembled onto
a double-sided printed circuit board (PCB) 11. The PCB 11 is
preferably made from FR4 or other materials commonly used in the
semiconductor industry, such as polyamide, Rogers, a ceramic, or
Teflon.TM.. The PCB 11 may have a thickness of between about ten
and one thousand micrometers (10-1000 .mu.m), and preferably about
0.25 millimeter (mm) or less. The sensor 12 and controller 18 may
be flip chip bonded or wire bonded to one side of the PCB 11, e.g.
using anistropic glue, a conductive adhesive, a nonconductive
adhesive, or solder bumps. The active sensing area of the sensor 12
may be exposed through an opening 13 in the PCB 11, since the
sensing area may be disposed on the same side as the electrical
pads (not shown).
Alternatively, a single-sided PCB may be used, which may result in
an implant that has a smaller thickness, but which may be longer or
wider to accommodate the circuits printed thereon. A longer,
thinner implant may be useful for implantation in particular
locations within a patient's body, as will be appreciated by those
skilled in the art. In a further alternative, a single-sided or
double-sided flexible PCB may be used, e.g., having a thickness of
about twenty five micrometer (25 .mu.m). After assembly, the PCB
may be folded, rolled, or otherwise arranged to minimize its
volume.
To protect the sensor 12 and/or to prevent drift, the sensor 12 may
be covered with a protective coating, e.g., a moisture barrier (not
shown). Preferably, the sensor 12 is coated with a relatively soft
material, such as silicone (e.g., NuSil MED4161). This coating may
substantially minimize the stiffness or stress that may be imposed
upon the sensor 12, which may otherwise affect its sensitivity and
stability. Other protective and/or moisture barrier layers may then
be applied over this coating, such as a relatively thin metal layer
and/or Parylene C, without significantly affecting performance of
the sensor 12. After the sensor 12 is assembled and coated, it may
be calibrated, for example, by trimming the controller 18, e.g., by
fuse blowing, and/or by soldering or otherwise bonding trim
resistors 17 to the print side of the PCB 11.
The energy storage device 16, preferably a capacitor, may be
attached to an edge of the PCB 11, e.g., bonded using epoxy or
other adhesive. Conductive glue may be used for electrical
contacts. The energy transducer 14 is attached to the print side of
the PCB 111, e.g., by bonding with conductive glue. Additional
mechanical fixation may be achieved, if desired, using an
additional adhesive, such as an epoxy, around and/or under the
energy transducer 14. Alternatively, the energy transducer 14 may
be bonded using a conductive epoxy for electrical pad areas, and a
structural epoxy for areas away from the pads. When the energy
transducer 14 is attached to the PCB 11, the active area 15 of the
energy transducer 14 is disposed away from the PCB 11 and/or
otherwise exposed to transmit and/or receive acoustic energy, as
described further below.
Preferably, a panel of implants are assembled, e.g., by attaching
the components for multiple implants onto a single PCB. To
calibrate the panel (or individual implants) following assembly,
the panel may be inserted into a testing and diagnostic chamber
(not shown). The chamber may be thermostatically controlled to
ensure substantially constant temperature. In addition, pressure
within the chamber may also be controlled within pressure ranges
defined by the implants' specifications, e.g., pressure ranges to
which the implants may be subjected during use. Preferably, the
chamber includes a "bed of nails" or similar fixture (also not
shown) that provides contact between desired electrical pads on the
PCB and the conductive "nails." The nails are coupled to external
diagnostic electronics that may perform diagnostics and
calibration, e.g., via trimming, as required. Thus, the diagnostic
electronics may communicate and/or control the implants on the
panel via the nails. The testing generally includes calibration of
the pressure sensors' sensitivity and offset, e.g., based upon
comparison of measurements of the implants to a calibrated pressure
sensor, and/or calibration of the frequency of the internal
oscillator.
Once the panel has been assembled and/or calibrated, the panel may
be separated into individual implants. For example, the panel may
be diced using a milling machine, a dicing machine such as that
used for dicing silicon wafers, a laser, or a knife-based cutter.
If desired, an intermediate moisture barrier, such as Parylene C,
may be applied to any or all of the components, e.g., the pressure
sensor, the controller, etc., to provide additional protection for
the covered components.
After separation, each implant 10 is generally placed within a box
or other casing (not shown). The casing may protect the implant 10
from penetration of moisture or other body fluids, which may cause
corrosion of the electrical pads or traces and/or may cause drift.
The casing may also provide mechanical protection and/or may
provide connection points from which to attach the implant 10,
e.g., to other devices that may also be implanted within a patient.
The casing may be provided from titanium, gold, platinum, tantalum,
stainless steel, or other metal. Alternatively, other biocompatible
materials may be used, e.g., a polymer, such as a fluorocarbon,
polyamide, PEEK, preferably covered with a metallization layer to
improve the polymer's performance and/or to enhance its moisture
resistance. The casing may also include a connector or other
attachment fixture that may facilitate connecting the implant to
other devices implanted within a patient's body, e.g., for
receiving a suture that extends from a stent-graft or other
implanted device.
Preferably, the casing is a five-sided box, and the implant 10 is
disposed within the box such that the active areas of the sensor 12
and the energy transducer 14 are exposed through the open side. The
implant 10 may be sealed within the box. For example, after
assembly, a lid (not shown) may be attached to the sixth side,
e.g., by welding, soldering, brazing, gluing, and the like. The lid
may include openings corresponding to the active areas of the
sensor 12 and/or the energy transducer 14, the perimeters of which
may be sealed. Alternatively, a six sided casing may be used,
having one side made of a relatively thin foil, e.g., only a few
microns thick. In a further alternative, a six-sided compartment
may be used, with one or more walls or one or more regions of walls
being thinner than the others. The interior of the casing may be
filled with a non-ionic solution, e.g., silicone oil, silicone gel,
or other low modulus material, for coupling the pressure sensor and
the energy transducer to the foil or thin-walled regions. U.S. Pat.
No. 4,407,296 issued to Anderson, the disclosure of which is
expressly incorporated herein by reference, discloses a casing that
may be appropriate for use with an implant, in accordance with the
present invention.
With the implant 10 within the casing, it may placed in a vacuum
oven, e.g., at a temperature of about eighty degrees Celsius (80
C.) for outgassing, followed by plasma treatment for surface
activation. The implant 10 may be attached to the casing using an
adhesive, such as an epoxy, or silicone. The outer surface of the
assembled casing and implant may be covered with a layer of
Parylene C for improving corrosion resistance, a polymer to improve
biocompatibility, and/or a metal deposition layer to provide a
final moisture barrier. Preferably, a metal coating may be applied,
which may electrically ground the casing with the energy transducer
14, and then a final coating of Parylene C or other corrosion
resistance coating may be applied.
Turning to FIGS. 8A and 8B, in an alternative embodiment, an
implant 110 may be assembled using wire bonding rather than the
flip-chip process described above. Similar to the previous
embodiment, the implant 110 generally includes a sensor 112, one or
more energy transducers 114, one or more energy storage devices
116, and a controller 118, which may include any of the subsystems
or components described above. The implant 110 may be mounted
within a casing (not shown), which may be formed from Titanium or
other material, similar to the previous embodiment. In the
exemplary embodiment shown, the overall dimensions of the implant
110 may be not more than about 5.75 mm long, 2.1 mm wide, and 0.95
mm deep. The casing may have a width about 0.1 mm wider than the
widest component, e.g., the controller 118, and a depth of about
1.3 mm. Of course, these dimensions are only exemplary and may be
varied to accommodate different size components or to facilitate
implantation within predetermined locations within a patient's
body.
During assembly, the sensor 112, the energy storage device(s) 116,
and the controller 118 may be attached to the casing, e.g., to a
bottom panel 120 (shown in phantom in FIG. 8B). After fabricating
the energy transducer(s) 114, e.g., using the methods described
above, the energy transducer(s) 114 may be attached to the
controller 118, e.g., to an upper surface, as shown. The energy
storage device(s) 116, e.g., one or more capacitors, may be coated,
e.g., to electrically isolate the positive terminal and/or other
portions of the energy storage device(s) 116.
Wires 119 may be bonded to provide any required electrical
connections between the components, e.g., between the sensor 112,
the energy exchanger(s) 114, the energy transducer(s) 116, and/or
the controller 118. For example, the components may include one or
more electrical contacts 121 to which ends of respective wires 119
may be soldered or otherwise bonded using known methods. The wires
119 may be bonded before testing the controller 118, e.g., in order
to test operation of the entire implant 110. Alternatively, the
wires 119 may be bonded after testing the controller 118 and/or
other components individually or at intermediate stages of testing.
For example, testing, calibration, and/or trimming the controller
118 may be completed using a probe card (not shown) that may be
coupled to leads on the controller 118, e.g., similar to the bed of
nails described above. During or after testing, trim resistor(s)
117 may be attached to the bottom 120 of the casing and/or
electrically coupled to the controller 118 or other component. The
trim resistor(s) 117 may be electrically isolated from the other
components.
The subassembly may be cleaned and/or coated, similar to the
previous embodiment. For example, the entire subassembly may be
coated with Parylene or other moisture barrier. The sensor may be
coated, for example, with silicone (NuSil), which may still expose
an active area of the sensor, e.g., a membrane of a pressure
sensor, to body conditions. Ground connections may be made, e.g.,
for the trim resistors 117 and/or other components. The casing may
then be at least partially filled with potting compound, e.g.,
using a mold to protect the active area of the sensor 112.
Preferably, the potting compound is filled to line 122 (shown in
phantom in FIG. 8B), thereby covering all of the components, except
the active area of the sensor 112 and/or the active area of the
energy transducer(s) 114.
A lid, membrane, or other seal (not shown) may be attached to the
casing to protect the implant 110 from an exterior of the casing,
while still coupling the active areas of the sensor 112 and/or the
energy transducer 114 to the exterior, similar to the previous
embodiment. The space within the casing above the potting compound
122 may be filled with a fluid to acoustically couple and/or
otherwise couple the active areas to the lid, membrane, or other
seal. The lid may be attached first to the energy transducer 114
and then may be secured across an open end of the casing and/or the
lid may be welded to the casing open end using a laser, electron
beam plasma, magnetic welding, or any other welding method. The
welding may be performed in a gas environment, preferably an inert
gas (e.g., helium or argon), or while the parts are immersed within
a fluid. Alternatively a thin membrane may be chemically etched or
diffusion bonded to the lid.
Wire bonding may have advantages over the flip-chip process
described above. For example, wire bonding may eliminate need for
the PCB 11, and may allow the pressure sensor or other sensor to be
mounted face up within the casing, which may simplify assembly. In
addition, wire bonding may allow the implant 110 to be narrower in
width and/or shorter in length than the previous embodiment.
Because of the elimination of the PCB 11, the implant 110 may be
easier, less expensive, and/or faster to assemble.
Turning to FIG. 9, during operation of an implant in accordance
with the present invention, such as the implant 10, e.g., upon
implantation within a patient's body 90, the implant 10 may be
configured to operate in a "half-duplex" mode. In this mode, an
external transducer 70 located outside the patient's body 90 may be
used to control, charge, and/or communicate with the implant 10.
The external transducer 70 includes a probe 72 having one or more
energy transducers 74, e.g., similar to the energy transducer of
the implant 10, for converting energy between acoustic energy and
electrical energy. The external transducer 70 also generally
includes control circuitry 76, memory for storing data 78, and a
transmitting/receiving (T/R) switch 80, which may be separate from,
but coupled to, the probe 72, or may be within the probe (not
shown). The T/R switch 80 may toggle the energy transducer 74 to
operate in one of two modes, an energizing mode for charging or
activating the implant 10, and a receiving mode for receiving data
from the implant 10. As described below, the external transducer 70
may automatically switch between these two modes one or multiple
times during use.
First, the probe 72 may be coupled to the patient, e.g., placed
against the patient's skin 92, and the energy transducer 74
operated in the energizing mode, transmitting acoustic energy from
its energy transducer to the implant 10 through the patient's body
90. The acoustic energy from this energizing transmission passes
through the patient's body 90, at least some of the energy striking
the active area 15 of the energy transducer 14 of the implant 10.
The energy transducer 14 converts the acoustic energy into
electrical energy, e.g., which may be used to charge the energy
storage device (not shown) or otherwise operate the implant 10,
and/or to receive commands from the external transducer 70, as
explained further below.
Initially, the external transducer 70 may be operated in a
diagnostic mode. For example, the external transducer 70 may
transmit a broadband signal or a scanning signal, i.e., scanning
through a range of frequencies, and wait for the implant 10 to
respond. The implant 10 may transmit at different frequencies in
response to the diagnostic signal, and the external transducer 70
may determine the optimal frequency for communicating with the
implant based upon the responses. For example, the external
transducer 70 may repeatedly charge the implant 10 using different
frequency signals and measure the length of time that the implant
10 is capable of sampling and transmitting data signals at each
frequency to determine the optimal frequency. Alternatively, when
the implant 10 detects the signal, it may transmit a response, the
response being at an optimal frequency that should be used to
communicate with the implant 10.
Once the external transducer 70 has determined the optimal
frequency for communicating with the implant 10 (or the external
transducer 70 may already know the proper frequency to use), the
external transducer 70 may then begin its operation in energizing
mode, transmitting acoustic energy from its energy transducer 74
through the patient's body 90 to the implant 10, which is stored in
the energy storage device. The energy storage device may continue
to store energy until a predetermined voltage is achieved, e.g.,
about eight Volts (8 V), and then the controller (not shown) may
automatically disconnect the energy storage device from the energy
transducer 14. Alternatively, the energy storage device may
continue to store energy until a stop command is transmitted by the
external transducer 70.
After a predetermined time, e.g., between about five and sixty
seconds (5-60 sec.), the external transducer 70 may automatically
cease the energizing transmission. At the end of the energizing
transmission, the external transducer 70 may send an identification
code, e.g., a predetermined pulse sequence, identifying a specific
implant. In addition, the external transducer 70 may send a stop
command, an activation command, a sampling rate instruction, or one
or more other instructions. The external transducer 70 may then
automatically switch to receiving mode and await data transmission
from the implant 10 matching the identification code.
Alternatively, the external transducer 70 may be switched manually
to its receiving mode.
The controller of the implant 10 may detect the end of the
energizing transmission and the identification code. The controller
may confirm that the identification code matches the implant 10,
and automatically activate the implant 10. Alternatively, the
controller may acquire an activation command or other instructions
from the external transducer 70, such as a sampling rate and the
like, and activate in accordance with the instructions.
For example, once activated, the implant 10 may draw electrical
energy from the energy storage device, and begin to sample data
using the sensor 12. The controller may receive signals, e.g., raw
pressure readings, from the sensor 12, digitize and/or otherwise
process the signals, and transmit sensor data using the energy
transducer 14. For example, the A/D converter may convert the raw
pressure readings into digital data signals, which may be further
processed by the controller in preparation for data transmission.
The energy transducer 14 may convert the processed digital data
signals from the controller into acoustic energy that may be
transmitted through the patient's body 90 to the external
transducer 70.
The implant 10 may continue to sample data and transmit the data
signals until the voltage of the energy storage device 16 falls
below a predetermined threshold, e.g., below a level at which the
pressure sensor may not continue to operate effectively, such as
1.5 volts. For example, using a 4.7 .mu.F tantalum capacitor for
the energy storage device 16, the implant 10 may operate for
between about two and six seconds (2-6 sec.). After the voltage
falls below the predetermined threshold, the controller may
automatically discontinue operation of the implant 10 and return to
a passive state until energized and activated by the external
transducer. The controller may also include additional information
in the data transmission, e.g., an initial confirmation of
instructions received from the external transducer, an
identification code identifying the implant 10, and/or a stop
notice when the signal transmission is being discontinued.
Thus, the external transducer 70 and one or more implants within
the patient may operate in a cooperative manner. The external
transducer 70 may energize one or more implants with an energizing
transmission and/or may send instructions to individual or multiple
implants. Thus, the external transducer 70 may selectively activate
and receive data from one or more implants. The activated
implant(s) may acquire data, transmit data signals to the external
transducer 70 as acoustic energy, and then automatically return to
their passive mode awaiting further instructions. The external
transducer 70 may receive data from the one or more implants, which
may be stored in memory 78 of the external transducer 70 or
transferred to other equipment for use by medical personnel and the
like.
In an alternative embodiment, the energy storage device may include
a first relatively fast-charging capacitor and a second relatively
slow-charging capacitor (not shown). For example, the first
capacitor, which may be a relatively low-value capacitor, may be
coupled to the energy transducer 14 initially, and, once the first
capacitor is charged, the second capacitor, which may be a much
higher value capacitor, may then be coupled to the energy
transducer 14. In addition, once the first capacitor is charged,
the controller may automatically transmit a signal to the external
transducer, thereby opening a communication channel with the
external transducer, e.g., identifying the implant 10, identifying
its optimal communication frequency, and the like.
For example, the first capacitor may charge in about fifty to two
hundred milliseconds (50-200 ms), thereby allowing the implant to
respond promptly upon detecting a signal from an external
transducer, e.g., within about fifty to two hundred milliseconds
(50-200 ms). The charge retained by the first capacitor, however,
may only allow the implant 10 to transmit a short reply, e.g., an
identification code or other one or two word acknowledgement, in
response to an interrogation from the external transducer. The
second capacitor may retain a more substantial charge, e.g., that
may be used to operate the implant 10 for more extended periods of
time, similar to the embodiment described above.
In a further alternative embodiment, the external transducer 70 and
implant 10 may operate in a quasi-continuous state, i.e.,
alternating between energizing/charging modes and
transmitting/receiving modes. For example, the external transducer
70 may transmit an energizing transmission, e.g., for between about
one and one hundred milliseconds (1-100 msec.), to charge the
energy storage device with sufficient energy to operate the implant
10 for a predetermined time, e.g., several milliseconds. The
external transducer 70 may then switch to receiving mode, and the
implant 10 may become activated, as described above, and sample and
transmit data. After the predetermined time, the implant 10 may
automatically switch back to charging mode and wait for another
energizing transmission from the external transducer 70. After
receiving the data transmission from the implant 10, the external
transducer 70 may switch back to the energizing mode and transmit
another energizing transmission to recharge the implant 10. Thus,
the process of "interrogating," i.e., requesting data from the
implant 10, and transmitting sensor data may be repeated
substantially indefinitely, as desired. For example, the external
transducer 70 and implant 10 may operate at a predetermined duty
cycle, e.g., at a rate of about fifteen to thirty Hertz (15-30 Hz),
depending upon how much information is needed. This mode of
operation may allow a smaller capacitor or other energy storage
device to be used, while still allowing substantially continuous
monitoring with no specific duration limit.
This quasi-continuous mode may also be implemented by the implant
10 in a hybrid mode. The external transducer 70 may transmit an
energizing signal whenever the operation of the implant 10 allows
it. For example, when the implant 10 is obtaining and/or processing
data or between bits being transmitted by the implant 10, the
energy transducer 14 may be available to receive additional energy
from the external transducer. These additional energizing signals
may be used to "top off" the charge on the energy storage device,
thereby substantially extending the length of time that the implant
10 may operate.
In a further alternative embodiment (not shown), the implant may be
operated in full-duplex mode. To facilitate this mode, the energy
transducer is generally configured to transmit at a different
frequency than the data signal transmissions of the implant. This
may be achieved by providing one or more separate energy
transmitters and receivers in the external transducer.
Alternatively, the external transducer may include a single energy
transducer and a circuit for separating the data transmission
frequency, similar to the transmission circuit shown in FIG. 7 and
described above. Thus, the external transducer and the implant may
both be configured for filtering and/or otherwise separating the
two transmissions from one another. Full-duplex mode may allow the
implant truly to operate continuously. Because the energy
transducer of the implant may receive energy substantially
continuously from the external transducer via the energizing
transmission, the implant may sample and transmit data
substantially indefinitely, if desired, or until a stop command is
transmitted from the external transducer.
Although full-duplex mode allows continuous operation of the
implant, the half-duplex mode also has advantages over the
full-duplex mode. First, because of its higher efficiency, i.e.,
only activating components as they are needed, half-duplex mode may
reduce the amount of energy consumed by the implant 10, allowing
the implant 10 to operate at higher voltages, although for
relatively short periods of time. Second, simultaneous energizing
and transmitting in full-duplex mode may cause interference between
the energizing and data signal transmissions. In particular,
because the energizing transmission is much stronger than the data
signal transmission, the energizing transmission may create
background noise for the signal transmission. In half-duplex mode,
the energizing and data signal transmissions are separated in time,
increasing the fidelity and detection of the signal transmission.
Finally, half-duplex mode may allow a single energy transducer to
be used as both an energy exchanger and as a transmitter,
simplifying construction of the implant and possibly reducing the
amount of acoustic energy needed.
It will be appreciated that the above descriptions are intended
only to serve as examples, and that many other embodiments are
possible within the spirit and the scope of the present
invention.
* * * * *