U.S. patent number RE41,603 [Application Number 11/342,237] was granted by the patent office on 2010-08-31 for tiled electronic display structure and method for modular repair thereof.
Invention is credited to Dennis Lee Matthies.
United States Patent |
RE41,603 |
Matthies |
August 31, 2010 |
**Please see images for:
( Certificate of Correction ) ** |
Tiled electronic display structure and method for modular repair
thereof
Abstract
A tiled display structure is formed containing a plurality of
image tiles. A method for assembling a tiled display structure that
includes a transparent front panel and a plurality of image tiles
is disclosed. The method includes the steps of: (1) heating a heat
activated adhesive to a working temperature; (2) applying the
softened adhesive to the front surface of the display section of an
image tile, or the inner surface of the transparent front panel;
(3) aligning the surface of the display section of the image tile
with the inner surface of the transparent front panel; (4) cooling
the adhesive. Another aspect of the invention is a modular method
of repairing a tiled display structure, which includes a
transparent front panel, a heat activated adhesive, and a plurality
of image tiles.
Inventors: |
Matthies; Dennis Lee
(Princeton, NJ) |
Family
ID: |
30116273 |
Appl.
No.: |
11/342,237 |
Filed: |
January 27, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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Reissue of: |
09716535 |
Nov 20, 2000 |
06683665 |
Jan 27, 2004 |
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Current U.S.
Class: |
349/73; 349/192;
349/187 |
Current CPC
Class: |
H01L
27/3293 (20130101); G02F 1/13336 (20130101); G02F
1/1309 (20130101); G02F 2202/28 (20130101) |
Current International
Class: |
G02F
1/1333 (20060101) |
Field of
Search: |
;349/73,187,192 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
G Muller, R. Mach, G. U. Reinsperger, L. Schrottke; "Tiling
Thin-Film Electroluminescent Displays," SID 91 Digest, pp. 567-570.
cited by other .
S.C. Thayer, "Late-News Paper: Modular Wall-Size IC-Driven
Flat-Panel Displays," SID 92 Digest pp. 950-953. cited by other
.
N. Mazurek, T. Zammit, "A 51-in.-Diagonal Tiled LCD VGA Monitor,"
SID 93 Digest, pp. 614-617. cited by other .
S. C. Thayer, "Active Driven TFEL Displays Using Ceramic Tiling,"
SID 93 Digest, pp. 618-621. cited by other.
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Primary Examiner: Caley; Michael H
Claims
What is claimed:
1. A tiled display structure comprising.[.;.]. .Iadd.:.Iaddend. a
plurality of image tiles; a transparent front panel having an outer
surface and an inner surface; .[.and.]. a heat activated adhesive
coupling the plurality of .Iadd.image .Iaddend.tiles to the inner
surface of the transparent front panel; .Iadd.and.Iaddend.
.[.wherein.]. .Iadd.a heating element configured to selectively
soften .Iaddend.the heat activated adhesive .[.softens.]. with the
application of heat .Iadd.at a softening temperature, .Iaddend.and
.[.has a working.]. .Iadd.wherein the softening
.Iaddend.temperature .[.which is greater than an operating
temperature of the plurality of tiles and.]. .Iadd.is .Iaddend.less
than a damage threshold temperature of the plurality of .Iadd.image
.Iaddend.tiles.
2. The tiled display structure of claim 1, wherein each .Iadd.image
.Iaddend.tile comprises.[.;.]. .Iadd.:.Iaddend. a circuit board;
and a display section including a glass substrate having a front
surface and a back surface including a plurality of pixel
structures, each pixel structure defining a pixel area and having
an active region which occupies a portion of the pixel area, the
plurality of pixel structures being arranged in a matrix having
rows and columns and including a plurality of contacts for
receiving electrical signals.
3. The tiled display structure of claim 2, further comprising a
black matrix mask having a plurality of rows and columns of
dark-colored lines, the plurality of lines being substantially
equal in width and defining a plurality of transparent regions
.[.oh.]. .Iadd.on .Iaddend.the transparent front panel; wherein
each of the plurality of transparent regions defined by the black
matrix mask corresponds to an active region of a respective one of
the .Iadd.plurality of .Iaddend.pixel structures in the tiled
display device.
4. The tiled display structure of claim 3, wherein the black matrix
mask is coupled to the inner surface of the transparent front panel
and the heat activated adhesive is disposed on the black matrix
mask.
5. The tiled display structure of claim 4, wherein the plurality of
lines in the black matrix mask contain resistive heating
elements.
6. The tiled display structure of claim 3, wherein the black matrix
mask is coupled to the outer surface of the transparent front
panel.
7. The tiled display structure of claim 3, further
comprising.[.;.]. .Iadd.:.Iaddend. a plurality of row mullions
extending horizontally between the plurality of image tiles; and a
plurality of column mullions extending vertically between the
plurality of image tiles; wherein the heat activated adhesive is
disposed on the plurality of row mullions and the plurality of
column mullions.
8. The tiled display structure of claim 7, wherein the plurality of
row mullions and the plurality of column mullions include one of
resistive heating elements and absorptive heating elements.
9. The tiled display structure of claim 1, wherein the working
temperature of the heat activated adhesive is greater than
80.degree. C. and less than 150.degree. C.
10. The tiled display structure of claim 1, wherein the heat
activated adhesive is a thermoplastic material.
11. The tiled display structure of claim 10, wherein the
thermoplastic material contains at least one of polystyrene and
acrylic.
12. The tiled display structure of claim 2, wherein the heat
activated adhesive is transparent.
13. The tiled display structure of claim 12, wherein the heat
activated adhesive is disposed substantially evenly over the front
surface of the glass substrate.
14. The tiled display structure of claim 2, further comprising a
plurality of heating elements coupled to the glass substrates of
.Iadd.each of .Iaddend.the respective plurality of .Iadd.image
.Iaddend.tiles.
15. The tiled display structure of claim 2, wherein.[.;.].
.Iadd.:.Iaddend. the heat activated adhesive is formed on the inner
surface of the transparent front panel as a plurality of rows and
columns of dark-colored lines, the plurality of lines being
substantially equal in width and defining a plurality of
transparent regions; and each of the plurality of transparent
regions defined by the black matrix mask corresponds to the active
region of a respective one of the pixel structures in a
corresponding one of the image tiles.
16. A method of assembling a tiled display structure that includes
a transparent front panel which has an inner surface and an outer
surface, and a plurality of image tiles, each image tile including
a display section which has a plurality of pixels in a matrix of
rows and columns, the method comprising the steps of.[.;.].
.Iadd.:.Iaddend. heating a heat activated adhesive to a working
temperature above a softening point temperature and below a damage
threshold temperature of the plurality of image tiles.Iadd.,
wherein the tiled display structure comprises a heating element
configured to selectively reheat the heat activated
adhesive.Iaddend.; applying the heat activated adhesive to at least
one of a surface of the display section of one .[.of: a).].
.Iadd.of .Iaddend.the plurality of image tiles .[.and b).].
.Iadd.or .Iaddend.the inner surface of the transparent front panel;
bringing the surface of the display section of the one of the
plurality of image tiles into alignment with the inner surface of
the transparent front panel such that the heat activated adhesive
forms a thin layer between the surface of the display section or
the one of the plurality of image tiles and the inner surface of
the transparent front panel; and cooling the heat activated
adhesive to a temperature below the softening point
temperature.
17. The method of claim 16.Iadd., .Iaddend.further comprising the
step of coupling a black matrix mask containing a plurality of
transparent regions to the transparent front panel using means
which remain coupled at a temperature less than a bonding
temperature which is greater than the working temperature.
18. The method of claim 17, wherein the step of bringing the
surface of the display section of the one of the plurality of image
tiles into alignment further comprises the step of arranging the
one tile so that each pixel is centered on a respective one of the
transparent regions of the black mask.
19. The method of claim 16.Iadd., .Iaddend.further comprising the
step of coupling a plurality of row mullions and a plurality of
column mullions to the inner surface of the transparent front panel
using means which remain coupled at a temperature less than a
bonding temperature which is greater than the working temperature,
thereby defining a plurality of regions on the transparent front
panel substantially corresponding with the plurality of image tiles
in the tiled display device.
20. The method of claim 19, wherein the step of bringing the
surface of the display section of the one of the plurality of image
tiles into alignment further comprises the step of arranging the
one .[.tile.]. of the plurality of image tiles so that the one
.[.tile.]. .Iadd.of the plurality of image tiles .Iaddend.is
centered in one of the plurality of regions defined by the
plurality of row mullions and the plurality of column mullions.
21. The method of claim 16, further comprising the step of placing
the display section and the transparent front panel in a vacuum to
prevent gas pockets from forming .Iadd.within .Iaddend.the thin
layer of heated, heat activated adhesive when the one .Iadd.of the
plurality of .Iaddend.image .[.tile.]. .Iadd.tiles .Iaddend.is
brought into alignment with the surface of the display section.
22. The method of claim 16, wherein the heat activated adhesive is
applied .[.to the at least one surface.]. in a star pattern.
23. A method of repairing a tiled display structure that includes a
transparent front panel which has an inner surface and an outer
surface, a heat activated adhesive, and a plurality of image tiles
including at least one defective tile, each image tile including a
display section, the method comprising the steps of.[.;.].
.Iadd.:.Iaddend. heating .Iadd., using a heating element coupled to
the transparent front panel, .Iaddend.the heat activated adhesive
to a working temperature above a softening point temperature and
below a damage threshold temperature of the plurality of image
tiles in a region of the tiled display structure corresponding to
the at least one defective tile; removing the at least one
defective tile from the inner surface of the transparent front
panel; bringing a surface of a display section of a replacement
image tile into alignment with a portion .Iadd.of .Iaddend.the
inner surface of the transparent front panel in the region
corresponding to the at least one defective tile such that the heat
activated adhesive forms a thin layer between the surface of the
display section of the replacement image tile and the inner surface
of the transparent front panel; and cooling the heat activated
adhesive to a temperature below the softening point
temperature.
24. The method of claim 23.Iadd., .Iaddend.further comprising the
step of applying further heat activated adhesive to at least one of
.[.a.]. .Iadd.the .Iaddend.surface of .[.a.]. .Iadd.the
.Iaddend.display section of .[.a.]. .Iadd.the .Iaddend.replacement
image tile and .[.a.]. .Iadd.the .Iaddend.portion of the inner
surface of the transparent front panel in the region of the
.Iadd.at least one .Iaddend.defective tile before bringing the
surface of the display section of the replacement image tile into
alignment with the portion of the inner surface of the transparent
front panel.
25. The method of claim 24.Iadd., .Iaddend.further comprising the
step of removing the heat activated adhesive from the .[.region.].
.Iadd.portion .Iaddend.of the inner surface of the transparent
front panel corresponding to the .Iadd.at least one
.Iaddend.defective tile before applying the further heat activated
adhesive.
26. The method of claim 23.Iadd., .Iaddend.wherein the step of
heating the heat activated adhesive includes at least one of.[.;.].
.Iadd.:.Iaddend. exposing the region of the tiled display structure
to heated air from a heat gun; illuminating the region of the tiled
display structure with an optical heat source; contacting the
region of the tiled display structure with a resistive heating
element; exposing the region of the tiled display structure to a
microwave source; exposing the region of the tiled display
structure to a flame; and immersing the region of the tiled display
structure in a hot liquid.
.Iadd.27. A display device comprising: a transparent panel
comprising a first surface and a second surface; a tiled display
comprising at least one display tile coupled to at least one of the
first surface or the second surface of the transparent panel with a
heat activated adhesive; and a heating element configured to soften
the heat activated adhesive at a first temperature that is higher
than an operating temperature of the tiled display..Iaddend.
.Iadd.28. The display device of claim 27, wherein a plurality of
display tiles are coupled to the at least one of the first surface
or the second surface of the transparent panel with a heat
activated adhesive..Iaddend.
.Iadd.29. The display device of claim 27, wherein the at least one
display tile comprises: a circuit board; a display section
including a front plate having a first surface and a second
surface; and a pixel structure formed on the second surface of the
front plate, wherein the pixel structure defines a pixel area and
has an active region that occupies a portion of the pixel
area..Iaddend.
.Iadd.30. The display device of claim 29, wherein the at least one
display tile comprises an insulating layer configured to insulate
the circuit board from the display section..Iaddend.
.Iadd.31. The display device of claim 29, wherein the front plate
comprises a glass substrate..Iaddend.
.Iadd.32. The display device of claim 29, wherein the heat
activated adhesive is disposed substantially evenly over the first
surface of the front plate..Iaddend.
.Iadd.33. The display device of claim 29, wherein the heating
element is coupled to the front plate..Iaddend.
.Iadd.34. The display device of claim 29, wherein the pixel
structure comprises a matrix of row electrodes and column
electrodes, and wherein the pixel structure includes a contact
capable of receiving an electrical signal..Iaddend.
.Iadd.35. The display device of claim 29, wherein the heat
activated adhesive is disposed on the front surface of the
transparent panel as one or more rows and columns of dark-colored
lines, wherein the dark-colored lines define one or more
transparent regions, and wherein the one or more transparent
regions correspond to the active regions of respective pixel
structures..Iaddend.
.Iadd.36. The display device of claim 27, further comprising: a
matrix mask having rows and columns of lines, wherein the lines are
substantially equal in width and define one or more transparent
regions on the transparent panel; wherein at least one of the one
or more transparent regions corresponds to an active region of a
pixel structure of the display tile..Iaddend.
.Iadd.37. The display device of claim 36, wherein the matrix mask
is coupled to the first surface or the second surface of the
transparent panel, and wherein the heat activated adhesive is
disposed on the matrix mask..Iaddend.
.Iadd.38. The display device of claim 36, wherein the lines of the
matrix mask include resistive heating elements..Iaddend.
.Iadd.39. The display device of claim 27, wherein the at least one
display tile is attached to a second display tile via a
mullion..Iaddend.
.Iadd.40. The display device of claim 39, wherein the heat
activated adhesive is disposed on the mullion..Iaddend.
.Iadd.41. The display device of claim 40, wherein the mullion is
coupled to the second display tile by the heat activated
adhesive..Iaddend.
.Iadd.42. The display device of claim 41, wherein the mullion is
coupled to the transparent panel by a second heat activated
adhesive, wherein the second heat activated adhesive is configured
to soften at a second temperature that is higher than the first
temperature..Iaddend.
.Iadd.43. The display device of claim 40, further comprising a
plurality of mullions arranged in one or more rows and in one or
more columns extending between a plurality of display
tiles..Iaddend.
.Iadd.44. The display device of claim 40, wherein the mullion
includes at least one of a resistive heating element, an absorption
heating element, or a thermocouple heating element..Iaddend.
.Iadd.45. The display device of claim 27, wherein the first
temperature is greater than 80.degree. C. and less than 150.degree.
C..Iaddend.
.Iadd.46. The display device of claim 27, wherein the heat
activated adhesive comprises a thermoplastic material..Iaddend.
.Iadd.47. The display device of claim 46, wherein the thermoplastic
material includes at least one of polystyrene or
acrylic..Iaddend.
.Iadd.48. The display device of claim 27, wherein the heat
activated adhesive is transparent..Iaddend.
.Iadd.49. The display device of claim 27, wherein the at least one
display tile comprises a reflective display material..Iaddend.
.Iadd.50. The display device of claim 27, wherein the at least one
display tile comprises a low power display material..Iaddend.
.Iadd.51. The display device of claim 27, wherein the at least one
display tile comprises a bistable, reflective cholesteric (BRC)
liquid crystal material..Iaddend.
.Iadd.52. A method of assembling a display device comprising:
heating a heat activated adhesive to a working temperature, wherein
the working temperature is higher than a softening temperature of
the heat activated adhesive; after said heating, applying the heat
activated adhesive to a display tile or a surface of a transparent
panel, wherein the display device comprises a heating element
configured to selectively reheat the heat activated adhesive;
attaching the display tile to the surface of the transparent panel;
and cooling the heat activated adhesive to a temperature below the
working temperature to harden the adhesive..Iaddend.
.Iadd.53. The method of claim 52, further comprising attaching a
black matrix mask to the surface of the transparent panel using an
adhesive that remains bonded at a temperature greater than the
working temperature, wherein the black matrix mask defines a
plurality of transparent regions..Iaddend.
.Iadd.54. The method of claim 53, further comprising aligning the
display tile with the transparent panel so that the display tile is
centered on a respective transparent region defined by the black
matrix mask..Iaddend.
.Iadd.55. The method of claim 52, further comprising attaching a
plurality of row mullions and column mullions to the transparent
panel to define a plurality of regions for receiving the display
tile..Iaddend.
.Iadd.56. The method of claim 55, further comprising aligning the
display tile with a respective region of the plurality of regions
for receiving the display tile..Iaddend.
.Iadd.57. The method of claim 52, further comprising attaching a
back panel to the display tile and the transparent
panel..Iaddend.
.Iadd.58. The method of claim 57, further comprising electrically
connecting the back panel to the display tile..Iaddend.
.Iadd.59. The method of claim 52, further comprising placing the
display tile and the transparent panel in a vacuum to prevent gas
pockets from forming in the layer of heat activated
adhesive..Iaddend.
.Iadd.60. The method of claim 52, wherein the step of applying the
heat activated adhesive comprises applying the heat activated
adhesive to the display tile or the surface of the transparent
panel in a star pattern..Iaddend.
.Iadd.61. A method of repairing a display device comprising:
selectively heating, using a heating element of the display device,
a heat activated adhesive to a working temperature that is higher
than a softening temperature of the heat activated adhesive,
wherein the heat activated adhesive is in contact with a defective
display tile that is coupled to a transparent panel; removing the
defective display tile from the transparent panel; attaching a
replacement display tile to the transparent panel in a region
formerly occupied by the defective display tile, wherein the heat
activated adhesive is configured to form a layer between the
replacement display tile and the transparent panel; and cooling the
heat activated adhesive to a temperature below the softening
temperature to secure the replacement display tile to the
transparent panel..Iaddend.
.Iadd.62. The method of claim 61, further comprising: loosening a
neighboring display tile of the defective display tile by heating a
second heat activated adhesive corresponding to the neighboring
display tile; replacing the neighboring display tile; and cooling
the second heat activated adhesive to a second temperature below
the softening temperature to secure a replacement neighboring
display tile to the transparent panel..Iaddend.
.Iadd.63. The method of claim 61, further comprising applying
additional heat activated adhesive to the replacement display tile
or the transparent panel in the region formerly occupied by the
defective display tile..Iaddend.
.Iadd.64. The method of claim 63, further comprising removing the
heat activated adhesive from the transparent panel in the region
formerly occupied by the defective display tile prior to applying
the additional heat activated adhesive..Iaddend.
.Iadd.65. The method of claim 61, further comprising: applying
additional heat activated adhesive to a mullion defining at least a
portion of the region formerly occupied by the defective display
tile; and aligning the replacement display tile with the region
formerly occupied by the defective display tile according to the
mullion..Iaddend.
.Iadd.66. The method of claim 61, further comprising aligning the
replacement display tile with the region formerly occupied by the
defective display tile, wherein at least a portion of the region is
defined by a black matrix mask..Iaddend.
.Iadd.67. The method of claim 61, wherein the step of heating the
heat activated adhesive further comprises exposing the region
formerly occupied by the defective display tile to heated air from
a heat gun..Iaddend.
.Iadd.68. The method of claim 61, wherein the step of heating the
heat activated adhesive further comprises illuminating the region
formerly occupied by the defective display tile with an optical
heat source..Iaddend.
.Iadd.69. The method of claim 61, wherein the step of heating the
heat activated adhesive further comprises contacting the region
formerly occupied by the defective display tile with a resistive
heating element..Iaddend.
.Iadd.70. The method of claim 61, wherein the step of heating the
heat activated adhesive further comprises exposing the region
formerly occupied by the defective display tile to a microwave
source..Iaddend.
.Iadd.71. The method of claim 61, wherein the step of heating the
heat activated adhesive further comprises exposing the region
formerly occupied by the defective display tile to a
flame..Iaddend.
.Iadd.72. The method of claim 61, wherein the step of heating the
heat activated adhesive further comprises immersing the region
formerly occupied by the defective display tile in a hot
liquid..Iaddend.
Description
BACKGROUND OF THE INVENTION
The present invention concerns electronic display devices and, in
particular, a method for repairing tilemodules in large-area
display devices that are formed as an array of tiled display
devices.
There is an unmet need for large-area flat displays. No clear
solution is apparent in the market place. This unmet need is
becoming increasingly critical since the advancement of information
results in increasing amounts of data to be displayed. A solution
for large-area displays is needed to serve as the human interface
for conveying information from sensors, computers, databases,
cameras, etc. in this information dominated age. Many critical
applications demand large-area displays: Home theater applications
Applications that require multiple viewers Applications in which
the user needs to move about in an area Applications where
simulation of the real world is needed for training.
The requirements for each application differs in size, shape, total
number of picture elements (pixels), and brightness. Requirements
that are common to most applications include, a relatively large
number of pixels, color, ruggedness, portability (minimum thickness
and weight), reliability, low power, and affordable cost. A good
display solution does not exist for these needs using present
technology.
There are fundamental technical issues that impose scaling-laws and
limit the complexity and size of displays that can be profitably
manufactured. These fundamental limitations are one reason why a
technical solution that meets the need for large-area displays has
not been achieved.
One measure of the complexity of a display device is its total
number of pixels. The evolution of display technology has made
newer and more complex pixel formats possible--VGA, SVGA, XGA, and
SXGA for instance. Increased complexity typically is accompanied by
added costs. The underlying cause of this empirical complexity law
is yield losses caused by random material or particle defects.
These defects cause manufacturing yields to diminish as the number
of pixels in the display increases.
The measure of size of the display is its area. Costs increase
exponentially with size. Each technology, LCD, PDP, EL, etc., has
its own limit on maximum size. The underlying technical cause of
this empirical relationship is tolerance. It is desirable to hold
tight tolerances in manufacturing displays because, as the size
increases, the effects of thermal expansion, humidity, residual
stresses, and physical sag become more important.
Building a large-area display out of smaller tiles has been
recognized as a desirable solution. Tiling is an approach that
provides great flexibility for size and shape. Tiling is not
subject to many of the problems that limit the size of monolithic
display technologies. The complexity law does not apply because,
depending on the size of the tile, the basic unit of manufacture in
tiled displays is less complex than a large, monolithic multipixel
display. The size law is not a limiting factor because the basic
unit of manufacture is relatively small. Tiled displays obey a
scaling-law which is not exponential but linear with display area.
This fundamentally different scaling behavior is one advantage of
tile technology. It makes these displays possible and reduces
manufacturing costs.
These same issues lead to a desire to provide a repair means for
large-area display devices, particularly the issues of ruggedness,
reliability and affordable price. The smaller the unit that must be
replaced, or repaired, when a defect occurs, the less the expense
incurred in the repair. Again tiling may provide-an answer, through
the approach of modular repair. In a tiled display the individual
tiles are desirably inexpensive, relatively, to manufacture. A
system designed to allow for the replacement of an individual tile
is, therefore, less expensive to repair. Also the expense of the
repair would depend on the size and complexity of the individual
tiles, not the size and complexity of the entire display,
eliminating the scaling-law issue of large-area displays with
regard to their repair.
One type of tiled display is disclosed in U.S. patent application
Ser. No. 09/250,324 filed on Feb. 16, 1999, which is incorporated
herein by reference for its teaching on tiled displays. This
application describes an OLED display which is formed as tiles that
may be joined together to provide a large-area display device.
SUMMARY OF THE INVENTION
The present invention is embodied in a tiled display structure
containing a plurality of image tiles. The plurality of image tiles
are coupled to a transparent front panel of the display structure
using a heat-activated adhesive.
The present invention is embodied in a method for assembling a
tiled display structure that includes a transparent front panel and
a plurality of image tiles, each of which includes a display
section. The first step of this exemplary method is to heat a heat
activated adhesive to a working temperature. The working
temperature is above the softening point temperature of the
adhesive and below a damage threshold temperature of the tiles. The
softened adhesive is applied to at least one of: the front surface
of the display section of an image tile, or the inner surface of
the transparent front panel. Next the surface of the display
section of the image tile is aligned with the inner surface of the
transparent front panel such that the adhesive forms a thin layer
between the two surfaces. Then the adhesive is cooled below the
softening point temperature to couple the tile to transparent front
panel.
Another aspect of the present invention is a method of repairing a
tiled display structure, which includes a transparent front panel,
a heat activated adhesive, and a plurality of image tiles, each
image tile including a display section. The first step of this
exemplary method is to heat the heat activated adhesive in a region
of the tiled display structure corresponding to a defective tile to
a working temperature. The working temperature is above the
softening point temperature of the adhesive and below a damage
threshold temperature of the tiles. The defective tile is then
pulled away from the inner surface of the transparent front
panel.
Once the defective tile has been removed, heated heat activated
adhesive may be applied to at least one of: the front surface of
the display section of a replacement image tile, and the inner
surface of the transparent front panel in the region of the
defective tile. The surface of the display section of the
replacement image tile is aligned with the portion the inner
surface of the transparent front panel in the region of the
defective tile such that the adhesive forms a thin layer between
the surface of the display section of the replacement image tile
and the inner surface of the front panel. The adhesive is then
cooled below the softening point temperature to couple the
replacement tile to the transparent front panel.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a front plan drawing of an exemplary large area display
device from which two tiles have been removed.
FIG. 2 is an exploded perspective view of an exemplary display
tile.
FIG. 3 is a cut-away side plan view of the glass plate of a pixel
of a tile which is useful for describing a method for forming a
black matrix for the display.
FIG. 4 is a cut-away side plan view of a portion of the glass
plates of two adjacent tiles and the front panel which is useful
for describing a method for forming a black matrix including
mullions for the display.
FIG. 5 is a cut-away side plan view of a portion of the glass
plates of two adjacent tiles and the front panel which is useful
for describing an alternate method for forming a black matrix for
the display. Two methods of including a heating element in a video
tile are also illustrated.
FIG. 6 is a cut-away side plan view of a portion of the glass
plates of two adjacent tiles and the front panel which is useful
for describing a method of modular display repair.
FIG. 7 is a cut-away side plan view of a portion of the glass
plates of two adjacent tiles and the front panel which is useful
for describing an alternate method of modular display repair.
FIG. 8 is a cut-away side plan view of a portion of the glass
plates of two adjacent tiles and the front panel which is useful
for describing an alternate method of modular display repair. A
method of including a heating element in a video tile is also
illustrated.
FIG. 9 is a cut-away side plan view of a portion of the glass
plates of two adjacent tiles and the front panel which is useful
for describing an alternate method of modular display repair.
FIG. 10A is a perspective view of an exemplary row mullion, which
may used in modular display repair.
FIG. 10B is a perspective view of an exemplary column mullion which
may used in modular display repair.
FIG. 11 is a partially exploded perspective view of the tiled
display shown in FIG. 1 which is useful for describing an exemplary
mounting method and an exemplary implementation of a black matrix
for the tiled display.
FIG. 11A is a detailed view of a portion of the partially exploded
perspective view shown in FIG. 11.
FIG. 12 is a flowchart describing an exemplary modular display
repair method.
FIG. 13 is a flowchart describing another exemplary modular display
repair method.
FIG. 14 is a flowchart describing a third exemplary modular display
repair method.
FIG. 15 is a flowchart describing an exemplary assembly method for
a modular display system.
FIG. 16 is a front plan drawing of an exemplary display tile
illustrating transparent adhesive which has been applied in an
exemplary star pattern for assembly.
DETAILED DESCRIPTION
The invention is described in terms of exemplary embodiments that
are illustrated in the drawing figures. The drawing figures are not
to scale. Indeed, dimensions of the drawing figures are exaggerated
to aid in the description of the invention. Although the invention
is described in terms of an optical light emitting diode (OLED)
display device, it is contemplated that it may be practiced with
other emissive display technologies such as electroluminescent,
light emitting diode (LED) or plasma technology; or with reflective
display technologies such as Bistable, Reflective Cholesteric (BRC)
liquid crystal technology.
FIG. 1 is a front plan view of a partially assembled large-area
display 100 according to the present invention. The display 100 is
a tiled display in which emissive or reflective elements, on which
the image pixels are formed, are built as relatively small arrays
on tiles 120 and assembled into a frame to produce the large-area
display having a large number of pixel forming elements.
Alternatively, the tiles may be assembled side-to-side with their
pixels aligned in rows and columns without a frame. In this
instance, the individual tiles may be held together by
mullions.
The tiles are constructed with pixel forming elements evenly spaced
up to the edges of the tiles. As described below with reference to
FIGS. 4 through 11A, the tiles are formed such that, when they are
joined, the inter-pixel distance between the edge pixels of two
adjacent tiles is the same as the inter-pixel distance of adjacent
pixels in the interior of a tile. The display shown in FIG. 1 is
missing two tiles 122 and 124. These tiles are inserted into the
positions 102 and 104 to complete the display.
Although the display 100 is shown as being formed from tiles having
16 pixel forming elements in a four by four array, it is
contemplated that each tile may include many more pixels. In one
exemplary embodiment of the invention, described below, each tile
includes 6400 pixel-forming elements arranged as a 80 by 80 matrix.
These tile sizes are only exemplary. It is contemplated that each
tile may include more or fewer pixel forming elements. In addition,
it is contemplated that a single display may be formed from tiles
having different numbers of pixel forming elements. For example, a
display may have tiles with relatively large numbers of pixel
forming elements near the center and tiles having relatively small
numbers of pixel forming elements near the edges.
In one exemplary embodiment of the invention, the pixel forming
elements are made from an organic light emitting diode (OLED)
material. The basic light emitting structure consists of a thin
organic polymer layer sandwiched between a pair of appropriately
selected and patterned electrodes. Current flowing from one
electrode to the other electrode causes the organic polymer to emit
light. At least one of the electrodes is desirably transparent to
the emitted light. Indium tin-oxide is the usual material used for
this purpose. OLED materials provide high brightness and high
efficiency, and are relatively low cost materials.
An exemplary display structure according to the present invention
is formed in two parts: a display section and an electronics
section. These two parts are made separately and then joined to
form a complete tile. The display section consists of a transparent
glass layer on which are transparent column electrodes are
deposited. The OLED material is deposited onto these layers, as the
active (i.e., light-emitting) medium. Row electrodes are deposited
as the final display layer. Additional layers such as blocking or
passivation layers may be present to improve the function or life
of the display layers. The transparent electrode is preferably the
hole-injecting electrode and the other electrode is preferably the
electron-injecting electrode. The OLED materials between the
electrodes are preferably conjugated polymer materials that are
applied by thick film processes; however, small molecule materials
can alternatively be applied by various thin film deposition
techniques. The layers are patterned so that there is electrical
access to each row and column at one or more points.
As an alternative to the OLED materials, the pixel forming elements
of the tiles may be any of a number of emissive devices such as
electroluminescent elements, light emitting diodes, field emissive
elements, plasma elements or cathodoluminescent elements.
The electronics section is formed by punching or drilling vias
through the circuit board and then printing or otherwise depositing
the conductive traces on the circuit board. The conductive ink or
paste used to form the conductive traces may also fill the vias.
The vias make contact with the row and column electrodes of the
display section when the electronics section and the display
section are joined to form a tile.
Although it is not illustrated, another exemplary embodiment of the
present invention includes a pixel forming structure that is
appropriate for applications in which either a reflective or low
power display is needed. The substrate and the electronics of this
new structure are essentially the same as described below for the
OLED embodiments. The display layer in this alternative embodiment,
however, is a reflective display material. For example, a Bistable,
Reflective Cholesteric (BRC) liquid crystal material which provides
for a low power, bistable display. The disclosed tile structure
enables, for the first time, video-rate displays in large area BRC
displays. These materials switch between a planar, reflective state
and a relatively transparent focal conic state. Utilizing a black
backing, these two states may appear colored and black. The BRC
materials offer distinct advantages for large area filed displays:
the operation between a reflecting and transparent state, combined
with a black back-plane makes possible bright, high contrast
displays under a variety of lighting conditions; and the
bistability also allows for maintaining static images with no power
applied.
One exemplary tile structure consists of a multilayer ceramic
circuit board 132 that serves as a substrate upon which: the
display material is mounted on the viewer side while the
electronics 134 (active and passive) for drive or other functions
are mounted mostly on the back side. Conductor elements 132 are
printed on the individual layers to provide interconnections
between the electronics and the display material, vias interconnect
the conductors in different layers; and connectors are provided on
the back surface to connect to external power and signal sources.
The tile structure may also have a structural layer(s) such as a
high softening point metal or insulator to provide freedom from
distortion during the processing of the ceramic materials, and/or
thermal management during the operation of the display. The tile
structure also contains a transparent layer (e.g. glass) on the
viewer surface to protect or contain the display material. A back
panel structure is provided to mount the individual tiles and to
provide electrical connection to the power and drive signals needed
by each individual tile structure.
The Multilayer ceramic circuit board 130 may be formed of layers of
ceramic material. The layers are first formed and processed to form
vias, conductors, and other features and then assembled in a stack
taking care to carefully align each layer with those layers
adjacent to it. Ceramic material here is meant in the broadest
sense to include ceramics, glass ceramics, glass, and other high
temperature insulating materials. The multiple layers together with
the connectors and vias provide the basic function of a circuit
board upon which active and passive electrical devices and circuits
can be placed.
The conductors 132 may be thin and/or thick film conductors formed
by any of the standard processes including, for example plating,
evaporation, sputtering, printing and laminating. The materials may
be metals or organic conductors. The conductors may be patterned by
processes that may include, for example, printing or
photolithography. These conductor patterns are formed on the
surfaces of the individual layers in the disclosed structure and
connect to the vias to provide, according to the design of the
device a means of interconnecting the electronics on and external
to the disclosed structure to the display material.
Another class of conductors is used to interconnect the layers.
These conductors are called vias. Via is used in the broadest sense
and includes conductors that go through openings in the layers,
including the substrate and those that go around the edge of a
layers. Vias that go through a layer can be formed, for example, by
making a hole in the layer and filling that hole with a conductor.
Alternatively, preformed physical conductors may be imbedded in the
layer. Vias that go over the edge of a layer(s) can be formed by
physically placing a wire (round or flat), or array of wires, and
wire bonding the ends to the surfaces to be interconnected.
Alternatively they can be formed in place by plating or other
fabrication process for thick or thin film conductors.
A core layer may also be included in this structure. This layer
typically serves as a substrate for the assembly and processing of
the ceramic material. The core layer acts to; eliminate horizontal
shrinkage, establish a single coefficient of expansion for the
multilayer system, and provide mechanical ruggedness to the
multilayer assembly. If the layer is a good electrical conductor it
may also provide RF shielding. If the layer is also a good thermal
conductor, it contributes to the thermal management of the display.
Conductive layers, however, present a special problem for via
connections. Via connections through metal layers can be fabricated
in several ways: filling the periphery of the hole with an
insulating material before putting a metal conductor through the
middle, or by putting the conductor only through the middle leaving
space separating the conductor from the conductive metal core.
The electronics that form the image processing and pixel driving
circuitry are mounted on the layers. Electronics are used in the
broadest sense to include both active and passive, and both
discrete devices mounted on the layers and devices formed in place
by processes such as those now used to make active matrix circuits
for displays on various high temperature substrates. While these
electronics can be placed anywhere, the most convenient location is
the back surface. This permits standard assembly and attachment
equipment and processes to be used. In addition, the placing of
active or passive devices on the intervening layers of viewer
surface permits greater flexibility in the system design.
The display material is applied to the surface visible to the
viewer. Because of the flexibility of the construction of the
disclosed structure, different display materials can be used. In an
exemplary structure the display material is covered by a
transparent layer to protect and contain the display material.
Though this layer may be the transparent electrodes, it is often
desirable to couple an additional, substantially flat layer of
transparent material, such as glass, over the electrodes and
display material.
The edges of the tiles are desirably carefully formed to ensure
that the tiled display has no visible seams between the tiles. One
criterion for the tiles is that the spacing between the pixels
separated by the tile seam is the same as the spacing of pixels on
the tile. To satisfy this criterion, the tile edges are desirably
dimensionally precise. Furthermore, if the edges are also used for
conductors or if mullions are used to join adjacent tiles, it is
desirable to account for the thickness of these conductors or
mullions in the design and placement of the tiles.
The display tiles may be physically mounted to form a display by
coupling the tiles to a transparent front panel. The mounting of
the tiles is done such that there is continuity in the pixel
spacing over the display. The shape of the tiles is most typically
square or rectangular, however the shape can be any shape that can
be tiled to form a larger display. Also, the tile is typically
flat, but may be curved along one or both dimensions to form curved
or domed displays. Curved or domed displays can also be made using
flat tiles mounted on a curved or domed front panel. Tiles may be
attached to the front panel by numerous means. Several exemplary
methods are described below with regard to FIGS. 4-11A.
Different types of tiles may be attached to different areas of the
display--for example, higher resolution areas may be placed in the
center or other areas of the large display. In addition, different
sized or different shaped tiles may be combined in a single
display. For example, tiles near the edges of a large panel may be
larger and have a lesser pixel density than tiles near the center
of the panel.
Alternatively a back panel may be provided for the physical
mounting and interconnection of the tiles to form a display. Again
the mounting of the tiles is done such that there is continuity in
the pixel spacing over the display. Curved or domed displays can
also be made using flat tiles mounted on a curved or domed back
panel. Tiles may be attached to the back panel either by permanent
connection such as soldering or using connectors which allow the
tiles to be plugged into the back panel. This latter method permits
the repair and replacement of individual tiles.
Even if a back panel is not used to for physical mounting of the
display tiles, the back panel may be used to provide the means for
connecting the tiles to the operational power and data signals
needed to operate the tile. Matching connectors may be provided on
both the back side of the tile and the back panel to provide this
connection. In the case of the data signal connections, optical
connection may be used as an alternative to physical
connection.
The electrical structure of the back panel provides for the
distribution of power and signals to the tiles, and the electrical
structure of the tiles provide for the addressing of the display
pixels. Both levels of structure are described. The information
needs of a tiled display increase with the size of the display as
measured in total number of pixels. A greater number of pixels on a
tile translates to greater amounts of data stored on the tile and
greater rates of information transfer.
One advantage of the tiled display is that the scan electronics can
be internal to the tile and the scan rate of any one tile may be
the same for a small display or for a large display. This ensures
that the brightness and gray scale of the display do not degrade
with increasing size. The tiled displays described in detail below
have an architecture which connects the signals to the pixels
without interrupting the continuity of the pixel spacing, even at
the edges of the tiles. The disclosed tiled displays may also have
signal processing circuitry which extracts the signal information
for that tile from a broadcast information signal and transforms
the extracted information into the signals needed to address that
tile.
In general, the front-to-back connections include at least one for
each row of pixels and at least one for each column of pixels on
the tile. Tiled displays have relatively few pixels so that the
number of interconnects per tile is relatively small and the yield
on individual tiles can be high. This is a significant advantage of
tiled displays when compared to fabrication of large displays from
single substrates. In general, the yield is a function of the
number of pixels in the display device. The redundancy provided by
adding more than one connection per row or column may further
increase yield and reliability, and may also reduce line impedance
for the rows and columns.
The connection to the row or column is made with a via that extends
from the back surface of the tile. This via has a diameter less
than the spacing of a pixel. To accomplish this, the portions of
the vias in the display layer(s) may be made smaller than the vias
through the other intervening layers, and, as described below, the
connections may be staggered over the area of the tile to provide
maximum spacing between the wider interconnects. These connections
are a link in the distribution of the display signals to the
pixels.
FIG. 2 is an exploded perspective diagram that shows a first
exemplary tile structure. The tile structure is formed in two
parts: the display section and the electronics section.
The display section includes a transparent front plate which may
be, for example, a glass plate. Transparent column electrodes 322
are formed on the front plate 320 by forming thin bands of a
transparent conductor, such as indium-tin oxide, using well known
processes. This may be done, for example, by depositing a film of
ITO over the surface of the glass plate and selectively etching the
ITO to form the electrodes. The display materials, red, green and
blue OLED materials 324 and 326, including a hole transport layer,
a light emitting layer and an electron injecting layer, are
deposited on top of the column electrodes to define the active area
of the pixel. The hole-transport layer is electrically coupled to
the column electrodes, and the light emitting layer is electrically
coupled to the hole-transport layer. The electron-injecting layer
which may, for example, be formed from metallic calcium is formed
on top of the light emitting layer. The row electrodes 328 are
formed on top of the electron-injecting layer. It is desirable for
the display materials 324 and 326 to occupy only a portion (e.g.
about 25 percent) of the pixel area. The row electrodes may be
formed, for example, from polysilicon or from a metal such as
aluminum using standard deposition techniques. An insulating layer
330 is formed on top of the row electrodes. The exemplary
insulating layer 330 may be formed from any of a number of
insulating materials. To protect the display materials, the
insulating layer 330 is desirably formed using low-temperature
processes. Exemplary materials include Polyimide or other
low-temperature insulating materials. The insulating layer 330 may
be applied using thick film or thin film deposition techniques. The
insulating layer 330 includes a plurality of openings 331 aligned
with the row electrodes 328 or column electrodes 322.
On top of the insulating layer are deposited a plurality of
connecting plates 332. The plates 332 may be formed using, for
example, vapor deposited aluminum or a metallic ink or paste, such
as silver combined with a solvent, which is deposited using thick
film processes. The connecting plates are coupled to the column
electrodes 322 and row electrodes 328 by vias which extend through
the openings in the insulating materials. Each of the exemplary
connecting plates makes electrical contact with only one row
electrode or one column electrode. To ensure that a good connection
is made, however, each connecting plate 332 may connect to its
corresponding row or column electrode at several locations.
The electronics section 312 includes image processing and display
driving circuitry (not shown in FIG. 2) a circuit board 130, which
may be, for example, a thin sheet of alumina (Al.sub.2O.sub.3),
deposited electrical conductors 132, connecting pads 334 and vias
338 which electrically connect the conductors 132 to the connecting
pads 334 through the circuit board 130. The conductors 132, vias
338 and connecting pads 334 may all be formed using thick film
deposition processes to apply a metallic ink or paste. The
connecting pads 334 may also be formed from vapor-deposited
aluminum. There is a one-to-one relationship between the connecting
pads 334 of the electronics section and the connecting plates 322
of the display section. In the exemplary embodiment of the
invention, the connecting pads 334 and the connecting plates 322
are electrically connected by bump bonding the display section to
the electronics section, using solder balls. Alternatively
electrical connection may be formed with an anisotropically
conductive adhesive applied between the display section and the
electronics section. The combined display section and electronics
section forms a tile 120.
It is contemplated, however, that other methods may be used to
electrically connect the connecting pads to their respective
connecting plates. For example, the connecting plates 322 and
connecting pads 334 may be made from a deformable material and
patterned to include a portion which extends above the plane of the
pad or plate. When the electronics section is mated to the display
section, the patterned material on the connecting plates 322 and
connecting pads 334 comes into contact and deforms, forming an
electrical connection between the corresponding connecting pads and
plates. The pads 334 and plates 322 may also be connected by
bump-bonding techniques or using wires that are implanted in one of
the pads 334 or plates 322 and engage the plate 322 or pad 334 when
the electronics section 312 is mated to its corresponding display
section 310.
Other tile configurations are contemplated by the subject
invention. One desirable configuration is a tile that extends the
full length (height) of the display and has a width of, for
example, 32 columns. A tile having this shape would require only
horizontal (vertical) alignment. In addition, the connecting plates
and connecting pads may be made to cover many more columns than
rows, providing many more locations at which to make connections to
the column electrodes than if the connecting plates and connecting
pads were approximately square. It is also contemplated that a
display may be formed from different shaped tiles, for example long
tiles that span the entire height of the display on the sides and
smaller, square tiles near the center of the display. The different
tiles may also employ different pixel pitches such that the tiles
on the sides of the display may have a relatively, large pixel
pitch while the tiles near the center of the display have a
relatively small pixel pitch.
Furthermore, although the exemplary embodiments of the invention
show the electronics sections of the tiles being the same size as
the display sections, it is contemplated that these may be
different sizes. For example, a single electronics section (not
shown) may be as large as two contiguous display sections (not
shown). When assembled, two display sections would be aligned with
and bonded to the single electronics section. A structure of this
sort would still be referred to as a single video tile of the
present invention. In another contemplated configuration, an
electronics section is formed which spans the entire display device
and individual display sections are mounted onto the electronics
section. In this configuration, the electronics section may include
multiple electronics modules 132, but would still be a single video
tile.
It is also contemplated that the electronics sections may be
smaller than the display sections. Thus, an entire display may
consist of a single display section (not shown) that is bonded to
multiple electronics sections (not shown). As in the previous case,
this would still be a single video tile of the present invention.
It may be desirable to manufacture the display sections and the
electronics sections in different sizes to maximize yield of both
components. The assembly of multiple display sections onto a single
electronics section should align the pixels such that no seam is
visible between contiguous display sections.
FIGS. 4 through 11A illustrate another exemplary method by which
tiles 120 may be joined to form a composite tiled display 100. By
definition, there is a physical gap between the tiles in a tiled
display. It is desirable to make this physical gap invisible to the
viewer. Invisible in this context means that light emitted by the
pixels that may be scattered or refracted at the gap should not be
seen by a viewer, and that no external line-of-sight exists which
would enable a viewer to detect the physical gap.
State-of-the-art tiled displays using CRTs or projection displays
use a mullion between the individual displays to hide the physical
gap, however, these mullions are visible to the observer and are
also objectionable to the viewer because they break the continuity
of the image. It is, therefore, desirable that any structure used
to make the gap invisible does not break the continuity of the
larger image.
Another structure commonly found in both tiled and non-tiled
displays is a black matrix. A black matrix may be fabricated from
black lines. The black matrix is put between the active portions of
the pixels to absorb ambient light in these areas in order to
increase the display contrast. Black matrix lines may be found, for
example between the phosphors on the front screen of a CRT or
between the pixel positions defined for a liquid crystal display.
In tiled displays, black matrix lines are typically smaller than
mullions and are typically placed in the plane of the pixels.
Because the black matrix lines are periodic and placed between the
pixels, they do not tend to break the continuity of the image. The
black matrix mask has many advantages in a tiled display system and
the embodiments as described below contain black matrix mask, but
it is contemplated that the tiled display systems and modular
repair methods described below may be practiced without such a
structure.
An embodiment of the present invention employs an optical structure
that may be incorporated in a tiled display to make the physical
gaps between the tiles indistinguishable from the black matrix and,
thus, invisible to the viewer. An illustration of this structure is
shown in FIGS. 11 and 11A. FIG. 11 is a cut-away perspective
drawing of a partially assembled display device. FIG. 11A shows
details of a portion of the display device shown in FIG. 11. The
main components of the structure shown in FIG. 11 are a frame 2014,
a transparent sheet 2020 of, for example, glass or plastic, a
plurality of black lines 2010 that form a black matrix and the
tiles 120 which form the display. An important feature of the
optical integrator structure is a pattern of black lines 2010 which
are like black matrix lines in that they have equal widths and
spacing equal to the pixel pitch. These black lines 2010 may be
aligned to lie between all pixels in the display, including those
pixels on either side of the gaps 2012 between the tiles 120. The
optical integrator pattern of black lines are also like mullions in
that some of the black lines in the optical integrator structure
lie on top of the gaps between the display tiles and block their
visibility. As assembled, the glass substrates 320 of the tiles 120
are positioned adjacent to the black lines 2010 on the back surface
of the transparent sheet 2020, which forms the integrating
structure.
Unlike a conventional black matrix, the disclosed optical structure
for integrating display tiles is placed above the plane containing
the pixels (like mullion structures), on the viewer-side of the
tiles 120, with the black line pattern being in contact with the
display tiles. Unlike mullions, the black lines on the optical
integrator structure 2020 are relatively narrow, so that the black
lines that cover the mullions are essentially the same width as the
black lines which form the black matrix. Thus the disclosed
structure simultaneously provides the functions of the black matrix
and the mullions, but the mullion lines are not visible, as such,
to the viewer because all lines in the pattern on the optical
integrator structure 2020 are essentially the same and are
virtually indistinguishable. Accordingly, the viewer simply sees a
uniform pattern of black lines. A key feature of this aspect of the
present invention is the precise specification of the pattern of
black lines and mullions on the disclosed optical integrator
structure so that the physical gaps between tiles are hidden from
the viewer, and at the same time little or no emitted light is
blocked from exiting the display. In addition, the black matrix and
the mullions do not disturb the continuity of the larger image,
even across the gaps between tiles.
To determine the optimum placement for a black stripe or to mullion
on the front surface of the glass substrate of an emissive display,
it is helpful to understand the properties of light emitted by the
display. FIG. 3 shows a cross section of an exemplary glass
substrate 320 that includes a bottom surface 1710 and a top surface
1712. A number of representative optical rays, 1714, 1716 and 1718
are shown emanating from a point on the lo bottom surface 1710.
Some rays 1714 exit the glass and some rays 1718 are totally
internally reflected from the top surface and are trapped in the
sheet of glass. At the transition between these two types of rays
are rays 1716 which are refracted to an angle parallel to the top
surface 1712 of the substrate 320.
The angle of incidence of the rays 1716 which are at the transition
is called the critical angle (.theta..sub.c). Light reaching the
surface 1712 with angles less than the critical angle exits the
glass, and light reaching the surface 1712 with angles larger that
the critical angle are totally internally reflected. The critical
angle is dependent on the index of refraction, n.sub.glass, of the
glass substrate 320 as shown in equation (1):
.theta..sub.c=Sin.sup.-1(1/n.sub.glass) (1) In the exemplary
embodiment of the invention, n.sub.glass=1.55 and
.theta..sub.c.sup..about.40.degree..
A tiled display is made of tiles that are placed in an array so
that the spacing between pixels across the gap between tiles is
substantially the same as the pitch between pixels within the
display tiles. Thus, the display tile edge is one half pitch
distance (or slightly less) from the center of the last pixel.
Because of the critical angle, light emitted from a point within a
sheet of glass can travel at most a lateral distance of
d.sub.c=t.sub.glass Tan(.theta..sub.c), where t.sub.glass is the
thickness of glass. Therefore, light from any part of a gap region
may be blocked by putting a black stripe of width
W.sub.m>2d.sub.c over the gap region. Such a black stripe may be
the top of the mullion 1512. Because of the symmetry of optics, the
same black stripe blocks any external rays from making the gap
region visible. Thus this black stripe makes the gap region
invisible to an observer. In practice, the black stripe may need to
be slightly wider than 2d.sub.c to fully block lines of sight to
the gap on account of the finite width of the gap. A similar
analysis may be used to determine the appropriate parameters in the
embodiment illustrated in FIG. 5 in which the black matrix mask is
formed on the outer surface of the front panel.
Referring, again, to the structure shown in FIGS. 11 and 11A, the
individual tiles do not need to be joined by discrete mullions.
Instead, the tiles may be assembled directly on the back surface of
the optical integrating structure 2020 such that the gaps are
positioned directly over black stripes having a width W.sub.m. As
shown in FIGS. 11 and 11A, the exemplary optical integrating
structure 2020 is positioned on top of the array of tiles, with the
black lines on the surface of the structure in contact with the
glass substrates 320 of tiles. The centers of the black lines are
aligned with the gaps between the tiles so that the gap regions can
not be seen by an observer. Although this embodiment of the
invention does not need discrete mullions, if the tiles are
connected by mullions 1512, the integrating structure 2020 may
include black lines that cover the crossbars 1610 of the mullions.
In this instance it would be desirable for the crossbar of the
mullion to be as narrow as possible to minimize any gap between the
top surface of the tile 120 and the back surface of the integrating
structure 2020. Alternatively, the mullions 1512 may be assembled
onto the integrating structure 2020 with the black matrix lines. In
this configuration, the mullions form pockets into which tiles 120
are inserted to form the composite display. This structure may be
formed by attaching the mullions directly to the integrating
structure 2020 using an adhesive and then applying an adhesive to
the undersides of the crossbars 1610 and to the sides of the stems
1008 before inserting a tile into the display.
The black lines on the optical integrating structure 2020 that form
the mullions which are used to cover the inter-tile gap tend to be
wider than the typical black matrix line and may block some or all
of the light emitted from the pixels near the edge of the tile. To
allow the maximum amount of light to pass and yet avoid any
artifact distortion in the assembled display device, the display
tiles and the black stripes on the integrating structure 2020 are
desirably specifically designed to have particular
relationships.
FIG. 4 shows a cross section of a pixel that includes two pixel
regions. The emissive regions 1910 at the bottom of the glass
substrate 320 have a width d.sub.P. The light rays that can exit
the glass section and are useful for viewing, exit the top of the
glass 320 in an area having a width w=2d.sub.c+d.sub.P. A display
tile has an array of pixels equally spaced a distance known as P,
the pixel pitch. Therefore, to not block any viewable light, it is
desirable for the black matrix to have a width,
W.sub.m<P-d.sub.P-2d.sub.c. The dimensions illustrated in FIGS.
4-9 depict cases where a stripe of the black matrix mask completely
hides the gap and yet, blocks no emitted light.
As described above, in the exemplary embodiment of the invention,
the pixels on the tiles have an aperture of approximately 25% in
order to allow room within the pixel for a via to make electrical
contact with a column electrode. Thus, in the exemplary embodiment
of the invention, d.sub.P is approximately P/2. This relatively
small aperture also has advantages by making it easier to hide the
inter-tile gap and allowing a relatively large-stripe black matrix
to improve the contrast of the display.
There are two width criteria to be met by the black stripes that
form the black matrix, and the top bar of the mullions:
W.sub.m>2d.sub.c (to hide the gap), and
W.sub.m<P-d.sub.P-2d.sub.c (to avoid blocking light from the
pixels). The most desirable solution is the design point with the
largest glass thickness, where both criteria are met. That design
point is met when the thickness of the glass is 0.15 times P, the
pixel pitch, and the width of the black stripe is 0.25 times the
pixel pitch. Designing the display tile and black matrix stripes to
meet that condition results in making a large area display by
integrating individual tiles behind the optical integrating
structure having inter-tile gaps that cannot be seen. It has been
found that the portion of the gap most often detected is the edge
of the top surface of the glass substrate of the tile, particularly
is if the stem of the mullion is either clear or reflective.
Therefore, W.sub.m may be smaller or the t.sub.glass may be greater
without significantly increasing the visibility of the gaps.
In the embodiment illustrated by FIG. 5 the calculation of d.sub.c
is more complicated because the light passes through three
transparent layers between the emissive pixel material 1910 and the
black matrix 2010. Although it may be desirable to match their
indices of refraction, these three layers may have three different
indices of refraction. Desirably, the adhesive layer 500 is
negligibly thin, leaving only the thicknesses of the glass
substrate 320 and the transparent front panel 2020 to consider. In
this embodiment it may be desirable for one, or both, of these
layers to have a relatively high index of refraction to allow for
greater thickness. It may also be desirable for the aperture
d.sub.P of the emissive region to be slightly smaller in this
embodiment.
When the thickness of the glass substrate 320 and the width of the
black stripe satisfy the criteria described above, no light that is
directed toward a viewer directly in front of the display (e.g.
viewing from a normal angle) is blocked, and no light from greater
viewing angles is blocked. When the thickness of the glass
substrate 320 and/or the width of the black stripe are greater than
the criteria described above, no light that is directed toward a
viewer directly in front of the display (e.g. viewing from a normal
angle) is blocked, but some light from greater viewing angles may
be blocked.
As mentioned above and illustrated in FIGS. 4-11A, the exemplary
black matrix masks 2010 offer several advantages in an exemplary
display tile of the present invention such as: serving as mullions
to hide seams between display tiles (part of the mask pattern may
even be formed by a mullion 1512 as shown in FIGS. 4, 6, 7, and 8);
improving contrast of the display; and, as shown in FIG. 11A,
framing the individual pixels to assist in precise alignment of
display tiles within the display system frame.
FIG. 4 shows a cut-away side view an exemplary embodiment of a
black matrix mask 2010, which includes a mullion 1512, in a portion
of a tiled display system of the present invention. To take full
advantage of the black matrix mask 2010 it is desirable to couple
the front surfaces of the glass substrates 320 of display tiles 120
to the transparent front panel 2020. When the tiles are coupled to
the front panel, the stripes of the black matrix mask are formed of
an opaque adhesive which may be cured during assembly. Many
adhesives, and curing methods, are well known which may be employed
in this embodiment.
If the tiled display is constructed so that the modular repair
method of the present invention may be employed, the adhesive
should be of a type that may be cured to provide a secure bond and
later unbonded to release the tile unharmed. This exemplary
embodiment, and those illustrated in FIGS. 5-10, are described in
terms of a heat-activated adhesive, such as an acrylic or
polystyrene thermoplastic. It is desirable that this heat-activated
adhesive layer have a softening point above the operating
temperature of the video display tile and below the damage
threshold temperature of the video display tile.
In an exemplary embodiment of present invention, these temperatures
are 80 degrees centigrade and 150 degrees centigrade respectively.
The softening point of both acrylic and polystyrene adhesives may
be set by picking the proper molecular weight for the thermoplastic
adhesive used. It will be understood to one skilled in the art that
either of these materials may be used in the present invention, as
well as a number of other adhesive materials.
An additional issue with large-area displays in general, which is
of particular importance in a tiled display system employing a
heat-activated adhesive, is the thermal expansion coefficient
differences between the components of the tiled display. With
regard to the tiles themselves, this issue has been address in two
different ways in two different exemplary embodiments of tile
construction which may be used in the system and methods of the
present invention.
With regard to the exemplary embodiment in which the electronics
section and the display section are formed separately and then
bonded together, the use of solder bumps to electrically connect
the two sections combined with a non-brittle adhesive for
mechanical connection has been described in U.S. patent application
Ser. No. 09/250,329 as a method to avoid problems arising from
possible differences in the thermal expansion coefficient of the
two sections.
In a co-pending US Patent Application entitled DISPLAY TILE
STRUCTURE USING ORGANIC LIGHT EMITTING MATERIALS and filed on an
even date herewith, an exemplary tile embodiment is described in
which the tile is formed on a single substrate. One of the
advantages of this exemplary tile embodiment is that the single
substrate can encourage a single thermal expansion coefficient in
the tile.
The tiled display system of the present invention has two addition
issues relating to thermal expansion. Because the tiles are bonded
directly to the front display panel it is important that the
display section of the tile and the front panel have substantially
the same thermal expansion coefficient. As in the case of the tiles
constructed in two sections, some thermal expansion mismatch can be
absorbed by a non-brittle adhesive layer, but this can leas to the
build up of strain or possible misalignment of pixels and the black
matrix mask. Therefore it is desirable to keep the thermal
expansion coefficients as close as possible. For this reason, an
exemplary embodiment of the present invention uses glass for both
the glass substrate 320 of the tile and the transparent front panel
2020.
Additionally in many of the exemplary modular repair methods of the
present invention it is desirable to only unbond the defective tile
from the display, without loosening its neighbors. When the tiles
are bonded to the front panel with a heat-activated adhesive, this
may mean selectively heating a small portion of the front panel. In
this case it is desirable that the front panel be constructed of a
transparent material which is largely immune to damage from thermal
shock. Two such materials are borosilicate glass, which has a small
thermal expansion coefficient, and polycarbonate, which has a
enough elasticity to make up for having a larger thermal expansion
coefficient.
FIG. 5 illustrates a cut-away side view of another exemplary video
display system of the present invention. Two video display tiles
120 are shown coupled to the transparent front display panel 2020
using a transparent adhesive 500, which is spread over the inside
surface of the transparent front display panel. Adhesive 500 is
desirably a heat activated adhesive, such as a thermoplastic
adhesive. Alternatively, adhesive 500 may be another transparent
adhesive, such as a UV-cured epoxy or an elastomeric adhesive
compound. An exemplary embodiment of the present invention may use
an elastomeric adhesive, not only to couple the video display tiles
to the transparent front panel, but also to pot the entire tile,
leaving only connectors for power and signals exposed.
FIG. 5 also shows a front surface heating element 502 on each of
the display tiles. This heating element, which may be, for example,
a simple resistive heating element, may be used to soften the
adhesive, both for original assembly of the video display system,
and for modular repair of defective tiles. In this exemplary
embodiment of the present invention, each tile includes a heating
element, or an array of heating elements, that allow an operator to
selectively soften and release the adhesive for one tile at a time,
thereby aiding in the modular repair of a defective tile.
The two tiles illustrated in FIG. 5 are shown with separate
exemplary embodiments of the heating element structure. In one
tile, via 504 is used to provide electrical connectivity to the
heating element, while in the other tile structure, an edge
electrode 506 is use to provide this connectivity. One or both of
these methods may be used to connect the heating elements to the
circuit board layer in an exemplary video tile with integral tile
heating of the present invention. Alternatively, the heating
elements may be adapted to be preferentially heated by energy
absorbed from an external electromagnetic radiation source, such as
microwaves.
Another feature illustrated in FIG. 5 is an alternate embodiment of
the black matrix mask 2010, used to hide seams between video
display tiles 2012. In this embodiment, the mask has been placed on
the outer surface of the front transparent display panel, rather
than on the inner surface. This placement of the black mask insures
that it will not be damaged during modular repair of a display
tile.
FIG. 6 illustrates another embodiment of the video display
structure of the present invention. In this embodiment, two display
tiles 120 are coupled to the transparent front panel 2020 by a
transparent adhesive layer 500. Once again in this embodiment the
transparent adhesive layer is spread over the entire top surface of
the transparent front plate 320 of the video tiles. In this
embodiment of the present invention the black matrix mask is 210 is
formed on the inside surface of the transparent front panel. A
mullion 1512 is shown between the two video tiles in FIG. 6 and is
illustrated as providing a portion of the black matrix mask. An
advantage of this embodiment is that the mullion may provide
additional assistance in aligning the video tiles to the black
matrix mask. It is contemplated that this embodiment may be
practiced with a stripe of the black matrix mask replacing the
mullion.
FIG. 7 is a cut-away side view that illustrates yet another
embodiment of the present invention. Once again in this embodiment,
video tiles 120 are coupled to the transparent front panel of the
video display unit with adhesive 500. In this embodiment, the
adhesive may be non-transparent, as the adhesive is applied only in
regions covered by the black matrix mask 2010. This embodiment may
provide additional advantages beyond the increased number of
adhesives that may be used. For example, this embodiment of
adhesive placement in a video display tile system may provide for
the more easily controlled heating of the adhesive during original
assembly, or modular repair of defective video tiles.
In this embodiment, as well as those shown in FIGS. 4 and 9, the
adhesive may be softened by heating only the black matrix mask. One
method to accomplish this is to use an infrared or other light
source. Such an energy source is preferentially absorbed by the
high absorptivity material used to construct the black matrix mask,
providing efficient localization of the heat applied to the
display. Also, the region to be heated may be easily masked off to
only one video tile. Therefore, the use of this heating method may
provide a means whereby the neighboring tiles are protected from
being loosened or misaligned during the softening of the adhesive
of the tile under repair. As the embodiments of FIGS. 4, 7, and 9
are well suited to an optical heating method, use of these
embodiments may further decrease the likelihood of damaging, or
misaligning a video tile during either assembly or modular repair
of a neighbor video tile.
Another method that may be used, in the embodiment of FIG. 7, to
heat the black mask is to provide resistive heating strips within
the body of the black matrix mask stripes. With this method, each
strip, horizontal and vertical, may be individually heated.
Alternatively, all of the horizontal heating strips associated with
a row of tiles may be connected together. Likewise, all of the
vertical heating strips associated with a column of tiles may be
connected together. This method may also be used to release only
one tile by heating all of the horizontal and vertical heating
strips associated with one tile. Other tiles will have the adhesive
under either their horizontal or their vertical strips softened,
but will not be completely loosened.
FIG. 8 is a cut-away side view of another exemplary embodiment of a
video display system according to the present invention. In this
embodiment the adhesive 500 is used to couple the video tiles 120
to mullions 1512 which are formed between the video tiles. The
mullions are attached to the transparent front panel 2020 by a
second adhesive 802. The second adhesive is desirably chosen to
have a higher softening point than the adhesive 500, thus
preventing the mullion from loosening when adhesive 500 is softened
during assembly or modular tile repair. As in FIG. 7, adhesive 500
may be a non-transparent adhesive in this embodiment.
This embodiment differs from the embodiments shown in FIGS. 4-7 in
that the thermally softened adhesive may be activated by heaters
which are disposed in the mullions, shown in FIG. 10, or by the
mullions themselves, if the mullions are formed from an appropriate
resistive, or absorptive, material. Alternately, as shown in FIG.
8, adhesive 500 may be heated to its softening point by edge
heating elements 804, which are formed along the edges of the video
tiles 120 and electrically coupled to the circuit board section of
the video tiles.
FIG. 9 shows a further exemplary embodiment of the present
invention. In this embodiment, as in the embodiment of FIG. 4, the
black matrix mask 2010 is itself desirably a non-transparent heat
activated adhesive that is used to couple the video tiles 120 to
the transparent front panel 2020. This embodiment of the present
invention provides an advantage similar to that of the embodiment
illustrated in FIG. 7, whereby the adhesive may be preferentially
softened by an infrared or other light source the energy of which
is absorbed by the black matrix mask during either assembly or
modular display repair.
FIGS. 10A and 10B illustrate two exemplary mullions 1512, which may
be used in an embodiment of the present video display system. FIG.
10A shows an exemplary row mullion which contains an integral upper
heating element 1002 that runs the length of the mullion. This
heating element may be employed to soften the adhesive 500 used to
couple video tiles to a mullion in an exemplary embodiment of the
present video display system, such as the embodiment shown in FIG.
8.
FIG. 10B illustrates an exemplary column mullion, containing an
integral lower heating element 1004. This heating element also runs
the length of the mullion and may be used to soften adhesive used
to couple a video tile to a mullion, just as the upper heating
element shown in FIG. 10A. It should be understood that the
designations of row and column for the exemplary mullions in FIGS.
10A and 10B are arbitrary and only used to provide clarity in these
descriptions. These designations may be switched or one type of
mullion may be used for both rows and columns.
An embodiment of the present video system is contemplated in which
the row mullions of FIG. 10A and the column mullions of FIG. 10B
are placed together in a matrix which surrounds each video tile
with two row and two column mullions. The upper heating elements
1002 are electrically coupled across an entire row of the mullions
in the video display system. Each end of the coupled row of upper
heating elements is electrically coupled to the frame of the video
display unit. In a similar fashion the lower heating elements 1004
are coupled together along entire columns. One advantage of this
exemplary configuration is that it provides a means whereby the
entire portion of the adhesive coupling a specific tile to the
mullions may be softened, without softening all of the adhesive
coupling any other tile to the mullions. This is accomplished by
heating two adjacent rows of heating elements and two adjacent
columns of heating elements.
The mullion 1512 also includes a crossbar 1006 which may be formed
from a black material or may be printed or painted black. To ensure
that the mullion does not create artifacts on the display device,
it is desirable for the top surface of the mullion to closely match
the black stripes in size, color and gloss. The mullion 1512 also
includes a bottom stem 1008 that are desirably formed from a
reflective material (e.g. white or specular). Alternatively, the
bottom stem of the mullion may be transparent and have an index of
refraction closely matching that of the glass substrate 320. It is
desirable for the bottom stem of the mullion to be reflective or
transparent so that any light scattered in the vicinity of the
mullion has the same properties as light that is scattered among
pixels at the interior of a tile. If light scatters differently at
the edge of a tile than near the center then the edge may be
visible, for example, as a band of reduced brightness in the
displayed image. The stem 1008 and the underside of the crossbar
1006 of the mullion may be coated with adhesive 500 to attach the
mullion 1512 to the two tiles which it joins. If the top surface is
coated with a second adhesive 802, the mullions may be used to join
the tiles into a display device.
Returning again to the optical structure of FIGS. 11 and 11A, it is
contemplated that the contrast may be further improved by coating
the viewer-side of the integrating structure 2020 with an
antireflection coating and/or by adding an ambient light absorber
or color filter on that surface in the adhesive or in the bulk of
the material (e.g. glass or plastic) from which the optical
integrating structure 2020 is constructed.
It is also contemplated that the integrating structure 2020 may
include a diffuser coating, or diffractive optics, on the
viewer-side surface. This diffuser enlarges the apparent size of
the pixels reducing the visibility of the individual pixels and
black matrix structure. Thus, a diffuser may act to reduce the
visibility of the pixel structure. This may be significant,
especially for display devices having relatively large pixels or
which have smaller pixels but are designed to be viewed at close
proximity to the display device. Another method by which the
visibility of the pixel structure may be reduced is to use a quad
pixel structure in which spaced single-color sub-pixels form a
single color pixel.
The integrating structure 2020 also provides a simple way to align
and mount the display tiles. In particular the patterns on the
integrating structure 2020 may be accurately aligned with the
pixels using, for example moire patterns, to position a tile and
then the tile may be mounted onto the structure 2020 with an
optically clear adhesive.
As described above many of the embodiments of a tiled display of
the present invention contain features that are well suited to the
exemplary methods of modular repair shown in FIGS. 12-14. One
advantage of tiled display, or detector, systems is modular
construction, a exemplary method for which is discussed below with
regard to FIG. 15. By constructing a large system from a number of
smaller modules, or in the present invention tiles, yield may be
increased and, thus, the cost of each piece lost due to defects may
be reduced. Modular repair is an important additional advantage
that may come from modular design, but not one that has been
available in tiled display systems.
The exemplary methods, illustrated in FIGS. 12-14, are described to
repair a single defective tile of a tiled display system in which
the tiles 120 have been coupled to the transparent front panel 2020
of the display using a heat activated adhesive 500 as described
above. It is contemplated that these methods may be used to repair
more than one defective tile, with other tiled optical systems, or
with other adhesives which may be non-destructively unbonded.
FIG. 12 is a flowchart of steps of an exemplary modular repair
method of the present invention. The first step 1200 is to heat the
heat activated adhesive to a working temperature which is desirably
greater than the softening point of the adhesive and below the
damage threshold of the display tiles. Numerous methods may be
employed to heat the adhesive, such as heat guns, optical heat
sources, microwave sources, electrical heaters, fire, and immersion
in hot liquids. Electrical heaters may be resistive, thermocouple
or absorptive and external to the display system or internal as
described above with regard to FIGS. 5 and 10. Though it is most
often desirable to only unbond the adhesive holding the defective
tile, this is not necessary. In fact, if the tiles are very closely
packed, it may prove desirable to loosen the neighboring tiles
during modular repair and then realign them before allowing the
adhesive to cure.
Once the adhesive coupling the defective tile has been softened,
the defective tile is removed 1202 and replaced with a replacement
tile which is carefully aligned to the front panel 1210. The
alignment process may be assisted by a black matrix mask 2010,
mullions 1512, or a combination of these two, as described above
with regard to FIGS. 4-11A. Alternately, the alignment may be based
on obtaining the best fit between the replacement tile and its
neighbors without any additional assistance. After the desired
alignment is achieved the adhesive is cured, i.e. allowed to cool
and harden 1212. It should be noted that the adhesive may be
allowed to cool between the removal of the defective tile and
completion of alignment of the replacement tile, then
resoftened.
FIG. 13 is a flowchart illustrating the steps of another exemplary
modular repair method of the present invention. The first two steps
1200, heating the adhesive, and 1202, removing the defective tile,
of this embodiment are the same as the embodiment described above
with regard to FIG. 12. Following these two steps come two new
steps: step 1206, applying heat activated adhesive to the front
panel, or mullions 1512 if the embodiment of FIG. 8 is used to
construct the display; and step 1208, applying heat activated
adhesive to the replacement tile. In both step 1206 and step 1208
the adhesive is desirably applied in its softened state. It is
contemplated that either of these steps, or both, may be employed.
The method of this embodiment then follows the same final two steps
1210, aligning the replacement tile, and 1212, curing the adhesive,
as in the method shown in FIG. 12.
FIG. 14 is a flowchart illustrating the steps of a third exemplary
modular repair method of the present invention. The first two steps
1200, heating the adhesive, and 1202, removing the defective tile,
of this embodiment are once again the same as the embodiments
described above with regard to FIGS. 12 and 13. At this point the
portion of the front panel uncovered by the removed tile may have
any remaining adhesive cleaned off of it, step 1204. This step may
be used for several reasons such as providing an even coat of
adhesive or providing fresh adhesive. It is contemplated, though,
that this step may be unnecessary or in some cases, such as the
embodiments illustrated in FIGS. 4 and 9, undesirable. The
remaining steps of the method shown in FIG. 14 are the same as the
remaining steps of the method shown in FIG. 13: step 1206, applying
heat activated adhesive to the front panel; step 1208, applying
heat activated adhesive to the replacement tile; step 1210,
aligning the replacement tile; and 1212, curing the adhesive. As
mentioned above with regard to FIG. 13 either one, or both, of
steps 1206 and 1208 may be employed.
Though the exemplary methods illustrated in each of the FIGS. 12-14
are similar, each method may have advantages in a particular tiled
display system. The method of FIG. 12 is the simplest of these
exemplary methods for modular repair. The method of FIG. 12 may
provide additional advantages as well, such as ensuring exact
matching of the adhesive 500 bonding the replacement tile 120 to
the front panel 2020 with the adhesive bonding the other tiles in
the display to the front panel. This may be an issue, especially if
the adhesive is tinted or used to provide another specific optical
property. Also in some embodiments of a tiled display system, such
as those illustrated in FIGS. 4 and 9, replacing or augmenting the
adhesive during modular repair is undesirable, making the method
shown in FIG. 12 the preferred approach.
One possible additional advantage afforded by the methods
illustrated in FIGS. 13 and 14 are the certainty that an adequate
amount of adhesive is provided to firmly bond the replacement tile
to the surface. Another advantage may be the ability to use an
improved adhesive that was not available at the time of initial
assembly. In some cases, though, such as those mentioned above, the
use of the method shown in FIG. 13 may prove undesirable. In cases
where the use of the method shown in FIG. 13 proves undesirable,
the use of the method of FIG. 14 may also be undesirable.
The method of modular repair illustrated in FIG. 14 may provide the
additional advantage of assisting in formation of a more even
adhesive layer 500 between replacement tile and the front panel.
This method may also allow matching of the thickness of the
adhesive used to couple the replacement tile to the front panel
with that used to couple other tiles in the display. Another
advantage may be the avoidance any possible problems associated
with fatigue or deterioration, such as clouding or tinting,
associated with repeated heat cycling of the adhesive.
Sometimes, compared to the method FIG. 12, the additional steps in
the methods of modular repair illustrated by FIGS. 13 and 14 may
prove unnecessary, or of negligible advantage. In such cases it is
contemplated that the simpler method of FIG. 12 may be used.
Likewise, if the additional step 1204, cleaning off the front
panel, shown in FIG. 14, but not FIG. 13, is deemed unnecessary in
a specific modular repair, then the method of FIG. 13 may be used
in the place of the method of FIG. 14.
It is also contemplated that a substantially similar method of
modular repair may be employed for tiled display system using an
elastomeric compound as adhesive 500. The only differences would be
that tile coupled to the transparent front panel using a
elastomeric adhesive may be removed by cutting the adhesive and
peeling off the tile rather than heating the adhesive.
FIG. 15 illustrates an exemplary method of modular assembly of a
tiled display system which is well suited to the exemplary modular
repair methods of FIGS. 12-14. As with the exemplary repair methods
of FIGS. 12-14, the exemplary assembly method described in FIG. 15
is explained with respect to an exemplary video display system in
which the tiles 120 have been coupled to the transparent front
panel 2020 of the display using a heat activated adhesive 500 as
described above with regard to FIGS. 4-11A. It is contemplated that
this exemplary method may be used to assemble other tiled optical
systems, or with other adhesives which may be non-destructively
unbonded.
The first step of the method of FIG. 15 is to heat the heat
activated adhesive 500 to its working temperature, step 1500. Any
of the heating method discussed with regard to step 1200 of FIGS.
12-14 may be used.
The heat adhesive is then applied to either the front panel of the
display, step 1206, or a display tile, step 1508, or both. The
choice of where to apply the adhesive may be determined by the
embodiment of the tiled display system being constructed. For
example, for a tiled display of the embodiment illustrated in FIG.
9 it may be desirable to apply the adhesive to front panel, step
1206, and not to apply the adhesive to the tile, step 1508.
Once the adhesive has been applied as desired, the tile is aligned
to the front panel of the display, step 1510. This alignment may be
assisted by mullions 1512, or a black matrix mask 2010, as
illustrated in FIGS. 11 and 11A. Alternatively, the alignment may
be in reference to only the frame of the display system 2014 and
other tiles 120 in the display system.
Next it is determined if the tile just placed is the final tile in
the display system, step 1512. If the tile is the final tile, then
the construction continues to step 1212, curing the adhesive. Once
the adhesive is cured, final assembly, including making electrical
connection and attaching a back panel, may be accomplished.
If the tile is not the final tile in the display, then the
procedure moves to step 1514, determining if the adhesive is only
applied to front panel. If the adhesive is only applied to front
panel in the embodiment being used, the procedure picks up at step
1510 aligning a new tile to the front panel. If the adhesive is
applied to the tiles in this embodiment, then the procedure goes
back to the application of the adhesive to the next tile, step
1508.
As in the repair methods of FIGS. 12-14, it should be noted that
the adhesive may be allowed to cool between the application and
completion of alignment of the replacement tile, then resoftened.
It is also contemplated that it may be desirable to make
alterations in the order of some of the operations in the assembly
method of FIG. 15. Among the possible alterations may be: curing
the adhesive, step 1212, after each tile is aligned; or, when step
1508 is employed, applying the adhesive to all of the tiles at
once, this may be particularly advantageous for the embodiment
shown in FIG. 4. Such modifications do not deviate from the scope
of the present invention as defined by the appended claims.
FIG. 16 illustrates an exemplary star pattern that may be used for
applying transparent adhesive 500 to the surface of the glass
substrate of a display tile 120. One issue, which may arise during
the coupling of display tiles to a transparent front panel of the
present invention, is the formation of pockets of gas trapped in a
visible portion of the display. The application of the transparent
adhesive in a star pattern may assist in avoiding such gas pockets.
A similar method has been successfully employed to improve the
adhesion of ceramic tiles in construction. Though the pattern in
FIG. 16 is shown as an eight-sided star, it is contemplated that
other patterns exist which may be used as well.
Additionally, it is contemplated that assembly, and modular repair,
of the video display system of the present invention may be carried
out in vacuo, thereby removing this possible problem.
Although the embodiments of the invention described above have been
in terms of an OLED display device, it is contemplated that similar
concepts may be practiced with other types of display tiles. Also,
it will be understood to one skilled in the art that a number of
other modifications exist which do not deviate from the scope of
the present invention as defined by the appended claims.
* * * * *