U.S. patent number RE40,781 [Application Number 11/502,577] was granted by the patent office on 2009-06-23 for method of providing a hydrophobic layer and condenser microphone having such a layer.
This patent grant is currently assigned to Pulse MEMS ApS. Invention is credited to Ib Johannsen, Niels Bent Larsen, Matthias Mullenborn, Pirmin Hermann Otto Rombach.
United States Patent |
RE40,781 |
Johannsen , et al. |
June 23, 2009 |
Method of providing a hydrophobic layer and condenser microphone
having such a layer
Abstract
A method of providing at least part of a diaphragm and at least
a part of a back-plate of a condenser microphone with a hydrophobic
layer so as to avoid stiction between said diaphragm and said
back-plate. The layer is deposited via a number small of openings
in the back-plate, the diaphragm and/or between the diaphragm and
the back-plate. Provides a homogeneous and structured hydrophobic
layer, even to small internal cavities of the microstructure. The
layer may be deposited by a liquid phase or a vapor phase
deposition method. The method may be applied naturally in
continuation of the normal manufacturing process. Further, a MEMS
condenser microphone is provided having such a hydrophobic layer.
The static distance between the diaphragm and the back-plate of the
microphone is smaller than 10 .mu.m.
Inventors: |
Johannsen; Ib (Vaerlose,
DK), Larsen; Niels Bent (Rodovre, DK),
Mullenborn; Matthias (Lyngby, DK), Rombach; Pirmin
Hermann Otto (Ho Chi Minh, VN) |
Assignee: |
Pulse MEMS ApS (Roskilde,
DK)
|
Family
ID: |
25350120 |
Appl.
No.: |
11/502,577 |
Filed: |
August 10, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
Reissue of: |
09867606 |
May 31, 2001 |
06859542 |
Feb 22, 2005 |
|
|
Current U.S.
Class: |
381/174; 381/175;
381/191 |
Current CPC
Class: |
B82Y
30/00 (20130101); H04R 19/005 (20130101); H04R
19/04 (20130101); H04R 31/00 (20130101) |
Current International
Class: |
H04R
25/00 (20060101) |
Field of
Search: |
;381/113,116,174,175,191,369 ;361/283.1 ;367/181,170 |
References Cited
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|
Primary Examiner: Ensey; Brian
Attorney, Agent or Firm: Nixon Peabody LLP
Claims
What is claimed is:
1. A condenser microphone comprising a diaphragm and a back-plate,
wherein an inner surface of said diaphragm forms a capacitor in
combination with an inner surface of said back-plate, said
back-plate and/or said diaphragm is/are provided with a number of
openings, and said inner surface of the back-plate and said inner
surface of the diaphragm being provided with a hydrophobic layer,
and wherein the static distance between said diaphragm and said
back-plate is smaller than 10 .mu.m.
2. A condenser microphone according to claim 1, wherein at least
the inner surfaces of the diaphragm and the back-plate are made
from a hydrophilic material.
3. A condenser microphone according to claim 1, wherein the
smallest dimension of each of the openings does not exceed 10
.mu.m.
4. A condenser microphone according to claim 3, wherein the
smallest dimension of each of the openings does not exceed 5
.mu.m.
5. A condenser microphone according to claim 4, wherein the
smallest dimension of each of the openings does not exceed 1
.mu.m.
6. A condenser microphone according to claim 5, wherein the
smallest dimension of each of the openings does not exceed 0.5
.mu.m.
7. A condenser microphone according to claim 4, wherein the
smallest dimension of each of the openings is approximately 3
.mu.m.
8. A condenser microphone according to claim 1, wherein the
hydrophobic layer base material comprises an alkylsilane.
9. A condenser microphone according to claim 1, wherein the
hydrophobic layer base material comprises a perhaloalkylsilane.
10. A condenser microphone according to claim 1, wherein the static
distance between the diaphragm and the back-plate is smaller than 5
.mu.m.
11. A condenser microphone according to claim 10, wherein the
static distance between the diaphragm and the back-plate is smaller
than 1 .mu.m.
12. A condenser microphone according to claim 11, wherein the
static distance between the diaphragm and the back-plate is smaller
than 0.5 .mu.m.
13. A condenser microphone according to claim 12, wherein the
static distance between the diaphragm and the back-plate is smaller
than 0.3 .mu.m.
14. A condenser microphone according to claim 11, wherein the
static distance between the diaphragm and the back-plate is
approximately 0.9 .mu.m.
15. A condenser microphone according to claim 1, wherein the
hydrophobic layer has a contact angle for water being between
90.degree. and 130.degree..
16. A condenser microphone according to claim 15, wherein the
hydrophobic layer has a contact angle for water being between
100.degree. and 110.degree..
17. A condenser microphone according to claim 1, wherein the
hydrophobic layer is stable at temperatures between -40.degree. C.
and 130.degree. C.
18. A condenser microphone according to claim 17, wherein the
hydrophobic layer is stable at temperatures between -30.degree. C.
and 110.degree. C.
19. A condenser microphone according to claim 1, wherein the
hydrophobic layer is stable at temperatures up to at least
400.degree. C. for at least 5 minutes.
20. A condenser microphone comprising a diaphragm and a back-plate,
wherein an inner surface of said diaphragm forms a capacitor in
combination with an inner surface of said back-plate, said
back-plate and/or said diaphragm is/are provided with a number of
openings, and said inner surface of the back-plate and/or said
inner surface of the diaphragm being provided with a hydrophobic
layer having a contact angle for water being larger than
90.degree., and wherein the static distance between said diaphragm
and said back-plate is smaller than 10 .mu.m.
21. A condenser microphone comprising: a diaphragm; a back-plate,
wherein an inner surface of said diaphragm forms a capacitor in
combination with an inner surface of said back-plate, said
back-plate and/or said diaphragm being provided with a number of
openings, wherein the static distance between said diaphragm and
said back-plate is smaller than 10 .mu.m; and a hydrophobic layer,
provided on said inner surface of the back-plate and/or on said
inner surface of the diaphragm.
.Iadd.22. A microelectromechanical microphone, comprising: a
diaphragm and a back-plate with an air gap therebetween, the
diaphragm and a back-plate including respective inner surfaces
forming a capacitor, the respective inner surfaces being made of a
hydrophobic or hydrophilic materials; a number of openings leading
to the air gap; and a hydrophobic molecular monolayer coating on
the inner surface of the diaphragm or the back-plate, wherein
molecules of the molecular monolayer are cross-linked and
multi-bounded to the inner surface of the diaphragm or the
back-plate..Iaddend.
.Iadd.23. The microelectromechanical microphone according to claim
22, wherein the multi-bounded molecular monolayer forms hydrophobic
chains pointing away from the inner surface of the diaphragm or the
back-plate..Iaddend.
.Iadd.24. The microelectromechanical microphone according to claim
23, wherein the hydrophobic molecular monolayer has a contact angle
for water greater than 90.degree...Iaddend.
.Iadd.25. The microelectromechanical microphone according to claim
24, wherein the hydrophobic molecular monolayer includes a
perfluoralkylsilane..Iaddend.
.Iadd.26. The microelectromechanical microphone according to claim
24, wherein the hydrophobic molecular monolayer includes an
alkylsilane..Iaddend.
.Iadd.27. The microelectromechanical microphone according to claim
24, wherein the hydrophobic molecular monolayer includes a
perhaloalkylsilane..Iaddend.
.Iadd.28. The microelectromechanical microphone according to claim
23, wherein the hydrophobic molecular monolayer has a contact angle
for water greater than about 100.degree...Iaddend.
.Iadd.29. The microelectromechanical microphone according to claim
23, wherein the hydrophobic molecule monolayer is stable at
temperatures up to at least 400.degree. C. for at least 5
minutes..Iaddend.
.Iadd.30. The microelectromechanical microphone according to claim
22, wherein the molecular monolayer comprises a structured molecule
monolayer..Iaddend.
.Iadd.31. The microelectromechanical microphone according to claim
22, wherein the diaphragm or the back-plate comprises respective
materials including at least one of silicon, poly-silicon,
silicon-oxide, silicon nitride, or silicon-rich silicon
nitride..Iaddend.
.Iadd.32. The microelectromechanical microphone according to claim
22, wherein the hydrophobic molecular monolayer includes a
perfluoralkylsilane, an alkylsilane or a
perhaloalkylsilane..Iaddend.
.Iadd.33. The microelectromechanical microphone according to claim
22, wherein the hydrophobic molecular monolayer has a contact angle
for water between 90.degree. and 130.degree...Iaddend.
.Iadd.34. The microelectromechanical microphone according to claim
22, wherein the hydrophobic molecular monolayer is stable at
temperatures up to at least 400.degree. C. for at least 5
minutes..Iaddend.
.Iadd.35. The microelectromechanical microphone according to claim
22, wherein the number of openings is in the back-plate, the
openings receiving the hydrophobic molecular monolayer during the
coating process..Iaddend.
.Iadd.36. The microelectromechanical microphone according to claim
35, wherein the hydrophobic molecular monolayer is stable at
temperatures up to at least 400.degree. C. for at least 5 minutes
and has a contact angle for water between 90.degree. and
130.degree...Iaddend.
.Iadd.37. The microelectromechanical microphone according to claim
22, wherein the number of openings is in the diaphragm, the
openings receiving the hydrophobic molecular monolayer during the
coating process..Iaddend.
.Iadd.38. The microelectromechanical microphone according to claim
22, wherein the number of openings is in the diaphragm and in the
back-plate, the openings receiving the hydrophobic molecular
monolayer during the coating process..Iaddend.
.Iadd.39. The microelectromechanical microphone according to claim
22, wherein the hydrophobic molecular monolayer has a contact angle
for water between 100.degree. and 110.degree...Iaddend.
.Iadd.40. The microelectromechanical microphone according to claim
22, wherein the air gap has a static distance not exceeding 10
.mu.m..Iaddend.
.Iadd.41. A microelectromechanical microphone, comprising: a
diaphragm having an inner surface; a back-plate having an inner
surface that, together with the inner surface of the diaphragm,
forms a capacitor, wherein the static distance between the
back-plate and the diaphragm does not exceed 10 .mu.m; and a
hydrophobic layer on the inner surface of the diaphragm and the
inner surface of the back-plate, the hydrophobic layer being
deposited through a number of openings provided in at least one of
(i) the back-plate, (ii) the diaphragm, or (ii) gaps at a periphery
of the back-plate and the diaphragm..Iaddend.
.Iadd.42. The microelectromechanical microphone according to claim
41, wherein the hydrophobic layer is a hydrophobic molecular
monolayer, wherein molecules of the molecule monolayer are
cross-linked and multi-bounded to the respective inner surfaces of
the diaphragm and the back-plate..Iaddend.
.Iadd.43. The microelectromechanical microphone according to claim
37, wherein the molecular monolayer comprises a structured
molecular monolayer..Iaddend.
.Iadd.44. The microelectromechanical microphone according to claim
37, wherein the hydrophobic molecular monolayer has a contact angle
for water greater than 90.degree...Iaddend.
.Iadd.45. The microelectromechanical microphone according to claim
39, wherein the hydrophobic molecule monolayer is stable at
temperatures up to at least 400.degree. C. for at least 5
minutes..Iaddend.
.Iadd.46. The microelectromechanical microphone according to claim
41, wherein the hydrophobic coating has a contact angle for water
greater than 90.degree...Iaddend.
.Iadd.47. The microelectromechanical microphone according to claim
41, wherein the hydrophobic layer is stable at temperatures up to
at least 400.degree. C. for at least 5 minutes..Iaddend.
.Iadd.48. The microelectromechanical microphone according to claim
41, wherein the hydrophobic layer is deposited by gaseous-phase
deposition onto the inner surfaces of the diaphragm and the
back-plate through the number of openings..Iaddend.
.Iadd.49. The microelectromechanical microphone according to claim
41, wherein the hydrophobic layer is deposited by liquid-phase
deposition onto the inner surfaces of the diaphragm and the
back-plate through the number of openings..Iaddend.
.Iadd.50. The microelectromechanical microphone according to claim
41, wherein the hydrophobic layer is stable at temperatures between
at least -30.degree. C. and at least 110.degree. C..Iaddend.
.Iadd.51. The microelectromechanical microphone according to claim
41, wherein the hydrophobic layer has a contact angle for water
greater than about 100.degree...Iaddend.
.Iadd.52. A microelectromechanical microphone, comprising: a
diaphragm and a back-plate defining an air gap between respective
inner surfaces thereof, the respective inner surfaces forming a
capacitor, the static distance between the diaphragm and the
back-plate not exceeding 10 .mu.m; a number of openings leading to
the air gap; and a hydrophobic layer deposited through the number
of openings into the air gap to form a structured monolayer on at
least one of the inner surface of the diaphragm or the inner
surface of the back-plate..Iaddend.
.Iadd.53. The microelectromechanical microphone of claim 52,
wherein the diaphragm includes the number of openings..Iaddend.
.Iadd.54. The microelectromechanical microphone of claim 52,
wherein the back-plate includes the number of
openings..Iaddend.
.Iadd.55. The microelectromechanical microphone of claim 52,
wherein the back-plate and the diaphragm includes the number of
openings..Iaddend.
.Iadd.56. The microelectromechanical microphone according to claim
55, wherein the hydrophobic layer is deposited by gaseous-phase or
liquid-phase deposition onto the inner surfaces of the diaphragm
and the back-plate through the number of openings..Iaddend.
.Iadd.57. The microelectromechanical microphone of claim 52,
wherein the number of openings correspond to gaps at the periphery
of the back-plate and the diaphragm..Iaddend.
.Iadd.58. The microelectromechanical microphone of claim 52,
wherein the number of openings are positioned between the diaphragm
and the back-plate..Iaddend.
.Iadd.59. The microelectromechanical microphone according to claim
58, wherein the hydrophobic layer has a contact angle for water
greater than about 100.degree...Iaddend.
.Iadd.60. The microelectromechanical microphone of claim 52,
wherein the hydrophobic layer is a hydrophobic molecular monolayer,
wherein molecules of the molecular monolayer are cross-linked and
multi-bounded to the respective inner surfaces of the diaphragm and
the back-plate..Iaddend.
.Iadd.61. The microelectromechanical microphone according to claim
60, wherein the molecule monolayer comprises a structured molecule
monolayer..Iaddend.
.Iadd.62. The microelectromechanical microphone according to claim
61, wherein the hydrophobic molecular monolayer has a contact angle
for water greater than 90.degree...Iaddend.
.Iadd.63. The microelectromechanical microphone according to claim
62, wherein the hydrophobic molecular monolayer is stable at
temperatures between at least -30.degree. C. and at least
110.degree. C..Iaddend.
.Iadd.64. The microelectromechanical microphone according to claim
52, wherein the hydrophobic layer is stable at temperatures up to
at least 400.degree. C. for at least 5 minutes..Iaddend.
.Iadd.65. The microelectromechanical microphone according to claim
52, wherein the hydrophobic layer is deposited by gaseous-phase
deposition onto the inner surfaces of the diaphragm and the
back-plate through the number of openings..Iaddend.
.Iadd.66. The microelectromechanical microphone according to claim
52, wherein the hydrophobic layer is deposited by liquid-phase
deposition onto the inner surfaces of the diaphragm and the
back-plate through the number of openings..Iaddend.
.Iadd.67. The microelectromechanical microphone according to claim
52, wherein the hydrophobic layer is stable at temperatures between
at least -30.degree. C. and at least 110.degree. C..Iaddend.
.Iadd.68. A condenser microphone comprising a diaphragm and a
back-plate, wherein an inner surface of said diaphragm forms a
capacitor in combination with an inner surface of said back-plate,
a number of openings being provided in at least one of (i) said
back-plate, (ii) said diaphragm, or (ii) gaps at a periphery of
said back-plate and said diaphragm, and said inner surface of the
back-plate and/or said inner surface of the diaphragm being
provided with a hydrophobic layer having a contact angle for water
being larger than 90.degree., and wherein the static distance
between said diaphragm and said back-plate is smaller than 10
.mu.m..Iaddend.
.Iadd.69. The condenser microphone according to claim 1, wherein
said inner surface of the back-plate and said inner surface of the
diaphragm is provided with said hydrophobic layer by depositing
said hydrophobic layer through the number of openings..Iaddend.
.Iadd.70. The condenser microphone according to claim 1, wherein
said hydrophobic layer is a hydrophobic molecular monolayer, and
wherein molecules of said molecular monolayer are cross-linked and
multi-bounded to the inner surface of at least one of said
diaphragm or said back-plate..Iaddend.
.Iadd.71. The condenser microphone according to claim 70, wherein
the multi-bounded molecular monolayer forms hydrophobic chains
pointing away from the inner surface of the diaphragm or the
back-plate..Iaddend.
.Iadd.72. The condenser microphone according to claim 20, wherein
said hydrophobic layer is a hydrophobic molecular monolayer, and
wherein molecules of said molecular monolayer are cross-linked and
multi-bounded to the inner surface of at least one of said
diaphragm or said back-plate..Iaddend.
.Iadd.73. The condenser microphone according to claim 21, wherein
said hydrophobic layer is a hydrophobic molecular monolayer, and
wherein molecules of said molecular monolayer are cross-linked and
multi-bounded to the inner surface of at least one of said
diaphragm or said back-plate..Iaddend.
Description
TECHNICAL FIELD
The present invention relates to a method of providing a
hydrophobic layer to inner surfaces of a microstructure, in
particular to inner surfaces of a condenser microphone, in order to
avoid or prevent stiction between said inner surfaces.
BACKGROUND OF THE INVENTION
During the manufacturing as well as the operation of micro
electromechanical system (MEMS) devices, it is well known that
failure due to adhesion between surfaces, e.g. between a moving
surface and a substantially stationary surface, of the device may
occur. This phenomenon is referred to as stiction. Stiction occurs
with a larger probability in microstructures, typically having
dimensions in the order of magnitude of 1-3 .mu.m because the
surface-to-volume ratio increases and surface forces, which are
responsible for stiction, are correspondingly higher. Stiction may
occur during or after the manufacturing process (i.e. during
operation), after releasing of the microstructure where the surface
tension of the rinse liquid is sufficiently strong to pull the
suspending microstructures in contact with the substrate or another
compliant or stiff counter surface, leading to permanent adhesion.
This kind of stiction is referred to as `after-release stiction`.
Alternatively or additionally, stiction may occur after a
successful release, e.g. when a microstructure is exposed to an
environment of increased humidity or changing temperature. If the
microstructure is first exposed to a humid environment, water
vapour can condense and form a water film/droplets on the device
surfaces. When the distance between the two surfaces decreases
during device operation and the water film/droplets of one surface
touch the counter surface, the two surfaces will stick together.
This phenomenon may occur during the normal device operation and is
therefore referred to as `in-use stiction`. In-use stiction is in
particular a problem in microstructures in which opposite surfaces,
e.g. a diaphragm and a back-plate, form capacitors in combination
with each other. This is, e.g., the case in condenser microphones
and condenser pressure sensors.
The present invention is concerned with preventing stiction in
microstructures, in particular in MEMS condenser microphones.
It is further known that the application of a hydrophobic layer to
the surfaces in question can solve, or a least relieve, the
problem. This has, e.g., been described in U.S. Pat. No. 5,822,170,
in "Anti-Stiction Hydrophobic Surfaces for Microsystems" by P.
Voumard, et al., CSEM scientific and technical report 1998,
Neuchatel, Switzerland, 26, in "The property of plasma polymerized
fluorocarbon film in relation to CH.sub.4/C.sub.4F.sub.8 ratio and
substrate temperature" by Y. Matsumoto, et al., Proc. of
Transducers '99, Jun. 7-10, 1999, Sendai, Japan, 34-37, in
"Self-Assembled Monolayer Films as Durable Anti-Stiction Coatings
for Polysilicon Microstructures" By M. R. Houston, et al.
Solid-State Sensor and Actuator Workshop Hilton Head, South
Carolina, Jun. 2-6, 1996, 42-47, in "Elimination of Post-Release
Adhesion in Microstructures Using Conformal Fluorocarbon Coatings"
by P. F. Man, et al., Journal of Microelectromechanical Systems,
Vol. 6, No. 1, March 1997, in "Anti-Stiction Methods for
Micromechanical Devices: A Statistical Comparison of Performance"
by S. Tatic-Lucid, et al., Proc. of Transducers '99, Jun. 7-10,
1999, Sendai, Japan, 522-525, in "A New Class of Surface
Modification for Stiction Reduction", by C.-H. Oh, et al., Proc. of
Transducers '99, Jun. 7-10, 1999, Sendai, Japan, 30-33, in
"Self-Assembled Monolayers as Anti-Stiction Coatings for Surface
Microstructures", by R. Maboudin, Proc. of Transducers '99, Jun.
7-10, 1999, Sendai, Japan, 22-25, and in "Anti-Stiction
Silanization Coating to Silicon Micro-Structures by a Vapor Phase
Deposition Process", by J. Sakata, et al., Proc. of Transducers
'99, Jun. 7-10, 1999, Sendai, Japan, 26-29.
The references above describe depositions of a hydrophobic layer,
e.g. a self-assembled monolayer (SAM) onto surfaces of the
microstructure, the microstructure preferably being made from a
silicon material, such as a Si-wafer or poly-silicon layers. The
deposition is primarily performed by successively positioning the
microstructure in various liquids. However, in "Anti-Stiction
Silanization Coating to Silicon Micro-Structures by a Vapor Phase
Deposition Process", by J. Sakata, et al., Proc. of Transducers
'99, Jun. 7-10, 1999, Sendai, Japan, 26-29, The deposition is
performed by a vapour phase deposition process (dry process), in
which the microstructure is positioned in a container containing a
gas or a vapour. The advantage of this process is that it is
possible to obtain a homogeneous coating, even inside a complicated
microstructure, and even inside a space with narrow gaps. However,
it has turned out that using a vapour phase deposition process
results in a hydrophobic layer having a surface which is less
structured than the surface of a hydrophobic layer which has been
deposited using a liquid phase deposition process. This is due to
the fact that the molecules forming the monolayer form cross
bindings in addition to forming bonds to the surface. With a
certain probability, this reaction already happens in the
gas-phase. Therefore, molecule clusters are deposited that cannot
chemically bind to the surface anymore or that can only partly
chemically bind to the surface. This results in a less structured
layer and therefore rough surface, which makes it possible for
water droplets to attach to the surface, even though the material
surface otherwise would be highly hydrophobic. Thus, the
hydrophobic property of the surfaces is partly or possibly totally
reduced. Furthermore, the process described in this reference
requires special equipment. In addition, the sacrificial layer has
to be removed and the structure has to be released before the
hydrophobic layer can be applied. The release process is a critical
process with a certain yield, which will reduce the total yield of
the manufacturing process and increase the manufacturing costs. The
gas phase deposition also needs pumping steps, which bear the risk
for stiction due to fast pressure transients. Therefore, the
coating process performed from a liquid material is preferred.
It is, thus, desirable to be able to provide a method for providing
a hydrophobic layer to the inner parts of a microstructure in such
a way that the hydrophobic property of the layer is maintained.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a method of
providing a microstructure with a hydrophobic layer in such a way
that a very structured layer may be applied to microstructures,
even to microstructures having internal spaces with narrow
gaps.
It is a further object of the present invention to provide a method
of providing a microstructure with a hydrophobic layer, which may
be introduced as a natural part of the manufacturing process for
the microstructure.
It is an even further object of the present invention to provide a
method of providing a microstructure with a hydrophobic layer,
which minimises the number of production steps of the manufacture
of the microstructure.
It is an even further object of the present invention to provide a
condenser microphone in which the stiction phenomenon is
avoided.
According to the present invention the above and other objects are
fulfilled by a method of providing at least part of a diaphragm and
at least a part of a back-plate of a condenser microphone with a
hydrophobic layer so as to avoid stiction between said diaphragm
and said back-plate, said method comprising the steps of providing
a condenser microphone comprising a diaphragm and a back-plate,
wherein an inner surface of said diaphragm forms a capacitor in
combination with an inner surface of said back-plate, and providing
the hydrophobic layer onto the inner surfaces of the diaphragm and
the back-plate through a number of openings, said openings being in
the back-plate, in the diaphragm and/or between the diaphragm and
the back-plate.
The condenser microphone may be a microphone for recording ordinary
sound waves, e.g. propagating in atmospheric air. However, it may
additionally or alternatively be a microphone which is adapted to
perform measurements in a hostile environment, e.g. in a humid,
extremely hot, or extremely cold environment. In this case the
condenser microphone needs to be able to function under such
extreme conditions. It is especially important that water vapour
(or other vapours which the microphone may be in contact with) can
not condense easily on the inner parts of the microphone, since
this would lead to water droplets and a temporary stiction between
the diaphragm and the back-plate, which in turn causes the
functionality of the microphone to decreases. If the water in the
air gap dries, the back-plate and the diaphragm have to separate
again. According to the invention such condensation is prevented or
at least reduced by providing the diaphragm and at least part of
the back-plate with a hydrophobic layer.
The microphone is preferably a MEMS microphone, i.e. at least the
diaphragm and/or the back-plate are manufactured using
semiconductor technology.
An inner surface of the diaphragm and an inner surface of the
back-plate of the microphone form a capacitor. Since the diaphragm
is movable in relation to the back-plate, which is substantially
stationary, the capacitance of said capacitor depends on the
immediate distance between the diaphragm and the back-plate.
The hydrophobic layer is provided onto the inner surfaces of the
diaphragm and the back-plate, respectively, through a number of
openings. The openings are positioned in the back-plate, in the
diaphragm and/or between the diaphragm and the back-plate. Thus,
the coating material may be applied to inner surfaces of the
microphone in a homogeneous and structured manner, even if the
microphone comprises small cavities to which it would otherwise be
difficult to gain access. Furthermore, this coating process may
advantageously be applied in continuation of the normal
manufacturing procedure. Thus, it is neither necessary to dry the
microphone after the normal manufacturing steps before the coating
process, nor to use special equipment for the process. This renders
the coating process of the present invention cost effective and
easy to perform, which in turn makes it very attractive for
commercial purposes.
For the gas-phase deposition but even more for the liquid
deposition the dynamics of the deposition processes have to be
taken into account. It is very difficult to deposit the coating
material into the air gap of a MEMS microphone with typical lateral
dimensions (back-plate or diaphragm radius and side length,
respectively) of 0.5 mm to 2 mm and typical air gap heights of only
0.3 .mu.m to 10 .mu.m. These high aspect ratios reduce the
deposition rate and make the process very time consuming and
inefficient. In order to get a direct access to the middle part of
the air gap, the deposition has to be performed through a number of
openings in the back-plate, in the diaphragm, and/or gaps at the
periphery of the back-plate and the diaphragm. This makes the
process faster and thus more cost effective.
At least the inner surfaces of the diaphragm and the back-plate may
be made from a hydrophilic material. If the inner diaphragm surface
and/or the inner surface of the back-plate are hydrophilic, this
property would cause stiction if water would dry out the air gap
volume. The term `hydrophilic material` could be interpreted as a
material having a surface which shows with water a contact angle
below 90.degree.. Thus, water droplets may easily form on a
hydrophilic surface. Materials that form hydrophilic surfaces may,
e.g., be silicon, poly-silicon, SiO.sub.2, Si.sub.xN.sub.y (such as
Si.sub.3N.sub.4), and/or any other suitable material.
The inner surface of the diaphragm and/or the inner surface of the
back-plate may, however, process hydrophobic properties which need
to be improved.
In one embodiment of the present invention the smallest dimension
of each of the openings does not exceed 10 .mu.m, such as not
exceeding 7 .mu.m, such as not exceeding 5 .mu.m, such as not
exceeding 3 .mu.m, such as not exceeding 1 .mu.m, such as not
exceeding 0.7 .mu.m, such as not exceeding 0.5 .mu.m. The smallest
dimension of each of the openings may, thus, be approximately 3
.mu.m, such as approximately 2 .mu.m, approximately 4 .mu.m,
approximately 2.5 .mu.m, approximately 3.5 .mu.m, approximately 2.7
.mu.m, or approximately 3.2 .mu.m. The smallest dimension of each
of the openings may, alternatively, be larger. The smallest
dimension of each of the openings may also be even smaller.
One or more of the openings may be shaped as substantially circular
hole(s), in which case the smallest dimension of each opening may
refer to the diameter of such a hole. Alternatively or
additionally, one or more of the openings may be shaped as
elongated groove(s), in which case the smallest dimension of each
opening may refer to the transversal size of such a groove.
Alternatively or additionally, one or more of the openings may be
shaped as a square, a rectangle, or any other polygonal shape,
and/or one or more of the openings may be shaped in any other
suitable way.
The static distance between the diaphragm and the back-plate is
preferably smaller than 10 .mu.m, such as smaller than 7 .mu.m,
such as smaller than 5 .mu.m, such as smaller than 3 .mu.m, such as
smaller than 1 .mu.m, such as smaller than 0.7 .mu.m, such as
smaller than 0.5 .mu.m, such smaller than 0.3 .mu.m, such as
approximately 0.2 .mu.m. The static distance between the diaphragm
and the back-plate may, thus, be approximately 1 .mu.m, such as
approximately 0.5 .mu.m, approximately 0.7 .mu.m, approximately 0.9
.mu.m, approximately 1.2 .mu.m, or approximately 1.5 .mu.m.
The term `static distance` should be interpreted as the distance
between the diaphragm and the back-plate when the diaphragm is in a
static equilibrium. In this case inner surfaces of the diaphragm
and the back-plate will normally be approximately parallel to each
other, and the `static distance` should be understood as the
distance between these inner surfaces along a direction being
normal to the two parallel inner surfaces.
The step of providing the hydrophobic layer may be performed by
chemical binding of the hydrophobic layer to poly-silicon, silicon
oxide, silicon nitride and/or silicon-rich silicon nitride
surfaces, and forming hydrophobic chains from said hydrophobic
layer, said hydrophobic chains pointing away from the surface to
which the binding is formed.
In this case at least the diaphragm and/or the back-plate may be
manufactured from one or more of the above mentioned materials.
The step of providing the hydrophobic layer may comprise the steps
of forming a molecule monolayer, and cross linking between
molecules and multi binding to surfaces
In this embodiment the provided hydrophobic layer is very durable
and stable.
The hydrophobic layer base material may comprise an alkylsilane,
such as: C.sub.nH.sub.2n+1C.sub.2H.sub.4SiX.sub.3; X.dbd.OCH.sub.3
or OCH.sub.2CH.sub.3 or Cl; n=1, 2, 3, . . .
C.sub.nH.sub.2n+1C.sub.2H.sub.4SiX.sub.2Y; X.dbd.OCH.sub.3 or
OCH.sub.2CH.sub.3 or Cl; Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . .
; m=1, 2, 3, . . . or C.sub.nH.sub.2n+1C.sub.2H.sub.4SiXY.sub.2;
X.dbd.OCH.sub.3 or OCH.sub.2CH.sub.3 or Cl;
Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
Alternatively, the hydrophobic layer base material may comprises a
perhaloalkylsilane, e.g. a perfluoroalkylsilane, such as
C.sub.nF.sub.2n+1C.sub.2H.sub.4SiX.sub.3; X.dbd.OCH.sub.3 or
OCH.sub.2CH.sub.3 or Cl; n=1, 2, 3, . . .
C.sub.nF.sub.2n+1C.sub.2H.sub.4SiX.sub.2Y; X.dbd.OCH.sub.3 or
OCH.sub.2CH.sub.3 or Cl; Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . .
; m=1, 2, 3, . . . or C.sub.nF.sub.2n+1C.sub.2H.sub.4SiXY.sub.2;
X.dbd.OCH.sub.3 or OCH.sub.2CH.sub.3 or Cl;
Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
The method may further comprise the step of positioning at least
part of the diaphragm and at least part of the back-plate in a
liquid comprising a liquid phase of the hydrophobic layer material
to be provided on the inner surfaces. In this embodiment the
hydrophobic layer is provided using a liquid phase deposition
method. As mentioned above, this usually results in a very
structured monolayer being deposited.
Alternatively, the method may further comprise the step of
positioning at least part of the diaphragm and at least part of the
back-plate in a container comprising a gaseous phase of the
hydrophobic layer base material to be provided on the inner
surfaces. The container may alternatively or additionally comprise
a vapour of the hydrophobic layer base material. In this embodiment
the hydrophobic layer is provided using a vapour deposition
method.
Preferably, the hydrophobic layer being provided has a contact
angle for water being between 90.degree. and 130.degree., such as
between 100.degree. and 110.degree..
The hydrophobic layer being provided is preferably stable at
temperatures between -40.degree. C. and 130.degree. C., such as
temperatures between -30.degree. C. and 110.degree. C. It is most
preferably stable at temperatures up to at least 400.degree. C. for
at least 5 minutes.
According to another aspect the present invention provides a
condenser microphone comprising a diaphragm and a back-plate,
wherein an inner surface of said diaphragm forms a capacitor in
combination with an inner surface of said back-plate, said
back-plate and/or said diaphragm is/are provided with a number of
openings, and said inner surfaces being provided with a hydrophobic
layer, and wherein the static distance between said diaphragm and
said back-plate is smaller than 10 .mu.m.
The condenser microphone according to the invention is thus a
microstructure in which inner surfaces of a narrow space or cavity
(i.e. the space or cavity defined by the inner surfaces of the
back-plate and the diaphragm, respectively) have been provided with
a hydrophobic layer. The hydrophobic layer has most preferably been
provided via the number of openings, i.e. according to the method
described above.
At least the inner surfaces of the diaphragm and the back-plate may
be made from a hydrophilic material as described above. However,
the inner surface of the diaphragm and/or the inner surface of the
back-plate may, to some extend, posses hydrophobic properties which
it is desirable to improve.
Preferably, the smallest dimension of each of the openings does not
exceed 10 .mu.m, such as not exceeding 5 .mu.m, such as not
exceeding 1 .mu.m, such as not exceeding 0.5 .mu.m. The smallest
dimension of each of the openings may, thus, be approximately 3
.mu.m.
The hydrophobic layer base material may comprise an alkylsilane,
such as C.sub.nH.sub.2n+1C.sub.2H.sub.4SiX.sub.3; X.dbd.OCH.sub.3
or OCH.sub.2CH.sub.3 or Cl; n=1, 2, 3, . . .
C.sub.nH.sub.2n+1C.sub.2H.sub.4SiX.sub.2Y; X.dbd.OCH.sub.3 or
OCH.sub.2CH.sub.3 or Cl; Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . .
; m=1, 2, 3, . . . or C.sub.nH.sub.2n+1C.sub.2H.sub.4SiXY.sub.2;
X.dbd.OCH.sub.3 or OCH.sub.2CH.sub.3 or Cl;
Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
Alternatively, the hydrophobic layer base material may comprise a
perhaloalkylsilane, e.g. a perfluoroalkylsilane, such as
C.sub.nF.sub.2n+1C.sub.2H.sub.4SiX.sub.3; X.dbd.OCH.sub.3 or
OCH.sub.2CH.sub.3 or Cl; n=1, 2, 3, . . .
C.sub.nF.sub.2n+1C.sub.2H.sub.4SiX.sub.2Y; X.dbd.OCH.sub.3 or
OCH.sub.2CH.sub.3 or Cl; Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . .
; m=1, 2, 3, . . . or C.sub.nF.sub.2n+1C.sub.2H.sub.4SiXY.sub.2;
X.dbd.OCH.sub.3 or OCH.sub.2CH.sub.3 or Cl;
Y.dbd.C.sub.mH.sub.2m+1; n=1, 2, 3, . . .
The static distance between the diaphragm and the back-plate may be
smaller than 5 .mu.m, such as smaller than 1 .mu.m, such as smaller
than 0.5 .mu.m, such as smaller than 0.3 .mu.m. The static distance
between the diaphragm and the back-plate may, thus, be
approximately 1 .mu.m, such as approximately 0.9 .mu.m.
The hydrophobic layer preferably has a contact angle for water
being between 90.degree. and 130.degree., such as between
100.degree. and 110.degree., and it is preferably stable at
temperatures between -40.degree. C. and 130.degree. C., such as
temperature between -30.degree. C. and 110.degree. C. Most
preferably, the hydrophobic layer is stable at temperatures up to
at least 400.degree. C. for at least 5 minutes.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic drawing of a condenser microphone cross
section during a manufacturing process, before sacrificial layer
SiO.sub.2 etching,
FIG. 2 shows the condenser microphone cross section of FIG. 1, but
after sacrificial layer SiO.sub.2 etching, and
FIG. 3 shows the condenser microphone cross section of FIGS. 1 and
2, after a hydrophobic coating has been applied.
DETAILED DESCRIPTION OF THE DRAWINGS
FIGS. 1-3 illustrate the last part of a manufacturing process for a
condenser microphone 1, including applying a hydrophobic coating to
the microphone 1, the process being performed in accordance with
the present invention.
The microphone 1 comprises a supporting structure 2, a back-plate
3, and a diaphragm 4. The supporting structure 2 is preferable made
from a silicon substrate, the back-plate 3 is preferably made from
poly-silicon, and the diaphragm 4 is preferably made from a
poly-silicon/silicon-rich silicon nitride (layers 5) sandwich. The
back-plate 3 is provided with a number of openings 6 through which
the hydrophobic coating material may pass (see below). In the
Figures there is shown five openings 6 for illustrative purposes.
However, in reality the number of openings 6 occurring in a
back-plate of 1.times.1 mm.sup.2 will typically be in the order of
30,000. The diaphragm 4 is movable by a sound pressure and the
back-plate 3 is substantially stationary, and in combination the
diaphragm 4 and the back-plate 3 form a capacitor, the capacitance
of which depends on the immediate distance between the two.
During the manufacturing of the microphone 1, a sacrificial layer 7
is applied to the microphone 1 in order to define the air gap
height. The sacrificial layer 7 is preferably made from SiO.sub.2,
SiON or SiGeON. When the process steps which are normally applied
have been carried out, the sacrificial layer 7 needs to be at least
partially removed in order to allow the diaphragm 4 to move in
relation to the back-plate 3. This sacrificial layer 7 may be
removed by an etching process using HF (hydrofluoric acid) followed
by a water rinse. FIG. 1 shows the microphone 1 before the
sacrificial etching process is applied, and FIG. 2 shows the
microphone 1 after the sacrificial etching process is applied. It
is clear that the sacrificial layer 7 which is present in FIG. 1
has been removed from the microphone 1 of FIG. 2.
The microphone 1 is then cleaned by means of a so-called `piranha
clean`. The microphone 1 is dipped into a container containing a
liquid of three parts H.sub.2O.sub.2 and seven parts
H.sub.2SO.sub.4. Subsequently, the microphone 1 is water
rinsed.
After the water rinse the microphone 1 is transferred into a
container containing isopropanol (IPA, 2-propanol) in order to
perform an IPA rinse. This step is repeated twice, i.e. the
microphone 1 is, in turn, transferred into two other containers
containing a fresh IPA solution. Subsequently, the microphone 1 is
transferred into a container containing heptane in order to perform
a heptane rinse. This step is also repeated twice as described
above.
Next, the actual coating step of is performed by means of silane
deposition. This is done by transferring the microphone to a
container containing heptane with perhaloalkylsilanes, e.g.
perfluoroalkylsilanes, or alkylsilanes, i.e. the actual hydrophobic
coating material. Due to the openings 6 provided in the back-plate
3, the coating material may enter the inner parts of the microphone
1, i.e. the parts defined by the opposite surfaces of the
back-plate 3 and the diaphragm 4, respectively. The coating
material may, thus, be deposited to the surfaces of these inner
parts, such as the inner surfaces of the back-plate 3 and the
diaphragm 4, respectively. Furthermore, since the deposition is
performed using a liquid phase deposition method, the resultant
hydrophobic layer is a structured monolayer. Thus, the hydrophobic
properties of the material are maintained at a high level.
Subsequently, first the heptane rinse steps and then the IPA rinse
steps described above are repeated. Then the microphone 1 is water
rinsed, dried, and post-baked in order to stabilise the
coating.
The IPA rinse steps, the heptane rinse steps, the coating process
and/or the water rinse steps described above may, alternatively, be
performed by continuously renewing the solution in the container,
thus avoiding to transfer the microphone 1 from one container to
another during the rinse step in question. This reduces the
exposure to air of the microphone 1 and, thus, the probability of
drying before the coating process is finished. This makes the
coating process easier to handle, i.e. more attractive for
commercial purposes.
FIG. 3 shows the microphone 1 after the coating process described
above has been performed. The resulting coating is shown as a
dotted line.
The coating process as described above may advantageously be
performed in continuation of the normal manufacturing process.
Thus, a method of providing at least part of a diaphragm and at
least a part of a back-plate of a condenser microphone with a
hydrophobic layer has been provided which is easy to perform, and,
thus, attractive for commercial purposes. Furthermore, a condenser
microphone has been provided in which in-use stiction between the
diaphragm and the back-plate is avoided, or at least prevented to a
great extend.
* * * * *