U.S. patent number RE39,784 [Application Number 11/041,193] was granted by the patent office on 2007-08-21 for structure for removable cooler.
This patent grant is currently assigned to Ma Laboratories, Inc.. Invention is credited to Paul Hsueh.
United States Patent |
RE39,784 |
Hsueh |
August 21, 2007 |
Structure for removable cooler
Abstract
A removable cooler on the memory module wherein the PC board is
able to attach on the memory module without any modification. The
cooler contains a heat sink module and a cooler module. The heat
sink module is combined by two heat conductive heat sinks placed
oppositely and screwed or tenoned on the memory module to stimulate
heat exchange above the extension part of the heat sinks. The
cooler module could be a fan or heat conductive tube. As a fan, it
could be buckled on the memory module socket for the extension part
of the heat sinks to stimulate heat exchange. As a heat conduction
tube screwed or tenoned against the extension part of the heat
sinks, it stimulates heat exchange and provides heat dispensation
function to assure the performance of the memory module.
Inventors: |
Hsueh; Paul (Concord, CA) |
Assignee: |
Ma Laboratories, Inc. (San
Jose, CA)
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Family
ID: |
32681326 |
Appl.
No.: |
11/041,193 |
Filed: |
January 20, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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Reissue of: |
10337782 |
Jan 8, 2003 |
06775139 |
Aug 10, 2004 |
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Current U.S.
Class: |
361/697;
165/104.33; 165/80.3; 257/719; 361/695; 361/700; 361/704 |
Current CPC
Class: |
G06F
1/184 (20130101); G06F 1/185 (20130101); G06F
1/186 (20130101); G06F 1/20 (20130101); H01L
23/3672 (20130101); H01L 23/4093 (20130101); H01L
23/427 (20130101); H01L 23/467 (20130101); H01L
2924/0002 (20130101); H01L 2924/0002 (20130101); H01L
2924/00 (20130101) |
Current International
Class: |
H05K
7/20 (20060101) |
Field of
Search: |
;361/685-688,690-697,704-711,714-721
;165/80.2,80.3,80.4,121,122,104.32,104.33,185,127 ;257/717-721
;174/16.3 ;454/184 ;62/259.2,259.3,259.7,263 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
USPGPUB 2002/0088607 A1, Jul. 11, 2002, Lo. cited by
examiner.
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Primary Examiner: Datskovsky; Michael
Attorney, Agent or Firm: Bever, Hoffman & Harms, LLP
Bever; Patrick T.
Claims
What is claimed is:
.[.1. A structure for a removable cooler on a memory module inside
a PC, comprising: a heat sink module is combined by two heat
conductive heat sinks placed oppositely and screwed or tenoned on
said memory module, stimulating heat exchange by transmitting heat
generated by said memory module to space above an extension part of
said heat sink; a cooler module consisting of a frame and at least
a pair of fans, on both sides of said frame there are flexible
frame's legs and two holes on top of said frame stretching to both
sides of said frame for ventilation; one of the at least a pair of
fans is placed above each of said frame's holes to enhance
ventilation; thus, several memory modules are inserted separately
in memory module sockets of a board and said frame's legs pushed
outward are stuck with a hook, allowing a frame's top and said at
least a pair of fans to be placed above said extension part of said
heat sinks for ventilation, stimulating heat exchange to said
extension parts, thus to provide heat dispensation for said memory
module..].
.[.2. The removable cooler for a memory module of claim 1, wherein
a cavity and a bevel are set at inner bottom of two frame's
legs..].
.[.3. The removable cooler on a memory module of claim 1, wherein
said bevels on both frame's legs are pushed toward a hook on both
sides of said memory module to have said cavity inside said frame's
legs stuck on said hook and secure said frame above said memory
module socket..].
.[.4. The removable cooler on a memory module of claim 1, wherein
there is a concave on said heat sink's opposite side that protects
and contacts with a chip protruding from said memory module for
direct heat conduction..].
.[.5. The removable cooler on a memory module of claim 1, wherein a
plurality of chips of said memory module and a concave provide heat
conduction through a heat conduction interface and said heat
conduction interface is one of a heat dispensation ointment and a
heat dispensation tape..].
.[.6. The removable cooler on a memory module of claim 1, wherein
there are holes on said heat sinks corresponding to holes on said
memory module so as to be screwed or tenoned and secure two heat
sinks on said memory module..].
.[.7. The removable cooler on a memory module of claim 1, wherein
there are one of heat dispensation fins and ventilators on said
extension part of said heat sinks for ventilation and heat
dispensation..].
.[.8. The removable cooler on a memory module of claim 1, wherein a
fan of said frame is placed on a location selected from said
frame's top, bottom and two sides for ventilation..].
.[.9. The removable cooler on a memory module of claim 1, wherein
said cooler module is a heat conduction tube; said heat conduction
tube is located against said extension part of said heat sink and
has heat dispensation fins at an extended end so as to transmit
heat of said extension part of said heat sinks; on one side of said
heat dispensation fins there is a fan to stimulate heat exchange
above said heat dispensation fins, thus provide heat dispensation
for said memory module..].
.Iadd.10. A removable cooler module for a memory module, the memory
module being mounted in a memory socket that is secured to a
printed circuit board such that a plane of the memory module
extends perpendicular to the printed circuit board, the cooler
module comprising: a frame including parallel side legs and an
upper section extending perpendicular to the parallel side legs and
attached to upper ends of the side legs, wherein a lower end of
each of the side legs includes an engaging structure, and wherein
the upper section defines at least one opening; and at least one
fan mounted on the frame, wherein, when the cooler module is
mounted on the memory socket over the memory module, the engagement
structures engage the memory socket, and the side legs extend
perpendicular to the printed circuit board and the upper section of
the frame is maintained over an upper edge of the memory module and
parallel to the printed circuit board, whereby the fan is
positioned to generate air flow over the memory module, and wherein
the lower end of each of the side legs includes a bevel, and
wherein the engaging structure comprises a cavity defined in said
each of the side legs adjacent an upper end of a corresponding one
of said bevels..Iaddend.
.Iadd.11. The removable cooler module according to claim 10,
wherein each of the side legs comprises a flexible material
selected such that when the lower ends of the side legs are pressed
against the memory socket and the bevels contact hook structures
attached to the memory sockets, the side legs flex to accommodate
engagement of the hook structures inside corresponding ones of said
cavities..Iaddend.
.Iadd.12. The removable cooler according to claim 10, wherein said
at least one fan comprises: a first fan mounted over said at least
one opening adjacent a first end of said upper section, and a
second fan mounted over said at least one opening adjacent a second
end of said upper section..Iaddend.
.Iadd.13. An assembly comprising: a module socket mounted on a
printed circuit board; a memory module mounted in the module socket
such that a plane of the memory module extends perpendicular to the
printed circuit board; and a cooler module including: a frame
including a plurality of side legs and an upper section extending
between upper ends of the side legs, and at least one fan mounted
on the frame, wherein a lower end of each of the side legs is
removably engaged with the module socket, wherein the upper section
is positioned over an upper edge of the memory module, and wherein
the fan is arranged on the frame such that air flow generated by
the fan passes along opposing surfaces of the memory module,
wherein the module socket includes a hook that is engaged with a
side edge of the memory module, wherein the lower end of each of
the side legs includes an bevel and defines a cavity, and wherein a
portion of the hook is received in the cavity defined by at least
one of the side legs of the frame..Iaddend.
.Iadd.14. The assembly according to claim 13, wherein each of the
side legs comprises a flexible material selected such that when the
lower ends of the side legs are pressed against the module socket
and the bevels contact first and second hooks attached to opposite
ends of the module sockets, the side legs flex to accommodate
engagement of the hook structures inside corresponding ones of said
cavities..Iaddend.
.Iadd.15. The assembly according to claim 13, wherein said at least
one fan comprises: a first fan mounted over a first opening defined
in said upper section adjacent to a first end of said memory
module, and a second fan mounted over a second opening defined in
said upper section adjacent to a second end of said memory
module..Iaddend.
.Iadd.16. The assembly according to claim 13, further comprising a
heat sink module including first and second conductive heat sinks
mounted over said opposing surfaces of the memory
module..Iaddend.
.Iadd.17. The assembly according to claim 16, wherein at least one
of the first and second conductive heat sinks includes a concave
section that contacts a chip protruding from the memory
module..Iaddend.
.Iadd.18. The assembly according to claim 16, wherein the memory
module comprises a plurality of chips that contact at least one of
the first and second conductive heat sinks by way of one of a heat
dispensation ointment and a heat dispensation tape..Iaddend.
.Iadd.19. The assembly according to claim 16, wherein the first and
second conductive heat sinks define holes that correspond to holes
defined on said memory module, and wherein the first and second
conductive heat sinks are secured by fasteners that extend through
the holes..Iaddend.
Description
FIELD OF THE INVENTION
The present invention relates to a cooler, especially a removable
cooler on the memory of a PC.
BACKGROUND OF THE INVENTION
Traditionally, during the run time of a PC, the electronic
components inside and memory module generate lots of heat,
especially the new memory module required by high-level computers.
The temperature of the memory module going up continuously affects
operation performance, even causes the memory module to break down.
Currently, a cooler designed for such a heat dispensation problem
of the memory module is still unavailable.
In view of such the unavailability, the inventor of the present
invention was devoted to finding a solution and accomplished
structural improvement for cooler.
SUMMARY OF THE INVENTION
The main objective for the present invention is to provide a
removable cooler on the memory module inside a PC, wherein the PC
board is able to attach on the memory module without any
modification. The cooler contains a heat sink module and a cooler
module. The heat sink module combined by two pieces of heat
conduction heat sinks placed oppositely is screwed or tenoned to
the memory module so that the heat generated by the memory module
is conducted to the extension part of the heat sink and thus
stimulates heat exchange. The cooler module could be a fan or heat
conduction tube. If it is a fan, it could be buckled on the memory
module socket for the extension part of the two oppositely placed
heat sinks to absorb the heat of the memory module and drives heat
exchange. If it is a heat conductive tube screwed or tenoned
against the extension of the two oppositely placed heat sinks, it
absorbs the heat of the memory conducted to the extension part of
the two oppositely placed heat sinks and stimulates heat exchange,
thus provides heat dispensation to assure the performance of the
memory module.
In the following, the embodiment illustrated is used to describe
the detailed structural characteristics and operation action for
the present invention
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a three-dimensional illustration for better application
of a removal cooler in the present invention.
FIG. 2 is a three-dimensional illustration for deformation of a
removal cooler's heat sink module in the present invention.
FIG. 3 is a cross-sectional illustration for a heat sink module
placed above the memory module in the present invention.
FIG. 4 is a cross-sectional illustration for heat conduction inside
heat sink module placed above the memory module in the present
invention.
FIG. 5 is an illustration for deformation of another heat sink
module covered on the memory module in the present invention.
FIG. 6 is a three-dimensional illustration for deformation of the
removal cooler in the present invention.
FIG. 7 is an illustration for formation of the frame buckled on the
memory socket in the present invention.
FIG. 8 is an illustration for air convection of the frame bucked on
the memory socket in the present invention.
FIG. 9 is a three-dimensional illustration for better application
of a removal cooler in the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Please refer to FIG. 1. The present invention provides a removal
cooler for the memory module inside a PC, mainly consisting of a
heat sink module 1 and a cooler module 2. The heat sink module 1
covered on the memory module 3 contains two pieces of
heat-conductive heat sinks 11 placed oppositely. There is a concave
111 on the inner side of each heat sink 11 that shelters and
contacts against the chips 31 protruding from both sides of the
memory module 3 and conducts heat (as shown in FIG. 3). Otherwise,
a heat conduction interface 4 is used between the chip 31 and the
concave 111 for heat conduction (as shown in FIG. 4). This heat
conduction interface 4 can be heat dispensation ointment or heat
dispensation tape. On the two heat sinks 11 placed oppositely there
are several holes 112 corresponding to the holes 32 on the memory
module 3 so that the two heat sinks 11 can be screwed (as shown in
FIG. 2) or tenoned (as shown in FIG. 5) to the memory module 3, on
the extension part above the heat sink 11 there are several heat
dispensation fins 114 (as shown in FIG. 2) or ventilators 115 (as
shown in FIG. 5) for ventilation and heat dispensation.
Please refer to FIG. 6. The above cooler module 2 is a fan-style
frame that contains a frame 21 and at least one fan 22 (in this
case two fans 22 are used). The frame 21 is a .pi.-shaped frame
with two flexible sides. On the frame's top 211 there are two holes
212 stretching to the side of the frame. There is a fan 22 placed
at different angle on top of the hole, at the bottom of the hole or
on one side of the hole (in this case the fan is placed on top of
the hole). At the inner bottom of the frame's leg 213 on both sides
of the frame 21 there is a cavity 214 and the inner bottom of the
two frame's legs 213 are bevels 215.
Please refer to FIGS. 6 through 8. Several memory modules 3 are
inserted on the memory socket 7 and fixed by hook 71. In this way,
when pushing the frame's legs 213 of the frame 21 outward and
pushing the bevel 215 at the inner bottom of the two frame's legs
213 toward the hook 71 on both sides of the memory socket 7, the
cavity 214 at the inner bottom of the two frames' legs 213 are
stuck onto the hook 71 on both sides of the memory socket 7, thus
secures the frame 21 above the memory socket 7 with the frame's top
211 and the fan 22 placed above the extension part 113 of the
oppositely placed heat sinks 11. In this way, the heat generated by
the chip 31 of each pair of memory module 3 is conducted to the
extension part 113 through the two heat sinks 11 and the air
absorbed by the fan 22 is transmitted to the space above the
extension part 113 for ventilation and heat exchange, thus achieves
the heat dispensation of the memory module 3 and ensures the
performance of the memory module 3.
Please refer to FIG. 9. The cooler module 2 of the present
invention can be a tube combined with a heat-conduction tube 23 and
a pair of fans 22. The heat-conduction tube 23 is screwed or
tenoned on top of the extension part 113 of the heat sinks 11 and
extends outward with heat dispensation fins 231 at the extended
end. The fan 22 is placed on one side of the heat dispensation fins
231, allowing the air absorbed by the fan 22 to be transmitted to
the space above the heat dispensation fins 231 for heat exchange,
thus achieves heat dispensation for the memory module 3 and ensures
the performance of the memory module 3.
* * * * *