U.S. patent number RE37,554 [Application Number 09/776,462] was granted by the patent office on 2002-02-19 for method for producing an optoelectronic semiconductor component.
This patent grant is currently assigned to Siemens Aktiengesellschaft. Invention is credited to Herbert Brunner, Heinz Haas, Gunter Waitl.
United States Patent |
RE37,554 |
Brunner , et al. |
February 19, 2002 |
Method for producing an optoelectronic semiconductor component
Abstract
The optoelectronic semiconductor component has an optoelectronic
semiconductor chip disposed on a chip carrier with an approximately
planar chip carrier surface. The semiconductor chip is fastened
with predetermined alignment of its optical axis. A plastic base
part supports the chip carrier. The semiconductor chip is
electrically conductively connected to at least two electrode
terminals routed through the base part, and a lens is disposed
above the semiconductor chip on top of the base part. The lens is
formed with an independently configured cap produced from plastic
material. The cap is mechanically form-locked to a support of the
base part. When the cap is placed onto the base part, a holder of
the cap and the support engage with one another. The holder and the
support are configured such that when the cap is placed onto the
base part, the two parts are automatically positioned with respect
to one another in such a way that the optical axes of the lens and
of the semiconductor chip coincide.
Inventors: |
Brunner; Herbert (Regensburg,
DE), Haas; Heinz (Regensburg, DE), Waitl;
Gunter (Regensburg, DE) |
Assignee: |
Siemens Aktiengesellschaft
(Munich, DE)
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Family
ID: |
7773223 |
Appl.
No.: |
09/776,462 |
Filed: |
October 25, 2000 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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PCTDE9601728 |
Sep 13, 1996 |
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Reissue of: |
048561 |
Mar 26, 1998 |
05985696 |
Nov 16, 1999 |
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Foreign Application Priority Data
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Sep 26, 1995 [DE] |
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195 35 777 |
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Current U.S.
Class: |
438/116; 257/81;
438/126; 438/127 |
Current CPC
Class: |
H01L
33/483 (20130101); H01L 31/0203 (20130101); H01L
33/58 (20130101); H01L 2224/48247 (20130101); H01L
2224/48091 (20130101); H01L 2924/00014 (20130101) |
Current International
Class: |
H01L
31/0203 (20060101); H01L 33/00 (20060101); H01L
021/44 (); H01L 021/48 (); H01L 021/50 (); H01L
027/15 () |
Field of
Search: |
;438/116,127,126,125,106
;257/81 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2733937 |
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Feb 1979 |
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DE |
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4232644 |
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Mar 1994 |
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DE |
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2098002 |
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Nov 1982 |
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GB |
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Other References
Japanese Patent Abstract No. 62105486 Yuzo), dated May 15, 1987.*
.
Japanese Patent Abstract No. 1-69061 (Araki), dated Mar. 15, 1989.*
.
Japanese Patent Abstract No. 03254162 (Masaharu et al.), dated Nov.
13, 1991.* .
Japanese Patent Abstract No. 62139367 (Kengo et al.), dated Jun.
23, 1987..
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Primary Examiner: Fahmy; Wael
Assistant Examiner: Berezny; Neal
Attorney, Agent or Firm: Lerner; Herbert L. Greenberg;
Laurence A. Stemer; Werner H.
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation of copending international
application PCT/DE96/01728, filed Sep. 13, 1996, which designated
the United States.
Claims
We claim:
1. A method of producing an optoelectronic semiconductor component,
which comprises:
providing a chip carrier strip with a multiplicity of successively
arranged chip carriers each having a substantially planar chip
carrier surface, injection-molding a base part around an individual
chip carrier of the multiplicity of chip carriers on the chip
carrier strip and at least two electrode terminals extending
through the base part;
fastening an optoelectronic semiconductor chip with a given optical
axis on the chip carrier surface of the chip carrier;
contacting the optoelectronic semiconductor chip with the at least
two electrode terminals extending through the base part;
providing an independent cap produced from a plastic material and
having a lens with an optical axis, and placing the independent cap
on the base part such that the cap and the base part are
automatically positioned with respect to one another such that the
optical axis of the lens and the optical axis of the semiconductor
chip substantially coincide; and
permanently fastening the cap to the base part.
2. The method according to claim 1, wherein the step of providing
the independent cap comprises producing the cap as a separate
structural part in an injection molding operation.
3. The method according to claim 1, which further comprises
producing a lens covering between the base part and the cap, the
lens covering the semiconductor chip.
4. The method according to claim 1, which comprises separating an
individual optoelectronic semiconductor component from the chip
carrier strip only subsequently to the steps of injection-molding,
fastening the semiconductor chip on the chip carrier surface, and
contacting the semiconductor chip with the electrode terminals.
5. The method according to claim 1, which comprises providing the
cap with a holding means and positively locking the holding means
to a support of the base part by placing the cap onto the base part
and mutually engaging the holding means and the support, and
forming the holding means and the support such that when the cap is
placed onto the base part the optical axes of the lens and the
semiconductor chip are automatically aligned with one another.
6. The method according to claim 5, wherein the cap and the base
part have a substantially cylindrical symmetrical cross-sectional
shape having mutually concentric axes of symmetry coinciding with
the optical axes of the lens and the semiconductor chip.
7. The method according to claim 5, which comprises forming the
holding means of the cap and the support of the base part with
positively form-locking elements.
8. The method according to claim 5, which comprises forming the
holding means and the support such that when the cap and the base
part are joined, the holding means and the support are
automatically positioned with respect to one another to ensure a
stable, substantially play-free symmetrical position of the cap and
the base part.
9. The method according to claim 5, which comprises forming a
peripheral abutment surface on an outer circumference of the
support and supporting the holding means of the cap with the
peripheral abutment surface.
10. The method according to claim 5, which comprises forming
projections and grooved recesses peripherally about the holding
means and the support for positively, and axially releasably,
locking the cap to the base part.
11. The method according to claim 5, which comprises forming
circumferentially limited radial projections and recesses
alternately on the holding means and the support for mutual
alignment of the cap and the base part in the circumferential
direction.
12. The method according to claim 5, forming a resilient protrusion
on the holding means of the cap, and forming the support of the
base part with a notch, the protrusion and the notch automatically
engaging into one another when the cap is mounted on the base
part.
13. The method according to claim 1, wherein the injection molding
step comprises forming the base part from a high-temperature
plastic.
14. The method according to claim 1, which comprises forming the
base part from a thermoplastic.
15. The method according to claim 14, wherein the base part is
formed from a thermoplastic selected from the group consisting of
liquid crystal polymers, polyphthalamide, and polysulfone.
16. The method according to claim 3, wherein the step of producing
the lens covering comprising producing the lens from a
light-transmitting plastic material.
17. The method according to claim 3, wherein the step of producing
the lens covering comprising producing the lens from a
light-transmitting plastic material with an optical filter
material.
18. The method according to claim 1, wherein the base part is
produced from plastic with a material for increasing an absorption
of incident scattered light.
19. The method according to claim 18, which further comprises
coloring the plastic material of the base part with a black
coloring substance.
20. The method according to claim 1, which further comprises
placing a reflector assigned to the semiconductor chip inside the
base part.
Description
BACKGROUND OF THE INVENTION
Field of the Invention
The invention relates to optoelectronic semiconductor components.
More particularly, the invention pertains to a method for producing
an optoelectronic semiconductor component, specifically for
applications having very narrow radiation and/or reception
characteristics. The components comprise a chip carrier, which has
an approximately planar chip carrier surface and on which an
optoelectronic semiconductor chip is fastened with predetermined
alignment of its optical axis, and a base part, which is assigned
to the chip carrier, supports the latter and is produced from a
plastic material, the semiconductor chip being electrically
conductively connected to at least two electrode terminals routed
through the base part, and the semiconductor chip being assigned a
lens, which covers over the base part.
Prior art optoelectronic semiconductor components, in particular
those which are subject to increased demands with regard to their
optical properties, have largely been produced in metal-glass
housings. There, the chip carriers are, usually, baseplates
produced from metal mounted with a metal cap with a glass lens
fitted in. Due to the mounting by means of a metal housing, it has
been possible, on the one hand, to ensure a hermetically sealed
closure of the housing and, on the other hand, to provide
suitability of the optoelectronic semiconductor component for
specific high-temperature applications starting from about
150.degree. C. The ageing of the semiconductor chip given such a
type of mounting was slight since, on account of the metal housing
type used, there was essentially no loading on the semiconductor
chip on account of directly surrounding material. Finally, it has
been possible to configure the optical properties of the
semiconductor component favorably on account of the glass lens
fitted into the metal cap.
The considerable costs necessarily incurred by the relatively
complicated production are regarded as a significant disadvantage
of the optoelectronic semiconductor components that have been
produced to date. In this case, the metal cap with a glass lens
fitted in, which requires a high production outlay, has a
particular impact. Furthermore, the semiconductor components
mounted in metal-glass housings have problems on account of the
adjustment and manufacturing tolerances that must be estimated to
be relatively large, with the result that such optoelectronic
semiconductor components generally have relatively unfavorable
squint angles. These are production-dictated deviations of the
optical axis from the mechanical axis of the component. As a
result, such semiconductor components can only be used to a limited
extent in applications which involve narrow radiation and/or
reception characteristics. In the prior art optoelectronic
semiconductor components, a larger adjustment play during mounting
consequently has an extremely unfavorable effect on the squint
angle obtained, given closer tolerance specifications.
Furthermore, mass-produced plastic light-emitting diodes having
lesser requirements with regard to the optical qualities are known
in which the housing with a baseplate and a cap is cast in one
process operation and thus produced in one part. That production
process is significantly less expensive than metal-glass housings.
However, as a result of the single work operation of the
(pressureless) casting production, excessively high adjustment
tolerances and thus high squint angles are produced. The
optoelectronic semiconductor components produced in such a way have
quite unsatisfactory optical properties for specific
applications.
There have become known, as disclosed in Patent Abstracts of Japan,
Vol. 16, No. 055 (E-1165), Feb. 12, 1992, & JP-A-03254162, a
light-emitting diode with a base part made of metal and a plastic
cap with a lens part. There, the object is to improve the
positioning accuracy and to increase the emission rate.
Reference is also had to Patent Abstracts of Japan, Vol. 11, No.
367 (E-561), Nov. 28, 1987 & JP-A-62139367 and Patent Abstracts
of Japan, Vol. 11, No. 312 (E-548), Oct. 12, 1987 &
JP-A-62105486, which show further light-emitting diodes with
separately configured lens caps.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide a method of
producing an optoelectronic semiconductor component, which
overcomes the above-mentioned disadvantages of the prior art
methods of this general type and which provides for a component
that, given high requirements on the adjustment tolerances and thus
squint angles, can be produced considerably more cost-effectively
as compared to the prior art.
With the foregoing and other objects in view there is provided, in
accordance with the invention, a method of producing an
optoelectronic semiconductor component, in particular such a
component with very narrow radiation and/or reception
characteristics. The method comprises:
providing a chip carrier strip with a multiplicity of successively
arranged chip carriers each having a substantially planar chip
carrier surface, injection-molding a base part around an individual
chip carrier of the multiplicity of chip carriers on the chip
carrier strip and at least two electrode terminals extending
through the base part;
fastening an optoelectronic semiconductor chip with a given optical
axis on the chip carrier surface of the chip carrier;
contacting the optoelectronic semiconductor chip with the at least
two electrode terminals extending through the base part;
providing an independent cap produced from plastic material and
having a lens with an optical axis, and placing the independent cap
on the base part such that the cap and the base part are
automatically positioned with respect to one another such that the
optical axis of the lens and the optical axis of the semiconductor
chip substantially coincide; and
permanently fastening the cap to the base part.
In accordance with an added feature of the invention, the step of
providing the independent cap comprises producing the cap as a
separate structural part in an injection molding operation.
In accordance with an additional feature of the invention, a lens
covering is produced between the base part and the cap, the lens
covering the semiconductor chip.
In accordance with another feature of the invention, an individual
optoelectronic semiconductor component is separated from the chip
carrier strip only subsequently to the steps of injection-molding,
fastening the semiconductor chip on the chip carrier surface, and
contacting the semiconductor chip with the electrode terminals.
In accordance with a further feature of the invention, the cap is
provided with a holding means and the holding means is positively
locked (form-locked) to a support of the base part by placing the
cap onto the base part and mutually engaging the holding means and
the support, and forming the holding means and the support such
that when the cap is placed onto the base part the optical axes of
the lens and the semiconductor chip are automatically aligned with
one another.
In other words, the objects of the invention are satisfied in that
the independently configured cap produced from plastic material is
produced as a separate structural part by means of an injection
molding operation. The base part is produced in an injection
molding operation of a chip carrier from a multiplicity of chip
carriers arranged successively in a chip carrier strip. An
optoelectronic semiconductor component is separated from the chip
carrier strip only after the base part has been produced, after the
semiconductor chip has been fastened on the chip carrier surface by
means of bonding, and after the semiconductor chip has been
contacted with the electrode terminals. The carrier strip
encapsulated by injection molding may be produced and processed in
an endless manner, so-called reel-to-reel technique. Overall, it is
possible in this way to realize cost-effective mounting of the
component with very close electro-optical parameter tolerances.
In accordance with a preferred embodiment of the invention, the
lens covering the base part is a part of an independently
configured cap produced from plastic material, the cap having a
holding means for a positively locking mechanical connection to a
support of the base part, in such a way that when the cap is placed
onto the base part, the holding means and the support alternately
engage with one another. The holding means and the support are
configured in such a way that when the cap is placed onto the base
part, the cap and the base part are automatically positioned with
respect to one another such that the optical axes of the lens and
of the semiconductor chip coincide at least approximately.
Due to the fact that the base part supporting the chip carrier and
the cap with the integrated lens (with the cap placed onto the base
part) are produced as two separate plastic structural parts each
produced by injection molding, it is possible to produce an
optoelectronic semiconductor component significantly more
cost-effectively. In fact, the cost savings is by approximately a
factor of 10, compared with the prior art components, without
accepting losses in the optical properties of the semiconductor
component. The two separately produced structural parts can be
joined to one another automatically in an substantially play-free
manner, with the result that the semiconductor component according
to the invention has only extremely small adjustment tolerances and
thus extremely small squint angles. The optoelectronic
semiconductor component according to the invention is therefore
outstandingly suitable for applications having very narrow
radiation and/or reception characteristics. The production of the
lens, integrated in the cap, from plastic furthermore enables lens
shapes which can be produced significantly more accurately than
glass lenses, and therefore better optical properties of the lens.
The effect that can be achieved by means of a suitable
configuration of cap and base part is that when the cap is placed
onto the base part, they are automatically positioned and/or
centered with respect to one another.
In accordance with again an added feature of the invention, the cap
and the base part are cylindrically symmetrical. Their axes of
symmetry run concentrically with respect to one another and each
coincide with the optical axes of lens and semiconductor chip.
Furthermore, the holding means of the cap and the support of the
base part are adapted and/or designed for a positively locking
connection. In accordance with again a further feature of the
invention, the holding means and the support are designed in such a
way that when the cap and the base part are joined, they are
automatically positioned with respect to one another in such a way
as to ensure stable and substantially play-free symmetrical
positioning of the cap and the base part.
In accordance with yet another feature of the invention, the cap
and the base part are mechanically alignment by forming the support
of the base part, on its outer circumference, with a peripheral
abutment surface, which supports the holding means of the cap (when
the cap is placed on the base part).
The holding means and support which are assigned to the positively
locking mechanical connection of cap and base part, which
connection can be released in the axial direction, are formed by
projections and grooved recesses which are formed alternately and
peripherally on both parts. Alternatively, the holding means and
support, for mutual alignment of cap and base part in the
circumferential direction, are formed by additional, radial
projections and recesses which are arranged alternately on both
parts and are formed to a limited extent in the circumferential
direction.
In accordance with another feature of the invention, the holding
means of the cap is provided with a resilient protrusion, and the
support of the base part is formed with a complementary notch or
groove, for automatically fastening the cap to the base part in a
mounting position.
Moreover, for the further configuration of the optical properties
of the component or merely for the purpose of protecting the
semiconductor chip, the production method may include a step of
placing a lens covering or lens-shaped chip covering between the
base part and the cap. That lens covering may be produced from a
light-transmitting plastic material which, in particular, has an
optical filter material.
Furthermore, the base part may be produced from a plastic material
which increases the absorption of incident scattered light. In
particular, the base material may be colored with a black coloring
substance. The shaping of the base part produced from plastic may
be chosen such that in addition to the suitability for fastening
the cap, a reflector is formed around the semiconductor chip and
the optical properties of the component are concomitantly
determined in a favorable manner. Furthermore, a reflector assigned
to the semiconductor chip may be provided inside the base part for
the purpose of improving the radiation properties of the
component.
The form of the lens integrated in the cap produced from plastic
may be of variable configuration, in a simple and cost-effective
manner, depending on desired optical properties of the component.
Thus, for example, the cap may have an integrated Fresnel lens,
with the result that optoelectronic components having a
particularly small structural height and very narrow-angled
radiation and/or reception characteristics can advantageously be
realized.
In total, the production method according to the invention enables
the optical system of the component to be configured in a very
differentiated and precise manner.
In accordance with yet another feature of the invention, the
production of the base part is from plastic materials which are
high-temperature-resistant, soldering-resistant and with which the
chip carrier and the soldering connections or electrode terminals
are encapsulated by injection molding. The plastic material may in
this case be, in particular, a thermoplastic, such as, for example,
LCP=liquid crystal polymers, PPA=polyphthalamide, or polysulfone or
similar material. Furthermore, thermosetting plastic materials are
also possible as the plastic material of the base part; they will
generally be more expensive than thermoplastics and are probably
less suitable for high-temperature applications.
The material of the cap which integrally comprises the lens of the
component may be, for example, a polycarbonate material which may
be optically clear and thus fully transparent, or, for the purposes
of filtering light of a specific wavelength, may be colored or
provided with specific absorptive materials.
The material of the lens covering or lens-shaped chip covering
above the semiconductor chip may preferably be resin or
silicone.
Other features which are considered as characteristic for the
invention are set forth in the appended claims.
Although the invention is illustrated and described herein as
embodied in a method of producing an optoelectronic semiconductor
component it is nevertheless not intended to be limited to the
details shown, since various modifications and structural changes
may be made therein without departing from the spirit of the
invention and within the scope and range of equivalents of the
claims.
The construction and method of operation of the invention, however,
together with additional objects and advantages thereof will be
best understood from the following description of specific
embodiments when read in connection with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a diagrammatic sectional view of an optoelectronic
semiconductor component in accordance with an exemplary embodiment
of the invention;
FIG. 2A is a diagrammatic sectional view of a base part and of a
chip carrier in an optoelectronic semiconductor component in
accordance with a further exemplary embodiment of the
invention;
FIG. 2B is a diagrammatic plan view thereof;
FIG. 3A is a sectional view of a cap with integrated lens of an
optoelectronic semiconductor component in accordance with a further
exemplary embodiment of the invention;
FIG. 3B is a diagrammatic sectional view of a base part in
accordance with the further exemplary embodiment of the
invention;
FIG. 3C is a plan view thereof; and
FIG. 4 is a diagrammatic view of a chip carrier strip for producing
an optoelectronic semiconductor component in accordance with the
invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to the figures of the drawing in detail, there is
seen as optoelectronic semiconductor component 1, having a chip
carrier 3 with an approximately planar chip carrier surface 2. An
optoelectronic semiconductor chip 4 is fastened on the carrier
surface 2 with predetermined alignment of its optical axis 5. The
component further includes a base part 6, which is assigned to the
chip carrier 3, supports the latter and produced from a plastic
material. The optoelectronic semiconductor chip 4 is electrically
conductively connected to two electrode terminals 7 and 8 routed
through the base part 6. In FIG. 1, a contact wire 9 connects the
semiconductor chip 4 to one electrode terminal 7, and the
electrical connection to the other electrode terminal 8 is effected
by a bonded connection of the electrically conductive underside of
the semiconductor chip 4 to the chip carrier surface 2. The latter
is integrally formed with the other electrode terminal 8. The lens
10 provided for optical imaging of the semiconductor chip 4 forms a
part of an independently configured cap 11. The cap 11 is
preferably produced from polycarbonate and is placed onto the base
part 6 in such a way that the optical axis 12 of the lens 10
coincides with the optical axis 5 of the semiconductor chip 4
disposed on the chip carrier 3.
The cap 11 has a holding means 13 which forms a positively locking
mechanical form-lock connection with a support 14 of the base part
6. When the cap 11 is placed onto the base part 6, the holding
means 13 and the support 14 engage with one another. The cap 11 and
the base part 6 have an essentially cylindrically symmetrical
cross-sectional shape whose axes of cylinder symmetry run
concentrically with respect to one another and also coincide with
the optical axes 5 and 12 of the lens 10 and the semiconductor chip
4.
In the embodiment of FIG. 1, the inner diameter of the holding
means 13 is approximately identical to the external diameter of the
support 14. The holding means 13 and the support 14 are matched and
thus form a positively locking connection. For defined support of
the cap 11 on the base part 6, the support 14 of the base part 6
has, on its outer circumference, a peripheral abutment surface 15,
which supports the holding means 13 of the cap 11. As a result,
when the cap 11 and the base part 6 are joined, they are
automatically positioned with respect to one another in such a way
that a stable, substantially play-free symmetry position of cap 11
and base part 6 is ensured. The optoelectronic component 1
according to the invention thus has extremely small adjustment
tolerances and resultant optical squint angles, and is thus
particularly suitable for applications having very narrow radiation
and/or reception characteristics.
A protective or lens covering 16, which is composed of resin or
silicone and is fastened between the base part 6 and the cap 11,
covers the semiconductor chip 4.
The reference symbol 17 indicates a reflector formed in the base
part 6. The reflector 17 is assigned to the semiconductor chip 4
and concomitantly determines the radiation and/or reception
characteristic of the component.
In the exemplary embodiment of the invention illustrated in FIG. 1,
the permanent stable fastening of the cap 11 placed onto the base
part 6 can be effected by a bonded connection or welded connection.
In contrast, FIGS. 3A to 3C show a further exemplary embodiment of
an optoelectronic component, in which the cap 11 can be snapped
onto the base part 6 for automatic establishment of a permanent and
secure fastening by a snap-action closure. For this purpose, the
holding means 13 of the cap 11 is provided with a resilient
protrusion 18, which interacts with an undercut notch 19, provided
in the support 14 of the base part 6, for the automatic
establishment of the cap 11 and of the base part 6 in a mounted
position.
Further features which assist in a reliable, automatic positioning
when the cap 11 and base part 6 are joined together are evident in
the exemplary embodiment of FIGS. 3A to 3C. For example,
projections 20 and depressions 21 are assigned to the positively
locking mechanical connection of the cap 11 and the base part 6.
That connection can be released in the axial direction. The
projections 20 and depressions 21 are formed on both parts of
holding means 13 and support 14 peripherally or to a limited extent
in the circumferential direction.
The novel method of producing the optoelectronic semiconductor
component 1 in accordance with a preferred exemplary embodiment
will now be explained in more detail. Production proceeds from a
chip carrier strip 22 illustrated according to FIG. 4. The strip
can be produced and processed in endless continuous production
(reel-to-reel technique). Firstly, the chip carrier surfaces 2 to
which the semiconductor chips 4 are to be fastened are produced in
an embossing step for producing smooth and clean surfaces.
Afterward, the regions of the chip carriers 3 and electrode
terminals 7 and 8 are subjected to an electrodeposition process.
There, for example, nickel is first applied and then silver. As the
next production step, the base part 6 is then produced by
encapsulating the chip carrier 3 and the electrode terminals 7 and
8 by injection molding with a thermoplastic material. In this case,
the thermoplastic material is introduced under pressure into an
injection mold, which has the desired, predetermined configuration
of the base part, in order to avoid the formation of shrink holes
and inclusions. Afterward, the semiconductor chip 4 is fastened on
the chip carrier surface 2 by bonding. Adhesive bonding is
particularly suitable. If appropriate, bonding wires for contacting
the semiconductor chip 4 are connected to an electrode terminal.
After this production step, it is possible, still on the endless
chip carrier strip 22, to produce, for the purpose of protecting or
configuring the optical system, a lens covering 16 by injection
molding of a suitable plastic material that is light-transmitting
or provided with a filter material, which lens covering covers the
semiconductor chip 4. Subsequently, after the individual chip
carriers 3 with formed base part 6 and applied chip covering 16
have been separated from the chip carrier strip 22, the
independently formed cap 11 produced from polycarbonate with an
integrated lens 10 is placed onto the base part 6 in such a way
that the cap 11 and the base part 6 are automatically positioned
with respect to one another such that the optical axes 5 and 12
coincide.
* * * * *