U.S. patent number RE35,838 [Application Number 08/430,271] was granted by the patent office on 1998-07-07 for electrically erasable programmable read-only memory with nand cell structure.
This patent grant is currently assigned to Kabushiki Kaisha Toshiba. Invention is credited to Yasuo Itoh, Ryouhei Kirisawa, Fujio Masuoka, Masaki Momodomi, Kazunori Ohuchi, Riichiro Shirota.
United States Patent |
RE35,838 |
Momodomi , et al. |
July 7, 1998 |
Electrically erasable programmable read-only memory with NAND cell
structure
Abstract
An erasable programmable read-only memory with NAND cell
structure is disclosed which has memory cells provided on a N type
substrate. The memory cells are divided into NAND cell blocks each
of which has a series array of memory cell transistors. Each of the
transistors has a floating gate, a control gate connected to a word
line and N type diffusion layers serving as its source and drain.
These semiconductor layers are formed in a P type well layer formed
in a surface area of a substrate. The well layer serves as a
surface breakdown prevention layer. During a data erase mode data
stored in all the memory cells are erased simultaneously. During
the data write mode subsequent to the erase mode, when a certain
NAND cell block is selected, memory cells in the NAND cell block
are subjected to data writing in sequence. When data is written
into a certain memory cell in the selected NAND cell block, a
control gate of the certain memory cell is supplied with a voltage
which is so high as to form a strong electric field to allow the
tunneling of electrons between the floating gate of the memory cell
and the well layer. Consequently, only the selected cell can be
written into.
Inventors: |
Momodomi; Masaki (Yokohama,
JP), Masuoka; Fujio (Yokohama, JP),
Shirota; Riichiro (Kawasaki, JP), Itoh; Yasuo
(Kawasaki, JP), Ohuchi; Kazunori (Yokohama,
JP), Kirisawa; Ryouhei (Yokohama, JP) |
Assignee: |
Kabushiki Kaisha Toshiba
(Kawasaki, JP)
|
Family
ID: |
27340373 |
Appl.
No.: |
08/430,271 |
Filed: |
April 28, 1995 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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951125 |
Sep 25, 1992 |
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Reissue of: |
289702 |
Dec 27, 1988 |
04959812 |
Sep 25, 1990 |
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Foreign Application Priority Data
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Dec 28, 1987 [JP] |
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62-329781 |
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Current U.S.
Class: |
365/185.17;
257/316; 365/104 |
Current CPC
Class: |
G11C
16/16 (20130101) |
Current International
Class: |
G11C
16/16 (20060101); G11C 16/06 (20060101); G11C
017/00 () |
Field of
Search: |
;365/104,182,184,185,218,230.03,185.13,185.17,185.19,185.27,185.28,185.33
;257/316 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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0247875 |
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Dec 1987 |
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EP |
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60-8559 |
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Mar 1985 |
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JP |
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60-182162 |
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Sep 1985 |
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JP |
|
2073488 |
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Oct 1981 |
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GB |
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84/02800 |
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Jul 1984 |
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WO |
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Other References
R Stewart et al., "A High Density EPROM Cell and Array," Symposium
on VLSI Technology Digest of Technical Papers, May 1986, pp. 89-90.
.
IBM Technical Disclosure Bulletin, vol. 27, No. 6, Nov. 1984, pp.
3302-3307, E. Alder, "Densely Arrayed EEPROM Having Low-Voltage
Tunnel Write"..
|
Primary Examiner: Popek; Joseph A.
Assistant Examiner: Ho; Hoai V.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier
& Neustadt, P.C.
Parent Case Text
.Iadd.This application is a Continuation of reissue application
Ser. No. 07/951,125, filed on Sep. 25, 1992, now abandoned, which
is a reissue application of U.S. Pat. No. 4,959,812. .Iaddend.
Claims
What is claimed is:
1. A non-volatile .[.dynamic.]. semiconductor memory device
comprising:
(a) a semiconductive substrate having a major surface;
(b) a semiconductive well region formed in said surface of said
substrate, said well region being provided separate from a well
region in which transistors are formed to constitute a peripheral
circuit of said memory device;
(c) parallel bit lines provided above said substrate;
(d) rewritable memory cells connected to said bit lines, said
memory cells comprising NAND cell blocks each of which has a series
array of memory cell transistors, each of said memory cell
transistors having a charge accumulation layer, a control gate and
semiconductive layers formed in said well region to function as
sources and drains.[., and said well region functioning as a
surface breakdown prevention layer.].; and
(e) control means for writing data into memory cells of a selected
NAND cell block sequentially during a data write mode subsequent to
.[.the.]. .Iadd.a .Iaddend.data erase mode, said control means
applying, when a certain memory cell of said selected NAND cell
block is subjected to writing, to said control gate of said certain
memory cell a voltage to form such a strong electric field as to
allow the transfer of charges between said charge accumulation
layer of said certain memory cell and said well region.
2. The device according to claim 1, wherein said substrate has a
first conductivity type, said well region has a second conductivity
type.Iadd., .Iaddend.and said semiconductive layers have the first
conductivity type.
3. The device according to claim 1, wherein said substrate and said
well region have a first conductivity type and said semiconductive
layers have a second conductivity type; and wherein said device
further comprises an additional well region of the second
conductivity type formed in said substrate so as to surround said
well region.
4. The device according to claim 3, wherein said well regions are
connected to a common well potential.
5. The device according to claim 1, wherein said selected NAND cell
block comprises:
a first selection transistor provided at one end of said selected
NAND cell block and selectively rendered conductive for
electrically connecting said selected NAND cell block to a
corresponding bit line associated therewith; and
a second selection transistor provided at the other end of said
selected NAND cell block and selectively rendered conductive for
electrically connecting said selected NAND cell block to .[.said
well area.]. .Iadd.a source potential.Iaddend., said second
selection transistor being rendered nonconductive during the data
write mode so as to prevent .[.leakage.]. .Iadd.flow .Iaddend.of
current .[.between.]. .Iadd.in .Iaddend.said corresponding bit line
.[.and said substrate.]..
6. The device according to claim 1, wherein each of said NAND cell
blocks comprises:
an erase gate layer provided insulatingly over said substrate so as
to extend substantially parallel to said series array of memory
cell transistors and sandwiched insulatingly by said charge
accumulation layer and said control gate of each of said memory
cell transistors, said erase gate layer overlapping said charge
accumulation layer.Iadd., .Iaddend.and said charge accumulation
layer and said control gate being capacitively coupled to each
other by said erase gate layer.
7. An erasable programmable read-only memory device comprising:
(a) a semiconductive substrate having a semiconductive well layer
formed in its major surface;
(b) parallel bit lines provided over said substrate;
(c) parallel word lines intersecting said bit lines
insulatingly;
(d) double-gate field effect transistors provided at intersections
of said bit lines and said word lines for functioning as memory
cells, said transistors including a cell array which has a
series-circuit of cell transistors constituting a NAND cell block,
each of said cell transistors having semiconductor layers serving
as a source and a drain thereof, an electrically floating gate
layer serving as a charge accumulation layer and a control gate
layer connected to a corresponding word line, said semiconductor
layers being formed in said well layer;
(e) a field effect transistor provided at one end of said NAND cell
block and selectively rendered conductive for serving as a first
selection transistor;
(f) a field effect transistor provided at the other end of said
NAND cell block and selectively rendered conductive for serving as
a second selection transistor; and
(g) driving means for, when said NAND cell block is selected during
a data write mode of said device, (1) rendering said first
selection transistor conductive to electrically connect said NAND
cell block to a corresponding bit line associated therewith to
which write data is applied, (2) rendering said second selection
transistor nonconductive .[.to electrically disconnect said NAND
cell block from said well layer.]., and (3) writing data into
memory cells of said NAND cell block sequentially, said driving
means changing a potential of said well layer to have a level
different from that of a potential of said well layer in a
simultaneous erase mode prior to the data write mode of said
device.
8. The device according to claim 7, wherein said driving means
writes data into memory cells of said NAND cell block in a
predetermined sequence in which a cell transistor adjacent to said
second selection transistor is subjected to writing first and a
cell transistor adjacent to said first selection transistor is
subjected to writing last.
9. The device according to claim 8, wherein said driving means
applies, when a certain memory cell of said NAND cell block is
subjected to writing, to said control gate of said certain memory
cell a first voltage to form such a strong electric field as to
allow the transfer of charges between said charge accumulation
layer of said certain memory cell and said well layer and to the
remaining memory cells of said NAND cell block a second voltage
lower than the first voltage.
10. The device according to claim 9, wherein said substrate has a
first conductivity type, said well layer has a second conductivity
type.Iadd., .Iaddend.and said semiconductive layers have the first
conductivity type.
11. The device according to claim 10, wherein said driving means
applies to said well layer one of a "H" level potential and a "L"
level potential during the simultaneous erase mode and the other of
the "H" level potential and the "L" level potential during the data
write mode.
12. The device according to claim 9, wherein said substrate and
said well layer have a first conductivity type and said
semiconductive layers have a second conductivity type; and wherein
said device further comprises an additional well layer of the
second conductivity type formed in said substrate so as to surround
said well layer.
13. The device according to claim 12, wherein said driving means
applies to said well layers a .[."L".]. .Iadd."H".Iaddend. level
potential during the simultaneous erase mode and a .[."H".].
.Iadd."L".Iaddend. level potential during the data write mode.
14. The device according to claim 1, wherein said control means
erases data stored in all said memory cells simultaneously during a
data erase mode of said memory device.
15. A non-volatile .[.dynamic.]. semiconductor memory device
comprising:
a semiconductor substrate having a major surface;
a semiconductor well region formed in said surface of said
substrate, said well region being provided separate from a well
region in which transistors are formed to constitute a peripheral
circuit of said memory device;
parallel bit lines provided above said substrate;
rewritable memory cells connected to said bit lines, said memory
cells comprising NAND cell blocks each of which has a series array
of memory cell transistors, each of said memory cell transistors
having a charge accumulation layer, a control gate and
semiconductor layers formed in said well region to function as
sources and drains.[., and said well region functioning as a
surface breakdown prevention layer.].;
control means for erasing data stored in all said memory cells
simultaneously during a data erase mode of said memory device and
writing data into memory cells of a selected NAND cell block
sequentially during a data write mode subsequent to the data erase
mode, said control means applying, when a certain memory cell of
said selected NAND cell block is subjected to writing, to said
control gate of said certain memory cell a voltage to form such a
strong electric field as to allow the transfer of charges between
said charge accumulation layer of said certain memory cell and said
well region;
a first selection transistor provided at one end of said selected
NAND cell block and selectively rendered conductive for
electrically connecting said selected NAND cell block to a
corresponding bit line associated therewith; and
a second selection transistor provided at the other end of said
selected NAND cell block and selectively rendered conductive for
electrically connecting said selected NAND cell block to .[.said
well area.]. .Iadd.a source potential.Iaddend., said second
selection transistor being rendered nonconductive during the data
write mode so as to prevent .[.leakage of current between.].
.Iadd.flow of current in .Iaddend.said corresponding bit line
.[.and said substrate.].. .Iadd.
16. A nonvolatile semiconductor memory device comprising:
(a) a semiconductor substrate having a major surface;
(b) a semiconductor well region formed in said surface of said
substrate, said well region being provided separate from a well
region in which transistors are formed to constitute a peripheral
circuit of said memory device;
(c) parallel bit lines provided above said substrate;
(d) rewritable memory cells connected to said bit lines, said
memory cells comprising NAND cell blocks each of which has a series
array of memory cell transistors, each of said memory cell
transistors having a charge accumulation layer, a control gate and
semiconductor layers formed in said well region to function as
sources and drains;
(e) at least first selection transistors included in said NAND cell
blocks, each of said first selection transistors provided at one
end of said series array of memory cell transistors, and said first
selection transistors being formed in said well region in which
said NAND cell blocks are formed; and
(f) control means for writing data into memory cells of a selected
NAND cell block sequentially during a data write mode subsequent to
a data erase mode, said control means applying, when a certain
memory cell of said selected NAND cell block is subjected to
writing, to said control gate of said certain memory cell a voltage
to form such a strong electric field as to allow the transfer of
charges between said charge accumulation layer of said certain
memory cell and said well region. .Iaddend..Iadd.17. The device
according to claim 16, wherein said substrate has a first
conductivity type, said well region has a second conductivity type,
and said semiconductor layers have the first conductivity type.
.Iaddend..Iadd.18. The device according to claim 16, wherein said
substrate and said well region have a first conductivity type and
said semiconductor layers have a second conductivity type; and
wherein said device further comprises an additional well region of
the second conductivity type formed in said substrate so as to
surround said well region. .Iaddend..Iadd.19. The device according
to claim 18, wherein said well regions are connected to a common
well potential. .Iaddend..Iadd.20. The device according to claim
16, wherein said selected NAND cell block further comprises:
second selection transistors included in said NAND cell blocks,
each of said second selection transistors provided at the other end
of said series array of memory cell transistors, and said second
selection transistors being formed in said well region in which
said NAND cell blocks are formed. .Iaddend..Iadd.21. The device
according to claim 16, wherein each of said NAND cell blocks
comprises:
an erase gate layer provided insulatingly over said substrate so as
to extend substantially parallel to said series array of memory
cell transistors and sandwiched insulatingly by said charge
accumulation layer and said control gate of each of said memory
cell transistors, said erase gate layer overlapping said charge
accumulation layer, and said charge accumulation layer and said
control gate being capacitively coupled to each other by said erase
gate layer. .Iaddend..Iadd.22. The device according to claim 20,
wherein:
said first selection transistors are selectively rendered
conductive for electrically connecting said series array of memory
cell transistors to a corresponding bit line associated therewith;
and
said second selection transistors are selectively rendered
conductive for electrically connecting said series array of memory
cell transistors to a source potential and are rendered
nonconductive during the data write mode so as to prevent flow of
current in said corresponding bit line. .Iaddend.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to non-volatile semiconductor
memories and, more particularly, to electrically erasable
programmable read-only memories with large storage capacity.
2. Description of the Related Art
With the increasing needs for high performance and reliability of
digital computer systems, the development of a semiconductor memory
has strongly been demanded that has enough storage capacity to
replace an existing non-volatile data storage device, such as a
magnetic floppy disk unit, for computers. As compared with magnetic
disk storage devices, such as a floppy disk unit and a hard disk
unit, a presently available electrically erasable programmable
semiconductor read-only memory is reliable and fast in data
writing/reading speed. However, the electrically erasable
programmable semiconductor read-only memory is not still large in
data storage capacity enough to replace the above magnetic data
storage devices.
In a conventional electrically erasable programmable read-only
memory (abbreviated to "EEPROM" hereinafter), each memory cell is
typically composed of two transistors and data is randomly written
or erased one byte at a time. Hence, such high-density integration
of the EEPROM as provides large storage capacity enough to replace
the peripheral data storage devices will be difficult to
expect.
Recently, as a non-volatile semiconductor memory which is
integrated at high density and thus has a large storage capacity,
an erasable programmable read-only memory has been developed that
has a "NAND type cell" structure. This type of memory device is
typically designed such that: (1) each memory cell utilizes one
transistor having a floating gate and a control gate; and (2) a
single contact is provided between an array of memory cells
arranged on a substrate to constitute an "NAND cell structure" and
a corresponding bit line. Hence, as compared with the conventional
EEPROM, the area occupied by memory cells can considerably be
reduced and thus the integration density can be improved.
However, the .[.conventional.]. NAND cell type .[.EE-PROM.].
.Iadd.EEPROM .Iaddend.is suffering from problems of the large
current dissipation and the surface .[.voltage drop (known as
"surface breakdown").]. .Iadd.breakdown .Iaddend.which occurs in
the memory cells of the NAND cell blocks at the time of data
writing. For example, according to .[.conventional.].
.Iadd.hot-electron injection type .Iaddend.devices, the .[.data.].
writing into a selected memory cell is achieved by injecting
electrons from a chip substrate into the floating gate of the
memory cell through hot-electron injection. The injection of
electrons through hot-electron injection undesirably increases the
current dissipation in EEPROM. Semiconductor diffusion layers
serving as drains and sources of series-arrayed cell transistors of
a selected NAND cell block are directly formed in a surface portion
of a chip substrate of an opposite conductivity type. .[.When.].
.Iadd.In the case of tunnel-electron emission type, when .Iaddend.a
boosted potential is applied to sources and drains of the remaining
nonselected cell transistors in order to write data into a selected
memory cell transistor of the NAND cell block, the surface
breakdown will occur in the diffusion .[.layers.]. .Iadd.layer
.Iaddend.of the .[.remaining transistors.]. .Iadd.selected cell
transistor.Iaddend.. The surface breakdown in the diffusion layers
not only prevents effective data writing into the selected cell but
also causes a variation of the thresholds of the .[.nonselected.].
cells. This will result in degradation of the operational
reliability of the .[.EE-PROM.]. .Iadd.EEPROM.Iaddend.. .Iadd.The
surface breakdown undesirably increases the current dissipation in
the EEPROM. .Iaddend.
SUMMARY OF THE INVENTION
It is accordingly an object of the present invention to provide a
novel and improved non-volatile semiconductor memory.
It is another object of the present invention to provide a novel
and improved electrically erasable programmable read only memory
which is high-density integrated to have large storage capacity and
has high operational reliability.
In accordance with the above objects, the present invention is
addressed to specific nonvolatile .[.dynamic.]. semiconductor
memory device comprising: a semiconductive substrate; parallel bit
lines formed over the substrate; and rewritable memory cells
connected to the bit lines. The memory cells comprise NAND cell
blocks each of which has a series array of memory cell transistors.
Each of the transistors has a charge accumulation layer, such as a
floating gate, a control gate and semiconductive layers serving as
its source and drain. These semiconductive layers are formed in a
semiconductive well area. The well area is formed on the surface of
the substrate separate from a well area in which transistors
constituting a peripheral circuit of the memory device are formed.
.[.The well area serves as a surface breakdown prevention layer of
the memory cell transistors.].. Parallel word lines are formed over
the substrate to intersect the bit lines and connected to the gates
of the transistors. The peripheral circuit includes a driving
circuit, which is arranged to simultaneously erase data stored in
all the memory cells during a data erase mode of the device and
sequentially write data into memory cells of a selected NAND cell
block during a data write mode subsequent to the data erase mode.
When a certain memory cell of the selected NAND cell block is
subjected to writing, its control gate is supplied with a voltage
which forms such a strong electric field as to allow the transfer
of charges between the charge accumulation layer of the certain
memory cell and the well area. This allows the data writing only in
the selected cell.
The present invention and its objects and advantages will become
more apparent from the detailed description of the preferred
embodiments presented hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
In the detailed description of preferred embodiments of the
invention presented below, reference is made to the accompanying
drawings of which:
FIG. 1 schematically shows the overall circuit arrangement of an
electrically erasable programmable read-only memory according to a
preferred embodiment of the invention;
FIG. 2 snows the internal arrangement of a memory section in the
EEPROM of FIG. 1 wherein memory cells are divided into NAND cell
blocks each of which includes memory cell transistors series
connected with first and second selection transistors so as to
constitute a NAND cell structure;
FIG. 3 is a plan view of a certain NAND cell block;
FIG. 4 is a sectional view of the NAND cell block of FIG. 3, taken
along the line 4--4 of FIG. 3;
FIG. 5 is a sectional view of the NAND cell block of FIG. 3, taken
along the line 5--5 of FIG. 3;
FIGS. 6 and 7 waveforms of main electrical signals appearing at
main portions of the EEPROM of FIG. 1 during its various modes of
operation;
FIG. 8 a modification of the NAND cell block of FIG. 5;
FIG. 9 illustrates waveforms of main electrical signals appearing
in main portion of the EEPROM having the sectional structure of
FIG. .[.5.]. .Iadd.8 .Iaddend.during its various modes of
operation;
FIG. 10 shows another modification of the sectional structure of
the NAND cell block of FIG. 5;
FIG. 11 is a plan view of a certain NAND cell block of an
electrically erasable programmable read-only memory according to
another embodiment of the invention;
FIG. 12 is a sectional view of the NAND cell block of FIG. 11, the
line 12--12 of FIG. 11;
FIG. 13 is an equivalent circuit diagram of the NAND cell block of
FIG. 11; and
FIG. 14 illustrates waveforms of main electrical signals appearing
in main portions of the EEPROM having the NAND cell block of FIG.
11 during various modes of operation of the EEPROM.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to FIG. 1, an electrically erasable programmable
read-only memory according to a preferred embodiment of the
invention has a memory cell section 10. Memory cell section 10 is
associated with a row decoder 12, a sense amplifier section 14 and
a column decoder 16. Memory section 10 is provided, as shown in
FIG. 2, with memory cells M at intersections of a selected number
of parallel bit lines BL1, BL2 . . . , BLn and parallel word lines
WL1, WL2, . . . . A reference symbol BLi is used hereinafter to
specify an arbitrary one of the bit lines. Sense amplifier 14 is
connected to bit lines BL so as to sense output voltages
thereon.
A latch circuit 18 is connected to column decoder 16 and
temporarily store input data to or output data from cell section
10. Latch circuit 18 has a latch capacity corresponding to the
number of bit lines BL of cell section 10. A row address buffer
unit 20 is connected to row decoder 12 and has address input
terminals 21 to which address signals are externally applied. A
column address buffer .[.u it.]. .Iadd.unit .Iaddend.22 is
connected to column decoder 16 and has address input terminals 23
to which address signals are externally applied. Input data is
applied from an I/O line terminal to latch 18 via data input buffer
unit 24. Output data is applied from latch 18 to the I/O line
terminal via I/O sense amplifier 26 and data output buffer unit 28.
Where the EEPROM performs data accessing in page mode, one-page
data (data of bits which are equal in number to bit lines BL of
cell section 10) is temporarily stored in latch 18 and then
transferred to bit lines BL so that the data is written into
selected memory cells connected to bit lines BL.
A static random access memory (referred to as "SRAM" hereinafter)
30 is additionally provided between a data input buffer 24 and
latch 18. SRAM 30 has a larger storage capacity than latch 18. In
this embodiment, SRAM 30 has a storage capacity of 256.times.4 bits
(the product of the number of bit lines BL and the number of memory
cells M1 through M4 in each cell block Bi), namely, 1 Kbits. In
other words, SRAM 30 has a static memory cell matrix which has
series arrays of static memory cells corresponding in number to
stages in a NAND block (four in this embodiment), each array having
a page length corresponding to the number of bit lines BL. Write
data to be entered into cell section 10 is stored in SRAM 30 first,
and then stored data corresponding to plural pages are sequentially
applied to latch 18 page by page. The installation of SRAM 30
contributes to reduction in the time required for data writing and
thus improvement in the page mode accessing speed.
As shown in FIG. 2, the memory cells connected to bit lines BL of
memory section 10 are divided into subarrays (referred to as "NAND
cell blocks" or simply as "cell blocks" hereinafter) .[.B11,
B12,.]. .Iadd.B1, B2, .Iaddend.each of which has first and second
selection transistors Qs1 and Qs2, and a selected number of memory
cells M. Selection transistor Qs is formed of a single-gate MOSFET.
Each of selection transistors Qs1 and Qs2 is formed of a
single-gate MOSFET. Each of memory cells M is essentially formed of
a double-gate MOSFET which has a floating gate and a control gate.
In the circuit arrangement of FIG. 2, only NAND cell blocks B1, B2,
. . . , Bn, which are connected to bit lines BL1, BL2, . . . , BLn,
respectively, are depicted in detail only for the purpose of
simplifying illustration.
The transistor series combination of each NAND cell block Bi has
one end (i.e., the drain of memory cell transistor M1i) connected
to corresponding bit line BLi via first selection transistor
.[.Qsil.]. .Iadd.Qs1 .Iaddend.and the other end (i.e., the source
of memory cell transistor M4i) connected to .[.substrate potential
Vs.]. .Iadd.a common source potential Vs through second selection
transistor Qs2.Iaddend.. In this embodiment memory cells M of each
cell block Bi are comprised of memory cell transistors M1, M2, . .
. , Mn which are series connected to constitute the so-called "NAND
cell" structure. In the following description the number of the
memory cell transistors in each cell block is set to as low as four
only for the purpose of simplifying illustration. In practical
applications, however, the number of memory cell transistors will
be eight or sixteen.
Selection transistors Qs and memory cell transistors M are placed
at intersections of bit lines BL and word lines WL as shown,
thereby forming a cell matrix. However, lines SG1 and SG2 connected
to selection .[.transistor Qsi1.]. .Iadd.transistors Qs1 and Qs2
.Iaddend.of each cell block .[.Bil.]. .Iadd.Bi .Iaddend.may be
called a gate control line in this description.
As shown in FIG. 3, a NAND cell block (e.g. B1) has a series array
of FETs which are formed in a well diffusion layer 40 formed in the
surface portion of an N type silicon chip substrate 42 (see FIG.
4). NAND cell block B1 has a contact hole .[.12.]. .Iadd.44
.Iaddend.on P type well layer 40. More specifically, a connection
line (aluminum wiring) 46 is formed to insulatingly run over the
series connection of FETs Qs and M. The wiring overlies the gates
of FETs Qs and M included in cell block B1. Gate control lines SG1
and SG2 and word lines WL11, WL12, WL13, WL14 are formed over P
type well layer 40 perpendicular to the direction in which wiring
46 runs, thereby defining selection transistors Qs1 and Qs2 and
memory cells M1 through M4 (in FIG. 3 the memory cell transistors
of this cell block are simply indicated as "M1", "M2", "M3", "M4")
of NAND cell block B1.
Referring to FIGS. 4 and 5, the transistor array of NAND cell block
B1 is formed in a substrate surface area surrounded with a
insulating layer 48 for device isolation formed in the surface
portion of P-well layer 40. P-well layer 40 is formed on the
surface of substrate .[.40.]. .Iadd.42 .Iaddend.widely enough for
memory section 10 to be formed therein. P-well layer 40 is
separated from another P-well layer (not shown) in which a
peripheral circuit including row decoder 12, sense amplifier
section 14, column decoder 16, etc. is formed. As most clearly
shown in FIG. 4, MOSFET M1 constituting one memory cell has a first
polysilicon layer 50 disposed over substrate 10 with a thermal
oxide layer 52 interposed therebetween and a second polysilicon
layer 54 disposed over layer 50 with a thermal oxide layer 56
interposed therebetween. First polysilicon layer 50 functions as
the floating gate of MOSFET M1, whereas second polysilicon layer 54
functions as the control gate of MOSFET M1. The other memory cells
have the same structure as described above.
Control gate layer 54 is connected to a corresponding word line
(word line WL1 in the case of memory cell M1). As shown in FIG. 4,
floating gate 50 is formed to overlap the device isolating region
whereby, in each cell Mi, coupling capacitance Cfs between floating
gate 50 and .Iadd.P-well layer 40 formed in .Iaddend.substrate 42
is made smaller than coupling capacitance Cfc between floating gate
.[.5.]. .Iadd.50 .Iaddend.and control gate 54. This thus enables
the data writing/erasing only through the transfer of electrons
between floating gate 50 and .[.substrate 42.]. .Iadd.P-well layer
40 .Iaddend.due to the tunnel effect. Selection transistor Qs1 has
a polysilicon layer 58 insulatingly disposed over P-well layer 40
of substrate 42. Another polysilicon layer 60 is deposited over
layer 58, and these layers 60 and 58 are electrically connected to
each other by conductive through-holes (not shown) so as to
function as the control gate of first selection transistor Qs1. The
control gate of second selection transistor Qs2 is also formed of a
multilayer structure consisting of polysilicon layers 62 and 64.
Such a multilayer structure results in low resistance of the gates
of selection transistors Qs1 and Qs2.
As shown in FIG. 5, N type diffusion layers 66, 68, 70, 72, 76, 78
are formed in the surface portion of P-well layer 40 of substrate
.[.10.]. .Iadd.42 .Iaddend.in such a way that they somewhat overlap
the gates of transistors Qs and M. The N diffusion layers serve as
the sources and drains of corresponding transistors. For example, N
diffusion layers 66 and 68 serve as the drain and source of
selection transistor Qs1, respectively. Similarly, N diffusion
layers 68 and 70 serve as the drain and source of cell transistor
M1, respectively.
The above layer structure is completely covered with a CVD
insulating layer 82. A through hole 44 is formed in CVD insulating
layer 82 as shown. An aluminum wiring layer 46 is deposited on CVD
insulating layer 82. Wiring layer 46 extends along the series
connection of transistors Qs and M and overlies the gates of
transistors Qs and M in cell block B1. Contact hole 44 is
positioned on drain diffusion layer 66 of selection transistor Qs1.
Aluminum wiring layer 46 runs on CVD insulating layer 82 and
contacts drain diffusion layer 66 of selection transistor Qs1
through contact hole 44. In a portion of N diffusion layer 66 that
contacts contact hole 44 there is formed a heavily-doped N type (N+
type) diffusion layer 80, thereby reducing the ohmic contact
resistance between wiring layer 46 and the drain of selection
transistor Qs1. Wiring layer 46 is selectively connected to a data
input line or a data output line.
According to this embodiment, both of the control gate and floating
gate of each memory cell transistor have a width of .[.1 `m,.].
.Iadd.1 .mu.m .Iaddend.and the channel width of each memory cell
transistor is also set to 1 .mu.m. The floating gate is protruded
from both ends of 1-.mu.m-wide wiring layer 46 by 1 .mu.m. First
gate insulating layer 52 is a thermal oxide layer of 20 nm
thickness, whereas second gate insulating layer 56 is a thermal
oxide layer of 35 nm thickness. Assuming the dielectric constant of
these thermal oxide layers to be .epsilon., coupling capacitances
Cfs and Cfc described above will be given by
It will thus be understood that the NAND cell structure of this
embodiment satisfies the above condition.
The operation of the EEPROM constructed as above will be described
with reference to the signal waveform diagram of FIG. 6. The EEPROM
is arranged to perform a simultaneous erase operation prior to
selective writing of data in which case data stored in all memory
cells M of cell section 10 are simultaneously erased. NAND cell
block B1 in the memory cell matrix in FIG. 2 will be taken as an
example in describing the simultaneous erase operation. At time t1,
a "L" level potential (e.g. 0 volts) is applied to control gate
lines SG1 and SG2 as shown in FIG. 6, so that selection transistors
Qs1 and Qs2 are rendered nonconductive and hence cell block B1 is
electrically disconnected from the corresponding line BL1. A "L"
level potential is applied to word lines WL1 through WL4, so that
substrate potential Vsub and well potential Vwell are set to a
"H"level potential (e.g. 18 volts). The potential Vbit of the bit
lines including bit lines BL1 and BL2 is set to a "H" level
potential (18 volts). Thus, an electric field is generated between
control gate 54 (see FIG. 5) of each of all memory cells M
including memory cells M1 through M4 (when a certain NAND cell
block is specified, its memory cells are simply indicated as "M1",
. . . , "M4" hereinafter) and P-well layer 40 with the result that
electrons are discharged from floating gate 50 to P-well layer 40
due to tunneling. Consequently, the threshold of each memory cell M
shifts in the negative direction to provide a logic "0" stored
state.
Subsequently the EEPROM is set to a data write mode at time t2.
When NAND cell block B1 is selected, the EEPROM writes data into
memory cells M1 through M4 is selected NAND cell block B1 in
sequence. In this case, memory cell .[.M1.]. .Iadd.M4
.Iaddend.which is most distant from the connection point (which may
be considered to be the drain of first Selection transistor Qs1)
between NAND cell block B1 and the corresponding bit line BL
associated therewith is subjected to data writing first, and memory
cell M1 which is nearest to the connection point is subjected to
data writing last. Namely, the sequential data writing is performed
in the order of M4, M3, M2, M1.
In a data write mode, as shown in FIG. 6, a turn-on voltage, which
is an intermediate voltage which is half of a boosted voltage Vpp,
10 volts in this example, is applied to control gate line SG1 so as
to render first selection transistor Qs1 conductive so that cell
block B1 may be electrically connected to corresponding bit line
BL1. Control gate line SG2 is maintained at a "L" level potential
(e.g. 0 volts) with the result that second selection transistor Qs2
is rendered nonconductive and thus cell block B1 is electrically
disconnected at the source of memory cell transistor M4 from
.[.P-well layer 40.]. .Iadd.source potential Vs.Iaddend.. At the
same time, .[.substrate.]. .Iadd.source .Iaddend.potential Vs and
well potential Vwell are set to a "L" level potential (0
volts).
To write data into memory cell M4 first, a "H" level potential,
which may be ranged from 12 to 20 volts; for example, 20 volts, is
applied to word line WL4 connected to the control gate of selected
memory cell M4 at time t2, whereas .[.a "L" level potential (0
volts).]. .Iadd.an intermediate potential (10 volts) .Iaddend.is
applied to nonselected word lines WL1 through WL3. The potential
Vbit1 of selected bit line BL1 is set to a "L" level potential
(.[.18.]. .Iadd.0 .Iaddend.volts), whereas the potential Vbit2 of
nonselected bit line BL2 is set to the intermediate potential (10
volts). Voltage Vcg4 of the control gate of selected cell M4 is set
to a "H" level potential, while voltages Vcg1, Vcg2, Vcg3 of the
control gates of the remaining cells M1 through M3 are set to the
intermediate potential as shown in FIG. 6. As a result, a high
electric field is generated between control gate 54 and .[.N-drain
layer 76.]. .Iadd.N-layers 74, 76 .Iaddend.and between control gate
54 and P-well layer 40 of selected memory cell M4 so that electrons
are tunneled from .[.drain layer 76.]. .Iadd.layers 74, 76
.Iaddend.and well layer 40 into floating gate 50 of selected memory
cell M4. The threshold of selected memory cell M4 thus becomes more
positive so that logic "1" data is stored in cell M4. At this time
the thresholds of nonselected cells M1 through M3 exhibit no
substantial variation and thus maintain the logic "0" stored state.
Since the control gate voltages of cells M1 through M3 are set to
the intermediate potential as described above, the electric field
generated in each cell is not so strong as to force electrons
toward the floating gate. The thresholds of memory cells M of
nonselected cell block B2 adjacent to selected NAND cell block B1
exhibit no substantial variation, thus maintaining the logic "0"
stored state. This is because bit line potential Vbit2 of
nonselected NAND cell block B2 is set to the intermediate potential
and thus such a strong electric field as to cause the tunneling of
electrons into their floating gates is not generated in these
memory cells.
When, in selected NAND cell block B1, memory cell M3 is selected
after memory cell M4, a "H" level potential (20 volts) is applied
to word line WL3 at time t3 with the result that control gate
voltage Vcg3 of memory cell M3 goes to a "H" level potential. The
control voltages Vcg1, Vcg2, Vcg4 of the remaining cells M1, M2 and
M4 go to the intermediate potential as shown in FIG. 6.
Consequently, a high electric field is generated in selected memory
cell M3 in accordance with the same manner as described above so
that electrons are tunnel-injected into floating gate 50. The
threshold of selected memory cell M3 thus becomes more positive so
that logic "1" data is stored in M3. Subsequently, the remaining
cells M2 and M1 are sequentially written into in accordance with
the writing technique described above.
When the EEPROM is set to a data read mode at time t6, a turn-on
voltage (e.g. 5 volts) is applied to control gate lines SG1 and SG2
as shown in FIG. 6, thus rendering selection transistors Qs1 and
Qs2 conductive to electrically connect cell block B1 to
corresponding bit line BL1 and .Iadd.source potential Vs, which is
same as .Iaddend.well potential Vwell. At this time substrate
potential Vsub and well potential Vwell are set to a "L" level
potential (0 volts).
To read the stored data from memory cell M4 of NAND cell block B1,
for example, a reading "H" level potential (e.g. 5 volts) is
applied to bit line BL1, while a "L" level potential (0 volts) is
applied to bit line BL2. By applying a "L" level potential (0
volts) to word line WL4 connected to cell M4, its control gate
potential Vcg4 is set to a "L" level potential (0 volts). At this
time the remaining cells M1 through M3 are maintained at the
"H"level potential (5 volts). As a result, first selection
transistor Qs1 and cells M1 through M3 are rendered conductive and
selected cell M4 is electrically connected to corresponding bit
line BL1. By detecting whether a current flows through bit line BL1
or not through sense amplifier 14, the determination can be made as
to whether the data stored in cell M4 is either a logic "1" or a
logic "0".
The simultaneous erasing of the EEPROM and the voltage application
scheme for selective data writing may be modified as shown in FIG.
7. According to the voltage application technique disclosed here,
substrate potential Vsub is constantly maintained at a "L" level
potential (ranged from 0 to 5 volts; e.g. 0 volts) through the
simultaneous erase mode and the write mode. In the simultaneous
erase mode performed during an interval between t1 and t2, a "L"
level potential (0 volts) is applied to control gate lines SG1 and
SG2 as shown in FIG. 7 so that selection transistors Qs1 and Qs2
are rendered .[.conductive.]. .Iadd.nonconductive.Iaddend., thus
electrically disconnecting each cell block Bi from corresponding
bit line .[.Bi.]. .Iadd.BLi.Iaddend.. A negative boosted
.[.potent.]. .Iadd.potential .Iaddend.(e.g. -18 volts) is applied
to word lines WL1 through WL4. In this case well potential Vwell
and potential Vbit of all the bit lines including bit lines BL1 and
BL2 are set to ground potential (0 volts). By such a voltage
application, in all the memory cells M including memory cells M1
through M4, electrons are discharged from their floating gates 50
to P-well layer 40 due to tunneling in accordance with the same
manner as the above erase mechanism. Consequently, all the memory
cells M are erased simultaneously.
In the data write mode, a voltage, which may be ranged from 0 volts
to -6 volts, e.g., 0 volts, is applied to control gate line SG1 so
that first selection transistor Qs1 is rendered .[.nonconductive.].
.Iadd.conductive .Iaddend.to electrically .[.disconnect.].
.Iadd.connect .Iaddend.cell block B1 .[.from.]. .Iadd.to
.Iaddend.bit line BL1. A negative boosted voltage (e.g. -20 volts)
is applied to control gate line SG2 so that second selection
transistor Qs2 is rendered nonconductive, thus electrically
disconnecting cell block B1 at the source of memory cell transistor
M4 from .[.P-well layer 40.]. .Iadd.source potential Vs.Iaddend..
At this time well potential Vwell is also set to the negative
boosted voltage (-20 volts).
As in the previous case, cell M4 is subjected to data writing
first. At this time ground potential (0 volts) is applied only to
word line WL4, whereas a negative intermediate voltage (-10 volts)
is applied to the remaining word lines WL1 through WL3. Potential
Vbit1 of selected bit line BL1 is set to a negative boosted voltage
(-20 volts) and potential Vbit2 of nonselected bit line BL2 is set
to a negative intermediate voltage (-10 volts). Consequently, a
strong electric field is generated in selected cell M4 in
accordance with the same manner as above so that the tunneling of
electrons into the floating gate takes place, causing logic "1"
data to be written into M4.
According to the embodiment, a current that flows in a selected
cell during the simultaneous erase mode or the data write mode
consists essentially of a tunnel current flowing between P-well
layer 40 formed in substrate 42 and the floating gate of the
selected cell and a leak current flowing between each of the
N-diffusion layers serving as the source and drain of the selected
cell and P-well layer 40 (or a leak current flowing through the
junction between substrate 42 and P-well layer 40). The current is
thus extremely small, not more than 10 .mu.A. This fact greatly
contributes to suppression of the power dissipation in the
EEPROM.
Further, according to the embodiment, semiconductor diffusion
layers 66, 68, 70, 72, 74, 76, 78 serving as the sources and drains
of memory cells M in each NAND cell block are surrounded with well
layer 40 having a conductivity type opposite to that of substrate
42. Since well layer 40 can effectively prevent the generation of
the surface breakdown in those diffusion layers, the undesirable
variation of the thresholds of .[.nonselected.]. cells can be
avoided in writing data into a selected cell. Therefore, the EEPROM
can be improved in its operational efficiency and reliability.
Furthermore, during the data write mode all the NAND cell blocks B
including selected NAND cell block (B1) are electrically isolated
from .[.well potential Vwell and substrate potential Vsub.].
.Iadd.source potential Vs .Iaddend.by rendering selection
transistors Qs2 therefor nonconductive. Accordingly, a current flow
path between bit lines BL and .[.substrate 42.]. .Iadd.source
potential Vs .Iaddend.can completely be interrupted so that an
internal leak current is eliminated that tends to flow through the
path. This leads to reduction in the power dissipation of the
EEPROM.
The EEPROM may be modified such that each NAND cell block Bi is
formed on P-type chip substrate 100 as shown in FIG. 8. In this
case, first and second selection transistors Qs1 and Qs2 and memory
cells M1 through M4 of NAND cell block B1 are each formed of a
P-channel MOSFET which is formed in N-well layer 102. N-well layer
102 is formed in a surface portion of P-well substrate 100 as shown
in FIG. 8. P-type semiconductor diffusion layers 104, 106, 108,
.[.10.]. .Iadd.110.Iaddend., 112, 114, 116 serving as the sources
and drains of transistors Qs1, Qs2 and M1 through M4 are formed in
array in N-well layer 102. P-type diffusion layers 104 each have a
heavily-doped P type diffusion layer 118 at the contact portion
with contact hole 44. Since the other portions of NAND cell block
B1 of FIG. 8 are the same as those of the previous embodiment, the
same symbols as those used in FIG. 5 are used again and the
detailed description thereof is omitted.
With the EEPROM having such a structure, substrate potential Vsub
is constantly maintained at ground potential (0 volts) through the
simultaneous erase, write and read modes. In the simultaneous erase
mode performed during interval between t1 and t2, a potential of 5
volts is applied to control gate lines SG1 and SG2 as shown in FIG.
9 so that selection transistors Qs1 and Qs2 are rendered
.[.conductive.]. .Iadd.nonconductive.Iaddend., thus electrically
disconnecting each cell block Bi from corresponding bit line
.[.Bi.]. .Iadd.BLi.Iaddend.. A positive boosted potential (e.g. 18
volts) is applied to word lines WL1 through WL4. In this case well
potential Vwell and potential Vbit of all the bit lines including
bit lines BL1 and BL2 are set to ground potential (0 volts). By
such a voltage application scheme, in all the memory cells M
including memory cells M1 through M4, electrons are tunneled
.[.from.]. .Iadd.between .Iaddend.their floating gates 50 .[.back
to.]. .Iadd.and .Iaddend.P-well layer 40 in accordance with the
same manner as the above erase mechanism. Consequently, all the
memory cells M are erased simultaneously.
In the data write mode, a voltage of 5 volts is applied to control
gate line SG1 so that first selection transistor Qs1 is rendered
.[.nonconductive.]. .Iadd.conductive.Iaddend., thereby electrically
.[.disconnecting.]. .Iadd.connecting .Iaddend.cell block B1
.[.from.]. .Iadd.to .Iaddend.bit line BL1. A positive boosted
voltage (e.g. 20 volts) is applied to control gate line SG2 so that
second selection transistor Qs2 is rendered nonconductive, thus
electrically disconnecting cell block B1 at the source of memory
cell transistor M4 from .[.N-well layer 102.]. .Iadd.source
potential Vs.Iaddend.. At this time well potential Vwell is also
set to the positive boosted voltage (20 volts). .[.Vwell is also
set to the positive boosted voltage (20 volts)..].
As in the previous case, cell M4 is subjected to data writing
first. At this time ground potential (-0 volts) is applied only to
word line WL4, whereas a positive intermediate voltage (10 volts)
is applied to the remaining word lines WL1 through WL3. Potential
Vbitl of selected bit line BL1 is set to a positive boosted voltage
(20 volts) and potential Vbit2 of nonselected bit line BL2 is set
to a positive intermediate voltage (10 volts). Consequently, a
strong electric field is generated in selected cell M4 in
accordance with the same manner as described above so that
electrons are tunneled from the floating gate back to N-well layer
102 and thus the threshold of cell M4 shifts in the negative
direction, causing logic "1" data to be written into M4. Similarly,
the selective data writing will be performed on cells M in the
order of M3, M2, M1.
In the data read mode, for example, when cell M4 is selected, gate
voltages Vsg1 and Vsg2 of first and second selection transistors
Qs1 and Qs2, control gate voltages Vcg1 to Vcg3 of nonselected
cells M1 to M3, and voltage Vbitl of selected bit line BL1 are set
to ground potential (0 volts). At this time selected bit line BL2
and well potential Vwell are set to 5 volts. Control gate voltage
Vcg4 of selected cell M4 is set to 5 volts by applying 5 volts to
word line WL4. Consequently, the readout voltage corresponding to
the stored data in selected cell M4 is transferred to bit line BL1
via nonselected cell transistors M1 to M3 which has been rendered
conductive and then subjected to the logic level discrimination in
the same manner as described above.
The EEPROM may be modified such that the NAND cell structure with
memory cells M consisting of N channel MOSFETs as shown in FIG. 5
is formed in P-type chip substrate 150 as shown in FIG. 10. In this
case, an N-well layer 152 is additionally formed in P-substrate 150
so as to surround P-well layer 40 in which first and second
selection transistors Qs1 and Qs2 and N type diffusion layers 66,
68, 70, 72, 76, 78 serving as the sources and drains of memory
cells M1 to M4 of NAND cell block B1 are formed. P-well layer 40
and N-well layer 152 are connected together to a terminal 154 so
that they are at the same potential. The simultaneous erase, write
and read operations of this modifications are performed by the use
of the same voltage application scheme as that in the previous
modification of FIG. 8.
The plan configuration of NAND cell block B1 of the EEPROM
according to still another modification has a "three-gate
structure" as shown in FIG. 11. More specifically, an erase gate
layer 200 is insulatingly provided between floating gates 50 and
control gates 54 of series-arrayed memory cell transistors M1 to M4
of NAND cell block B1 so as to run perpendicular to those gates.
Floating gates 50 overlap erase gate 200 as shown. Erase gate layer
200 is formed of a polysilicon layer which runs parallel to
aluminum wiring layer 46. The polysilicon layer is ranged in
thickness from 100 to 400 nm. The cell sectional structure taken
along aluminum wiring layer 46 is exactly the same as that in the
embodiment of FIG. 5.
The sectional structure taken along erase gate layer 200 is shown
in FIG. 12 wherein like reference symbols are used to denote like
portions in FIG. 5. As shown in FIG. 12, erase gate layer 200 is
also insulatingly sandwiched between double-layered gates 58 and 60
(62 and 64) of each of first and second selection transistors Qs1
and Qs2 provided at the opposite ends of the series array of cell
transistors M1 to M4. In each memory cell transistor, floating gate
50 and control gate 52 are capacitively coupled to each other
through erase gate 200. An equivalent circuit of NAND cell block B1
having the "three-gate" structure is shown in FIG. 13 wherein erase
gate 200 of NAND cell block B1 and the erase gate of another NAND
cell block B2 adjacent to B1 are connected together to gate control
voltage Veg.
In the simultaneous erase mode, voltage Veg on erase gate 200 is
set a boosted potential (20 volts) as shown in FIG. 14. Well
potential Vwell and substrate potential Vsub are constantly
maintained at ground potential (0 volts) during all the operation
modes including the simultaneous erase mode. Gate voltages Vsg1 and
Vsg2 of first and second selection transistors Qs1 and Qs2 are set
to a voltage which may be ranged from 0 to 5 volts (e.g. 0 volts).
Voltage Vbit on all bit lines BL and voltages Vcgl to Vcg4 on word
lines WL1 to WL4 are set to ground potential (0 volts).
Consequently, in NAND cell block B1, electrons accumulated at
floating gates of memory cells M1 to M4 are simultaneously
discharged to erase gate 200 due to tunnel effect so that all the
memory cells M are erased simultaneously. The selective writing and
reading is performed in the same way as in the embodiment having
P-well layer 40.
With such an arrangement, since floating gate 50 and control gate
54 of each of memory cells M are partly capacitively coupled to
each other, no high gate voltage is needed for erasing data. Hence,
this will enable the reduction of the power dissipation in the
EEPROM and the simplification of the peripheral circuit
arrangement. Further, since, in each cell, a region through which
tunnel current flows to erase data is relatively narrow, when the
EEPROM is repeatedly subjected to the simultaneous erase, the
degradation of the quality of polycrystalline silicon gate
insulating layer 52 (see FIG. 4) of NAND cell block B1 can be
minimized. Thus the operational reliability of the EEPROM can be
improved. This type of NAND cell structure may be directly formed
on a chip substrate without the use of P-well layer 40, if
desired.
* * * * *