U.S. patent number RE31,114 [Application Number 06/207,515] was granted by the patent office on 1982-12-28 for electrical connector.
This patent grant is currently assigned to Tektronix, Inc.. Invention is credited to William E. Berg.
United States Patent |
RE31,114 |
Berg |
December 28, 1982 |
Electrical connector
Abstract
This disclosure describes an electrical connector for joining
microcircuit or microcircuit modules, such as leadless integrated
or hybrid circuit carriers to utilization means, such as printed or
etched circuit boards or similar means. The electrical contacts
through which the microcircuit and utilization means are connected
are formed and etched in place on an elastomeric material,
precisely located; the material acting as a restoring force to
maintain connection. The connector when used in a system maintains
transmission line mediums in a single environment.
Inventors: |
Berg; William E. (Prior Lake,
MN) |
Assignee: |
Tektronix, Inc. (Beaverton,
OR)
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Family
ID: |
26902309 |
Appl.
No.: |
06/207,515 |
Filed: |
November 17, 1980 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
631591 |
Nov 13, 1975 |
|
|
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Reissue of: |
861066 |
Dec 15, 1977 |
04150420 |
Apr 17, 1979 |
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Current U.S.
Class: |
439/71; 361/779;
439/592 |
Current CPC
Class: |
H01H
1/24 (20130101); H05K 3/325 (20130101); H05K
7/1061 (20130101); H05K 1/0237 (20130101); H05K
2201/10727 (20130101); H05K 2201/049 (20130101); H05K
2201/10393 (20130101); H05K 2201/10681 (20130101); H05K
2201/0314 (20130101) |
Current International
Class: |
H01H
1/24 (20060101); H01H 1/12 (20060101); H05K
7/10 (20060101); H05K 3/32 (20060101); H05K
1/02 (20060101); H01R 009/09 () |
Field of
Search: |
;339/17CF,174,176MF
;174/52FP ;361/398 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Desmond; Eugene F.
Attorney, Agent or Firm: Spence; Thomas J.
Parent Case Text
This is a continuation of application Ser. No. 631,591 filed Nov.
13, 1975, now abandoned.
Claims
The invention is claimed in accordance with the following: .[.1. A
high frequency electrical connector system for making electrical
connections between a microcircuit and a circuit board
comprising:
a circuit board having first electrical conductive path means fixed
upon a surface thereof;
a microcircuit having second electrical conductive path means fixed
upon a surface thereof;
1ocation means provided by said circuit member of for locating said
microcircuit along said circuit board so that said first and second
electrical conductive path means are positioned adjacent to each
other; and
means for electrically connecting said first and second electrical
conductive path means together, including
(a) frame means,
(b) elastomeric material removably attached to said frame means and
being deformable to exert a resilient force,
(c) conductive material in the form of electrical contacts bonded
to an undulating surface of said elastomeric material to
electrically engage respective ones of said first and second
electrical conductive path means, and
(d) securing means for removably securing said frame means to said
circuit board with said electrical contacts on said elastomeric
material electrically engaging said first and second electrical
conductive path means, said elastomeric material being deformed by
said securing means so that said resilient force causes said
electrical contacts to wipingly engage said first and second
electrical conductive path means thereby forming an electrical
connection therebetween and maintaining said
microcircuit in position on said circuit board..]. .[.2. A high
frequency electrical connector system of claim 1 wherein said
circuit board has a ground plane on another surface thereof and
said microcircuit has a conductive coating on another surface
thereof, said conductive coating being in electrical engagement
with said ground plane..]. .[.3. A high frequency electrical
connector system of claim 1 wherein said first and second
electrical conductive path means are in the same plane..]. .[.4. A
high frequency electrical connector system of claim 1 wherein said
first and second electrical conductive path means are positioned in
stepped relationship to each other..]. .[.5. A high frequency
electrical connector system of claim 1 wherein said location means
comprises an opening in said circuit board into which said
microcircuit is disposed..]. .Iadd. 6. A high-frequency electrical
connector system for electrically interconnecting a conductive path
of a first circuit element with a conductive path of a second
circuit element, said system comprising:
(a) a resilient member having a surface defined by two protruding
portions and an intermediate indented portion;
(b) a contact of flexible metallic material overlaying a
substantial part of each said portion of said surface of said
resilient member and extending no further than the boundaries of
said surface, said contact member also having a surface defined by
two protruding portions and an intermediate indented portion, said
surfaces of said resilient member and said conduct member being
further configured such that said resilient member provides a
restoring support for said contact member and such that a common
force applied against both protruding portions of said contact
member causes said portions to move away from each other;
(c) rigid frame means for holding said resilient member and said
contact member against said circuit elements such that a first
protruding portion of said contact member touches a conductive path
of said first circuit element and a second protruding portion of
said contact member touches a conductive path of said second
circuit element; and
(d) means for urging said frame means, and thereby said resilient
member and said contact member, further against said circuit
elements so as to cause said protruding portions of said contact
member to move away from each other and thereby wipingly engage
said conductive paths. .Iaddend.
.Iadd. 7. The connector system of claim 6 wherein said frame means
includes means defining a chamber, and wherein said resilient
member includes a third portion configured for mating insertion
into said chamber. .Iaddend..Iadd. 8. The connector system of claim
6 wherein said resilient member is elongate in form, and wherein
said surface thereof defines a pair of protruding ridges separated
by an elongate indentation, further comprising a plurality of said
contact members spaced along said resilient member in a
longitudinal direction. .Iaddend..Iadd. 9. The connector system of
claim 8 wherein each said contact member extends across said
resilient member in a lateral direction. .Iaddend..Iadd. 10. The
connector system of claim 6 wherein a first protruding portion of
said contact member is separated from a second protruding portion
by a first distance in a first direction and offset from said
second portion by a second distance in a second direction so as to
define with said second portion a contact member of stepped
configuration for interconnecting conductive paths in non-coplanar
alignment. .Iaddend..Iadd. 11. The connector system of claim 6
wherein said frame means comprises a rigid frame member of
rectangular configuration, and wherein said resilient member is of
mating rectangular configuration, further comprising a plurality of
said contact members spaced around the periphery of said resilient
member so as to permit the interconnection of a like plurality of
conductive paths of a first circuit element located within the
enclosure of said frame member with a like plurality of conductive
paths of a second circuit element located without said enclosure.
.Iaddend. .Iadd. 12. The connector system of claim 6 wherein a
surface of said resilient member proximate at least one edge
thereof defines a pair of elongate protruding ridges separated by
an elongate indentation and wherein each said contact member spaced
therealong extends across both said ridges. .Iaddend..Iadd. 13. The
connector system of claim 6 wherein said indented and protruding
portions of said surface of said contact member define an
undulating surface including a concave portion interposed between
two convex portions. .Iaddend..Iadd. 14. The connector system of
claim 6 wherein said contact member is of longitudinal
configuration having a width dimension substantially greater than
its thickness dimension..Iaddend.
Description
BACKGROUND OF THE INVENTION
In the prior art there are various types of connectors in general
use. Numerous expedients exist for the connection of elements of
flexible circuitry to each other or to printed circuit boards
having like spacing between their conductive leads. For example,
one of the more common type of connectors uses male or female
components where one component is mounted on a circuit board and
the other attached to a conductor. This is quite bulky, requires
considerable area and transmission mediums are not maintained.
Another connection scheme for overcoming the disadvantages of
bulkiness and area required is to use a cable which is preferably
flat and having insulation removed at one end .[.is.]. placed over
conductors on a circuit board which are in a parallel array, spaced
the same distance apart as the conductors in the cable. A clamp is
placed over the cable to hold it against the circuit board. This
system, however, has disadvantages in that miniature circuitry,
such as found in modern elctronic apparatus, does not fully meet
the requirements. To overcome this disadvantage, schemes using
metal to metal contact between flexible circuit conductors and
plated leads of a similar circuit or of a terminal board board
which are pressed together by a compressive compression element as,
for example, a multifingered spring which applies individual force
from the insulated side of the flexible circuit and mounted in a
clamping bar that fastens, clips or otherwise holds together the
cable elements being connected. The disadvantage here, of course,
being that the transmission mediums environment is changed by added
capacitance of the metal spring elements and high frequency
operation is quite limited.
Another connecting system presently in use on small square or
rectangular leaded ceramic packages is the conventional reflow
soldering technique. This, however, requires special production
equipment and heat becomes a problem. As described in
"Electronics", July 10, 1975, pages 39 and 40, a solderless
connector consisting of alternate vertical layers of nonconductive
and conductive silicone rubber fits between the leadless carrier
and the surface of a printed circuit board. The combination
resembles a sandwich, which, when pressed together electrically
connects conductive elements on the printed circuit board and
contacts on the integrated circuit carrier together. A
disadvantage, however, is that well matched, high frequency
connections are not easily obtainable.
SUMMARY OF INVENTION
The electrical connector, according to subject invention, is used
to connect, say, a glass teflon etched circuit board transmission
line, usually 50 ohm characteristic .[.impedence.]. .Iadd.impedance
.Iaddend.to a transmission line, again usually 50 ohm, of a
microcircuit, i.e. hybrid. Additionally, the subject invention is
extended to also connect DC or ground connections of the
microcircuit to the etched circuit board. The connector may be
advantageously employed where the circuit board and microcircuit to
be connected has small closely spaced transmission mediums. For
such a connection, the conductors will have the same configuration
as the circuit board and microcircuit. A system employing the
connector exhibits well matched high frequency connections
previously unobtainable, as well as maintaining a single
transmission medium environment. Considerable cost savings with
improved performance over prior approaches are obtainable as well
as mass production.
Basically, the connector according to the present invention
.[.comprise.]. .Iadd.comprises .Iaddend.contacts secured in place
on an elastomeric material such as silicone rubber and being of
small size precisely located; the rubber acts as a restoring force
and has a low dielectric constant. The system continues
transmission line mediums in a single environment.
It is, therefore, an object of the present invention to provide a
new electrical connector.
It is a second object of the present invention to provide a new
electrical connector system.
It is a third object of the present invention to provide a new
electrical connector for joining microcircuits to utilization
means.
It is a fourth object of the present invention to provide a new
electrical connector having contacts secured in place on an
elastomeric material that are of small size and precisely
located.
It is a fifth object of the present invention to provide a new
electrical connector for maintaining transmission line
environments.
It is a sixth object of the present invention to provide a new
electrical connector at a minimum expense.
It is a seventh object of the present invention to provide an
electrical connector which can be mass produced.
It is an eighth object of the present invention to provide an
electrical connector which allows microcircuits to be easily
replaceable.
It is a ninth object of the present invention to provide an
electrical connector for DC (low frequency) through high frequency
applications.
It is a further object of the present invention to provide a new
electrical connector that provides optimum heat transfer of thermal
energy from microcircuit to heat sink.
It is yet another object of the present invention to provide a
switch employing contacts on an elastomeric material.
It is still yet another object of the present invention to provide
a relay employing contacts on an elastomeric material.
It is a further object of the present invention to provide a
process for bonding metal to an elastomeric material.
The foregoing and numerous other objects, advantages, and inherent
functions of the present invention will become apparent as the same
is more fully understood from the following description which
describes the subject invention; it is to be understood, however,
that the preferred embodiment is not intended to be exhausting nor
limiting of the invention, but is given for purposes of
illustration in order that others skilled in the art may fully
understand the invention and principles thereof and the manner of
applying it in practical use so that they may modify it in various
forms such as may best be suited to the conditions of the
particular use.
The subject matter of the invention, both as to organization and
method of operation may best be understood by reference to the
following description taken in conjunction with the accompanying
drawings, wherein like reference characters refer to like
elements.
DESCRIPTION OF THE INVENTION
In the drawings:
FIG. 1 details a new electrical connector;
FIG. 2 details a new microcircuit to utilization means
connector;
FIG. 3, including FIGS. 3A and 3B, is a completed connector system
according to FIG. 2;
FIG. 4 details the contact means for the connector according to the
present invention;
FIG. 5, including FIGS. 5A and 5B, details a second embodiment of
the new microcircuit to utilization means according to the present
invention;
FIG. 6 details a switch in accordance with the present
invention;
FIG. 7 details a relay in accordance with the present invention;
and
FIG. 8 is a block diagram of a flow chart detailing the process of
forming the connector system according to the present
invention.
DESCRIPTION OF THE INVENTION
Referring now to the drawings and in particular to FIG. 1, there is
shown a new electrical connector, an object of the subject
invention. An elastomeric material 10 has contact means 12 secured
thereon; the elastomeric material acting as a restoring force for
the contacts and the contacts for providing, say, an electrical
connection between a microcircuit and a utilization means. In the
preferred embodiment, the connector of the subject invention
employs as the elastomeric material, a 50 durometer silicone rubber
compound with low compression set. It should be emphasized that the
50 durometer rating is given as the preferred rating only and other
ratings can be used. Contacts 12 may be of any desired shape or
design while the number, spacing, etc. of the connectors is
determined by the number of connections required by the
microcircuit and are preferably gold-plated. The process for
securing contact means 12 to the elastomeric material will be
described elsewhere in this specification. Thus, there is provided
a new contact comprising an elastomeric material and contact means
secured to the material.
Referring now to FIG. 2, there is shown a new microcircuit to
utilization means connector system including a utilization means 14
such as printed or etched circuit board or similar means having
transmission mediums 16, a microcircuit means 18 such as leadless
integrated circuit or hybrid circuits, including transmission
mediums 20, and an elastomeric material 10 having contact means 12
secured thereon. In addition, there is provided a unit 22 which
provides a means for removably carrying the elastomeric material
(not essential that elastomeric material be carried as will be
described elsewhere in this specification) and is removably fixed
to the utilization means for maintaining positive engagement of the
contacts 12 on the transmission mediums 16 and 20.
Unit 22, preferably a polyphenylene sulfide resin, is removably
fixed to the utilization means 14 via conventional means such as
nut and bolt assemblies 24, 26 respectively, the latter passing
through mounting means provided in both the unit 22 and circuit
board or utilization means 14. Provided as a portion of unit 22 are
alignment means 28 which are removably received by further
conventional means provided in the utilization means 14.
Utilization means 14 includes a ground plane 15 provided on a
surface opposite the surface containing transmission mediums 16,
these mediums being of correct width and spacing from ground plane
forming a transmission line defining a micro-strip transmission
line. Alternatively, a ground plane 15 may be provided on the
transmission medium side of the utilization means and being
properly spaced from the transmission line to form a coplanar
transmission line. As the formation of either type transmission
line for providing a transmission line of certain characteristic
impedance is well known to those having ordinary skill in the art,
no further discussion thereof is deemed necessary. Utilization
means 14 also includes a device locating means 17 such as, for
example, an opening into the upper side of the utilization means
and extending inwardly to ground plane 15.
Referring now to FIG. 3, and in particular to FIG. 3A, there is
shown the completed connector system previously described for FIG.
2. The connector, according to the subject invention, maintains
transmission mediums 16, 20 of utilization means 14 and
microcircuit means 18 respectively in the same or a single
environment, i.e., no means such as coaxial connector means are
required to connect the transmission mediums together. This, of
course, is an important object of the subject invention.
Microcircuit means 18 including transmission medium 20 is disposed
into the device locating means 17 so that the transmission mediums
16, 20 are substantially .[.co-planer.]. .Iadd.co-planar
.Iaddend.with each other and precisely aligned. .[.Co-planer.].
.Iadd.co-planar .Iaddend.is in the sense of mechanical alignment.)
Disposed thusly, microcircuit means 18 connects to, by pressure of
the elastomeric material, the ground plane 15 to form a continuous
transmission line of uniform characteristic impedance and of the
same geometry; in the same environment. As mentioned above, the
microcircuit means 18 is precisely aligned in a device locating
means 17. This is accomplished in a plurality of ways, but the most
important is that during manufacture, transmission medium 16 and
device locating means 17 must reflect the microcircuit means used.
The other ways including alignment means 28 and the nut and bolt
assemblies 24, 26 will be taken up again elsewhere in the
description. Also shown in FIG. 3A is the element 30 which
represents the working part of the microcircuit means 18. Element
30 could be, for example, an amplifier, a power supply module,
digital circuit, etc. It should be noted that the microcircuit
means 18 defining the working part of the means and the
transmission mediums are all formed on a substrate 19. Substrate 19
is a ceramic in the preferred embodiment. It should be noted that
the drawings show the element 30 to a medium 20 which appears much
larger than any other, as well as a larger medium 16 on utilization
means 14. These large mediums are shown for purposes of clarity
only and are not to be taken as different from the other
mediums.
FIG. 3B is a cross-sectional view of the system shown in FIG. 3A
taken along the line AA. As previously stated, and as shown in the
drawings, the elastomeric material is carried by the unit 22. This
is accomplished by providing in unit 22 a channel 32 into which the
elastomeric material is removably placed, the resiliency of the
elastomeric material maintaining connection. Elastomeric material
10 is in the preferred embodiment, T shaped with a first portion 34
for insertion into channel 32 and a second portion 36 onto which
contact means 12 is secured. It can also be seen in this drawing
that contact means 12 is serpentined. This insures that in the
mated state, i.e., contacts 12 to transmission medium 16, 20, equal
pressure will be applied all along the edges of microcircuit means
18 to assure (1) good thermo contact and (2) good electrical
contact. (It should be mentioned that DC connections are also made
the same way.) Thermo energy in the microcircuit is transferred to
the ground plane by conduction. Although not shown in the drawings,
a heat sink may be secured to the ground plane side of the
utilization means via the nut and bolt assemblies to provide
additional heat sinking of the microcircuit unit. This provides
optimum heat transfer of thermo energy from the microcircuit and is
an important object of the present invention. It should also be
noted that the securing means of unit 22 extend beyond the channel
32 to provide a positive stop feature so that the elastomeric
material cannot be crushed when secured to the utilization means.
Additionally, and it will be explained later in this specification,
the ridges formed by the undulating shape of the connector allows
(forces) a wiping action to be made at contact. Thus, there is
provided a microcircuit to utilization means connection system
which comprises a body having a chamber, an elastomeric material
adapted to mount in said chamber, contact means secured to said
material and protruding a distance away from said material, and
being secured to said material away from where adapted to mount in
said chamber, and means for removably afixing said body over said
element and circuit medium, thereby, to bias said contact means to
.[.positive.]. .Iadd.positively .Iaddend.engage said element and
circuit medium. Further explanation of the above discussed ridges
will be described in detail elsewhere in the description.
Shown in FIG. 4 are various shaped contact means 12 which can be
utilized by the present invention for the system shown in FIG. 3.
For example, the contact means 12A may include a pair of spaced leg
portions which are spaced apart and extend substantially parallel
from .[.thier.]. .Iadd.their .Iaddend.free ends to their other ends
joined in common. The leg portions may have .[.bifercated.].
.Iadd.bifurcated .Iaddend.contacts at their free ends for further
engaging with the transmission mediums. Contact means 12B may
include two pairs of spaced leg portions which are spaced apart and
extend substantially parallel from their free ends to the other
ends or the contact may be as the contact means 12C which is a
single leg portion. The contact means 12A-12C are flat in the
direction of double headed arrow 11. It should be emphasized that
the contacts shown in FIG. 4 are the preferred, but that other
shapes and designs can be used depending upon the particular
application.
Referring now to FIG. 5, there is shown another embodiment of the
subject invention. FIG. 5A shows the contact system similar to FIG.
3A but in FIG. 5B, which is taken along the line BB of FIG. 5A, the
contact means 12 is provided in a stepped rather than flat
configuration. This is because microcircuit means 18 is mounted
flush with the surface of utilization means 14 which requires that
the serpentine shape of the contact means 12 be stepped, since the
transmission mediums 16 and 20 are now not .[.co-planer.].
.Iadd.co-planar.Iaddend.. As the microcircuit is mounted flush with
the surface of utilization means 14, a device locating means such
as device locating means 17 of FIG. 2 is not required and the
principal locating means becomes the alignment means 28, shown in
FIG. 2. Additionally, the elastomeric material 10 in this
embodiment is adapted to be carried by unit 22, thus the unit is
channeled so that when secured to utilization means 14 it will
capture material 10 to precisely locate the contacts. Another
embodiment may, however, include no channel and the unit 22 made to
forcibly hold the elastomeric material 10 in position once secured
to the utilization means 14.
The above described connector or connector systems has advantages
over other connector schemes in that in the mated state equal
pressure is applied all along the microcircuit means which insures
good electrical contact and good thermal contact. By careful design
of the shape of ridges in the elastomeric material, a wiping action
is made at contact or during connection. The elastomeric material
acts as a restoring force and maintains pressure during the
lifetime of the connector, has good compression set characteristics
and is inert to acid and most all electronic chemicals except
strong solvents like .[.tolene.]..Iadd.toluene.Iaddend.. Since
contact means 12 mate mediums 16 and 20, as described, thermal
expansion of the substrate, i.e., used to carry the microcircuit
means, does not break or interrupt the contact. Contact is always
maintained during shock and vibration. The connector system,
according to the subject invention, makes tests and integration of
system of microcircuits easy as well as field replacement of a
microcircuit. No soldering (bonding) to the substrate is necessary
to make connection for a next higher assembly. Considering
manufacturing capability, accumulation of manufacturing tolerances
for combined components of the contact system are about plus and
minus 0.0010-inch. Therefore, the contact system can be mass
produced.
Referring next to FIG. 6, there is shown a switch in accordance
with the subject invention. A support plate 42 which could be
similar to utilization means 14 includes fixed transmission line
elements 44 secured to the support plate and a movable switch
contact 46 secured to an elastomeric material mounting means 48 on
said support plate for movement between a closed position engaging
said fixed contact to join or connect transmission line elements
and a open position spaced from said fixed contact and actuator
means 50 for moving the movable switch contact toward and away from
the support plate between said open and closed positions. Actuator
means 50 could be, for example, a cam switch, a slide switch, etc.
Alternatives to the switch include providing a plurality of fixed
switch contacts attached to support plate and a plurality of
movable switch contacts secured to the elastomeric material.
Referring now to FIG. 7, there is shown a relay in accordance with
the present invention. A housing member 52 includes signal input
and output connectors 54, 56 respectively, such as coaxial cable
connectors, and means for connecting the signal input and output
connectors to say interrupted transmission line means 58 on a
substrate 60. The elastomeric material 10 having contact means 12
according to the present invention is next provided. To operate as
a relay, solenoid or mechanical pressure indicated by the arrow 62
causes the contact means to connect the interrupted transmission
line means allowing a signal to pass through the unit. Therefore,
the interrupted transmission lines can be considered as fixed relay
contacts carried by the housing, the elastomeric material and
contact means as movable relay contacts, and the solenoid pressure
as an actuator means for moving the movable relay contact between a
closed position and an open position. An alternative would be to
provide additional movable relay contacts and having common
actuator means.
Turning now to the process of securing the contact means to the
elastomeric material, an object of the subject invention, there is
shown in FIG. 8 a block diagram flow chart therefor. The first step
in the process, as in any process, is the selection of a raw
material. Various base metals can be used; wrought or rolled
nickel, an alloy of Beryllium-Nickel, or an alloy of
Copper-Beryllium which is preferred. It has been found that nickel
presents slight manufacturing problems, such as bending too easily,
creases, etc., whereas the alloy of Beryllium-Nickel reduces the
above manufacturing difficulties but it is hard to etch, which is
required by the hereinafter described process. The Copper-Beryllium
alloy, however, allows most of the manufacturing and process
difficulties to be overcome. The thickness of the wrought or rolled
alloy is important to the process; too thick invites undercutting
which eventually leads to the possibility of short circuits, too
thin invites manufacturing handling problems. A thickness of 0.0015
to 0.0025, preferably 0.002-mils thick, has been utilized.
(Undercutting is well known in circuit board and photo processing
techniques.)
The second step of the process includes a blanking and punching of
the raw material. Blanking enables the wrought or rolled alloy to
be handled easily by simply cutting the material to a size
necessary for the process. Punching simply punches tooling holes
into the material so that further processing and alignment is
possible.
The third step of the process uses conventional photographic
techniques to provide the contact means. The process is fully
explained on pages 1-5 through 1-17, specifically FIG. 7b on page
1-11, in Handbook of Electronic Packaging, edited by Charles A.
Harper, Copyright 1969 by McGraw-Hill, Inc. The desired shape,
number and spacing of the contact means (three are shown in FIG. 4
as 12A, 12B and 12C) are provided in the form of a contact pattern,
or mask, and precisely aligned using the punched holes. A negative
mask is preferred, but can be a positive. Once the desired contact
areas have been photographically defined in the photo resist, the
actual contact means are provided by plating a layer of nickel,
followed quickly by a plating layer of gold, each having a
thickness of 5 to 6 microns. As is well known, the two platings
must be preformed in a very short time to prevent oxidation of the
metals. Additionally, if nickel is used as the raw material, onto
which the desired contacts are formed, only gold need be plated.
Further, gold contacts are preferred because gold is usually the
transmission mediums previously discussed. Thus, gold transmission
lines on the utilization means, gold contacts, and gold
transmission mediums on the microcircuit (gold-gold-gold) provides
a very compatible connection scheme. The photo resist is then
removed.
Step four of the process is to heat and cool the photographically
processed unit for softening and making the metal contacts less
brittle, i.e., annealing. A flat contact, say, for use in a
connection system similar to that shown in FIG. 3 where the
transmission mediums are substantially .[.co-planer.].
.Iadd.co-planar .Iaddend.need not be necessarily subjected to
annealing, but it is preferred. Where the connection system is
used, similar to that shown in FIG. 5, i.e., a stepped
configuration, the annealing process is required and even more so
when the contacts are nickel under gold as in the preferred
embodiment. The annealing temperature should be between 400.degree.
and 600.degree. C., preferably 500.degree. C., for one hour. Step 4
also includes preforming the annealed unit to the desired shape,
i.e., step. The preforming is similar to conventional methods
whereby the annealed unit is merely placed over a die and pressure
applied via some means to form the annealed unit into the shape of
the die.
The annealed and preformed unit, or annealed unit, as the case may
be, is then subjected to a cleaning, partial etch and application
of a primer on the raw material opposite the side to which the
metal contacts have been deposited. The partial etch affects the
monolayers of the material to insure a clean surface onto which the
elastomeric material will be applied. Having the surface cleaned
and primed, the unit is placed into a die installed in a
conventional transfer molding machine. The elastomeric material is
then injected in the areas desired. In the case of the subject
invention, the elastomeric material is injected along the contacts
but on the opposite side. The unit then undergoes a partial cure in
the transfer molding machine. After the partial cure, the entire
unit is subjected to a postbaking process to obtain a final cure
and to outgas any curing agents, catalyst by-products, etc. and to
obtain the optimum characteristics of the elastomeric material.
The final step of the process is to remove the raw material which
is exposed, i.e., not covered by gold. This is accomplished by a
spray etch and enables all exposed raw metal material to be removed
without affecting the contact or elastomeric material. The unit is,
of course, trimmed after etching to conform to the drawing.
Thus, there has been described a process for securing metal
contacts to an elastomeric material, another object of the subject
invention.
While there has been shown and described the preferred embodiments
according to the subject invention, it will be apparent to those
skilled in the art that many changes and modifications may be made
without departing from the invention in its broader aspects. For
example, two connection systems could be disposed on opposite sides
of the utilization means and mounted thereto by common securing
means, or a series of connection systems could be utilized.
Therefore, the appended claims are intended to cover all such
changes and modifications that fall within the true spirit and
scope of the invention.
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