U.S. patent number D919,669 [Application Number D/743,419] was granted by the patent office on 2021-05-18 for seal member for semiconductor production apparatus.
This patent grant is currently assigned to Valqua, Ltd.. The grantee listed for this patent is Valqua, Ltd.. Invention is credited to Takafumi Sakurai, Kazuaki Tsuji.
United States Patent |
D919,669 |
Tsuji , et al. |
May 18, 2021 |
Seal member for semiconductor production apparatus
Claims
CLAIM The ornamental design for a seal member for semiconductor
production apparatus, as shown and described.
Inventors: |
Tsuji; Kazuaki (Tokyo,
JP), Sakurai; Takafumi (Santa Clara, CA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Valqua, Ltd. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Valqua, Ltd. (Tokyo,
JP)
|
Family
ID: |
73823947 |
Appl.
No.: |
D/743,419 |
Filed: |
July 21, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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35507137 |
Jan 21, 2019 |
D905761 |
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Foreign Application Priority Data
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Jul 24, 2018 [JP] |
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2018-016130 |
Jul 24, 2018 [JP] |
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2018-016131 |
Jul 24, 2018 [JP] |
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2018-016132 |
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Current U.S.
Class: |
D15/7 |
Current CPC
Class: |
F16K51/02 20130101 |
Current International
Class: |
1503 |
Field of
Search: |
;D15/7,9,11,17,21,28,123,199 ;D23/269,356,259 ;D8/349 ;277/602-626
;285/98,109,336,910,918 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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D127505 |
|
Feb 2009 |
|
TW |
|
D149670 |
|
Oct 2012 |
|
TW |
|
D163769 |
|
Oct 2014 |
|
TW |
|
D164826 |
|
Dec 2014 |
|
TW |
|
D164827 |
|
Dec 2014 |
|
TW |
|
D166713 |
|
Mar 2015 |
|
TW |
|
D180129 |
|
Dec 2016 |
|
TW |
|
D183422 |
|
Jun 2017 |
|
TW |
|
Primary Examiner: Chilcot; Richard E
Attorney, Agent or Firm: The Webb Law Firm
Description
FIG. 1 is a perspective view of a seal member for semiconductor
production apparatus, showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a cross-sectional view thereof;
FIG. 9 is an enlarged cross-sectional view of a portion thereof;
and,
FIG. 10 is an enlarged cross-sectional view of a portion thereof in
a condition of use.
The broken lines shown in FIG. 10 are for the purposes of
illustrating environmental structure and form no part of the
claimed design.
* * * * *