U.S. patent number D916,040 [Application Number D/687,638] was granted by the patent office on 2021-04-13 for electronic device housing.
This patent grant is currently assigned to ABB Schweiz AG. The grantee listed for this patent is ABB Schweiz AG. Invention is credited to Fredrik Alfredsson, Mikael Edoff.
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United States Patent |
D916,040 |
Alfredsson , et al. |
April 13, 2021 |
Electronic device housing
Claims
CLAIM The ornamental design for a for electronics device housing,
as shown and described.
Inventors: |
Alfredsson; Fredrik (Vasteras,
SE), Edoff; Mikael (Saltsjo-Boo, SE) |
Applicant: |
Name |
City |
State |
Country |
Type |
ABB Schweiz AG |
Baden |
N/A |
CH |
|
|
Assignee: |
ABB Schweiz AG (Baden,
CH)
|
Appl.
No.: |
D/687,638 |
Filed: |
April 15, 2019 |
Foreign Application Priority Data
|
|
|
|
|
Oct 15, 2018 [EM] |
|
|
005798378 |
Apr 5, 2019 [EM] |
|
|
006370771 |
|
Current U.S.
Class: |
D13/184; D13/110;
D13/123 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,123,158,162,184,199 ;D14/301,439 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
ABB Launches new microgrid system to boost use of renewables; Oct.
10, 2016; 1 pg.;
https://www.windpowerengineering.com/abb-launches-new-microgrid-system-bo-
ost-use-renewables/. cited by examiner .
Rolls-Royce and ABB partner to develop micorgrid solution for
business; Apr. 2, 2019; 1 pg. ;
https://www.edie.net/news/8/Rolls-Royce-and-ABB-partner-to-develop-microg-
rid-solution-for-business/. cited by examiner.
|
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Slater Matsil, LLP
Description
FIG. 1 is a top, front isometric view of a electronic device
housing in accordance with a new design;
FIG. 2 is a left side elevational view of the embodiment shown in
FIG. 1;
FIG. 3 is a right side elevational view of the embodiment shown in
FIG. 1;
FIG. 4 is a front elevational view of the embodiment shown in FIG.
1;
FIG. 5 is a rear elevational view of the embodiment shown in FIG.
1;
FIG. 6 is a top plan view of the embodiment shown in FIG. 1;
and
FIG. 7 is a bottom plan view of the embodiment shown in FIG. 1.
FIG. 8 is a top, front isometric view of a second embodiment of the
for electronic device housing in accordance with the new
design;
FIG. 9 is a left side elevational view of the embodiment shown in
FIG. 8;
FIG. 10 is a right side elevational view of the embodiment shown in
FIG. 8;
FIG. 11 is a front elevational view of the embodiment shown in FIG.
8;
FIG. 12 is a rear elevational view of the embodiment shown in FIG.
8;
FIG. 13 is a top plan view of the embodiment shown in FIG. 8;
and,
FIG. 14 is a bottom plan view of the embodiment shown in FIG.
8.
The broken line portions of the figure drawings are included to
show unclaimed subject matter only and form no part of the claimed
design. The dash-dot broken lines define the bounds of the claimed
design and form no part thereof.
* * * * *
References