Light emitting diode chip

Description

FIG. 1 is a top, front perspective view of a light emitting diode chip showing my new design;

FIG. 2 is a bottom, rear perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 7.

Broken lines depictions of transparent cavity lens of the light emitting diode chip shown in the drawings indicate unclaimed portions of the design, and thus illustrative purpose only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a light emitting diode chip, as shown and described.

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Inventors:	Maruyama; Tsukasa (Akita, JP)
Applicant:	Name City State Country Type DOWA Electronics Materials Co., Ltd. Tokyo N/A JP
Assignee:	DOWA Electronics Materials Co., Ltd. (Tokyo, JP)
Appl. No.:	D/713,752
Filed:	November 19, 2019

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Foreign Application Priority Data

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Jun 4, 2019 [JP]			2019-012240

Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/1

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References Cited [Referenced By]

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U.S. Patent Documents

D521948	May 2006	Inoue
D778849	February 2017	Maruyama
D857638	August 2019	Maruyama et al.
2005/0173721	August 2005	Isoda
2010/0155752	June 2010	Lim
2013/0049565	February 2013	Jung
2013/0141920	June 2013	Emerson
2015/0171274	June 2015	Guo
2015/0340581	November 2015	Han
2016/0079478	March 2016	Kong
2017/0069606	March 2017	Gould
2017/0179352	June 2017	Song
2018/0151790	May 2018	Kim
2020/0013759	January 2020	Yoo
2020/0350468	November 2020	Lee

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Kenja IP Law PC

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