U.S. patent number D915,308 [Application Number D/713,752] was granted by the patent office on 2021-04-06 for light emitting diode chip.
This patent grant is currently assigned to DOWA Electronics Materials Co., Ltd.. The grantee listed for this patent is DOWA Electronics Materials Co., Ltd.. Invention is credited to Tsukasa Maruyama.
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United States Patent |
D915,308 |
Maruyama |
April 6, 2021 |
Light emitting diode chip
Claims
CLAIM The ornamental design for a light emitting diode chip, as
shown and described.
Inventors: |
Maruyama; Tsukasa (Akita,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
DOWA Electronics Materials Co., Ltd. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
DOWA Electronics Materials Co.,
Ltd. (Tokyo, JP)
|
Appl.
No.: |
D/713,752 |
Filed: |
November 19, 2019 |
Foreign Application Priority Data
|
|
|
|
|
Jun 4, 2019 [JP] |
|
|
2019-012240 |
|
Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/180 ;D26/1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Kenja IP Law PC
Description
FIG. 1 is a top, front perspective view of a light emitting diode
chip showing my new design;
FIG. 2 is a bottom, rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof; and,
FIG. 9 is a cross sectional view taken along line 9-9 in FIG.
7.
Broken lines depictions of transparent cavity lens of the light
emitting diode chip shown in the drawings indicate unclaimed
portions of the design, and thus illustrative purpose only and form
no part of the claimed design.
* * * * *