Light emitting diode chip
Maruyama February 14, 2
U.S. patent number D778,849 [Application Number D/560,176] was granted by the patent office on 2017-02-14 for light emitting diode chip. This patent grant is currently assigned to DOWA ELECTRONICS MATERIALS CO., LTD.. The grantee listed for this patent is DOWA ELECTRONICS MATERIALS CO., LTD.. Invention is credited to Tsukasa Maruyama.
| United States Patent | D778,849 |
| Maruyama | February 14, 2017 |
Light emitting diode chip
Claims
CLAIM The ornamental design for a light emitting diode chip, as shown and described.
| Inventors: | Maruyama; Tsukasa (Akita, JP) | ||||||||||
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| Applicant: |
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| Assignee: | DOWA ELECTRONICS MATERIALS CO.,
LTD. (Tokyo, JP) |
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| Appl. No.: | D/560,176 | ||||||||||
| Filed: | April 4, 2016 |
Foreign Application Priority Data
| Nov 5, 2015 [JP] | 2015-024752 | |||
| Current U.S. Class: | D13/180 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/180 ;D26/1 |
References Cited [Referenced By]
U.S. Patent Documents
| 6713868 | March 2004 | Ueno |
| D619977 | July 2010 | Ni |
| D631021 | January 2011 | Ni |
| D640644 | June 2011 | Tsou |
| 8421093 | April 2013 | Okada |
| 8546828 | October 2013 | Takayama |
| 8648365 | February 2014 | Won |
| D737784 | September 2015 | Song |
| 9455388 | September 2016 | Kim |
| 2006/0220050 | October 2006 | Higaki |
Attorney, Agent or Firm: Oliff PLC
Description
FIG. 1 is a front perspective view of a light emitting diode chip showing my new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 4.
The broken lines shown in the drawings are for illustrative purpose only and form no part of the claimed design.
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