U.S. patent number D909,495 [Application Number D/692,836] was granted by the patent office on 2021-02-02 for robotic device. This patent grant is currently assigned to Samsung Electronics Co., Ltd.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Hongkue Lee, Norio Okada, Masato Suzuki.
United States Patent | D909,495 |
Lee , et al. | February 2, 2021 |
Inventors: | Lee; Hongkue (Tokyo, JP), Okada; Norio (Tokyo, JP), Suzuki; Masato (Tokyo, JP) | ||||||||||
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Applicant: |
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Assignee: | Samsung Electronics Co., Ltd.
(Suwon-si, KR) |
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Appl. No.: | D/692,836 | ||||||||||
Filed: | May 29, 2019 |
Nov 30, 2018 [KR] | 30-2018-0056354 | |||
Current U.S. Class: | D21/578 |
Current International Class: | 2101 |
Field of Search: | ;D21/578-583,621-622 ;D15/199 ;D16/203 |
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