Seal member for semiconductor production apparatus

Tsuji , et al. December 22, 2

Patent Grant D905761

U.S. patent number D905,761 [Application Number 35/507,137] was granted by the patent office on 2020-12-22 for seal member for semiconductor production apparatus. This patent grant is currently assigned to Valqua, Ltd.. The grantee listed for this patent is VALQUA, LTD.. Invention is credited to Takafumi Sakurai, Kazuaki Tsuji.


United States Patent D905,761
Tsuji ,   et al. December 22, 2020

Seal member for semiconductor production apparatus

Claims

CLAIM The ornamental design for seal member for semiconductor production apparatus, as shown and described.
Inventors: Tsuji; Kazuaki (Tokyo, JP), Sakurai; Takafumi (Santa Clara, CA)
Applicant:
Name City State Country Type

VALQUA, LTD.

Tokyo

N/A

JP
Assignee: Valqua, Ltd. (Tokyo, JP)
Family ID: 73823947
Appl. No.: 35/507,137
Filed: January 21, 2019

International Registration

Int'l Reg. No. Int'l Reg. Date Int'l Reg.
Publication Date
Hague Int'l
Filing Date
DM/200460 Jan 21, 2019 Aug 2, 2019 Jan 21, 2019


Foreign Application Priority Data

Jul 24, 2018 [JP] 2018-016130
Jul 24, 2018 [JP] 2018-016131
Jul 24, 2018 [JP] 2018-016132
Current U.S. Class: D15/7
Current CPC Class: F16K51/02 20130101
Current International Class: 1503
Field of Search: ;D15/7,9,11,17,21,28,123,199 ;D23/269,386,259 ;D8/349 ;277/602-626 ;285/98,109,336,910,918

References Cited [Referenced By]

U.S. Patent Documents
1805442 May 1931 Wallfisch
4226431 October 1980 Jelinek
4560174 December 1985 Bisi
4834398 May 1989 Guzowski
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D582436 December 2008 Shimomura
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D582438 December 2008 Shimomura
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D614271 April 2010 Weston
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2005/0001195 January 2005 Blease
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Foreign Patent Documents
D127505 Feb 2009 TW
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D180129 Dec 2016 TW
D183422 Jun 2017 TW
Primary Examiner: Chilcot; Richard E
Attorney, Agent or Firm: The Webb Law Firm

Description



1.1 is a perspective view of a seal member for semiconductor production apparatus, showing our new design;

1.2 is a front elevation view thereof;

1.3 is a rear elevation view thereof;

1.4 is a left side elevation view thereof;

1.5 is a right side elevation view thereof;

1.6 is a top view thereof;

1.7 is a bottom view thereof;

1.8 is a cross-sectional view thereof;

1.9 is an enlarged cross-sectional view of a portion thereof; and

1.10 is an enlarged cross-sectional view of a portion thereof in a condition of use.

The broken lines shown in Reproduction 1.10 are for the purposes of illustrating environmental structure and form no part of the claimed design.

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Patent Diagrams and Documents

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