U.S. patent number D899,416 [Application Number D/721,877] was granted by the patent office on 2020-10-20 for case for electronic communications device.
This patent grant is currently assigned to Spigen Korea CO., LTD.. The grantee listed for this patent is SPIGEN KOREA CO., LTD.. Invention is credited to Eun Hee Koo, Jung Hun Kwak.
![](/patent/grant/D0899416/USD0899416-20201020-D00000.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00001.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00002.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00003.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00004.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00005.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00006.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00007.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00008.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00009.png)
![](/patent/grant/D0899416/USD0899416-20201020-D00010.png)
United States Patent |
D899,416 |
Kwak , et al. |
October 20, 2020 |
Case for electronic communications device
Claims
CLAIM The ornamental design for a case for electronic
communications device, as shown and described.
Inventors: |
Kwak; Jung Hun (Seoul,
KR), Koo; Eun Hee (Seoul, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
SPIGEN KOREA CO., LTD. |
Seoul |
N/A |
KR |
|
|
Assignee: |
Spigen Korea CO., LTD. (Seoul,
KR)
|
Appl.
No.: |
D/721,877 |
Filed: |
January 23, 2020 |
Current U.S.
Class: |
D14/250 |
Current International
Class: |
1403 |
Field of
Search: |
;D3/201,212,218,226,227,247,249,250,269,303 ;D13/103,107,108,119
;D14/137,138R,138AA,138C,138G,172,192,203.3-203.7,217,238.1,247,248,250-253,434,440,447,496
;D11/200,212,231,234 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Krakower; Susan E
Assistant Examiner: Grabenstetter; L. A.
Attorney, Agent or Firm: Chae; Heedong Lucem, PC
Description
FIG. 1 is a front perspective view of the case for electronic
communications device showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is an enlarged detail view of the encircled region in FIG.
2; and,
FIG. 10 is an enlarged detail view of the encircled region in FIG.
4.
The dot-dash broken line circles in FIGS. 2 and 4 are included for
the purpose of illustrating the portion of the case for electronic
communications device shown in an enlarged scale in FIGS. 9 and 10.
The dot-dash broken lines form no part of the claimed design. The
dashed broken lines throughout the drawing figures depict portions
of the case that form no part of the claimed design.
* * * * *