Electronics case

Meyer

Patent Grant D891773

U.S. patent number D891,773 [Application Number D/641,044] was granted by the patent office on 2020-08-04 for electronics case. This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Anna Grace Meyer.


United States Patent D891,773
Meyer August 4, 2020

Electronics case

Claims

CLAIM The ornamental design for an electronics case, as shown and described.
Inventors: Meyer; Anna Grace (Hannibal, MO)
Applicant:
Name City State Country Type

Harman International Industries, Incorporated

Northridge

CA

US
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Appl. No.: D/641,044
Filed: March 19, 2018

Current U.S. Class: D3/294
Current International Class: 0301
Field of Search: ;D3/203.1,204,205,218,273-274,276,283,284,294-298,315,901,903 ;D9/414,418,420,430,432 ;D27/186,187,189,190,191 ;D28/9,73,76,78,82,91 ;D6/659,663,667,671.1 ;D14/188,204,209.1

References Cited [Referenced By]

U.S. Patent Documents
D397869 September 1998 Minhas
D527182 August 2006 Ham
D566395 April 2008 Langer
D569103 May 2008 Hoge
D584700 January 2009 Urry et al.
D592398 May 2009 Roesler
D624316 September 2010 Ferber
D675434 February 2013 Vernall
D710824 August 2014 Mackiewicz et al.
D754092 April 2016 Mackiewicz
D766214 September 2016 Mackiewicz et al.
D806389 January 2018 Muhlenkamp, IV
D816994 May 2018 Fischer et al.
D824365 July 2018 Vogt, Jr.
D839583 February 2019 Cao
D839920 February 2019 Demin et al.
2008/0250739 October 2008 Krupinski
2016/0105050 April 2016 Chan

Other References

Design U.S. Appl. No. 29/674,907, filed Dec. 27, 2018. cited by applicant .
Design U.S. Appl. No. 29/688,606, filed Apr. 23, 2019. cited by applicant .
Design U.S. Appl. No. 29/695,337, filed Jun. 18, 2019. cited by applicant.

Primary Examiner: Bekic; Lilyana
Assistant Examiner: Malley; Mary Shannon
Attorney, Agent or Firm: Plumsea Law Group, LLC

Description



FIG. 1 is a top perspective view of an electronics case showing the new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a side elevational view thereof;

FIG. 6 is an opposite side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines illustrate portions of the electronics case that form no part of the claimed design.

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Patent Diagrams and Documents

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