Wireless headset
Wang , et al.
U.S. patent number D887,396 [Application Number D/710,427] was granted by the patent office on 2020-06-16 for wireless headset. This patent grant is currently assigned to Shenzhen Earfun Technology Co., Ltd.. The grantee listed for this patent is Shenzhen Earfun Technology Co., Ltd.. Invention is credited to Zhigang Deng, Fangfang Lan, Zili Wang.
| United States Patent | D887,396 |
| Wang , et al. | June 16, 2020 |
| **Please see images for: ( Certificate of Correction ) ** |
Wireless headset
Claims
CLAIM The ornamental design for a Bluetooth headset, as shown and described.
| Inventors: | Wang; Zili (Shenzhen, CN), Deng; Zhigang (Shenzhen, CN), Lan; Fangfang (Shenzhen, CN) | ||||||||||
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| Applicant: |
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| Assignee: | Shenzhen Earfun Technology Co.,
Ltd. (Shenzhen, CN) |
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| Appl. No.: | D/710,427 | ||||||||||
| Filed: | October 23, 2019 |
| Current U.S. Class: | D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/223,205 ;D24/174 ;455/41.3,90.3,569.1,575.1 |
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Attorney, Agent or Firm: ScienBiziP, P.C.
Description
FIG. 1 is a front elevation view of a Bluetooth headset, showing our design.
FIG. 2 is a rear elevation view thereof.
FIG. 3 is a left side elevation view thereof.
FIG. 4 is a right side elevation view thereof.
FIG. 5 is a top plan view thereof.
FIG. 6 is a bottom plan view thereof.
FIG. 7 is a top, front, right side perspective view thereof.
FIG. 8 is a bottom, rear, left side perspective view thereof; and,
FIG. 9 is an enlarged view of an area labeled 9 in FIG. 2.
The broken lines depict environment that are for illustrative purposes only and form no part of the claimed design.
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