Flexible printed wiring board for a module

Toya , et al.

Patent Grant D877099

U.S. patent number D877,099 [Application Number D/617,547] was granted by the patent office on 2020-03-03 for flexible printed wiring board for a module. This patent grant is currently assigned to Sumitomo Electric Industries, Ltd.. The grantee listed for this patent is Sumitomo Electric Industries, Ltd.. Invention is credited to Takashi Iwasaki, Youichi Nagai, Kenji Saito, Kazumasa Toya.


United States Patent D877,099
Toya ,   et al. March 3, 2020

Flexible printed wiring board for a module

Claims

CLAIM The ornamental design for a flexible printed wiring board for a module, as shown and described.
Inventors: Toya; Kazumasa (Osaka, JP), Saito; Kenji (Osaka, JP), Nagai; Youichi (Osaka, JP), Iwasaki; Takashi (Osaka, JP)
Applicant:
Name City State Country Type

Sumitomo Electric Industries, Ltd.

Osaka-shi

N/A

JP
Assignee: Sumitomo Electric Industries, Ltd. (Osaka-shi, JP)
Appl. No.: D/617,547
Filed: September 14, 2017

Foreign Application Priority Data

Mar 15, 2017 [JP] 2017-005253
Mar 15, 2017 [JP] 2017-005254
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/155,182 ;174/68.1,68.2,68.3,250,253,255,256,257,258,260

References Cited [Referenced By]

U.S. Patent Documents
5799392 September 1998 Mishiro
6324067 November 2001 Nishiyama
7067912 June 2006 Takeuchi
7338290 March 2008 Motohashi
7466519 December 2008 Wakaki
7660126 February 2010 Cho
8035983 October 2011 Takahashi
8238109 August 2012 Sagisaka
D687397 August 2013 Kajiya
8866027 October 2014 Oka
D757666 May 2016 Yokoo
D784936 April 2017 Mori
D785575 May 2017 Mori
D803172 November 2017 Mori
D803803 November 2017 Mori
D805045 December 2017 Mori
D810707 February 2018 Mori
D812023 March 2018 Mori
D831594 October 2018 Mori
2002/0007961 January 2002 Yamato
2005/0217895 October 2005 Maharshak
2006/0169485 August 2006 Kawaguchi
2006/0281343 December 2006 Uchida
2007/0281505 December 2007 Kobayashi
2008/0014768 January 2008 Lee
2008/0093118 April 2008 Takahashi
2008/0099230 May 2008 Takahashi
2008/0289859 November 2008 Mikado
2009/0229876 September 2009 Takahashi
2009/0255111 October 2009 Takahashi
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Baker Botts L.L.P. Sartori; Michael A.

Description



FIG. 1 is a front view of a flexible printed wiring board for a module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is an enlarged front view of a portion taken along line 8-8 of FIG. 1;

FIG. 9 is an enlarged rear view of FIG. 8;

FIG. 10 is an enlarged top view of FIG. 8;

FIG. 11 is an enlarged bottom view of FIG. 8;

FIG. 12 is an enlarged right side view of FIG. 8;

FIG. 13 is an enlarged left side view of FIG. 8;

FIG. 14 is an enlarged perspective view of FIG. 8; and,

FIG. 15 is another perspective view thereof, shown in a used condition with a device in broken lines.

The broken lines shown in the drawings represent portions of the flexible printed wiring board for a module that form no part of the claimed design. The dashed-dot-dashed lines indicate a boundary between the claimed and unclaimed portions of the design.

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Patent Diagrams and Documents

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