Headphone

Nagamine , et al. Feb

Patent Grant D875068

U.S. patent number D875,068 [Application Number D/642,791] was granted by the patent office on 2020-02-11 for headphone. This patent grant is currently assigned to AUDIO-TECHNICA CORPORATION. The grantee listed for this patent is Audio-Technica Corporation. Invention is credited to Shohei Araki, Takaya Nagamine, Kodai Tsubone.


United States Patent D875,068
Nagamine ,   et al. February 11, 2020

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Nagamine; Takaya (Tokyo, JP), Tsubone; Kodai (Tokyo, JP), Araki; Shohei (Kanagawa, JP)
Applicant:
Name City State Country Type

Audio-Technica Corporation

Tokyo

N/A

JP
Assignee: AUDIO-TECHNICA CORPORATION (Tokyo, JP)
Appl. No.: D/642,791
Filed: April 2, 2018

Foreign Application Priority Data

Oct 3, 2017 [JP] 2017-021945
Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/205,207,217,221,223,224,224.1,225,204,209,209.1,210,211,212,213,214,215,216,222 ;D24/173,174

References Cited [Referenced By]

U.S. Patent Documents
7412070 August 2008 Kleinschmidt
D761761 July 2016 Ando
D795218 August 2017 Ohmachi
D795835 August 2017 Nagamine
D816061 April 2018 Ando
D830333 October 2018 Carr
D834557 November 2018 Hardi
D836084 December 2018 Xie
D838687 January 2019 Wu
D841616 February 2019 Bian
D841617 February 2019 Mei
D842270 March 2019 Chen
D849712 May 2019 Billaudet
D849713 May 2019 Hanggi
2010/0310093 December 2010 Semcken
2014/0086429 March 2014 Semcken
2014/0254854 September 2014 Blonder
2018/0109866 April 2018 Tsuihiji
2018/0268845 September 2018 Yeo
2019/0075388 March 2019 Schrader

Other References

Audio Technica ATH-DSR7BT Wireless Over-Ear Headphones, posted Dec. 26, 2016 [online], retrieved Jun. 6, 2019, https://www.amazon.com/Audio-Technica-ATN-DSR7BT-Bluetooth-Wireless-Headp- hones/dp/B06XY4TSGP?ref_=bl_dp_s_web_2528981011. cited by examiner.

Primary Examiner: Fox; Barbara
Assistant Examiner: Smith; Messina L
Attorney, Agent or Firm: W&C IP

Description



FIG. 1 is a perspective view of a headphone, showing the new design;

FIG. 2 is a front elevational view of the headphone;

FIG. 3 is a rear elevational view of the headphone;

FIG. 4 is a top plan view of the headphone;

FIG. 5 is a bottom plan view of the headphone;

FIG. 6 is a left side elevational view of the headphone;

FIG. 7 is a right side elevational view of the headphone;

FIG. 8 is an enlarged sectional view of the headphone taken in the direction of line 8-8 of FIG. 4;

FIG. 9 is an enlarged partial sectional view of the headphone shown in FIG. 8; and,

FIG. 10 is an enlarged partial sectional view of the headphone shown in FIG. 8.

The broken lines in the drawings depict portions of the headphone that form no part of the claimed design. Shade lines are used to show surface contours only and are not representative of specific materials or material properties.

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References

Patent Diagrams and Documents

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