Earphone
Cui J
U.S. patent number D872,061 [Application Number D/648,310] was granted by the patent office on 2020-01-07 for earphone. This patent grant is currently assigned to Shenzhen Tuopu Global Technology Co., Ltd. The grantee listed for this patent is Yonggang Cui. Invention is credited to Yonggang Cui.
| United States Patent | D872,061 |
| Cui | January 7, 2020 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and described.
| Inventors: | Cui; Yonggang (Guangdong, CN) | ||||||||||
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| Applicant: |
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| Assignee: | Shenzhen Tuopu Global Technology
Co., Ltd (Shenzhen, Guangdong, CN) |
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| Appl. No.: | D/648,310 | ||||||||||
| Filed: | May 21, 2018 |
| Current U.S. Class: | D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/223,205 ;D24/174 ;128/864,865,866 ;181/129,130,135 ;379/430,431 ;381/380,381,374,370,373,338,322,328 ;455/90.3,575.1,569.1 |
References Cited [Referenced By]
U.S. Patent Documents
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| D788079 | May 2017 | Son |
| D828823 | September 2018 | Lin |
| D847125 | April 2019 | Akana |
| 2011/0051979 | March 2011 | Lee |
| 2011/0176699 | July 2011 | Lin |
| 2015/0382099 | December 2015 | Chu |
| 004675320-0002 | Jan 2018 | EM | |||
Description
FIG. 1 is a perspective view of an earphone showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines depict environment that forms no part of the claimed design.
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