U.S. patent number D862,407 [Application Number D/670,508] was granted by the patent office on 2019-10-08 for mobile phone. This patent grant is currently assigned to SAMSUNG ELECTRONICS CO., LTD.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Jae Ho Baik, Dong Kyun Kim, Kuk Hwan Kim, Ji Young Lee, Soyeon Lee, Jinie Ryu, Jung Hee Yeo, Sung Jin Yum.
United States Patent | D862,407 |
Lee , et al. | October 8, 2019 |
Inventors: | Lee; Ji Young (Seoul, KR), Kim; Kuk Hwan (Seoul, KR), Baik; Jae Ho (Gyeonggi-do, KR), Yeo; Jung Hee (Seoul, KR), Kim; Dong Kyun (Seoul, KR), Yum; Sung Jin (Seoul, KR), Ryu; Jinie (Seoul, KR), Lee; Soyeon (Seoul, KR) | ||||||||||
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Applicant: |
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Assignee: | SAMSUNG ELECTRONICS CO., LTD.
(Suwon-si, KR) |
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Family ID: | 59960461 | ||||||||||
Appl. No.: | D/670,508 | ||||||||||
Filed: | November 16, 2018 |
Application Number | Filing Date | Patent Number | Issue Date | ||
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29619124 | Sep 27, 2017 | D835597 | |||
15477722 | Apr 3, 2017 | 10171636 | |||
Apr 1, 2016 [KR] | 10-2016-0040398 | |||
Current U.S. Class: | D14/138G |
Current CPC Class: | H04M1/0277 20130101; G06F1/1637 20130101; G06F1/1686 20130101; H04M1/0264 20130101; G03B29/00 20130101; G06F1/1609 20130101; G03B2215/05 20130101; H04M1/0266 20130101; G03B2217/002 20130101 |
Current International Class: | 1403 |
Field of Search: | ;D14/138AA,138AB,138AC,138AD,138C,138R,248,341,345,203.7,371,137,138G ;D21/329 ;D10/50,65 |
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