Sealing material ring for a semiconductor manufacturing apparatus

Murata , et al. O

Patent Grant D862404

U.S. patent number D862,404 [Application Number D/601,165] was granted by the patent office on 2019-10-08 for sealing material ring for a semiconductor manufacturing apparatus. This patent grant is currently assigned to KOKUSAI ELECTRIC CORPORATION, TOHO KASEI CO., LTD.. The grantee listed for this patent is KOKUSAI ELECTRIC CORPORATION, TOHO KASEI Co., Ltd.. Invention is credited to Shinya Morita, Satoru Murata, Masashi Suzuki.


United States Patent D862,404
Murata ,   et al. October 8, 2019

Sealing material ring for a semiconductor manufacturing apparatus

Claims

CLAIM The ornamental design for a sealing material ring for a semiconductor manufacturing apparatus, as shown and described.
Inventors: Murata; Satoru (Toyama, JP), Morita; Shinya (Toyama, JP), Suzuki; Masashi (Yamatokoriyama, JP)
Applicant:
Name City State Country Type

KOKUSAI ELECTRIC CORPORATION
TOHO KASEI Co., Ltd.

Tokyo
Nara

N/A
N/A

JP
JP
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo, JP)
TOHO KASEI CO., LTD. (Nara, JP)
Appl. No.: D/601,165
Filed: April 19, 2017

Foreign Application Priority Data

Oct 25, 2016 [JP] 2016-023182
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182,184,199 ;D15/144,144.1 ;D30/152 ;D3/207 ;D8/399 ;D11/26

References Cited [Referenced By]

U.S. Patent Documents
135712 February 1873 Jenks
4225162 September 1980 Dola
4447749 May 1984 Reeb, Jr.
5302980 April 1994 Barrett
6879023 April 2005 Gutierrez
D557226 December 2007 Uchino
8242586 August 2012 Chang
D770992 November 2016 Tauchi
D797691 September 2017 Joubert
D803917 November 2017 Harada
D804556 December 2017 Harada
D810705 February 2018 Krishnan
D827592 September 2018 Ichino
D840364 February 2019 Ichino
Foreign Patent Documents
270879 Feb 1996 TW

Other References

DANCO#18 O-Rings (10-Pack), https://www.homedepot.com/p/DANCO-18-O-Rings-10-Pack-96735/100299374, copyright 2000, Home Depot Product Authority, LLC. (Year: 2000). cited by examiner .
O-Rings-Freudenberg Innovating Together, Sealing Technologies, https://www.fst.com/products/static-seals/o-rings, by Freudenberg Sealing Technologies, May 24, 2018. (Year: 2018). cited by examiner .
Assortment Tray A/C Green Universal O-Rings, 18 Styles-110 PCS, https://henrysautowarehouse.com/product/assortment-tray-ac-green-universa- l-o-rings-18-styles-110-pcs/,copyright 2019 Henry's Automotive Warehouse. (Year: 2019). cited by examiner .
O-Ring, Item #23CJ16, Mfr Model # PP60076G, https://www.grainger.com/product/DAYTON-O-Ring-for-4ZA35A-23CJ16, Grainger, copyright 1994. (Year: 1994). cited by examiner .
Office Action of TW Appln. No. 106301911 dated Sep. 6, 2017, with English translation. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, L.L.P.

Description



FIG. 1 is a front, bottom, and right side perspective view of a sealing material ring for a semiconductor manufacturing apparatus, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 thereof; and,

FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 8.

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References

Patent Diagrams and Documents

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