Earphone attachment

Willis , et al. A

Patent Grant D857667

U.S. patent number D857,667 [Application Number D/586,591] was granted by the patent office on 2019-08-27 for earphone attachment. This patent grant is currently assigned to Human, Incorporated. The grantee listed for this patent is Human, Incorporated. Invention is credited to Adam Abraham Jossem, Dae Il Kwon, Lea Martin, Stephen John Minarsch, Francesca Alyssum Quaglia, Benjamin S. Willis.


United States Patent D857,667
Willis ,   et al. August 27, 2019

Earphone attachment

Claims

CLAIM The ornamental design for an earphone attachment, as shown and described.
Inventors: Willis; Benjamin S. (Bellevue, WA), Jossem; Adam Abraham (Seattle, WA), Minarsch; Stephen John (Seattle, WA), Kwon; Dae Il (Edmonds, WA), Quaglia; Francesca Alyssum (Seattle, WA), Martin; Lea (Seattle, WA)
Applicant:
Name City State Country Type

Human, Incorporated

Seattle

WA

US
Assignee: Human, Incorporated (Seattle, WA)
Appl. No.: D/586,591
Filed: December 5, 2016

Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/205,217,221,223,224,224.1,225 ;D24/173,174

References Cited [Referenced By]

U.S. Patent Documents
D326654 June 1992 Brown
D357479 April 1995 Coomans
D541485 April 2007 Birgersson
D707201 June 2014 Arjomand
D814445 April 2018 Willis
D815065 April 2018 Willis
D822007 July 2018 Willis
2016/0360307 December 2016 Willis
2017/0311067 October 2017 Willis

Other References

These futuristic wireless headphones will make you look like an alien, posted on Sep. 20, 2016, site visited Dec. 5, 2018, <http://www.digitalspy.com/tech/news/a808548/these-futuristic-wireless- -headphones-will-make-you-look-like-an-alien/>. cited by examiner .
Human Inc. Unveil `Sound` Wireless Headphones, posted on May 24, 2016, site visited Dec. 5, 2018, <https://www.androidheadlines.com/2016/05/human-inc-unveil-sound-wirel- ess-headphones-2.html>. cited by examiner.

Primary Examiner: Fox; Barbara
Assistant Examiner: Smith; Messina L
Attorney, Agent or Firm: Seed IP Law Group LLP

Description



FIG. 1 is a first isometric view of an earphone attachment showing the new design in a first embodiment, showing the earphone attachment for the left ear.

FIG. 2 is a second isometric view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

A second embodiment for the right ear is provided, which is a mirror image of the embodiment for the left ear shown in FIGS. 1 through 8.

Stippling and tangency lines in the drawings represent the three-dimensional contours of the design, and are not intended to indicate surface decoration. The broken lines in the drawings depict portions of the earphone attachment and form no part of the claimed design.

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References

Patent Diagrams and Documents

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