Electronic device cover

Mecchella , et al. November 6, 2

Patent Grant D832851

U.S. patent number D832,851 [Application Number D/599,218] was granted by the patent office on 2018-11-06 for electronic device cover. This patent grant is currently assigned to Amazon Technologies, Inc.. The grantee listed for this patent is Amazon Technologies, Inc.. Invention is credited to Monica Liane Mecchella, Jesse Wheeler Moore.


United States Patent D832,851
Mecchella ,   et al. November 6, 2018

Electronic device cover

Claims

CLAIM The ornamental design for an electronic device cover, as shown and described.
Inventors: Mecchella; Monica Liane (San Francisco, CA), Moore; Jesse Wheeler (Oakland, CA)
Applicant:
Name City State Country Type

Amazon Technologies, Inc.

Seattle

WA

US
Assignee: Amazon Technologies, Inc. (Seattle, WA)
Appl. No.: D/599,218
Filed: March 31, 2017

Current U.S. Class: D14/440
Current International Class: 1402
Field of Search: ;D14/440,250,447,426,330 ;206/45.23,320,45.2 ;361/679.55 ;294/25

References Cited [Referenced By]

U.S. Patent Documents
D323937 February 1992 Solomon
D467429 December 2002 Bone
D657354 April 2012 Kim
D676448 February 2013 Gorman
D676449 February 2013 Probst
8542495 September 2013 Gorman
D707229 June 2014 Almodova
D736777 August 2015 Rayner
D742888 November 2015 Mecchella
D742889 November 2015 Mecchella
D742890 November 2015 Mecchella
D748097 January 2016 Feng
D748636 February 2016 Zadvinskis
D753123 April 2016 Probst
9307131 April 2016 Breen
D761798 July 2016 Lee
D765086 August 2016 Lee
D765663 September 2016 Shih
D768638 October 2016 Lee
D774036 December 2016 Kuntz
D781278 March 2017 Kim
D787520 May 2017 Wall
D792412 July 2017 Zhang
D792887 July 2017 Zhang
D808393 January 2018 Moore
D810088 February 2018 Moore
D811411 February 2018 Moore
2007/0097087 May 2007 Homer
2008/0194139 August 2008 Chan
2012/0043235 February 2012 Klement
2013/0264459 October 2013 McCosh
2016/0011628 January 2016 Sato
Foreign Patent Documents
D1567116 Jan 2017 JP

Other References

The Japanese Office Action dated Feb. 9, 2018 for Japanese design application No. 2017-019791, a counterpart foreign application of Design U.S. Appl. No. 29/599,218, 4 pages. cited by applicant .
The Indian Office Action dated Oct. 17, 2017 for Indian design application No. 297355, a counterpart foreign application of Design U.S. Appl. No. 29/599,218, 2 pages. cited by applicant .
The Chinese Office Action dated Jan. 11, 2018 for Chinese design application No. 201730472788.0, a counterpart foreign application of Design U.S. Appl. No. 29/599,218, 1 page. cited by applicant .
The Korean Office Action dated Jan. 19, 2018 for Korean design application No. 30-2017-42087, a foreign counterpart application of Design U.S. Appl. No. 29/599,218, 2 pages. cited by applicant .
The Canadian Office Action dated Mar. 19, 2018 for Canadian Patent Application No. 177017, a counterpart foreign application of U.S. Appl. No. 29/599,218, 2 pages. cited by applicant .
The Canadian Office Action dated Mar. 19, 2018 for Canadian Patent Application No. 177014, a counterpart foreign application of U.S. Appl. No. 29/599,218, 1 page. cited by applicant .
Translated the Japanese Office Action dated Jun. 22, 2018 for Japanese Design Application No. 2017-019791, a counterpart foreign application of Design U.S. Appl. No. 29/599,218, 3 pages. cited by applicant.

Primary Examiner: Underwood; Cynthia R
Attorney, Agent or Firm: Lee & Hayes, PLLC

Description



FIG. 1 is a front perspective view of a first embodiment of an electronic device cover.

FIG. 2 is a back perspective view of the first embodiment of the electronic device cover.

FIG. 3 is a front view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 4 is a back view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 5 is a left-side view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 6 is a right-side view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 7 is a top view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 8 is a bottom view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 9 is a first opened state view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 10 is a second open state view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 11 is a front perspective view of a second embodiment of an electronic device cover. The crosshatched pattern shown on the views of the second embodiment represents fabric (e.g., a woven fabric), and is understood to be distributed uniformly over the surface of the claimed design upon which the pattern occurs.

FIG. 12 is a back perspective view of the second embodiment of the electronic device cover.

FIG. 13 is a front view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 14 is a back view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 15 is a left-side view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 16 is a right-side view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 17 is a top view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 18 is a bottom view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 19 is a first open state view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 20 is a second open state view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 21 is a front perspective view of a third embodiment of an electronic device cover.

FIG. 22 is a back perspective view of the third embodiment of the electronic device cover.

FIG. 23 is a front view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 24 is a back view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 25 is a left-side view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 26 is a right-side view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 27 is a top view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 28 is a bottom view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 29 is a first open state view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 30 is a second open state view of the third embodiment of the electronic device cover of FIG. 21.

FIG. 31 is a front perspective view of a fourth embodiment of an electronic device cover. The crosshatched pattern shown on the views of the fourth embodiment represents fabric (e.g., a woven fabric), and is understood to be distributed uniformly over the surface of the claimed design upon which the pattern occurs.

FIG. 32 is a back perspective view of the fourth embodiment of the electronic device cover.

FIG. 33 is a front view of the fourth embodiment of the electronic device cover of FIG. 31.

FIG. 34 is a back view of the fourth embodiment of the electronic device cover of FIG. 31.

FIG. 35 is a left-side view of the fourth embodiment of the electronic device cover of FIG. 31.

FIG. 36 is a right-side view of the fourth embodiment of the electronic device cover of FIG. 31.

FIG. 37 is a top view of the fourth embodiment of the electronic device cover of FIG. 31.

FIG. 38 is a bottom view of the fourth embodiment of the electronic device cover of FIG. 31.

FIG. 39 is a first open state view of the fourth embodiment of the electronic device cover of FIG. 31; and,

FIG. 40 is a second open state view of the fourth embodiment of the electronic device cover of FIG. 31.

The broken lines depict portions of the electronic device cover which form no part of the claimed design.

* * * * *


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