U.S. patent number D768,638 [Application Number D/530,921] was granted by the patent office on 2016-10-11 for cover for a mobile device.
This patent grant is currently assigned to Hewlett-Packard Development Company, L.P.. The grantee listed for this patent is Hewlett-Packard Development Company, L.P.. Invention is credited to Yoon Jung Byun, Dong Ryu Cha, Ilchan Lee.
United States Patent |
D768,638 |
Lee , et al. |
October 11, 2016 |
Cover for a mobile device
Claims
CLAIM We claim the ornamental design for a cover for a mobile
device, as shown and described.
Inventors: |
Lee; Ilchan (Houston, TX),
Cha; Dong Ryu (Houston, TX), Byun; Yoon Jung (Houston,
TX) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hewlett-Packard Development Company, L.P. |
Houston |
TX |
US |
|
|
Assignee: |
Hewlett-Packard Development
Company, L.P. (Houston, TX)
|
Appl.
No.: |
D/530,921 |
Filed: |
June 22, 2015 |
Current U.S.
Class: |
D14/440 |
Current International
Class: |
1402 |
Field of
Search: |
;D14/250,440,447
;206/45.23,320,45.2 ;361/679.55 ;294/25 ;224/218 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Underwood; Cynthia
Attorney, Agent or Firm: Foley & Lardner
Description
FIG. 1 is a top, front, right perspective view of the claimed
design according to an embodiment;
FIG. 2 is a top plan view of thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a front elevation view thereof; and,
FIG. 7 is a rear elevation view thereof.
The ornamental design which is claimed is shown in solid lines in
the drawings. The broken lines represent portions of the structure
that forms no part of the claim.
* * * * *