U.S. patent number D829,707 [Application Number D/577,508] was granted by the patent office on 2018-10-02 for computer laptop assembly. This patent grant is currently assigned to Intel Corporation. The grantee listed for this patent is Intel Corporation. Invention is credited to Chunlin Tony Bai, La Hung Richard Shih, William Tin, Jie Gandalf Yan.
United States Patent | D829,707 |
Tin , et al. | October 2, 2018 |
Inventors: | Tin; William (Shenzhen, CN), Bai; Chunlin Tony (Shenzhen, CN), Shih; La Hung Richard (Shenzhen, CN), Yan; Jie Gandalf (Shenzhen, CN) | ||||||||||
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Applicant: |
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Assignee: | Intel Corporation (Santa Clara,
CA) |
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Appl. No.: | D/577,508 | ||||||||||
Filed: | September 13, 2016 |
Current U.S. Class: | D14/315; D14/327 |
Current International Class: | 1402 |
Field of Search: | ;D14/434,440,447,251-253,432,451,452,454,140,142,149,217,240,299,496,356,358,139,315,318,320,322,324,326,331,338-340,341,327 ;D13/103,107,108,118,119,184 ;D10/74,80 ;D6/512,672,682 ;D21/333 |
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