U.S. patent number D827,778 [Application Number D/610,308] was granted by the patent office on 2018-09-04 for manifold type electromagnetic valve.
This patent grant is currently assigned to SMC CORPORATION. The grantee listed for this patent is SMC CORPORATION. Invention is credited to Shinji Miyazoe, Takashi Murakami.
United States Patent |
D827,778 |
Miyazoe , et al. |
September 4, 2018 |
Manifold type electromagnetic valve
Claims
CLAIM The ornamental design for a manifold type electromagnetic
valve, as shown and described.
Inventors: |
Miyazoe; Shinji (Moriya,
JP), Murakami; Takashi (Moriya, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
SMC CORPORATION |
Chiyoda-ku |
N/A |
JP |
|
|
Assignee: |
SMC CORPORATION (Chiyoda-ku,
JP)
|
Appl.
No.: |
D/610,308 |
Filed: |
July 11, 2017 |
Foreign Application Priority Data
|
|
|
|
|
Jan 31, 2017 [JP] |
|
|
2017-001601 |
|
Current U.S.
Class: |
D23/233 |
Current International
Class: |
2301 |
Field of
Search: |
;D23/233,249
;137/884,269,554,861,882,270,271,625.64,487.5
;251/129.01,129.15,129.2,596.13,596.16,15,130,219,331,129.04
;D15/1,5,199 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Ramirez; Cynthia
Assistant Examiner: Colan; Gino
Attorney, Agent or Firm: Oblon, McClelland, Maier &
Neustadt, L.L.P.
Description
FIG. 1 is a front, top, and left side perspective view of a
manifold type electromagnetic valve;
FIG. 2 is a rear, bottom, and right side perspective view
thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a left side elevational view thereof, the right side
elevational view being a mirror image of the left side elevational
view shown.
The broken lines shown in the figures are for the purpose of
illustrating portions of the manifold type electromagnetic valve
and form no part of the claimed design.
* * * * *