Headphone
Hsieh , et al. July 31, 2
U.S. patent number D824,360 [Application Number D/593,750] was granted by the patent office on 2018-07-31 for headphone. This patent grant is currently assigned to 1MORE INC.. The grantee listed for this patent is 1MORE INC.. Invention is credited to Siru Fei, Kuan-Hong Hsieh, Yonghui Hu, Shichen Xu.
| United States Patent | D824,360 |
| Hsieh , et al. | July 31, 2018 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and described.
| Inventors: | Hsieh; Kuan-Hong (Guangdong, CN), Xu; Shichen (Guangdong, CN), Fei; Siru (Guangdong, CN), Hu; Yonghui (Guangdong, CN) | ||||||||||
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| Applicant: |
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| Assignee: | 1MORE INC. (Shenzhen,
CN) |
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| Appl. No.: | D/593,750 | ||||||||||
| Filed: | February 13, 2017 |
Foreign Application Priority Data
| Sep 28, 2016 [CN] | 2016 3 0487303 | |||
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,224,221,222 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,345,424,309,370,374,371,379,376,386,389 ;455/90.3,575.1,569.1 |
References Cited [Referenced By]
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Attorney, Agent or Firm: Ladas & Parry LLP
Description
FIG. 1 is a front elevational view of a headphone showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view thereof.
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