U.S. patent number D811,361 [Application Number D/585,905] was granted by the patent office on 2018-02-27 for conference telephone device.
This patent grant is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONGFUJIN PRECISION ELECTRONICS (CHONGQING) CO., LTD.. The grantee listed for this patent is HON HAI PRECISION INDUSTRY CO., LTD., HONGFUJIN PRECISION ELECTRONICS (CHONGQING) CO. LTD. Invention is credited to Yen-Chun Lin, Mei-Hua Liu, Ye Peng.
United States Patent |
D811,361 |
Peng , et al. |
February 27, 2018 |
**Please see images for:
( Certificate of Correction ) ** |
Conference telephone device
Claims
CLAIM The ornamental design for a conference telephone device, as
shown and described.
Inventors: |
Peng; Ye (Shenzhen,
CN), Lin; Yen-Chun (New Taipei, TW), Liu;
Mei-Hua (Shenzhen, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
HONGFUJIN PRECISION ELECTRONICS (CHONGQING) CO. LTD
HON HAI PRECISION INDUSTRY CO., LTD. |
Chongqing
New Taipei |
N/A
N/A |
CN
TW |
|
|
Assignee: |
HONGFUJIN PRECISION ELECTRONICS
(CHONGQING) CO., LTD. (Chongqing, CN)
HON HAI PRECISION INDUSTRY CO., LTD. (New Taipei,
TW)
|
Appl.
No.: |
D/585,905 |
Filed: |
November 30, 2016 |
Current U.S.
Class: |
D14/149 |
Current International
Class: |
1403 |
Field of
Search: |
;D14/140,140.1,141.1,142,144,147,149,150,155,168,172,204,209.1,212,213,215,216,248,249,299,496,226,356,358,432,454,192
;D13/184 ;D10/104.1,106.1,106.3,106.5 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Hallmark; Janice
Assistant Examiner: Fast Horse; Marie D.
Attorney, Agent or Firm: ScienBiziP, P.C.
Description
FIG. 1 is a first perspective view of a conference telephone
device;
FIG. 2 is a second perspective view of a conference telephone
device;
FIG. 3 is a front elevational view of the device of FIG. 1;
FIG. 4 is a rear elevational view of the device of FIG. 1;
FIG. 5 is a left side elevational view of the device of FIG. 1;
FIG. 6 is a right side elevational view of the device of FIG.
1;
FIG. 7 is a top plan view of the device of FIG. 1; and,
FIG. 8 is a bottom plan view of the device of FIG. 1.
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