Instrument module

LiCalzi , et al. December 26, 2

Patent Grant D806259

U.S. patent number D806,259 [Application Number D/569,384] was granted by the patent office on 2017-12-26 for instrument module. This patent grant is currently assigned to Siemens Healthcare Diagnostics Inc.. The grantee listed for this patent is Siemens Healthcare Diagnostics Inc.. Invention is credited to Youngsang Lee, Daniel LiCalzi.


United States Patent D806,259
LiCalzi ,   et al. December 26, 2017

Instrument module

Claims

CLAIM The ornamental design for an instrument module, as shown and described.
Inventors: LiCalzi; Daniel (New York, NY), Lee; Youngsang (Flushing, NY)
Applicant:
Name City State Country Type

Siemens Healthcare Diagnostics Inc.

Tarrytown

NY

US
Assignee: Siemens Healthcare Diagnostics Inc. (Tarrytown, NY)
Appl. No.: D/569,384
Filed: June 27, 2016

Current U.S. Class: D24/216
Current International Class: 2401
Field of Search: ;D24/216,111,127,107,169,186,217,219,223-224,231-234 ;D10/46,70,81,97 ;422/1,62-65,67,68.1,70,81,129,500,506,561,FOR106 ;435/287.1,287.3 ;436/43,45,47 ;600/300,301,368,372,481,529,544,554,561 ;607/4,5,9,30

References Cited [Referenced By]

U.S. Patent Documents
D645367 September 2011 Hayashi
D669189 October 2012 Liu
D676143 February 2013 Liu
D676568 February 2013 Liu
D685483 July 2013 LiCalzi
D735878 August 2015 Chang
D738243 September 2015 Selberg
Primary Examiner: Laymon; Wan
Assistant Examiner: Booker; Mark

Description



FIG. 1 is a front perspective view of an instrument module in accordance with an embodiment;

FIG. 2 is a rear perspective view of an instrument module in accordance with an embodiment;

FIG. 3 is a front elevational view of an instrument module in accordance with an embodiment;

FIG. 4 is a rear elevational view of an instrument module in accordance with an embodiment;

FIG. 5 is a left side elevational view of an instrument module in accordance with an embodiment;

FIG. 6 is a right side elevational view of an instrument module in accordance with an embodiment;

FIG. 7 is a top view of an instrument module in accordance with an embodiment;

FIG. 8 is a bottom view of an instrument module in accordance with an embodiment; and,

FIG. 9 is a front elevational view of an instrument module in accordance with an embodiment showing additional environmental information.

The broken lines shown in the figures represent portions of the instrument module that form no part of the claimed design.

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