U.S. patent number D804,438 [Application Number D/541,741] was granted by the patent office on 2017-12-05 for electronics enclosure.
This patent grant is currently assigned to EATON CORPORATION. The grantee listed for this patent is EATON CORPORATION. Invention is credited to David Loren Makis, Rajkiran Bhagwat Rokade.
United States Patent |
D804,438 |
Makis , et al. |
December 5, 2017 |
Electronics enclosure
Claims
CLAIM The ornamental design for an electronics enclosure, as shown
and described.
Inventors: |
Makis; David Loren (Shakopee,
MN), Rokade; Rajkiran Bhagwat (Pune, IN) |
Applicant: |
Name |
City |
State |
Country |
Type |
EATON CORPORATION |
Cleveland |
OH |
US |
|
|
Assignee: |
EATON CORPORATION (Cleveland,
OH)
|
Appl.
No.: |
D/541,741 |
Filed: |
October 7, 2015 |
Foreign Application Priority Data
Current U.S.
Class: |
D13/184 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,118,123,133,146,147,149,152,153,158-161,173,184,199 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Rogers; Lakiya
Assistant Examiner: Blackwell, II; Harold E
Attorney, Agent or Firm: Millar; Jarett D.
Description
FIG. 1 is a perspective view of an electronics enclosure showing my
new design.
FIG. 2 is a front elevation view of the electronics enclosure of
FIG. 1.
FIG. 3 is a back elevation view of the electronics enclosure of
FIG. 1.
FIG. 4 is a top plan view of the electronics enclosure of FIG.
1.
FIG. 5 is a bottom plan view of the electronics enclosure of FIG.
1.
FIG. 6 is a left elevation view of the electronics enclosure of
FIG. 1; and,
FIG. 7 is a right elevation view of the electronics enclosure of
FIG. 1.
The broken lines illustrate portions of the electronics enclosure
which form no part of the claimed design.
* * * * *