Wafer handling assembly

Description

FIG. 1 is a top perspective view of a first embodiment of a wafer handling assembly.

FIG. 2 is a top view of the wafer handling assembly of FIG. 1.

FIG. 3 is a side view of the wafer handling assembly of FIG. 1.

FIG. 4 is another side view of the wafer handling assembly of FIG. 1.

FIG. 5 is a bottom perspective view of the wafer handling assembly of FIG. 1.

FIG. 6 is a top perspective view of a second embodiment of a wafer handling assembly.

FIG. 7 is a top view of the wafer handling assembly of FIG. 6.

FIG. 8 is a side view of the wafer handling assembly of FIG. 6.

FIG. 9 is another side view of the wafer handling assembly of FIG. 6.

FIG. 10 is a bottom perspective view of the wafer handling assembly of FIG. 6.

FIG. 11 is a top perspective view of a third embodiment of a wafer handling assembly.

FIG. 12 is a top view of the wafer handling assembly of FIG. 11.

FIG. 13 is a side view of the wafer handling assembly of FIG. 11.

FIG. 14 is another side view of the wafer handling assembly of FIG. 11.

FIG. 15 is a bottom perspective view of the wafer handling assembly of FIG. 11.

FIG. 16 is a top perspective view of a fourth embodiment of a wafer handling assembly.

FIG. 17 is a top view of the wafer handling assembly of FIG. 16.

FIG. 18 is a side view of the wafer handling assembly of FIG. 16.

FIG. 19 is another side view of the wafer handling assembly of FIG. 16.

FIG. 20 is a bottom perspective view of the wafer handling assembly of FIG. 16.

FIG. 21 is a top perspective view of a fifth embodiment of a wafer handling assembly.

FIG. 22 is a top view of the wafer handling assembly of FIG. 21.

FIG. 23 is a side view of the wafer handling assembly of FIG. 21.

FIG. 24 is another side view of the wafer handling assembly of FIG. 21.

FIG. 25 is a bottom perspective view of the wafer handling assembly of FIG. 21.

FIG. 26 is a top perspective view of a sixth embodiment of a wafer handling assembly.

FIG. 27 is a top view of the wafer handling assembly of FIG. 26.

FIG. 28 is a side view of the wafer handling assembly of FIG. 26.

FIG. 29 is another side view of the wafer handling assembly of FIG. 26; and,

FIG. 30 is a bottom perspective view of the wafer handling assembly of FIG. 26.

Claims

CLAIM The ornamental design for a wafer handling assembly, as shown and described.

---

Inventors:	Rashkovsky; Yuliy (Millburn, NJ), Snowden; Brett Stuart (Manasquan, NJ), Saldana; Miguel Angel (Aptos, CA)
Applicant:	Name City State Country Type Veeco Instruments, Inc. Plainview NY US
Assignee:	Veeco Instruments Inc. (Plainview, NY)
Appl. No.:	D/564,740
Filed:	May 16, 2016

---

Current U.S. Class:	D15/138
Current International Class:	1509
Field of Search:	;D3/315 ;D13/182 ;D15/138

---

References Cited [Referenced By]

---

U.S. Patent Documents

4029351	June 1977	Apgar et al.
5643366	July 1997	Somekh et al.
5791895	August 1998	Kyung
6249342	June 2001	Cheng
6276892	August 2001	Haraguchi
6357996	March 2002	Bacchi et al.
6514033	February 2003	Sundar
6537011	March 2003	Wang
6692219	February 2004	Coomer et al.
6935466	August 2005	Lubomirsky
8008884	August 2011	Krupyshev
D674366	January 2013	Kajiwara
D674761	January 2013	Iida
8920097	December 2014	Chan
2005/0111944	May 2005	Aho
2008/0107508	May 2008	Chan
2015/0075431	March 2015	Barriss et al.
2017/0256434	September 2017	Rashkovsky
2017/0256436	September 2017	Rashkovsky

Foreign Patent Documents

	2012099755		May 2012		JP
	2016001863		Jan 2016		WO

Primary Examiner: Palasik; Patricia A
Attorney, Agent or Firm: Holzer Patel Drennan