Module-level power electronics mounting plate

Schuit , et al. November 7, 2

Patent Grant D801781

U.S. patent number D801,781 [Application Number D/571,274] was granted by the patent office on 2017-11-07 for module-level power electronics mounting plate. This patent grant is currently assigned to Unirac Inc.. The grantee listed for this patent is Unirac Inc.. Invention is credited to Jason Mayfield, Nathan Schuit.


United States Patent D801,781
Schuit ,   et al. November 7, 2017

Module-level power electronics mounting plate

Claims

CLAIM The ornamental design for a module-level power electronics mounting plate, as shown and described.
Inventors: Schuit; Nathan (Edgewood, NM), Mayfield; Jason (Albuquerque, NM)
Applicant:
Name City State Country Type

Unirac Inc.

Albuquerque

NM

US
Assignee: Unirac Inc. (Albuquerque, NM)
Appl. No.: D/571,274
Filed: July 15, 2016

Current U.S. Class: D8/354
Current International Class: 0805
Field of Search: ;D8/323,325,349,354,366,373,400 ;248/205.1,207,213.1,247,248,309.1 ;D12/223

References Cited [Referenced By]

U.S. Patent Documents
2745175 May 1956 Purdy
2837820 June 1958 Ostrowski
3071857 January 1963 Preis
D235308 June 1975 Clarke
4679324 July 1987 Kirk
D306133 February 1990 Zupancic
D398835 September 1998 Coll
6047936 April 2000 Favotto
D541623 May 2007 Hord
D583221 December 2008 Johnsen
D608183 January 2010 Meyer
D649863 December 2011 Meyer
D653524 February 2012 Meyer
D673114 December 2012 Schnakenberg, III et al.
8371543 February 2013 Schneider
8929094 January 2015 Marroquin et al.
9068764 June 2015 Moore et al.
D734653 July 2015 Martin et al.
D736595 August 2015 Moore et al.
2003/0038222 February 2003 Holmes
Primary Examiner: Rogers; Lakiya
Assistant Examiner: Blackwell, II; Harold E
Attorney, Agent or Firm: Crowell & Moring LLP

Description



FIG. 1 is a top perspective view of a module-level power electronics mounting plate according to the design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a side elevational view thereof, the opposite side elevational view being a mirror image; and,

FIG. 8 is a side elevational view thereof, showing a possible environment of the design.

The broken lines in the drawings illustrate the environment of the module-level power electronics mounting plate which form no part of the claimed design.

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