LED chip

Zhang , et al. August 29, 2

Patent Grant D795822

U.S. patent number D795,822 [Application Number D/572,649] was granted by the patent office on 2017-08-29 for led chip. This patent grant is currently assigned to Enraytek Optoelectronics Co., Ltd.. The grantee listed for this patent is ENRAYTEK OPTOELECTRONICS CO., LTD.. Invention is credited to Qiming Li, Huiwen Xu, Tingting Yu, Shuai Zhang.


United States Patent D795,822
Zhang ,   et al. August 29, 2017

LED chip

Claims

CLAIM The ornamental design for an LED chip, as shown and described.
Inventors: Zhang; Shuai (Shanghai, CN), Xu; Huiwen (Shanghai, CN), Yu; Tingting (Shanghai, CN), Li; Qiming (Shanghai, CN)
Applicant:
Name City State Country Type

ENRAYTEK OPTOELECTRONICS CO., LTD.

Shanghai

N/A

CN
Assignee: Enraytek Optoelectronics Co., Ltd. (Shanghai, CN)
Appl. No.: D/572,649
Filed: July 29, 2016

Current U.S. Class: D13/180
Current International Class: 1303
Field of Search: ;D13/180 ;D26/1

References Cited [Referenced By]

U.S. Patent Documents
6650018 November 2003 Zhao
D566057 April 2008 Edmond
D582866 December 2008 Edmond
D583338 December 2008 Edmond
D602450 October 2009 Edmond
D633876 March 2011 Shan
D635525 April 2011 Edmond
D653630 February 2012 Liu
8212276 July 2012 Gong
D680975 April 2013 Lee
D684548 June 2013 Chu
D689448 September 2013 Kimura
D691569 October 2013 Edmond
8866186 October 2014 Oriji
D729752 May 2015 Chou
9070834 June 2015 Kim
D737228 August 2015 Chen
9130125 September 2015 Hwang
D764421 August 2016 Kao
9425358 August 2016 Pfeuffer
D771578 November 2016 Wang
2003/0107053 June 2003 Uemura
2006/0131600 June 2006 Nakaoka
2006/0192223 August 2006 Lee
2008/0230791 September 2008 Lin
2013/0214320 August 2013 Onishi
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Faegre Baker Daniels LLP

Description



FIG. 1 is a 3D view of a LED chip according to the embodiment of the present disclosure;

FIG. 2 is another 3D view of the LED chip according to the embodiment of the present disclosure;

FIG. 3 is a top view of the LED chip according to the embodiment of the present disclosure;

FIG. 4 is a left-side view of the LED chip shown in FIG. 3;

FIG. 5 is a right-side view of the LED chip shown in FIG. 3;

FIG. 6 is a front-side view of the LED chip shown in FIG. 3;

FIG. 7 is a rear-side view of the LED chip shown in FIG. 3;

FIG. 8 is a bottom view of the LED chip shown in FIG. 3;

FIG. 9 is a 3D view of a LED chip according to another embodiment of the present disclosure;

FIG. 10 is another 3D view of the LED chip according to the another embodiment of the present disclosure;

FIG. 11 is a top view of the LED chip according to the another embodiment of the present disclosure;

FIG. 12 is a left-side view of the LED chip shown in FIG. 11;

FIG. 13 is a right-side view of the LED chip shown in FIG. 11;

FIG. 14 is a front-side view of the LED chip show FIG. 11;

FIG. 15 is a rear-side view of the LED chip shown in FIG. 11; and,

FIG. 16 is a bottom view of the LED chip shown in FIG. 11.

* * * * *


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